Storage box blanking clamp of LED die bonder

Abstract

The utility model discloses a storage box blanking clamp of a light-emitting diode (LED) die bonder, which comprises a bottom plate, a backup plate arranged on the bottom plate and an elastic sheet mounting frame positioned on the left side and / or the right side of the backup plate, an upper elastic sheet arranged on the elastic sheet mounting frame, a corner part capable of pressing a substrate storage box positioned between the backup plate and the upper elastic sheet, and a lower elastic sheet arranged on the corner part, the distance between the upper edge of the upper elastic piece and the backup plate is larger than the left-right width of the substrate storage box. When the substrate storage box is used, a certain force is adopted, the filled substrate storage box is pulled upwards, the substrate storage box can be pulled out upwards, an empty substrate storage box is pushed downwards from the upper direction of the bottom plate, the substrate storage box can be placed in the space between the elastic piece installation frame and the backup plate, and convenience and rapidness are achieved.

Description

Technical Field

[0001] This utility model relates to the field of LED light strip production technology, and in particular to a storage box unloading clamp for an LED die bonder. Background Technology

[0002] LED die bonders play a crucial role in the production of LED light strips. The purpose of an LED die bonder is to fix semiconductor chips onto a packaging substrate or lead frame.

[0003] Existing LED die bonders all use a square substrate storage box to hold the packaged substrates. During the operation of the die bonder, when the substrate storage box is full of packaged substrates, it needs to be replaced. However, many substrate storage boxes are locked during operation, and they need to be unlocked before replacement, which makes replacing the substrate storage box inconvenient. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a storage box unloading clamp for an LED die bonder that facilitates the replacement of the substrate storage box.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows:

[0006] A substrate storage box unloading clamp for an LED die bonder includes a base plate, a backing plate disposed on the base plate, and a spring clip mounting bracket located on the left and / or right side of the backing plate. The spring clip mounting bracket is provided with an upper spring clip, which has a corner portion capable of pressing the substrate storage box located between the backing plate and the upper spring clip. The distance between the upper edge of the upper spring clip and the backing plate is greater than the left and right width of the substrate storage box.

[0007] In a preferred embodiment of this utility model, the lower part of the upper spring sheet is connected and fixed to the spring sheet mounting bracket, and the spring sheet mounting bracket is also provided with a lower spring sheet. The lower spring sheet is located below the upper spring sheet and the upper part of the lower spring sheet is connected and fixed to the spring sheet mounting bracket. The upper spring sheet and the lower spring sheet are mirror symmetrical.

[0008] In a preferred embodiment of this utility model, the spring plate mounting bracket is provided with a cylindrical arc surface, the axis of which is a horizontal line extending in the front-back direction. The lower part of the upper spring plate has a bent plate portion that is in contact with the cylindrical arc surface. The cylindrical arc surface is provided with a fastening hole, and the bent plate portion is provided with an elongated hole arranged in the up-down direction. The bracket also includes a second fastener, which cooperates with the elongated hole and the fastening hole to lock the bent plate portion and the spring plate mounting bracket.

[0009] In a preferred embodiment of this utility model, the backing plate is a vertical plate, and the number of the spring clip mounting brackets is two. The two spring clip mounting brackets are located on the left and right sides of the vertical plate, respectively, and each vertical plate is provided with an upper spring clip and a lower spring clip.

[0010] The beneficial effects of this utility model are: In this mechanism, by using a certain force to pull the filled substrate storage box upward, the substrate storage box can be pulled upward and an empty substrate storage box can be pushed downward from above the base plate to insert the substrate storage box into the space between the spring plate mounting bracket and the back plate. This is convenient and quick, and it is also convenient to use a robotic arm to automatically disassemble and assemble the substrate storage box. Attached Figure Description

[0011] Figure 1 This is a perspective view of the present invention;

[0012] Figure 2 This is a front view of the LED die bonder feeding mechanism that applies this utility model;

[0013] Figure 3 This is a schematic diagram of the connection structure between the upper spring clip, the lower spring clip, and the spring clip mounting bracket;

[0014] Figure 4 It is an exploded view of the connection structure between the upper spring, the lower spring, and the spring mounting bracket. Detailed Implementation

[0015] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings.

[0016] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached drawings). If the specific posture changes, the directional indicator will also change accordingly. Furthermore, descriptions involving "preferred," "second-preferred," etc., in this utility model are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "preferred" or "second-preferred" may explicitly or implicitly include at least one of those features.

[0017] Reference Figures 1 to 4 This utility model proposes a storage box unloading clamp for an LED die bonder, including a base plate 2, a backing plate 21 and a spring clip mounting bracket 7 located on the left and / or right side of the backing plate 21. The spring clip mounting bracket 7 is provided with an upper spring clip 81, and the upper spring clip 81 has a corner portion 811 that can press the substrate storage box 3 located between the backing plate 21 and the upper spring clip 81. The distance between the upper edge of the upper spring clip 81 and the backing plate 21 is greater than the left and right width of the substrate storage box 3.

