Digital sounding chip assembly

Abstract

The utility model provides a digital sounding chip assembly, comprising a digital sounding chip fixed on a substrate; and the bottom surface of the horn is flush with the bottom surface of the digital sounding chip, and the opening direction of the horn is consistent with the normal of the digital sounding chip. According to the digital sound production chip assembly, the horn is additionally arranged on the digital sound production chip, and the vibrating diaphragm is flush with the horn, so that the sound pressure level of the digital sound production chip can be improved under the condition of small volume, and the problem that the sound pressure level of the digital sound production chip is small is solved.

Description

Technical Field

[0001] This utility model relates to the field of digital sound generation chips, and in particular to a digital sound generation chip assembly. Background Technology

[0002] The structure of a digital sound chip mainly consists of an array of sound-generating units mounted on the same substrate. Through the array structure, the digital sound chip can achieve efficient digital sound generation and has broad application prospects.

[0003] As a core component of audio technology, the performance of digital sound chips directly impacts the sound quality and user experience of audio products. However, traditional digital sound chips often fall short of high standards in terms of sound pressure level (SPL), limiting their use in certain demanding applications. For example, in education or remote interactive teaching, there is a need for long-distance, high-fidelity audio acquisition and transmission in classrooms, but existing digital sound chips often fail to meet this requirement, exhibiting insufficient SPL performance.

[0004] With the development of emerging technologies such as the Internet of Things, the demand for low-power, high-precision, and small-size microphones and digital sound chips has surged. However, while meeting these demands, achieving high signal-to-noise ratio and wide dynamic range under low-voltage power supply conditions has become a key challenge in microphone and digital sound chip design. This also indirectly reflects the current limitations of digital sound chips in terms of performance such as sound pressure level.

[0005] Therefore, despite continuous technological advancements, the low sound pressure level of digital sound-generating chips remains a problem. Utility Model Content

[0006] The purpose of this invention is to provide a digital sound generation chip assembly to increase the sound pressure level.

[0007] To achieve the above objectives, this utility model provides a digital sound chip assembly, comprising: a digital sound chip fixed on a substrate; and a horn, the bottom surface of which is flush with the bottom surface of the digital sound chip, and the opening direction of which is consistent with the normal of the digital sound chip.

[0008] Preferably, the number of horns is one, and it is located on the periphery of the digital sound chip.

[0009] Preferably, the number of digital sound-producing chips is multiple, and the horn includes conventional horns respectively disposed around each digital sound-producing chip.

[0010] Preferably, the horn further includes a large horn structure located on the common periphery of all digital sound chips, formed by extending a portion of the conventional horn at the outermost digital sound chip; and / or the conventional horn is in multiple rows and columns.

[0011] Preferably, the horn is inserted and fixed on the mounting base of the base plate.

[0012] Preferably, the digital sound chip assembly further includes a horn support structure fixedly connected to the horn, so as to define a receiving cavity together by the horn and the horn support structure; the substrate is accommodated in the receiving cavity defined by the horn and the horn support structure, and is supported and fixed by a plurality of adjustable brackets; the bottom of the adjustable bracket is fixed to the bottom surface of the horn support structure, and the height of the adjustable bracket is adjustable.

[0013] Preferably, the horn is fixedly connected to the horn support structure through inserts and studs.

[0014] Preferably, the horn satisfies at least one of the following conditions:

[0015] a1) The height of the horn is between 0.2cm and 50cm;

[0016] a2) The expansion angle at the bottom of the horn is between 20° and 90°;

[0017] a3) The vertical cross-sectional shape of the horn is one of the following: exponential, hyperbolic, or parabolic.

[0018] a4) The shape of the bottom cross-section of the horn is circular or a centrally symmetrical polygon.

[0019] Preferably, the digital sound chip includes a sound unit array and a driver chip, wherein the sound unit array includes multiple pixel sound units.

[0020] Preferably, the digital sound chip assembly is used in headphones or speakers.

[0021] The present invention adds a horn to the digital sound chip, and the bottom surface of the digital sound chip is flush with the horn, which can improve the sound pressure level of the digital sound chip in a small volume, thereby solving the problem of low sound pressure level of digital sound chips. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a digital sound-generating chip assembly according to the first embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of the structure of a digital sound-generating chip assembly according to the second embodiment of the present invention.

[0024] Figure 3 This is a schematic diagram of the structure of the digital sound-generating chip assembly according to the third embodiment of the present invention, excluding the digital sound-generating chip.

[0025] Figures 4A-4C This is a sound pressure level diagram of an existing digital sound chip, in which... Figure 4A This is a vibration signal diagram of a pulse signal. Figure 4B The vibration signal diagram is for a 2kHz signal. Figure 4C This is a graph showing the sound pressure level results at different frequencies.

