Same-profile separated device lead frame

Abstract

The utility model provides a same-profile separated device lead frame, which comprises a base island, two elliptical locking glue holes, a radiating fin, a fillet, a V-shaped waterproof groove, a plurality of pins and a plurality of transverse ribs, and is characterized in that the radiating fin is connected to one side of the base island, the two elliptical locking glue holes are arranged on one side of the surface of the base island, and the fillet is arranged on one side of the radiating fin; the V-shaped waterproof groove is formed in the surface of the base island, the multiple pins are connected to one side of the base island, and the multiple transverse ribs are connected to the left side and the right side of the cooling fin respectively. According to the same-profile separated device lead frame provided by the utility model, the transverse ribs of the lead frame are designed to be the middle parts of the radiating fins and the base islands, so that the strip strength of the connecting ribs is achieved, and glue overflow on the side surfaces of the radiating fins is prevented, and the top parts of the radiating fins are designed to be filleted corners on the lead frame in advance, so that the service life of the lead frame is prolonged. And the cutting and separation of the top in the packaging and cutting process can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of lead frames in the semiconductor packaging industry, and in particular to a lead frame for a discrete device with the same profile. Background Technology

[0002] As a chip carrier for integrated circuits, the lead frame is a key structural component that uses bonding materials to achieve electrical connection between the internal circuit leads of the chip and the external leads, forming an electrical circuit. It acts as a bridge connecting to external wires. Most semiconductor integrated circuits require the use of lead frames, making it an important basic material in the electronics and information industry.

[0003] Conventional discrete component lead frames:

[0004] The base island heatsink is 1.27mm thick, the pins are 0.38mm thick, and the lead frame is a non-standard material design, resulting in high material costs.

[0005] Conventional discrete components use a method of connecting the top horizontal ribs of the heat sink to connect each unit product in series. In the later stage of packaging, the ribs are cut to separate them. Cutting marks will be left on the top, and some of the internal copper material will be exposed. The cutting on the top may also generate shear stress on the product base island, causing delamination problems within the product base island.

[0006] The side of the heatsink frame is also prone to adhesive overflow, which cannot be effectively resolved.

[0007] Therefore, it is necessary to provide a lead frame for a discrete device with the same profile to solve the above-mentioned technical problems. Utility Model Content

[0008] This utility model provides a lead frame for discrete devices with the same profile, which solves the problems of delamination in the product base island and side glue overflow on the side of the heat sink of conventional discrete device lead frames during conventional processing.

[0009] To solve the above-mentioned technical problems, this utility model provides a lead frame for a profile-separated device, comprising:

[0010] The base island, two elliptical locking holes, a heat sink, rounded corners, a V-shaped waterproof groove, multiple pins and multiple horizontal ribs are provided. The heat sink is connected to one side of the base island, and the two elliptical locking holes are both opened on one side of the surface of the base island. The rounded corners are set on one side of the heat sink.

[0011] The V-shaped waterproof groove is provided on the surface of the base island, and the multiple pins are connected to one side of the base island. The multiple horizontal ribs are respectively connected to the left and right sides of the heat sink.

[0012] Preferably, the surface of the base island is provided with an electroplating area.

[0013] Preferably, the elliptical locking hole and the V-shaped waterproof groove are used for double waterproofing and moisture infiltration prevention of the base island.

[0014] Preferably, the surface of the heat sink is provided with multiple stamped pits in both horizontal and vertical directions.

[0015] Preferably, the surface of the pin is provided with punched holes.

[0016] Compared with related technologies, the lead frame for a profile-separated device provided by this utility model has the following advantages:

[0017] This utility model provides a lead frame for a separate device with the same profile. The horizontal ribs of the lead frame are designed in the middle of the heat sink and the base island to block the glue overflow from the side of the heat sink and prevent glue overflow. The top of the heat sink is pre-designed with rounded corners on the lead frame, which can reduce the need to cut and separate the top during the packaging process. The lead frame is designed with two elliptical glue-locking holes and a V-shaped waterproof groove to provide double waterproof and moisture-proof protection. Attached Figure Description

[0018] Figure 1 A schematic diagram of the first embodiment of a lead frame for a profile-separated device provided by this utility model;

[0019] Figure 2 A schematic diagram of a single-point silver-plated lead frame;

[0020] Figure 3 This is a schematic diagram of the bare copper lead frame structure;

[0021] Figure 4 A schematic diagram of a structure connecting lead frames for multiple discrete devices;

[0022] Figure 5 This is a schematic diagram of the second embodiment of the lead frame for a profile-separated device provided by this utility model.

