Multi-wire solder strip tin plating device and solder strip processing equipment

Abstract

The utility model provides a multi-wire solder strip tin-plating device and solder strip processing equipment. The multi-wire solder strip tin-plating device comprises a tin-plating rack, a tin-plating mechanism and a multi-path traction cooling mechanism, the tin coating mechanism is arranged on the tin coating rack, the two opposite sides of the tin coating mechanism are configured to be a wire inlet side and a wire outlet side, the multi-base material enters from the wire inlet side, is subjected to tin coating and then is pulled out from the wire outlet side, the tin coating traction direction points to the wire outlet side from the wire inlet side, and the tin coating traction direction is configured to be perpendicular or basically perpendicular to the front face when an operator conducts base material traction threading. The multiple traction cooling mechanisms are located on the wire outlet side of the tin plating mechanism and are sequentially distributed on the tin plating rack in the direction perpendicular to or intersecting with the traction face, and the traction face is a plane formed by the tin plating traction direction and the gravity direction. Each traction cooling mechanism comprises a wire outlet traction assembly and at least one cooling piece, wherein the wire outlet traction assembly is used for vertically or approximately vertically pulling the tin-coated welding strip, and the cooling piece is arranged on each wire outlet traction assembly to cool the welding strip.

Description

Technical Field

[0001] This utility model relates to the photovoltaic field, and in particular to a multi-line solder strip tinning device and solder strip processing equipment. Background Technology

[0002] Solder ribbon is a crucial component of photovoltaic (PV) modules. As an electrical connection part, it's used to connect PV cells in series or parallel, playing a vital role in conductivity and charge collection to enhance the output voltage and power of the PV module. Solder ribbon consists of a substrate and a surface tin alloy coating. The substrate is typically made of copper, and the tin alloy coating must be uniformly applied to the copper substrate surface according to a specific composition ratio and thickness. Tin coating is the main process in PV solder ribbon manufacturing; its efficiency directly affects the overall processing efficiency, while the quality of the coating (such as thickness, uniformity, and surface gloss and smoothness) directly impacts the solar energy collection efficiency of the PV module.

[0003] In existing solder ribbon coating equipment, the distribution of the coating and traction mechanisms on the frame restricts the operator's ability to align the front of the substrate with the traction direction of the solder ribbon during threading. Therefore, the solder ribbon can only be threaded and pulled along the surface of the equipment, resulting in low processing efficiency and directly impacting the overall processing efficiency. Furthermore, due to this limitation, when expanding the circuit for multi-line coating, multiple coating units must be arranged sequentially along the traction direction, with the substrate from the next unit being pulled through the previous unit before entering the coating mechanism. This arrangement significantly increases the size of the coating units in the traction direction, and the large size of each unit further increases its space requirements, making this expansion method incompatible with space-constrained workshops. In addition, existing solder ribbon processing equipment suffers from poor uniformity of the tin alloy layer thickness after coating and excessive tin waste, leading to high coating costs. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, this utility model provides a multi-line solder strip tinning device and solder strip processing equipment.

[0005] To achieve the above objectives, this utility model provides a multi-wire solder ribbon tinning device, comprising a tinning frame, a tinning mechanism, and a multi-path traction and cooling mechanism. The tinning mechanism is disposed on the tinning frame, with its opposite sides configured as an inlet side and an outlet side. Multiple substrates enter from the inlet side, are tinned, and then pulled out from the outlet side. The tinning traction direction points from the inlet side to the outlet side and is configured perpendicular or substantially perpendicular to the operator's face when pulling and threading the substrate. The multi-path traction and cooling mechanism is located on the outlet side of the tinning mechanism and is sequentially distributed on the tinning frame in directions perpendicular to or intersecting the traction surface. The traction surface is a plane composed of the tinning traction direction and the direction of gravity. Each traction and cooling mechanism includes an outlet traction component for vertically or nearly vertically traction of the tinned solder ribbon and at least one cooling component disposed on each outlet traction component to cool the solder ribbon.

