Layout structure of four-head vertical separation sheet inserting machine

Abstract

The utility model belongs to the technical field of wafer inserting machines, and particularly relates to a layout structure of a four-head vertical separating wafer inserting machine, which comprises wafer separating conveying lines, a blue filling line, a blue returning line and a blue changing manipulator mechanism, four wafer separating conveying lines are sequentially arranged in parallel along the x-axis direction, and each wafer separating conveying line is used for conveying silicon wafers along the y-axis direction; the full blue line and the back blue line are arranged side by side in the x-axis direction and located on one side of any fragment conveying line in the y-axis direction. One end of the basket changing mechanical arm mechanism is erected above the four piece separating conveying lines, the other end of the basket changing mechanical arm mechanism is erected above the basket full line and the basket returning line, and the basket changing mechanical arm mechanism is used for carrying baskets among the piece separating conveying lines, the basket full line and the basket returning line. According to the utility model, the reasonable equipment layout is adopted, so that the cooperative work among all production lines and mechanisms is ensured, the influence on the operation due to the limited plant space is reduced, and the space utilization maximization and the productivity maximization are further realized.

Description

Technical Field

[0001] This utility model relates to the field of chip inserter technology, and in particular to the layout structure of a four-head vertical chip inserter. Background Technology

[0002] In the precision machining industry of semiconductor materials (such as silicon wafers), the accuracy of equipment layout is extremely high. Equipment layout forms the foundation of the overall equipment architecture, and its rationality has a crucial impact on the machine's performance, stability, and efficiency. Improper equipment layout can not only lead to unnecessary interference between components, causing damage to the equipment itself, but also potentially damage the silicon wafers during processing, directly reducing production efficiency and the yield of the final product. Utility Model Content

[0003] The technical problem to be solved by this utility model is: in order to solve the technical problem of damage to silicon wafers or equipment bodies and low production efficiency caused by improper layout in the prior art, this utility model provides a layout structure of a four-head vertical wafer inserter to improve production efficiency and reduce the breakage rate.

[0004] The technical solution adopted by this utility model to solve its technical problem is: a layout structure of a four-head vertical chip inserter, which includes: a chip conveyor line, a full-blue line, a return-blue line, and a blue-changing robotic arm mechanism.

[0005] The wafer conveying lines are arranged in parallel along the x-axis, and each wafer conveying line is used to convey silicon wafers along the y-axis.

[0006] The full blue line and the return blue line are arranged side by side along the x-axis and located on one side of any of the segmented conveyor lines along the y-axis.

[0007] One end of the basket-changing robot is mounted above the four segmented conveyor lines, and the other end of the basket-changing robot is mounted above the full basket line and the return basket line. The basket-changing robot is used to transport flower baskets between the segmented conveyor lines, the full basket line, and the return basket line.

[0008] The specific technical effects are as follows: by adopting a parallel design of four slab conveyor lines, multiple silicon wafers can be conveyed and processed simultaneously, improving the processing speed and production efficiency of silicon wafers; the parallel setting of the full blue line and the return blue line, as well as the efficient handling capability of the blue changing robot mechanism, ensure that the various production lines and mechanisms work together in a reasonable layout, reducing the impact of limited factory space on operation, thereby maximizing space utilization and production capacity.

[0009] Furthermore, two of the segmented conveyor lines form a first conveyor line group, and the other two segmented conveyor lines form a second conveyor line group. The first conveyor line group and the second conveyor line group are symmetrically arranged about the x-axis symmetry line.

[0010] The specific technical effects are: the symmetrical design makes the conveyor line group more compact and reasonable in layout, effectively utilizes production space, reduces interference and conflict between conveyor lines, and improves the smoothness and coordination of the entire production line.

[0011] Furthermore, a first channel is formed between the first conveyor line group and the second conveyor line group for the feeding trolley to pass through. The projection distance of the first channel along the x-axis is L1, and the range of L1 is 600mm to 700mm.

[0012] The specific technical effect is that the range of L1 is designed to be 600mm to 700mm in order to allow the feeding trolley to pass through, which facilitates the feeding trolley to feed materials onto the segmented conveyor line and improves production efficiency.

[0013] Furthermore, the projected distance of the basket-changing robotic arm mechanism along the x-axis is equal to the sum of the projected distances of the first channel and the four segmented conveyor lines along the x-axis.

[0014] The specific technical effect is that this design ensures that the movement range of the basket-changing robotic arm can cover all four slab conveyor lines.