[0026] Figures 4D-4F The diagram shows the sound pressure level effect of the digital sound-generating chip assembly of this utility model, wherein... Figure 4D This is a vibration signal diagram of a pulse signal. Figure 4E The vibration signal diagram is for a 2kHz signal. Figure 4F This is a graph showing the sound pressure level results at different frequencies. Detailed Implementation

[0027] The present invention will be further described below with reference to specific embodiments. It should be understood that the following embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0028] First embodiment: A digital sound-generating chip component

[0029] like Figure 1 The image shows a digital sound chip assembly according to a first embodiment of the present invention, which includes a digital sound chip 10 and a horn 20.

[0030] The digital sound chip 10 is fixed on the substrate 30 and includes a sound-generating unit array and a driver chip. The sound-generating unit array is used to generate high-quality audio signals according to the driving signal. It includes multiple pixel sound-generating units, each of which is connected to the driver chip via a cable to receive the driving signal. The driver chip is used to generate and control the driving signal to drive the sound-generating unit array of the digital sound chip 10 to emit sound.

[0031] The substrate 30 is preferably a circuit board. In this embodiment, the sound-emitting unit array is fixed on the substrate 30 by welding or plugging to ensure a stable and reliable electrical connection between the digital sound-emitting chip 10 and the substrate 30.

[0032] The horn 20 is arranged around the digital sound chip 10 for sound amplification. In this embodiment, there is one digital sound chip 10 and one horn 20, which is arranged around the digital sound chip 10.

[0033] The bottom surface of the horn 20 is flush with the bottom surface of the digital sound chip 10, and the opening direction of the horn 20 is consistent with the normal of the digital sound chip 10. In this embodiment, the horn 20 is directly fixed to the substrate 30, for example, inserted into a specially provided mounting base on the substrate 30, so as to firmly fix the substrate 30 and the horn 20 together, and to achieve that the bottom surface of the horn 20 is flush with the bottom surface of the digital sound chip 10.

[0034] The shape of the bottom cross-section of the horn 20 can be circular or a centrally symmetrical polygon (such as a rectangle).

[0035] In this embodiment, the height of the horn 20 is between 0.2cm and 50cm; the expansion angle at the bottom of the horn 20 (i.e., the angle between the horn's cross-section at the bottom and the horizontal plane) is between 20° and 90°, which is used to achieve a focusing effect for sound production; the vertical cross-sectional shape of the horn 20 is exponential, hyperbolic, parabolic, etc.

[0036] Second embodiment: A digital sound chip assembly

[0037] like Figure 2 The diagram shows a digital sound-generating chip assembly according to a second embodiment of the present invention. Its structure is essentially the same as that of the digital sound-generating chip assembly in the first embodiment of the present invention, including a digital sound-generating chip 10' and a horn 20'. The digital sound-generating chip 10' is fixed on a substrate 30' and includes a sound-generating unit array and a driving chip. The sound-generating unit array includes multiple pixel sound-generating units. Each pixel sound-generating unit can, for example, employ a CMUT (Capacitive Micromechanical Ultrasonic Transducer) structure to receive driving signals from the driving chip via a cable.

[0038] The difference between the digital sound-generating chip assembly of the second embodiment of the present invention and the digital sound-generating chip assembly of the first embodiment of the present invention is that, in this embodiment, since there are multiple digital sound-generating chips 10', the horn includes conventional horns 21' respectively disposed around each digital sound-generating chip 10'.

[0039] Because the digital sound-generating chips 10' form a multi-row, multi-column array, the conventional horn 21' also has multiple rows and columns. That is, when multiple digital sound-generating chips 10' are cascaded, each digital sound-generating chip 10' combined with the horn 20' forms a unit, and multiple units are cascaded to form a sound-generating unit array.

[0040] In this embodiment, the horn 20' may further include a large horn structure 22' formed by extending a portion of the conventional horn at the outermost digital sound chip 10', thus creating a common periphery for all digital sound chips 10'. The height of the large horn structure 22' is greater than the height of the conventional horn 21'.

[0041] In this embodiment, the horn 20' is directly fixed to the substrate 30', for example, by inserting it into a specially provided mounting base on the substrate 30', so as to securely fix the substrate 30' and the horn 20' together and make the bottom surface of the horn 20' flush with the bottom surface of the digital sound chip 10'.

[0042] In this embodiment, the height of the horn 20' is between 0.2cm and 50cm; the expansion angle at the bottom of the horn 20' (i.e., the angle between the horn's cross-section at the bottom and the horizontal plane) is between 20° and 90°, used to achieve a focusing effect for sound production; the vertical cross-sectional shape of the horn 20' is exponential, hyperbolic, parabolic, etc.; the shape of the bottom cross-section of the horn 20' can be circular or a centrally symmetrical polygon (such as a rectangle).

[0043] Third embodiment: A digital sound chip assembly

[0044] like Figure 3 The diagram shown is a structural schematic of a digital sound-generating chip assembly according to an embodiment of the present invention, excluding the digital sound-generating chip. Figure 3 As shown, the difference between the digital sound chip assembly and the first embodiment of this utility model lies in the connection method between the digital sound chip and the horn.