[0006] According to one embodiment of the present invention, the multi-path traction cooling mechanism is arranged in an inclined column on the tin-coating frame and is arranged in a stepped manner between adjacent traction cooling mechanisms; or, the multi-path traction cooling mechanism is arranged in multiple columns in the tin-coating traction direction and the corresponding traction cooling mechanisms on adjacent columns are staggered.

[0007] According to one embodiment of the present invention, the multi-path traction cooling mechanism is separately and independently installed on the tin plating rack; or, the multi-path traction cooling mechanism is integrated into one unit and then assembled on the tin plating rack.

[0008] According to one embodiment of the present invention, the tin coating mechanism includes a tin furnace and multiple tin coating drive components. The tin furnace extends in a direction perpendicular to the traction surface. The multiple tin coating drive components are distributed correspondingly to the multi-path traction cooling mechanism. Each tin coating drive component drives the corresponding path substrate to move relative to the tin furnace so that the substrate is immersed in the tin furnace or separated from the tin furnace.

[0009] According to one embodiment of the present invention, the furnace body of the tin furnace has an inclined furnace body section with gradually decreasing furnace depth on the side near the tin coating mechanism inlet line.

[0010] According to one embodiment of the present invention, the furnace body of the tin furnace also includes a flat-bottomed furnace body section near the outlet side of the tin coating mechanism and whose inner wall is close to a plane. The tin furnace has the maximum furnace depth at the flat-bottomed furnace body section, and multiple tin coating drive components are arranged at the location of the flat-bottomed furnace body section.

[0011] According to one embodiment of the present invention, the tin furnace further includes at least one ring of first heating elements disposed at the bottom of the inclined furnace body section and arranged in a U-shape; and / or, at least one ring of second heating elements disposed at the bottom of the flat-bottomed furnace body section and arranged in a U-shape.

[0012] According to one embodiment of the present invention, the tin-coating drive assembly includes a tin-coating drive component and a pusher component that moves up and down relative to the tin pot driven by the tin-coating drive component. The pusher component includes a pusher body and a guide component connected to the pusher body. A guide groove is formed on the guide component to accommodate solder strip and the width of the guide groove matches the diameter of the solder strip.

[0013] According to one embodiment of the present invention, a cooling assembly is disposed on the traction path of the lead-out traction assembly, and includes at least one air knife located on the lead-out side of the tinning mechanism and a vertical cooling component located at the rear end of at least one air knife and extending along the height direction of the tinning frame, wherein the vertical cooling component has a cooling channel for conveying solder strip.

[0014] According to one embodiment of the present invention, the vertical cooling component is a vertical air duct, and a nozzle for cooling the tin layer on the solder strip is provided in the cooling channel of the vertical air duct. There is one nozzle; or, there are multiple nozzles arranged sequentially along the height direction of the vertical air duct.

[0015] According to one embodiment of the present invention, multiple air nozzles are symmetrically distributed on the two side walls of the cooling channel, and the air outlet of each air nozzle is either a parallel air outlet or an inclined air outlet facing the top of the tinning rack.

[0016] According to one embodiment of the present invention, the outgoing line traction assembly includes an outgoing line traction drive, a lifting frame that is driven by the outgoing line traction drive and is connected to the tin plating frame in a lifting manner, and a plurality of outgoing line traction guide wheels disposed on the lifting frame.

[0017] According to one embodiment of the present invention, the multi-wire soldering strip tinning device further includes an inlet traction component disposed on the tinning frame and located on the inlet side of the tinning frame to draw the substrate into the tinning mechanism.

[0018] On the other hand, this utility model also provides a soldering strip processing equipment, which includes the above-mentioned multi-line soldering strip tinning device.

[0019] In summary, in the multi-line solder ribbon coating device and solder ribbon processing equipment provided by this utility model, the traction direction of the substrate on the coating mechanism is configured to be perpendicular or substantially perpendicular to the front of the operator when performing substrate traction and threading. This configuration provides the operator with sufficient working space to thread each substrate, thereby providing conditions for integrating multiple traction cooling mechanisms into the same coating rack. Furthermore, the sequential distribution of multiple traction cooling mechanisms along directions perpendicular to or intersecting the traction surface ensures that the expanded multi-line solder ribbon coating device only increases in size in the direction perpendicular to the traction surface, while its size in the traction direction remains essentially consistent with existing single-line coating devices. This effectively solves the problem of existing multi-line solder ribbon coating devices being too long to be easily arranged in factories with limited space when expanded to multiple lines.