[0015] Furthermore, each of the segmented conveyor lines includes a feeding trough, a straightening and guiding conveyor mechanism, a segmentation reversing mechanism, and an insert conveyor mechanism arranged sequentially on the feeding trough along the y-axis. The full blue line and the return blue line are located on one side of any of the feeding troughs and are close to the insert conveyor mechanism. One end of the blue changing robot arm mechanism is mounted above the four insert conveyor mechanisms.

[0016] The specific technical effects are as follows: The straightening and guiding conveyor mechanism, the wafer slicing and reversing mechanism, and the wafer insertion conveyor mechanism are all located within the feeding water tank. After the silicon wafers are cleaned by the washing machine, water can flow directly into the feeding water tank during the guiding conveyor, wafer slicing and reversing, and wafer insertion processes, effectively preventing water from wetting other production areas and ensuring a clean and safe production environment. The straightening and guiding conveyor mechanism receives the silicon wafers fed by the feeding trolley and straightens them, ensuring that the silicon wafers are conveyed to the wafer slicing and reversing mechanism in the correct posture and position, improving the accuracy of subsequent wafer slicing and thus reducing the breakage rate. The wafer slicing and reversing mechanism slices the silicon wafers in the material frame and converts them from a vertical to a horizontal orientation, preparing them for wafer insertion. The wafer insertion conveyor mechanism conveys the silicon wafers horizontally and inserts them into the wafer basket. This structural setup automates the entire process of silicon wafer production, from feeding to straightening, wafer slicing and reversing, and finally wafer insertion, reducing manual intervention and improving silicon wafer production efficiency.

[0017] Furthermore, the straightening and guiding conveying mechanism includes a bottom conveying front section and a bottom conveying rear section arranged sequentially along the y-axis, as well as a straightening and guiding mechanism located above the bottom conveying front section and a clamping conveying mechanism located above the bottom conveying rear section. The clamping conveying mechanism is located close to the segmented reversing mechanism.

[0018] The specific technical effects are as follows: By setting up a bottom conveyor front section and a bottom conveyor rear section, the material frame is placed above the bottom conveyor front section and the bottom conveyor rear section. The two sections work together to support the material frame and achieve stable conveying of silicon wafers. The straightening and guiding mechanism is set above the bottom conveyor front section and located on both sides of the material frame. It plays a straightening role during the silicon wafer conveying process, ensuring the accuracy of the silicon wafer conveying direction. The clamping and conveying mechanism is set above the bottom conveyor rear section and close to the slitting and reversing mechanism. This mechanism is used to clamp both sides of the silicon wafer, preventing the silicon wafer from shifting or tilting during the conveying process. It ensures that the silicon wafer is conveyed to the slitting and reversing mechanism in the correct posture and position. Through the synergistic effect of the above mechanisms, the accuracy of subsequent slitting operations can be effectively improved, thereby reducing the breakage rate of silicon wafers during the production process.

[0019] Furthermore, the layout structure also includes a two-axis robotic arm mechanism, which is mounted above the four bottom conveyor front sections and is used to convey the material frame in the x-axis and z-axis directions.

[0020] The specific technical effect is that by installing two-axis robotic arms above the four bottom conveyor front sections, the material frame is conveyed in the x-axis and z-axis directions to transport the material frame from the feeding trolley to the bottom conveyor front section, realizing automatic feeding operation in the production process and effectively improving feeding efficiency.

[0021] Furthermore, the wafer reversing mechanism includes: a water-absorbing plate lifting assembly, an arc-shaped ramp reversing assembly, and an air knife assembly. The water-absorbing plate lifting assembly is vertically arranged at the lower end of the arc-shaped ramp reversing assembly to receive a silicon wafer conveyed by the straightening and guiding conveying mechanism and lift the silicon wafer vertically. The top end of the arc-shaped ramp reversing assembly outputs the lifted and ramped silicon wafer horizontally. The air knife assembly is installed on the arc-shaped ramp reversing assembly and is used to blow air onto the silicon wafer.

[0022] The specific technical effect is as follows: The water absorption plate lifting component utilizes the surface tension and adsorption of water to adsorb the vertically arranged silicon wafers onto the water absorption plate lifting component, and then lifts them upward to the arc-shaped ramp reversing component. The airflow blown by the air knife component can press the silicon wafers onto the arc-shaped ramp reversing component to prevent them from falling off during the ramping process. On the other hand, it can remove moisture from the surface of the silicon wafers. The arc-shaped ramp reversing component converts the silicon wafers from a vertical to a horizontal arrangement, realizing the reversing function of the silicon wafers, and thus preparing for the subsequent wafer insertion process.

