Cleaning device

Abstract

Cleaning equipment comprises a telescopic module, an optical module and a laser module which are arranged on a machine table, the telescopic module can extend to the position above a testing seat in a protruding mode, the optical module is arranged on the telescopic module, and therefore when the laser module sends laser beams, the laser beams can be guided to the position above the testing seat through the optical module, and the testing seat is arranged on the machine table. Therefore, the plurality of probes of the test bench are cleaned by using the laser beams, and the problems of time and manpower resource consumption and the like caused by the fact that the test bench is replaced and cleaned manually are solved.

Description

Technical Field

[0001] This application relates to a cleaning device, and more particularly to a cleaning device for a probe. Background Technology

[0002] Electrical testing of semiconductors typically involves placing a device under test (DUT), such as a semiconductor package or wafer, into a test socket with multiple probes. After each probe contacts the electrical pads or solder balls of the DUT, a test signal is transmitted to the DUT via each probe to achieve the testing purpose.

[0003] However, as Figure 1A As shown, after a large number of uses, dirt 12 will accumulate at the contact point of probe 11, leading to poor contact. If testing continues, it will damage the solder ball 13 (e.g., Figure 1B (As shown). Therefore, quality control personnel need to stop the machine and replace the test sockets, which is not only time-consuming, but the replaced test sockets also need to be cleaned by warehouse personnel, which consumes manpower and seriously slows down the testing progress.

[0004] Therefore, how to overcome the problems of the aforementioned conventional technologies has become an urgent issue that needs to be addressed. Utility Model Content

[0005] In view of the various deficiencies of the prior art, this application provides a cleaning device for cleaning a test socket with multiple probes, comprising: a machine base; a telescopic module disposed on the machine base and movable relative to the machine base to protrude from the machine base; an optical module disposed in the telescopic module; and a laser module disposed on the machine base and providing a laser beam through the optical module to the test socket.

[0006] This application also provides a cleaning method for cleaning a test socket with multiple probes, comprising: providing a cleaning device including a machine base, a telescopic module disposed on the machine base and movable relative to the machine base to protrude from the machine base, an optical module disposed in the telescopic module, and a laser module disposed on the machine base to provide a laser beam to the optical module; causing the telescopic module to protrude from the machine base and be positioned above the test socket; and causing the laser module to provide a laser beam, and the optical module to guide the laser beam to clean the multiple probes.

[0007] The aforementioned cleaning equipment and method also include turning off the laser module after cleaning the multiple probes.

[0008] The aforementioned cleaning equipment and method also include retracting the telescopic module for storage in the machine.

[0009] In the aforementioned cleaning equipment and method, the machine can move in three dimensions.

[0010] In the aforementioned cleaning equipment and method, the telescopic module has a cavity for accommodating the optical module.

[0011] In the aforementioned cleaning equipment and method, the optical module includes a first optical lens, a second optical lens and a third optical lens, wherein the first optical lens is disposed on the machine base, and the second optical lens and the third optical lens are disposed on the telescopic module.

[0012] In the aforementioned cleaning equipment and method, the first optical lens is a reflector, the second optical lens is a focusing lens, and the third optical lens is a reflector.

[0013] Therefore, the cleaning equipment disclosed in this application mainly consists of a telescopic module, an optical module, and a laser module on a three-dimensionally movable machine platform. The telescopic module can extend above the test base, and the optical module is disposed on the machine platform and the telescopic module. When the laser module sends a laser beam, it can be guided to the top of the test base through the optical module, thereby using the laser beam to clean multiple probes of the test base. This avoids the time and manpower problems caused by conventional manual replacement of test bases and cleaning operations, thus accelerating the testing process. Attached Figure Description

[0014] Figure 1A and Figure 1B This is a schematic diagram illustrating how contamination of the probe can damage the solder ball.

[0015] Figures 2 to 5 This is a schematic diagram of the cleaning equipment and method described in this application.

[0016] Explanation of reference numerals in the attached figures

[0017] 11 probes

[0018] 12 Dirt and filth

[0019] 13 Tin Balls

[0020] 2 Cleaning equipment

[0021] 21 machines

[0022] 22 Telescopic Module

[0023] 220 chambers

[0024] 23 Optical Module

[0025] 231 First Optical Lens

[0026] 232 Second optical lens

[0027] 233 Third optical lens

[0028] 24 Laser Module

[0029] 31 Test socket

[0030] 311 First Surface

[0031] 312 Second Surface

[0032] 313 Positioning Hole

[0033] 32 probes

[0034] 33 cavities

[0035] 34 Electronic Carrier

[0036] b. Laser beam

[0037] S is damaged. Detailed Implementation

[0038] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0039] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0040] Please see Figures 2 to 5 This is a schematic diagram of the cleaning equipment and method described in this application.

[0041] First, a cleaning device 2 is provided for cleaning a testing device, which includes a platform 21, a telescopic module 22, an optical module 23, and a laser module 24.