[0020] To make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0021] Figure 1 The diagram shown is a structural schematic of a multi-line solder ribbon tinning device provided in an embodiment of this utility model.

[0022] Figure 2 As shown Figure 1 A schematic diagram showing the distribution of the traction direction K1 for intermediate tin coating and the worker's orientation.

[0023] Figure 3 and Figure 4 As shown Figure 1 A structural diagram from another perspective.

[0024] Figure 5 As shown Figure 4 Enlarged diagram of point A in the middle.

[0025] Figure 6 As shown Figure 4 Enlarged diagram of point B in the middle.

[0026] Figure 7 As shown Figure 1 A schematic diagram of the tin coating mechanism.

[0027] Figure 8 As shown Figure 7 A cross-sectional schematic diagram.

[0028] Figure 9 and Figure 10 The diagram shown is a schematic representation of the distribution of multiple tin-coating drive components in a multi-line solder ribbon tin-coating device provided in another embodiment of this utility model. Detailed Implementation

[0029] like Figure 1 and Figure 2As shown, the multi-wire solder ribbon coating device provided in this embodiment includes a coating frame 1, a coating mechanism 2, and a multi-path traction cooling mechanism 3. The coating mechanism 2 is disposed on the coating frame 1, and its opposite sides are configured as an inlet side 201 and an outlet side 202. The multi-path substrate enters from the inlet side 201, is coated with tin, and is then pulled out from the outlet side 202. The tinning traction direction K1 points from the inlet side 201 to the outlet side 202 and is also configured to be perpendicular or substantially perpendicular to the front side 101 of the operator 100 when performing substrate traction and threading. The multi-path traction cooling mechanism 3 is sequentially distributed on the coating frame 1 in a direction perpendicular to or intersecting the traction surface and is located on the outlet side of the coating mechanism 2. The traction surface is the plane formed by the tinning traction direction K1 and the gravity direction G. Each traction cooling mechanism 3 includes a lead-out traction component 31 for vertically or nearly vertically traction of the solder strip after tinning, and at least one cooling component 32 disposed in each lead-out traction component 31 for cooling the solder strip.

[0030] The substrate referred to in this embodiment can be either a copper substrate annealed by an annealing device, or a substrate that has been annealed and coated with flux.

[0031] In the multi-wire solder ribbon coating device provided in this embodiment, the multi-path traction cooling mechanism 3 is sequentially integrated along intersecting or perpendicular directions to the traction surface. This arrangement allows the multi-wire solder ribbon coating device to increase its size only in the direction K2 perpendicular to the traction surface, without increasing its overall length in the traction direction K1. That is, the size of the multi-wire solder ribbon coating device provided in this embodiment in the traction direction K1 is basically close to that of a traditional single-wire coating device, effectively solving the problem of incompatibility with existing factory space due to excessive length in the traction direction K1 during line expansion. Furthermore, as... Figure 2 As shown, in the multi-wire soldering device provided in this embodiment, the soldering traction direction K1 is also configured to be substantially perpendicular to the front face 101 of the operator 100 when threading the substrate on the traction cooling mechanism 3. This arrangement allows the output side 202 of the soldering mechanism 2 to serve as the threading operation space, and the operator's front face can simultaneously face multiple substrates, thereby realizing the threading operation of multiple substrates.

[0032] In this embodiment, the multi-path traction cooling mechanism 3 is separately and independently installed on the solder coating rack 1. However, this utility model does not impose any limitations on this. In other embodiments, the multi-path traction cooling mechanism can also be integrated into one unit and then assembled on the solder coating rack. The integrated multi-path traction cooling mechanism can simultaneously or asynchronously traction multiple solder strips.