[0023] Furthermore, the insert conveying mechanism includes an insert conveying section and an insert platform arranged sequentially along the y-axis. The insert conveying section is connected to the end of the insert reversing mechanism. The full blue line and the return blue line are located on one side of any one of the insert platforms. One end of the blue changing robot arm mechanism is mounted above the insert platform.

[0024] The specific technical effect is as follows: the wafer insertion conveyor section is close to the wafer reversing mechanism, which ensures that the silicon wafers can be quickly and accurately transported to the wafer insertion platform after reversing. The wafer insertion platform is equipped with baskets for receiving silicon wafers. When a silicon wafer is inserted into the basket, the wafer insertion platform will automatically lift the basket by one layer to prepare for the insertion of the next silicon wafer, until the basket is fully loaded. This design not only improves loading efficiency, but also ensures that the silicon wafers are neatly arranged in the basket, avoiding damage to the silicon wafers caused by stacking.

[0025] Furthermore, the blue-changing robotic arm mechanism includes: a first x-axis guide rail, a second x-axis guide rail, a y-axis guide rail, a lifting slider, a z-axis guide rail, and a handling robotic arm. The first x-axis guide rail is arranged horizontally across the four segmented conveyor lines along the x-axis direction. The second x-axis guide rail is arranged horizontally across the full blue line and the return blue line along the x-axis direction. The y-axis guide rail is mounted on the first x-axis guide rail and the second x-axis guide rail and can move along the first x-axis guide rail and the second x-axis guide rail. The lifting slider is slidably mounted on the y-axis guide rail. The z-axis guide rail is slidably connected to the lifting slider along the z-axis direction. The handling robotic arm is mounted on the lower end of the z-axis guide rail.

[0026] The specific technical effects are as follows: The first and second x-axis guide rails are set across the top of the four segmented conveyor lines. In order to meet the handling of flower baskets on the four segmented conveyor lines, a handling robot is set up to grab empty or full flower baskets. In conjunction with the y-axis guide rail, lifting slider and z-axis guide rail, the handling needs of flower baskets at different heights and positions can be met. It realizes the ability to move in the x, y and z directions, improves handling efficiency, shortens the basket changing time and increases production capacity.

[0027] Compared with the prior art, the beneficial effects of this utility model are:

[0028] This invention employs a parallel design of four slab conveyor lines, enabling the simultaneous conveying and processing of multiple silicon wafers, thereby improving wafer processing speed and production efficiency. The parallel arrangement of the full-blueing line and the return-blueing line, along with the efficient handling capability of the blueing robot mechanism, ensures coordinated operation between various production lines and mechanisms through a rational equipment layout. This reduces operational disruptions caused by limited factory space, thus maximizing space utilization and production capacity. Attached Figure Description

[0029] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0030] Figure 1 This is a schematic diagram of the layout structure of the four-head vertical chip inserter of this utility model.

[0031] Figure 2 for Figure 1 The main view.

[0032] Figure 3 for Figure 1 Top view.

[0033] Figure 4 This is a schematic diagram of the segmented conveyor line of this utility model.

[0034] Figure 5 This is a schematic diagram of the structure of the bottom conveying front section and the bottom conveying rear section of this utility model.

[0035] Figure 6 This is a schematic diagram of the straightening and guiding mechanism of this utility model.

[0036] Figure 7 This is a schematic diagram of the clamping and conveying mechanism of this utility model.

[0037] Figure 8 This is a schematic diagram of the segmented reversing mechanism of this utility model.

[0038] Figure 9 This is a schematic diagram of the insert conveying mechanism of this utility model.

[0039] In the diagram: 1. Segmented conveyor line; 101. Feeding trough; 102. Straightening and guiding conveyor mechanism; 1021. Bottom conveyor front section; 1022. Bottom conveyor rear section; 1023. Straightening and guiding mechanism; 1024. Clamping conveyor mechanism; 103. Segmented reversing mechanism; 1031. Water suction plate lifting assembly; 1032. Arc-shaped climbing reversing assembly; 1033. Air knife assembly; 104. Insertion plate conveying mechanism; 1041. Insertion plate conveying section; 1042. Insertion plate platform; 2. Full blue line; 3. Return blue line; 4. Blue changing robot mechanism; 401. First x-axis guide rail; 402. Second x-axis guide rail; 403. Y-axis guide rail; 404. Lifting slider; 405. Z-axis guide rail; 406. Handling robot; 5. Feeding trolley; 501. First channel; 6. Two-axis robot mechanism. Detailed Implementation