[0023] The diagram labels are as follows: 1. Base island; 2. Oval locking hole; 3. Heat sink; 4. Rounded corner; 5. V-shaped waterproof groove; 6. Pin; 7. Horizontal rib; 8. Electroplating area;

[0024] 9. Stamping pits; 10. Punching. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0026] First Embodiment

[0027] Please refer to the following: Figure 1 , Figure 2 , Figure 3 and Figure 4 ,in, Figure 1 A schematic diagram of the first embodiment of a lead frame for a profile-separated device provided by this utility model; Figure 2 A schematic diagram of a single-point silver-plated lead frame; Figure 3 This is a schematic diagram of the bare copper lead frame structure; Figure 4 A schematic diagram of a structure connecting multiple discrete device lead frames. A lead frame for discrete devices of the same profile includes:

[0028] The base island 1, two elliptical locking holes 2, heat sink 3, rounded corners 4, V-shaped waterproof groove 5, multiple pins 6 and multiple horizontal ribs 7, the heat sink 3 is connected to one side of the base island 1, the two elliptical locking holes 2 are both opened on one side of the surface of the base island 1, and the rounded corners 4 are set on one side of the heat sink 3.

[0029] The V-shaped waterproof groove 5 is disposed on the surface of the base island 1, and the plurality of the pins 6 are connected to one side of the base island 1, and the plurality of the horizontal ribs 7 are respectively connected to the left and right sides of the heat sink 3.

[0030] The surface of the base island 1 is provided with an electroplating zone 8.

[0031] The elliptical locking hole 2 and the V-shaped waterproof groove 5 are used for the double waterproofing and moisture-proofing of the base island 1.

[0032] The lead frame is designed with the same profile, and both the base island and the pins are 0.5mm thick—resulting in lower cost compared to non-standard profiles.

[0033] The upper horizontal rib of the lead frame is designed to be located in the middle of the heat sink base island, which can prevent glue from overflowing from the side of the heat sink and prevent glue overflow from occurring.

[0034] The lead frame has been enhanced with two oval locking holes 2, and the red and blue squares are designed with two V-shaped waterproof grooves 5, providing double waterproofing and preventing moisture penetration.

[0035] The fork-shaped middle tube with double support columns provides more stable support for the base island.

[0036] The protruding part in the middle can be used as the ground wire location for bonding.

[0037] All three leadframe pins feature rounded corner locking adhesive and two waterproof V-grooves at the neck position, meeting the high-reliability semiconductor packaging requirements, including automotive-grade standards.

[0038] Compared with related technologies, the lead frame for a profile-separated device provided by this utility model has the following advantages:

[0039] This utility model provides a lead frame for a separate device with the same profile. The horizontal rib 7 of the lead frame is designed as the middle part of the heat sink 3 and the base island 1 to block the side of the heat sink from overflowing glue and prevent glue overflow. The top of the heat sink 3 is pre-designed with a rounded corner 4 on the lead frame, which can reduce the need to cut and separate the top during the packaging process. The lead frame is designed with two elliptical glue-locking holes 2 and a V-shaped waterproof groove 5 to provide double waterproof and moisture-proof protection.

[0040] Second Embodiment

[0041] Please refer to the following: Figure 5 Based on the lead frame for a modular device with the same profile provided in the first embodiment of this application, the second embodiment of this application proposes another lead frame for a modular device with the same profile. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0042] Specifically, the difference in the lead frame of the same profile separating device provided in the second embodiment of this application is that the heat sink 3 has a plurality of stamped pits 9 arranged horizontally and vertically on its surface.

[0043] Multiple stamped pits 9 are made by stamping, and punch holes 10 are opened by stamping.

[0044] The surface of the pin 6 is provided with a punch 10.

[0045] The use of punch 10 facilitates the installation of pin 6.

[0046] The working principle of the lead frame for the same profile separation device provided by this utility model is as follows:

[0047] When in use, the heat generated by the heat sink 3 is transferred through multiple stamped pits 9.

[0048] Compared with related technologies, the lead frame for a profile-separated device provided by this utility model has the following advantages:

[0049] This utility model provides a lead frame for a separate device with the same profile. Multiple stamped dots 9 are provided on the surface of the heat sink 3 to facilitate the flow and dissipation of heat during use.

[0050] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A lead frame for separating identical components, characterized in that, include: The base island, two elliptical locking holes, a heat sink, rounded corners, a V-shaped waterproof groove, multiple pins and multiple horizontal ribs are provided. The heat sink is connected to one side of the base island, and the two elliptical locking holes are both opened on one side of the surface of the base island. The rounded corners are set on one side of the heat sink. The V-shaped waterproof groove is provided on the surface of the base island, and the multiple pins are connected to one side of the base island. The multiple horizontal ribs are respectively connected to the left and right sides of the heat sink.

2. The homogenous material separation device lead frame of claim 1, wherein, The surface of the base island is provided with an electroplating zone.

3. The homogenous material separation device leadframe of claim 1, wherein, The elliptical locking hole and the V-shaped waterproof groove are used for the dual waterproofing and moisture-proofing of the base island.

4. The homogenous material separation device leadframe of claim 1, wherein, The surface of the heat sink has multiple stamped pits arranged horizontally and vertically.

5. The homogenous material separation device leadframe of claim 1, wherein, The surface of the tube pin is punched with holes.

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