[0033] In this embodiment, as Figures 1 to 7As shown, the tin coating mechanism 2 includes a tin furnace 21 and multiple tin coating drive components 22 disposed on one side of the tin furnace 21 and distributed corresponding to the multi-path traction cooling mechanism 3. Each tin coating drive component 22 drives the corresponding substrate to move vertically relative to the tin furnace 21, so that the substrate is immersed in the tin furnace 21 for tin coating or separated from the tin furnace 21 after tin coating. However, this utility model does not limit this. In other embodiments, the tin coating mechanism may also be a spray-type tin coating mechanism, and the tin coating device may include an integral spray-type tin coating mechanism to realize tin coating of multiple substrates; or, the tin coating device may also include multiple independent spray-type tin coating mechanisms.

[0034] In this embodiment, as Figure 1 and Figure 2 As shown, multiple solder coating drive components 22 and multi-path traction cooling mechanisms 3 are vertically mounted on the solder coating frame 1, and the multiple solder coating drive components 22 and multi-path traction cooling mechanisms 3 are respectively arranged in a row in a direction perpendicular to the traction surface K2. However, this utility model does not limit this in any way. In other embodiments, the row direction formed by the arrangement of multiple solder coating drive components may also intersect with the solder coating traction direction K1, that is, the arrangement direction of the multiple solder coating drive components is inclined relative to the solder strip traction direction K1; correspondingly, the multi-path traction cooling mechanism 3 is also arranged in an inclined row or a stepped row (e.g., Figure 9 (As shown). Alternatively, the multi-path traction cooling mechanism 3 is distributed in multiple columns along the solder strip traction direction K1 on the solder coating rack 1, with the corresponding multi-path traction cooling mechanisms 3 on adjacent columns being staggered. On the vertical projection plane of the solder coating rack 1, the distribution of the multi-path traction cooling mechanism 3 resembles one or more W shapes (as shown). Figure 10 As shown in the figure); correspondingly, in this structure, multiple tin-coating drive components are also distributed in multiple staggered columns.

[0035] In this embodiment, the solder furnace 21 extends in a direction perpendicular to the traction surface formed by the solder strip traction direction K1 and the gravity G direction (i.e., Figure 1 (As indicated by the middle arrow K2), this arrangement allows multiple substrates to be immersed in the same solder pot 21 for soldering. Although this embodiment is described using multiple substrates sharing one solder pot as an example, this invention does not limit it in any way. In other embodiments, each substrate may correspond to an independent solder pot, with multiple independent solder pots distributed sequentially along the K2 direction; or, when there are many substrate lines, two or three solder pots may be set to allow some substrate lines to share one solder pot.

[0036] In this embodiment, the tin plating of the substrate mainly relies on the pressing action of the tin-coating drive assembly 22. The tension and traction of the substrate inevitably cause the substrate near the tin-coating mechanism inlet side 201 on the tin-coating drive assembly 22 to be tilted. In the solder ribbon tinning device, the solder in the tin furnace needs to be replaced periodically after a period of use. Traditional flat-bottomed tin furnaces, while ensuring complete tin plating at the tin-coating drive assembly 22, inevitably create a large, unused area (i.e., the solder area below the tilted substrate) on the tin-coating mechanism inlet side. This area of ​​solder also needs to be replaced after its usage time reaches its limit, resulting in significant waste of solder. Furthermore, tin is second only to precious metals in price, which will severely impact the tinning cost of the solder ribbon.

[0037] To solve this problem, such as Figure 3 and Figure 4 As shown, the tin furnace 21 provided in this embodiment has an inclined furnace body section 211 with a gradually decreasing furnace depth formed on the inlet side 201 near the tin coating mechanism. This arrangement greatly reduces the amount of tin in the tin furnace near the inlet side 201 of the tin coating mechanism while achieving tin plating on the substrate in the inclined section, thereby significantly reducing the tin coating cost. In this embodiment, the furnace body of the tin furnace 21 also includes a flat-bottomed furnace body section 212 near the outlet side 202 of the tin coating mechanism, with the inner wall of the furnace body being close to a plane. The tin furnace has the maximum furnace depth at the flat-bottomed furnace body section 212, and multiple tin coating drive assemblies 22 are arranged above the flat-bottomed furnace body section 212. The flat-bottomed furnace body section 212 provides sufficient immersion depth for the substrate at the tin coating drive assembly 22. However, this utility model does not limit this in any way. In other embodiments, the flat-bottomed furnace body section may not be required in the tin furnace, in which case the tin coating drive assembly is correspondingly arranged on the inclined furnace body section near the outlet side 202 of the tin coating mechanism.