[0040] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0041] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0042] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0043] like Figures 1 to 9The diagram shows the preferred embodiment of this utility model. The layout structure of the four-head vertical wafer inserter in this embodiment includes: a wafer conveying line 1, a full-blue line 2, a return-blue line 3, and a basket-changing robot mechanism 4. Four wafer conveying lines 1 are arranged in parallel along the x-axis direction, and each wafer conveying line 1 is used to convey silicon wafers along the y-axis direction. The full-blue line 2 and the return-blue line 3 are arranged side by side along the x-axis direction and located on one side of any wafer conveying line 1 along the y-axis direction. One end of the basket-changing robot mechanism 4 is mounted above the four wafer conveying lines 1, and the other end of the basket-changing robot mechanism 4 is mounted above the full-blue line 2 and the return-blue line 3. The basket-changing robot mechanism 4 is used to move baskets between the wafer conveying lines 1, the full-blue line 2, and the return-blue line 3.

[0044] In this embodiment, two segmented conveyor lines 1 form a first conveyor line group, and the other two segmented conveyor lines 1 form a second conveyor line group. The first conveyor line group and the second conveyor line group are symmetrically arranged about the x-axis symmetry line.

[0045] Therefore, the symmetrical design makes the conveyor line group more compact and reasonable in layout, effectively utilizes production space, reduces interference and conflict between conveyor lines, and improves the smoothness and coordination of the entire production line.

[0046] In this embodiment, a first channel 501 is formed between the first conveyor line group and the second conveyor line group for the feeding trolley 5 to pass through. The projection distance of the first channel 501 along the x-axis is L1, and the range of L1 is 600mm to 700mm.

[0047] Therefore, the range of L1 is designed to be 600mm to 700mm in order to allow the feeding trolley 5 to pass through and facilitate the feeding of materials from the feeding trolley 5 to the segmented conveyor line 1, thereby improving production efficiency.

[0048] Specifically, the feeding trolley 5 adopts an AGV (Automated Guided Vehicle) feeding trolley 5.

[0049] In this embodiment, the sum of the projection distances along the x-axis between the first channel 501 and the four segmented conveyor lines 1 is L2. The range of L2 is designed to be 3300mm to 3800mm in order to ensure that all four segmented conveyor lines 1 can connect to the cleaning machine of the previous process.

[0050] In this embodiment, the projected distance of the blue-changing robotic arm mechanism 4 along the x-axis is greater than or equal to the sum of the projected distances of the first channel 501 and the four segmented conveyor lines 1 along the x-axis.

[0051] Therefore, this design ensures that the movement range of the basket changing robot 4 can cover all four slab conveyor lines 1.

[0052] In this embodiment, each segmented conveyor line 1 includes a feeding trough 101, a straightening and guiding conveyor mechanism 102, a segmented reversing mechanism 103, and a segmented conveyor mechanism 104 arranged sequentially on the feeding trough 101 along the y-axis. The full blue line 2 and the return blue line 3 are located on one side of any feeding trough 101 and close to the segmented conveyor mechanism 104. One end of the blue changing robot arm mechanism 4 is mounted above the four segmented conveyor mechanisms 104.

[0053] Therefore, the straightening and guiding conveyor mechanism 102, the wafer slitting and reversing mechanism 103, and the wafer insertion conveyor mechanism 104 are arranged inside the feeding water tank 101. After the silicon wafers are cleaned by the cleaning machine, water can flow directly into the feeding water tank 101 during the guiding conveyor, wafer slitting and reversing, and wafer insertion processes, effectively preventing water from wetting other production areas and ensuring a clean and safe production environment. The straightening and guiding conveyor mechanism 102 is used to receive the silicon wafers fed by the feeding trolley 5 and straighten them to ensure that the silicon wafers are conveyed to the wafer slitting and reversing mechanism 103 in the correct posture and position, improving the accuracy of subsequent wafer slitting and reducing the breakage rate. The wafer slitting and reversing mechanism 103 is used to slit the silicon wafers in the material frame and change the silicon wafers from a vertical direction to a horizontal direction, so that the silicon wafers are ready for insertion. The wafer insertion conveyor mechanism 104 is used to convey the silicon wafers horizontally and insert them into the basket. This structure realizes the entire automated process of silicon wafers from feeding to straightening to wafer slitting and reversing to wafer insertion, reducing manual intervention and improving the production efficiency of silicon wafers.