[0018] Preferably, the lower end of the upper spring piece 81 is fixed to the spring piece mounting bracket 7. The spring piece mounting bracket 7 is also provided with a lower spring piece 82 located below the upper spring piece 81. The upper spring piece 81 and the lower spring piece 82 are mirror-symmetrical. The mirror-symmetrical plane between the two is a horizontal plane. The backing plate 21 is a vertical plate, and there are two spring piece mounting brackets 7. The two spring piece mounting brackets 7 are located on the left and right sides of the vertical plate, respectively. Each vertical plate is provided with an upper spring piece 81 and a lower spring piece 82.

[0019] When this unloading gripper is used on a die bonder, a motor or a cylinder can be used as the power source to drive the entire unloading gripper to move up and down. The substrate storage box is placed between the upper spring 81 and the backing plate 21 and is pressed by the upper spring. The substrate storage box is square-shaped, with a workpiece loading inlet at the front end. Straight grooves for supporting the encapsulated substrate are provided on the inner side walls of the left and right sides of the substrate storage box.

[0020] The die-bonded packaging substrate enters the substrate storage box under the drive of the conveyor line, so that the left and right edges of the packaging substrate are supported in the corresponding straight slots. Then, the base plate 2 carries the substrate storage box up or down a certain distance, so that another pair of straight slots moves to a position where the packaging substrate can be loaded. After the packaging substrate is loaded into this pair of straight slots, the base plate carries the substrate storage box up or down a certain distance, and continues to load the packaging substrate with the next pair of straight slots 301... When the substrate storage box is full, the substrate storage box can be pulled upward to overcome the weight of the substrate storage box and the friction of the upper spring 81 and lower spring 82 on the substrate storage box. Then, since the distance between the upper edge of the spring and the backing plate 21 is greater than the left and right width of the substrate storage box, an empty substrate storage box can be directly pushed down from above the base plate 2 to load the substrate storage box into the space between the spring mounting bracket 7 and the backing plate 21. This is convenient and quick, and it is easy to use a robot to automatically load and unload the substrate storage box.

[0021] Furthermore, the spring clip mounting bracket 7 is provided with a cylindrical arc surface 72, the axis of which extends along the front-to-back direction. The lower part of the upper spring clip 81 has a bent plate portion 812 that abuts against the cylindrical arc surface 72. The cylindrical arc surface 72 is provided with a fastening hole 73, and the bent plate portion 812 is provided with an elongated hole 813 arranged along the vertical direction and aligned with the fastening hole 73. The bent plate portion 812 and the spring clip mounting bracket 7 are locked together by a second fastener 62, which passes through the elongated hole 813 and engages with the fastening hole 73. In this design, the tightness of the upper spring clip 81 clamping the substrate storage box can be adjusted without changing the position of the spring clip mounting bracket 7. The specific adjustment method is as follows: the second fastener 62 is a screw, and the fastening hole 73 is a corresponding screw hole 23. When it is necessary to adjust the tightness of the upper spring 81, the second fastener 62 can be loosened, and then the upper spring 81 can be pushed along the cylindrical arc surface 72 to rotate the upper spring 81 to a certain angle. When the upper spring 81 is adjusted to the appropriate position, the second fastener 62 can be tightened.

[0022] To facilitate adjustment of the tightness of the lower spring 82, the lower spring 82 can also adopt the same mounting structure as the upper spring 81.

[0023] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A dispensing gripper of a receiving box of an LED die bonder, characterized in that, Includes a base plate (2), a back plate (21) disposed on the base plate (2), and a spring plate mounting bracket (7) located on the left and / or right side of the back plate (21). The spring plate mounting bracket (7) is provided with an upper spring plate (81). The upper spring plate (81) has a corner portion (811) that can press the substrate storage box (3) located between the back plate (21) and the upper spring plate (81). The distance between the upper edge of the upper spring plate (81) and the back plate (21) is greater than the left and right width of the substrate storage box (3).

2. The unloading clamp of the receiving box of the LED die bonder according to claim 1, wherein, The lower part of the upper spring piece (81) is connected and fixed to the spring piece mounting bracket (7). The spring piece mounting bracket (7) is also provided with a lower spring piece (82). The lower spring piece (82) is located below the upper spring piece (81) and the upper part of the lower spring piece (82) is connected and fixed to the spring piece mounting bracket (7). The upper spring piece (81) and the lower spring piece (82) are mirror symmetrical.

3. The unloading clamp of the receiving box of the LED die bonder according to claim 1, wherein The spring plate mounting bracket (7) is provided with a cylindrical arc surface (72), the axis of which is a horizontal line extending in the front-back direction. The lower part of the upper spring plate (81) has a bent plate portion (812) that is in contact with the cylindrical arc surface (72). The cylindrical arc surface (72) is provided with a fastening hole (73). The bent plate portion (812) is provided with an elongated hole (813) arranged in the up-down direction. It also includes a second fastener (62), which cooperates with the elongated hole (813) and the fastening hole (73) to lock the bent plate portion (812) and the spring plate mounting bracket (7).

4. The unloading clamp of the receiving box of the LED die bonder according to claim 2, wherein, The backing plate (21) is a vertical plate, and there are two spring plate mounting brackets (7). The two spring plate mounting brackets (7) are located on the left and right sides of the vertical plate respectively. Each vertical plate is provided with an upper spring plate (81) and a lower spring plate (82).

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