[0038] In this embodiment, the solder pot 21 further includes a heating element 23 disposed at the bottom of the pot body. The heating element 23 includes multiple rings of first heating elements disposed in a U-shape at the bottom of the inclined pot body section 211 and multiple rings of second heating elements disposed in a U-shape at the bottom of the flat-bottomed pot body section 212. However, this invention does not impose any limitations on this. In other embodiments, when the solder pot does not have a flat-bottomed pot body section, the heating element may not include the second heating element. As for the number and distribution of the first and second heating elements, this invention also does not impose any limitations.

[0039] like Figure 3 , Figure 4 as well as Figure 6As shown, the tin-coating drive assembly 22 includes a tin-coating drive component 221 and a pusher component 222 that moves up and down relative to the solder pot 21 driven by the tin-coating drive component 221. The pusher component 222 includes a pusher body 2221 and a guide component 2222 connected to the pusher body. The guide component 2222 has a guide groove 2223 formed on it, which accommodates the solder strip and whose width matches the diameter of the solder strip. Specifically, the cross-section of the guide groove 2223 is V-shaped, and the two sidewalls of the guide groove 2223 limit the solder strip to prevent it from detaching from the tin-coating drive assembly 422. The matching of the width of the guide groove 2223 and the diameter of the solder strip effectively prevents the solder strip from sliding in the guide groove 2223, ensuring accurate traction of the solder strip after tinning while avoiding coating wear caused by lateral sliding of the solder strip during traction. Preferably, the guide groove 2223 is arc-shaped on the traction path to facilitate smooth traction of the solder strip. Furthermore, the pusher 222 can also move along the length direction (i.e., the K2 direction) of the tin pot 21 under the action of the tin-coating drive 221. However, this utility model does not impose any limitations on this.

[0040] In the traction cooling mechanism 3 provided in this embodiment, the cooling component 32 is disposed on the traction path of the lead-out traction component 31. It includes at least one air knife 321 located on the lead-out side 202 of the soldering mechanism and a vertical cooling element 322 located at the rear end of the at least one air knife 321 and extending along the height direction of the soldering frame 1. The vertical cooling element 322 has a cooling channel 3220 for conveying the solder strip. Preferably, each cooling component 32 includes two air knives 321, and the vertical cooling element 322 is a vertical air duct. Multiple air nozzles 3221 are symmetrically distributed on the two side walls of the cooling channel 3220 of the vertical air duct. The air outlet of each air nozzle 3221 is an inclined air outlet facing the top of the soldering frame 1. Figure 2 As shown. However, this utility model does not limit this in any way. In other embodiments, the air outlet of the nozzle 3221 may also discharge air horizontally or downward at an angle, and this utility model does not limit the number of nozzles and air blades. In other embodiments, the vertical cooling component may also have a long, strip-shaped integral air outlet.

[0041] In the solder ribbon tinning apparatus provided in this embodiment, at least one air knife 321 within the cooling assembly 32 rapidly blows off the remaining solder on the surface of the solder ribbon using a high-speed air curtain, achieving precise control of the solder layer thickness. The upward traction of the solder ribbon after tinning ensures the uniformity of the solder layer across the cross-section, avoiding the unevenness caused by gravity during horizontal or inclined traction, where the thickness of the lower solder layer is greater than that of the upper solder layer at the same cross-section.

[0042] To control the solder layer thickness after soldering more precisely and flexibly, the position of each air knife 321 is adjustable, allowing it to move along the height of the soldering frame 1 and / or horizontally along the distribution direction of the multiple soldering drive components 22 (i.e., the K2 direction). However, this invention does not impose any limitations on this.