[0054] In this embodiment, the straightening and guiding conveying mechanism 102 includes a bottom conveying front section 1021 and a bottom conveying rear section 1022 arranged sequentially along the y-axis, as well as a straightening and guiding mechanism 1023 located above the bottom conveying front section 1021 and a clamping conveying mechanism 1024 located above the bottom conveying rear section 1022. The clamping conveying mechanism 1024 is located close to the segmentation and reversing mechanism 103.

[0055] For details, see Figure 6 As shown, the straightening and guiding mechanism 1023 includes two straightening belts, which are located on both sides above the bottom conveying front section 1021. When the material frame is placed on the bottom conveying front section 1021, the two straightening belts clamp the two sides of the silicon wafer respectively, and play a straightening role in the silicon wafer during the conveying process.

[0056] In this embodiment, the projection distance along the y-axis between one end of the straightening guide mechanism 1023 and the inner wall of one end of the feeding water tank 101 is L3. The range of L3 is designed to be 250mm to 320mm in order to avoid the overflow port in the feeding water tank 101.

[0057] For details, see Figure 7As shown, the clamping and conveying mechanism 1024 includes two clamping conveying belts. The two clamping conveying belts are located on both sides above the bottom conveying rear section 1022. When the material frame is conveyed to the bottom conveying rear section 1022, the two clamping conveying belts clamp the two sides of the silicon wafer respectively to prevent the silicon wafer from shifting or tilting during the conveying process, and to ensure that the silicon wafer is conveyed to the slitting and reversing mechanism 103 in the correct posture and position.

[0058] Therefore, by setting up a bottom conveying front section 1021 and a bottom conveying rear section 1022, the material frame is placed above the bottom conveying front section 1021 and the bottom conveying rear section 1022. The two together play the role of supporting the material frame and realizing the stable conveying of silicon wafers. The straightening and guiding mechanism 1023 is set above the bottom conveying front section 1021 and located on both sides of the material frame. It plays a straightening role during the silicon wafer conveying process, ensuring the accuracy of the silicon wafer conveying direction. The clamping conveying mechanism 1024 is set above the bottom conveying rear section 1022 and close to the slitting and reversing mechanism 103. This mechanism is used to clamp both sides of the silicon wafer, preventing the silicon wafer from shifting or tilting during the conveying process, and ensuring that the silicon wafer is conveyed to the slitting and reversing mechanism 103 in the correct posture and position. Through the synergistic effect of the above mechanisms, the accuracy of subsequent slitting operations can be effectively improved, thereby reducing the breakage rate of silicon wafers in the production process.

[0059] In this embodiment, the conveying distance of the bottom conveying front section 1021 along the y-axis is 2000mm, and the conveying distance of the bottom conveying rear section 1022 along the y-axis is 700mm.

[0060] Therefore, the conveying distance of the bottom conveying section is 2000mm to meet the conveying length of one and a half pieces of material and the buffer transition of silicon wafers before entering the bottom conveying rear section 1022, and the conveying distance of the bottom conveying rear section 1022 is 700mm to meet the clamping and conveying of half pieces of material.

[0061] In this embodiment, the layout structure also includes a two-axis robotic arm mechanism 6, which is mounted above the four bottom conveyor front sections 1021 and is used to convey the material frame in the x-axis and z-axis directions.

[0062] For details, see Figure 1As shown, the two-axis robotic arm mechanism 6 includes an x-axis guide rail arranged along the x-axis direction. The x-axis guide rail is positioned across the top of the four bottom conveyor front sections 1021. A z-axis lifting assembly is slidably mounted on the x-axis guide rail. A cylinder gripper for gripping the material frame is mounted at the lower end of the z-axis lifting assembly. The z-axis lifting assembly drives the cylinder gripper to move along the z-axis direction. Thus, by mounting a two-axis robotic arm above the four bottom conveyor front sections 1021, the material frame is conveyed in the x-axis and z-axis directions, transporting the material frame from the feeding trolley 5 to the bottom conveyor front sections 1021, realizing automatic feeding operation in the production process and effectively improving feeding efficiency.

[0063] In this embodiment, the wafer reversing mechanism 103 includes: a water-absorbing plate lifting assembly 1031, an arc-shaped ramp reversing assembly 1032, and an air knife assembly 1033. The water-absorbing plate lifting assembly 1031 is vertically disposed at the lower end of the arc-shaped ramp reversing assembly 1032 to receive a silicon wafer conveyed by the straightening and guiding conveying mechanism 102 and lift the silicon wafer vertically. The top end of the arc-shaped ramp reversing assembly 1032 outputs the lifted and ramped silicon wafer horizontally. The air knife assembly 1033 is mounted on the arc-shaped ramp reversing assembly 1032 and is used to blow air onto the silicon wafer.