[0045] Specifically, the digital sound-generating chip assembly includes, in addition to the digital sound-generating chip (not shown) and the horn 20” fixed on the substrate, a horn support structure 40” fixedly connected to the horn 20”, so that the horn 20” and the horn support structure 40” together define a receiving cavity. The horn 20” is fixedly connected to the horn support structure 40” via an insert 23” and / or a stud.

[0046] In this embodiment, there is one digital sound chip and one horn 20, which are disposed around the digital sound chip.

[0047] In this embodiment, the height of the horn 20” is between 0.2cm and 50cm; the expansion angle at the bottom of the horn 20” (i.e., the angle between the horn's cross-section at the bottom and the horizontal plane) is between 20° and 90°, which is used to achieve a focusing effect for sound production; the vertical cross-sectional shape of the horn 20” is exponential, hyperbolic, parabolic, etc.; the shape of the bottom cross-section of the horn 20” can be circular or a centrally symmetrical polygon (such as a rectangle).

[0048] In this embodiment, the substrate is housed in the cavity defined by the horn 20” and the horn support structure 40”, and is supported and fixed by a plurality of adjustable brackets 41”. The bottom of the plurality of adjustable brackets 41” is fixed to the bottom surface of the horn support structure 40”, and the height of the adjustable brackets is adjustable to facilitate fine adjustment of the height and orientation of the digital sound chip, thereby firmly fixing the digital sound chip and the horn 20” together, and achieving optimal adjustment of the relative height between the bottom surface of the horn 20” and the diaphragm of the digital sound chip, so as to achieve the best sound amplification effect.

[0049] The digital sound chip component of this invention can be used in devices that use digital sound chips, such as headphones and speakers.

[0050] The following is combined with Figures 4A-4F This explains the effect of incorporating a horn structure in the digital sound-generating chip assembly of this utility model. Among other things, Figures 4A-4C The diagram shows the sound pressure level of an existing digital sound chip (bare chip), in which... Figure 4A This is a vibration signal diagram of a pulse signal. Figure 4B The vibration signal diagram is for a 2kHz signal. Figure 4C This is a graph showing the sound pressure level results at different frequencies. Figures 4D-4F The diagram shows the sound pressure level effect of the digital sound-generating chip assembly (with a horn and a bend coefficient of 0.04) of this invention. Figure 4D This is a vibration signal diagram of a pulse signal. Figure 4E The vibration signal diagram is for a 2kHz signal. Figure 4F This is a graph showing the sound pressure level results at different frequencies.

[0051] Figures 4A-4F This invention demonstrates that by adding a horn around the perimeter of the original digital sound chip structure, the sound pressure level of the digital sound chip can be increased by 10-15 dB in a small volume, thus solving the problem of low sound pressure level in existing digital sound chips.

[0052] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various variations can be made to the above embodiments of this utility model. All simple and equivalent changes and modifications made based on the claims and description of this utility model application fall within the protection scope of the claims of this utility model patent. Any aspects not described in detail in this utility model are conventional technical content.

Claims

1. A digital sound chip assembly, comprising: include: A digital sound-generating chip, which is fixed on a substrate; and The bottom surface of the horn is flush with the bottom surface of the digital sound chip, and the direction of its opening is consistent with the normal of the digital sound chip.

2. The digital sound chip assembly of claim 1, wherein, The number of horns is one, and it is located on the periphery of the digital sound chip.

3. The digital sound chip assembly of claim 1, wherein, The number of digital sound-producing chips is multiple, and the horn includes conventional horns respectively disposed around each digital sound-producing chip.

4. The digital sound chip assembly of claim 3, wherein, The horn also includes a large horn structure formed by extending a portion of the conventional horn at the outermost digital sound chip, creating a common periphery for all digital sound chips; and / or The conventional horn is arranged in multiple rows and columns.

5. The digital sound chip assembly of claim 1, wherein, The horn is inserted and fixed on the mounting base of the base plate.

6. The digital sound chip assembly of claim 1, wherein, It also includes a horn support structure fixedly connected to the horn, so as to define a receiving cavity together by the horn and the horn support structure; the base plate is accommodated in the receiving cavity defined by the horn and the horn support structure, and is supported and fixed by a plurality of adjustable brackets; the bottom of the adjustable bracket is fixed to the bottom surface of the horn support structure, and the height of the adjustable bracket is adjustable.

7. The digital sound chip assembly of claim 1, wherein, The horn is fixedly connected to the horn support structure through inserts and / or studs.

8. The digital sound chip assembly of claim 1, wherein, The horn satisfies at least one of the following conditions: a1) The height of the horn is between 0.2cm and 50cm; a2) The expansion angle at the bottom of the horn is between 20° and 90°; a3) The vertical cross-sectional shape of the horn is one of the following: exponential, hyperbolic, or parabolic. a4) The shape of the bottom cross-section of the horn is circular or a centrally symmetrical polygon.

9. The digital sound chip assembly of claim 1, wherein, The digital sound chip includes a sound unit array and a driver chip, and the sound unit array includes multiple pixel sound units.

10. The digital sound chip assembly of claim 1, wherein, The digital sound chip assembly is used in headphones or speakers.

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