[0042] The machine tool 21 can move in three dimensions, as shown in the figure, moving along the X-axis (left and right), along the Y-axis (front and back), and along the Z-axis (up and down).

[0043] The telescopic module 22 is mounted on the machine base 21 and has a chamber 220. It can move relative to the machine base 21, and thus move to protrude from the machine base 21 or move to be submerged inside the machine base 21.

[0044] The optical module 23 is disposed in the machine base 21 and the telescopic module 22, and includes a first optical lens 231, a second optical lens 232 and a third optical lens 233. The first optical lens 231 is disposed on the machine base 21, and the second optical lens 232 and the third optical lens 233 are disposed on the telescopic module 22. In this embodiment, the second optical lens 232 and the third optical lens 233 are disposed at opposite ends of the cavity 220 of the telescopic module 22. For example, the first optical lens 231 is a reflector, the second optical lens 232 is a focusing lens, and the third optical lens 233 is a reflector, and the second optical lens 232 is located between the first optical lens 231 and the third optical lens 233.

[0045] The laser module 24 is mounted on the machine base 21 and is used to provide a laser beam to the optical module 23.

[0046] The testing device is, for example, a test base 31 containing a plurality of probes 32. The test base 31 has a first surface 311 and a second surface 312 facing each other and a plurality of positioning holes 313 connecting the first surface 311 and the second surface 312, and the plurality of probes 32 are disposed in the plurality of positioning holes 313 of the test base 31.

[0047] Furthermore, the test socket 31 can be connected to a cavity 33, which provides a testing environment. A robotic arm can be used to move the component under test (DUT) into the cavity 33 and place it onto the first surface 311 of the test socket 31 for subsequent electrical testing. For example, the DUT can be moved into the cavity 33 using a picking / adsorption method to perform electrical testing in a pre-defined testing environment. The DUT can be, for example, an active component, a passive component, or a packaged module. The test socket 31 can also be connected to an electronic carrier board 34, which receives / transmits test information.

[0048] After prolonged use, the test socket 31 may become contaminated due to contact and pressure with the component under test, resulting in dirt residue remaining on the test socket 31 (multiple probes 32). This may cause test errors or prevent testing, or even damage to the component under test.

[0049] In practical applications, when the average yield of the component under test is lower than the set value, the cleaning device 2 can be started manually or automatically.

[0050] First, such as Figure 2As shown, the cleaning device 2 moves to the vicinity of the test seat 31 via the machine platform 21, and the telescopic module 22 protrudes from the machine platform 21 and is positioned above the test seat 31.

[0051] like Figure 3 As shown, the laser module 24 then provides a laser beam to the optical module 23. The laser beam b is first emitted to the first optical lens 231 on the machine base 21, and then reflected by the first optical lens 231 to the second optical lens 232 at one end of the telescopic module 22 (cavity 220). The laser beam is then focused by the second optical lens 232 and transmitted to the third optical lens 233 at the other end of the telescopic module 22 (cavity 220). The laser beam is then reflected by the third optical lens 233 to the test stand 31. The third optical lens 233 can be positioned directly above the test stand 31 by the operation of the telescopic module 22, so as to use the laser beam to clean the surface of the probe 32 of the test stand 31. At the same time, the machine base 21 is moved to clean multiple probes 32 in sequence.

[0052] like Figure 4 As shown, after the multiple probes 32 have been cleaned, the laser module 24 is turned off to stop the output of the laser beam.

[0053] like Figure 5 As shown, the telescopic module 22 is then retracted and stored in the machine base 21, and the cleaning device 2 can then be moved to a specific position for standby via the machine base 21.

[0054] In summary, the cleaning equipment of this application mainly includes a telescopic module, an optical module, and a laser module on a three-dimensionally movable machine platform. The telescopic module can extend above the test base, and the optical module is disposed on the machine platform and the telescopic module. When the laser module sends a laser beam, it can be guided to the top of the test base through the optical module, thereby using the laser beam to clean the multiple probes of the test base. This avoids the time and manpower problems caused by conventional manual replacement of test bases and cleaning operations, thus accelerating the testing process.

[0055] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. A cleaning device for cleaning a test socket having multiple probes, characterized in that, include: Machine tool; A telescopic module is mounted on the machine base and can move relative to the machine base to protrude from the machine base; An optical module is located within the telescopic module; as well as A laser module is mounted on the machine and provides a laser beam through the optical module to the test stand.

2. The cleaning apparatus of claim 1, wherein, The machine tool moves in three dimensions.

3. The cleaning apparatus of claim 1, wherein, The telescopic module has a cavity for housing the optical module.

4. The cleaning apparatus of claim 1, wherein, The optical module includes a first optical lens, a second optical lens and a third optical lens, with the first optical lens mounted on the machine base and the second and third optical lenses mounted on the telescopic module.

5. The cleaning apparatus of claim 4, wherein, The first optical lens is a reflector, the second optical lens is a focusing lens, and the third optical lens is a reflector.

6. The cleaning apparatus of claim 1, wherein, The telescopic module protrudes above the multiple probes to clean them using the laser beam.

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