[0064] For details, see Figure 8 As shown, there are two sets of air knife assemblies 1033. One set of air knife assemblies 1033 is located at the connection between the water absorption plate lifting assembly 1031 and the arc-shaped ramp reversing assembly 1032. This ensures that when the silicon wafer moves from the water absorption plate lifting assembly 1031 to the arc-shaped ramp reversing assembly 1032, it can be pressed against the arc-shaped ramp reversing assembly 1032 by the airflow blown out by the air knife assembly 1033, thus preventing the silicon wafer from falling off during the process of being moved to the arc-shaped ramp reversing assembly 1032. The other air knife assembly 1033 is located on the top of the arc-shaped ramp reversing assembly 1032 to prevent the silicon wafer from falling off during the ramping process.

[0065] Therefore, the water absorption plate lifting assembly 1031 utilizes the surface tension and adsorption of water to adsorb the vertically arranged silicon wafer onto the water absorption plate lifting assembly 1031, and lift it upward to the arc-shaped ramp reversing assembly 1032. The airflow blown by the air knife assembly 1033 can press the silicon wafer onto the arc-shaped ramp reversing assembly 1032 to prevent the silicon wafer from falling off during the ramping process. On the other hand, it can remove moisture from the surface of the silicon wafer. The arc-shaped ramp reversing assembly 1032 changes the silicon wafer from a vertical arrangement to a horizontal arrangement, realizing the reversing function of the silicon wafer, and thus preparing for the subsequent wafer insertion process.

[0066] In this embodiment, see Figure 9As shown, the insert conveying mechanism 104 includes an insert conveying section 1041 and an insert platform 1042 arranged sequentially along the y-axis. The insert conveying section 1041 is connected to the end of the insert reversing mechanism 103. The full blue line 2 and the return blue line 3 are located on one side of any insert platform 1042. One end of the blue changing robot arm mechanism 4 is mounted above the insert platform 1042.

[0067] Therefore, the wafer insertion transport section 1041 is close to the wafer reversing mechanism 103, ensuring that the silicon wafers can be quickly and accurately transported to the wafer insertion platform 1042 after reversing. The wafer insertion platform 1042 contains a basket for receiving silicon wafers. When a silicon wafer is inserted into the basket, the wafer insertion platform 1042 will automatically lift the basket by one layer to prepare for the insertion of the next silicon wafer, until the basket is fully loaded. This design not only improves loading efficiency, but also ensures that the silicon wafers are neatly arranged in the basket, avoiding damage to the silicon wafers caused by stacking.

[0068] In this embodiment, the blue-changing robotic arm mechanism 4 includes: a first x-axis guide rail 401, a second x-axis guide rail 402, a y-axis guide rail 403, a lifting slider 404, a z-axis guide rail 405, and a handling robotic arm 406. The first x-axis guide rail 401 is horizontally arranged above the four segmented conveyor lines 1 along the x-axis direction. The second x-axis guide rail 402 is horizontally arranged above the full blue line 2 and the return blue line 3 along the x-axis direction. The y-axis guide rail 403 is mounted on the first x-axis guide rail 401 and the second x-axis guide rail 402 and can move along the first x-axis guide rail 401 and the second x-axis guide rail 402. The lifting slider 404 is slidably mounted on the y-axis guide rail 403. The z-axis guide rail 405 is slidably connected to the lifting slider 404 along the z-axis direction. The handling robotic arm 406 is mounted on the lower end of the z-axis guide rail 405.

[0069] Specifically, there are two lifting sliders 404, two z-axis guide rails 405, and two handling robots 406. One lifting slider 404, one z-axis guide rail 405, and one handling robot 406 form a full basket handling group for handling fully loaded flower baskets, and the other lifting slider 404, one z-axis guide rail 405, and one handling robot 406 form an empty basket handling group for handling empty flower baskets.

[0070] Preferably, two lifting sliders 404 are mounted side by side on a mounting plate. The mounting plate can slide along the y-axis guide rail 403. When the mounting plate moves the full basket transport group and the empty basket transport group above an insert platform 1042, the full basket transport group completes the transport operation of the full basket from the insert platform 1042. Then, the empty basket transport group places the empty basket on the insert platform 1042, waiting for the next insert operation. With this design, a large-scale movement can be performed in three-dimensional space. Combined with the fine adjustment of the mounting plate in the x-axis and y-axis directions, the replacement of full and empty baskets on an insert platform 1042 can be realized, which improves work efficiency and avoids interference.