[0043] In this embodiment, as Figure 1 As shown, the lead wire traction assembly 31 includes a lead wire traction drive 311, a lifting frame 312 driven by the lead wire traction drive 311 and connected to the solder coating rack 1 in a lifting manner, and multiple lead wire traction guide wheels 313 disposed on the lifting frame 312. Specifically, in the working state, the multiple lead wire traction guide wheels 313 are located at the top of the solder coating rack 1. Before solder coating, the substrate needs to be wound around the lead wire to the multiple lead wire traction guide wheels 313. Before solder coating, the operator can control the lead wire traction drive 311 through the controller to move the lifting frame 312 and the multiple lead wire traction guide wheels 313 to a suitable height so as to wind the substrate around the multiple lead wire traction guide wheels 313; then, the controller controls the lead wire traction drive 311 to move the lifting frame 312 and the multiple lead wire traction guide wheels 313 to the top of the solder coating rack 1 to achieve vertical traction of the solder strip. Specifically, the outgoing line traction drive can be a drive motor or a cylinder, and the tin-coating frame is equipped with a slide rail that cooperates with the lifting frame.

[0044] Furthermore, such as Figure 1 As shown, the solder strip tinning device provided in this embodiment also includes a rear-end traction component 4 disposed on the tinning frame 1 and located on one side of the traction cooling mechanism 3. The rear-end traction component 4 pulls the tinned and cooled solder strip to the next process, such as the solder strip winding process. Specifically, the rear-end traction component 4 includes a traction fixing frame 41 movably connected to the tinning frame 1 and multiple rear-end traction members 42 disposed on the traction fixing frame 41, each rear-end traction member 42 pulling one solder strip. Specifically, the rear-end traction member 42 includes a traction motor and multiple traction gears. However, this utility model does not impose any limitations on this.

[0045] Furthermore, such as Figure 1 and Figure 3 As shown, the multi-wire soldering strip coating device provided in this embodiment also includes an inlet traction component 5 disposed on the inlet side 201 of the inlet frame 1 to pull the substrate into the inlet mechanism 2.

[0046] Correspondingly, this example also provides a solder ribbon processing device including the aforementioned multi-wire solder ribbon coating apparatus. Specifically, the solder ribbon processing device may include a wire feeding device and an annealing device located at the front end of the solder ribbon coating apparatus, and a wire take-up device located at the rear end of the solder ribbon coating apparatus. However, this utility model does not impose any limitations on this.

[0047] In other embodiments, the solder strip processing equipment may also include a wire drawing device disposed between the wire feeding device and the annealing device, and a column soldering coating device located between the annealing device and the solder strip tinning device.

[0048] In summary, in the multi-line solder ribbon coating device and solder ribbon processing equipment provided by this utility model, the traction direction of the substrate on the coating mechanism is configured to be perpendicular or substantially perpendicular to the front side of the operator when performing substrate traction and threading. This configuration provides the operator with sufficient working space to thread each substrate, thereby providing conditions for integrating multiple traction cooling mechanisms into the same coating rack. Furthermore, the sequential distribution of multiple traction cooling mechanisms along directions perpendicular to or intersecting the traction surface ensures that the expanded multi-line solder ribbon coating device only increases in size in the direction perpendicular to the traction direction, while its size in the traction direction remains essentially consistent with existing single-line coating devices. This effectively solves the problem of existing multi-line solder ribbon coating devices being too long to be easily arranged in factories with limited space when expanded into multi-line equipment.

[0049] Although the present invention has been disclosed above by way of preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of protection claimed in the claims.

Claims

1. A multi-wire solder strip tinning device, characterized in that, include: Tin coating rack; The tin coating mechanism is set on the tin coating frame and its opposite sides are configured as the inlet side and the outlet side. Multiple substrates enter from the inlet side, are tinned, and are pulled out from the outlet side. The tin coating pulling direction is from the inlet side to the outlet side and is configured to be perpendicular or substantially perpendicular to the front of the operator when pulling and threading the substrate. A multi-path traction cooling mechanism is located on the lead-out side of the tin-coating mechanism and is sequentially distributed on the tin-coating frame in a direction perpendicular to or intersecting the traction surface. The traction surface is a plane composed of the tin-coating traction direction and the gravity direction. Each traction cooling mechanism includes a lead-out traction component that vertically or nearly vertically tractions the solder strip after tin-coating and at least one cooling component disposed in each lead-out traction component to cool the solder strip.