[0071] Therefore, the first x-axis guide rail 401 and the second x-axis guide rail 402 are arranged across the top of the four segmented conveyor lines 1. In order to meet the transportation work of flower baskets on the four segmented conveyor lines 1, a handling robot 406 is set to grab empty or full flower baskets. In conjunction with the y-axis guide rail 403, the lifting slider 404 and the z-axis guide rail 405, the transportation needs of flower baskets at different heights and positions can be met. This realizes the ability to move in the x, y and z directions, improves the transportation efficiency, shortens the basket changing time, and increases the production capacity.

[0072] The working process of this utility model is as follows:

[0073] After being cut and cleaned in the previous process, the silicon wafers are placed on the feeding trolley 5. The feeding trolley 5 enters the first channel 501 and is within the grasping range of the two-axis robot arm. The two-axis robot arm grasps the material frame carrying the silicon wafers and moves it according to the program settings into the bottom conveyor front section 1021 of the feeding water tank 101 of a slab conveyor line 1. At this time, the straightening and guiding mechanism 1023 clamps on both sides of the silicon wafer. After the straightening and guiding mechanism 1023 straightens and clamps the wafers in place, the bottom conveyor front section 1021 starts and moves along the y-axis. The bottom conveyor section 1022 conveys silicon wafers. When the silicon wafer enters the bottom conveyor section 1022, the clamping conveyor mechanism 1024 clamps the silicon wafer on both sides and conveys the silicon wafer along the y-axis to the slicing reversing mechanism 103. When the silicon wafer runs to the vicinity of the water absorption plate lifting assembly 1031, the silicon wafer adheres to the water absorption plate lifting assembly 1031 due to the adsorption force of the water. The water absorption plate lifting assembly 1031 drives the silicon wafer to rise to the arc-shaped ramp reversing assembly 1032. (It should be noted that after the previous silicon wafer is absorbed by the water absorption plate...) The lifting assembly 1031 lifts the wafer to the curved ramp reversing assembly 1032, and the clamping conveyor mechanism 1024 continues to convey the wafer forward by the distance of one piece, so that the next wafer is attached to the water-absorbing plate lifting assembly 1031, until all wafers in the material frame are separated. The airflow blown by the air knife assembly 1033 presses the wafer onto the curved ramp reversing assembly 1032, which converts the wafer from a vertical position to a horizontal position. The wafer insertion conveyor section 1041 then places the wafer horizontally. The silicon wafers are transported to the insertion platform 1042, which contains a basket for receiving silicon wafers. When a silicon wafer is inserted into the basket, the insertion platform 1042 automatically lifts the basket by one layer to prepare for the insertion of the next silicon wafer, until the basket is fully loaded. The basket-changing robot 4 picks up the full basket and transports it to the full basket line 2. The basket-changing robot 4 picks up the empty basket from the return basket line 3 and transports it to the insertion platform 1042, waiting for the next insertion operation.

[0074] Compared with the prior art, the beneficial effects of this utility model are:

[0075] This invention employs a parallel design of four slab conveyor lines 1, enabling the simultaneous conveying and processing of multiple silicon wafers, thereby improving the processing speed and production efficiency. The parallel arrangement of the full blue line 2 and the return blue line 3, along with the efficient handling capability of the blue-changing robotic arm mechanism 4, ensures coordinated operation between various production lines and mechanisms through a reasonable equipment layout. This reduces operational disruptions caused by limited factory space, thus maximizing space utilization and production capacity.

[0076] The above description is based on the preferred embodiments of this utility model. Through the above description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined by the scope of the claims.

Claims

1. A layout structure for a four-head vertical chip inserter, characterized in that, include: The system consists of a segmented conveyor line (1), a full-blue line (2), a return-blue line (3), and a blue-changing robotic arm mechanism (4). The wafer conveying line (1) has four parallel lines arranged in sequence along the x-axis direction, and each wafer conveying line (1) is used to convey silicon wafers along the y-axis direction. The full blue line (2) and the return blue line (3) are arranged side by side along the x-axis and are located on one side of any of the segmented conveyor lines (1) along the y-axis. One end of the basket changing robot (4) is mounted above the four segmented conveyor lines (1), and the other end of the basket changing robot (4) is mounted above the full basket line (2) and the return basket line (3). The basket changing robot (4) is used to transport flower baskets between the segmented conveyor lines (1), the full basket line (2) and the return basket line (3).

2. The layout structure of the four-head vertical chip inserter as described in claim 1, characterized in that, Two of the segmented conveyor lines (1) form a first conveyor line group, and the other two segmented conveyor lines (1) form a second conveyor line group. The first conveyor line group and the second conveyor line group are symmetrically arranged about the x-axis symmetry line.

3. The layout of a four-head vertical split plug machine as claimed in claim 2, wherein, A first channel (501) is formed between the first conveyor line group and the second conveyor line group for the feeding trolley (5) to pass through. The projection distance of the first channel (501) along the x-axis is L1, and the range of L1 is 600mm to 700mm.

4. The layout of a four-head vertical split chip bonder as recited in claim 3, wherein, The projection distance of the blue-changing robotic arm (4) along the x-axis is equal to the sum of the projection distances of the first channel (501) and the four segmented conveyor lines (1) along the x-axis.

5. The layout of a four-head vertical split plug machine as defined in claim 1, wherein, Each of the segmented conveyor lines (1) includes a feeding trough (101), a straightening and guiding conveyor mechanism (102), a segmented reversing mechanism (103), and a segmented conveyor mechanism (104) arranged sequentially on the feeding trough (101) along the y-axis. The full blue line (2) and the return blue line (3) are located on one side of any of the feeding troughs (101) and close to the segmented conveyor mechanism (104). One end of the blue changing robot mechanism (4) is mounted above the four segmented conveyor mechanisms (104).

6. The layout of a four-head vertical split chip bonder as recited in claim 5, wherein, The straightening and guiding conveying mechanism (102) includes a bottom conveying front section (1021) and a bottom conveying rear section (1022) arranged sequentially along the y-axis, as well as a straightening and guiding mechanism (1023) located above the bottom conveying front section (1021) and a clamping conveying mechanism (1024) located above the bottom conveying rear section (1022). The clamping conveying mechanism (1024) is located close to the segmentation and reversing mechanism (103).

7. The layout of a four-head vertical split chip bonder as recited in claim 6, wherein, The layout structure also includes a two-axis manipulator mechanism (6), which is mounted above the four bottom conveyor front sections (1021) and is used to convey the material frame in the x-axis and z-axis directions.

8. The layout of a four-head vertical split chip bonder as recited in claim 5, wherein, The wafer reversing mechanism (103) includes: a water-absorbing plate lifting assembly (1031), an arc-shaped ramp reversing assembly (1032), and an air knife assembly (1033). The water-absorbing plate lifting assembly (1031) is vertically arranged at the lower end of the arc-shaped ramp reversing assembly (1032) to receive a silicon wafer conveyed by the straightening and guiding conveying mechanism (102) and lift the silicon wafer vertically. The top end of the arc-shaped ramp reversing assembly (1032) outputs the lifted and ramped silicon wafer horizontally. The air knife assembly (1033) is installed on the arc-shaped ramp reversing assembly (1032) and is used to blow air onto the silicon wafer.

9. The layout of a four-head vertical split chip bonder as recited in claim 5, wherein, The insert conveying mechanism (104) includes an insert conveying section (1041) and an insert platform (1042) arranged sequentially along the y-axis. The insert conveying section (1041) is connected to the end of the insert reversing mechanism (103). The full blue line (2) and the return blue line (3) are located on one side of any one of the insert platforms (1042). One end of the blue changing robot arm mechanism (4) is mounted above the insert platform (1042).

10. The layout structure of the four-head vertical chip inserter as described in claim 1, characterized in that, The blue-changing robotic arm mechanism (4) includes: a first x-axis guide rail (401), a second x-axis guide rail (402), a y-axis guide rail (403), a lifting slider (404), a z-axis guide rail (405), and a handling robotic arm (406). The first x-axis guide rail (401) is arranged horizontally across the four segmented conveyor lines (1) along the x-axis direction. The second x-axis guide rail (402) is arranged horizontally across the full blue line (2) and the return blue line (3) along the x-axis direction. The x-axis guide rail (403) is mounted on the first x-axis guide rail (401) and the second x-axis guide rail (402), and can move along the first x-axis guide rail (401) and the second x-axis guide rail (402). The lifting slider (404) is slidably mounted on the y-axis guide rail (403). The z-axis guide rail (405) is slidably connected to the lifting slider (404) along the z-axis direction. The handling robot (406) is mounted on the lower end of the z-axis guide rail (405).

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