2. The multi-strand solder ribbon tin coating apparatus of claim 1, wherein, The multi-path traction cooling mechanism is arranged in an inclined column on the tin-coating rack and is arranged in a stepped manner between adjacent traction cooling mechanisms; or, the multi-path traction cooling mechanism is arranged in multiple columns in the tin-coating traction direction and the corresponding traction cooling mechanisms on adjacent columns are staggered.

3. The multi-strand solder ribbon tinning apparatus of claim 1, wherein, The multi-path traction cooling mechanism is separately and independently installed on the tin coating rack; or, the multi-path traction cooling mechanism is integrated into one unit and then assembled on the tin coating rack.

4. The multi-strand solder ribbon tinning apparatus of claim 1, wherein, The tin coating mechanism includes a tin furnace and multiple tin coating drive components. The tin furnace extends in a direction perpendicular to the traction surface. The multiple tin coating drive components are distributed correspondingly to the multi-path traction cooling mechanism. Each tin coating drive component drives the corresponding substrate to move relative to the tin furnace so that the substrate is immersed in the tin furnace or separated from the tin furnace.

5. The multi-wire solder strip tinning device according to claim 4, characterized in that, The furnace body of the tin furnace has an inclined section with gradually decreasing furnace depth on the side near the tin coating mechanism inlet line.

6. The multi-strand solder ribbon tin coating apparatus of claim 5, wherein, The tin furnace body also includes a flat-bottomed furnace body section near the outlet side of the tin coating mechanism and with the inner wall of the furnace body being close to a plane. The tin furnace has the maximum furnace depth at the flat-bottomed furnace body section, and multiple tin coating drive components are arranged at the location of the flat-bottomed furnace body section.

7. The multi-strand solder ribbon tin coating apparatus of claim 6, wherein, The tin furnace also includes at least one ring of first heating elements arranged in a U-shape at the bottom of the inclined furnace section; and / or at least one ring of second heating elements arranged in a U-shape at the bottom of the flat-bottomed furnace section.

8. The multi-strand solder ribbon tinning apparatus of claim 4, wherein, The tin-coating drive assembly includes a tin-coating drive component and a pusher component that moves up and down relative to the tin pot driven by the tin-coating drive component. The pusher component includes a pusher body and a guide component connected to the pusher body. The guide component has a guide groove formed on it to accommodate solder strips and the width of the guide groove matches the diameter of the solder strips.

9. The multi-strand solder ribbon tinning apparatus of claim 1, wherein, The cooling assembly is disposed on the traction path of the lead-out traction assembly, and includes at least one air knife located on the lead-out side of the tinning mechanism and a vertical cooling element located at the rear end of at least one air knife and extending along the height direction of the tinning frame. The vertical cooling element has a cooling channel for conveying solder strips.

10. The multi-strand solder ribbon tin coating apparatus of claim 9, wherein, The vertical cooling component is a vertical air duct, and the cooling channel of the vertical air duct is provided with a nozzle for cooling the tin layer on the solder strip. The nozzle is one; or, the nozzle is multiple and arranged sequentially along the height direction of the vertical air duct.

11. The multi-strand solder ribbon tin coating apparatus of claim 10, wherein, The cooling channel has multiple air nozzles symmetrically distributed on its two side walls. Each air nozzle has either a parallel air outlet or an inclined air outlet facing the top of the tinning rack.

12. The multi-strand solder ribbon tinning apparatus of claim 1, wherein, The outgoing line traction assembly includes an outgoing line traction drive, a lifting frame that is driven by the outgoing line traction drive and is connected to the tin coating rack in a lifting manner, and a plurality of outgoing line traction guide wheels disposed on the lifting frame.

13. The multi-strand solder ribbon tinning apparatus of claim 1, wherein, The multi-wire soldering strip coating device also includes an inlet traction component disposed on the inlet side of the coating rack to draw the substrate into the coating mechanism.

14. A strip processing apparatus, characterized by Includes the multi-wire solder strip tinning apparatus according to any one of claims 1 to 13.

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