Multilayer high-order HDI micropore fine copper plating device

Abstract

The utility model relates to the technical field of HDI micropore copper plating, and discloses a multilayer high-order HDI micropore fine copper plating device which comprises an electroplating bath, the bottom of the electroplating bath is fixedly connected with a supporting column, and the bottom of the supporting column is fixedly connected with a fixed bottom plate. By rotating the threaded rod, the threaded rod drives the sliding block to move, so that the clamping plate moves to be matched with the L-shaped baffle to clamp and fix the HDI circuit board, a plurality of HDI circuit boards can be fixed conveniently, the operation is simple and rapid, the copper plating efficiency is improved, the servo motor is started, the servo motor drives the fixing rod to rotate, the connecting plate is made to rotate, and the clamping plate is fixed. According to the HDI circuit board electroplating device, the clamped and fixed HDI circuit board is rotated to enter the electroplating bath, copper plating is conducted on the HDI circuit board, when one mounting plate enters the electroplating bath, the other mounting plate is located above the electroplating bath, the HDI circuit board to be machined is fixed to the upper mounting plate, continuous machining is achieved, and therefore the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of HDI micro-hole copper plating technology, and in particular to a multilayer high-order HDI micro-hole fine copper plating device. Background Technology

[0002] High-level multilayer PCB (HDI) is an advanced PCB technology primarily used in modern electronic products, especially those requiring miniaturization, high performance, and multifunctional integration. This technology achieves higher integration and smaller size by increasing line density, reducing via diameter, and increasing the number of layers.

[0003] Most existing HDI circuit board micro-via copper plating equipment clamps the circuit board before copper plating. This usually requires fixing each HDI circuit board individually, which is inconvenient for fixing multiple circuit boards at once. This makes the operation cumbersome, affects the efficiency of copper plating, and thus reduces production efficiency. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a multilayer high-order HDI micro-hole fine copper plating device.

[0005] This utility model is achieved by the following technical solution: a multilayer high-order HDI micro-hole fine copper plating device, including an electroplating tank, a support column fixedly connected to the bottom of the electroplating tank, a fixed base plate fixedly connected to the bottom of the support column, a clamping assembly inside the electroplating tank, and a stirring assembly at the upper end of the fixed base plate.

[0006] The clamping assembly includes a servo motor, with a fixed rod fixedly connected to the output end of the servo motor. A connecting plate is fixedly connected to the surface of the fixed rod, and mounting plates are fixedly connected to both ends of the connecting plate. A limit groove is formed in the inner wall of the mounting plate, and a threaded rod is threadedly connected to the inner wall of the mounting plate. A sliding block is slidably connected to the inner wall of the limit groove. An L-shaped baffle is fixedly connected to the upper surface of the mounting plate, and a clamping plate is fixedly connected to the upper surface of the sliding block. Several through holes are formed in the inner bottom wall of the limit groove.

[0007] The above technical solution involves rotating the threaded rod to drive the sliding block to slide along the inner wall of the limiting groove, thereby moving several clamping plates. In conjunction with the L-shaped baffle, the HDI circuit board is fixed. The operation is simple and quick, and it is convenient to perform copper plating on multiple HDI circuit boards at one time. Several through holes facilitate the discharge of the electroplating solution inside the limiting groove.

[0008] As a further improvement to the above solution, the left end of the servo motor is fixedly connected to the right end of the electroplating tank, and the surface of the fixing rod is rotatably connected to the inner wall of the electroplating tank.

[0009] The above technical solution uses a servo motor to drive a fixed rod to rotate, which in turn causes the connecting plate to rotate and the mounting plate to rotate. When one mounting plate enters the electroplating tank, the other mounting plate will be positioned above the electroplating tank. The HDI circuit board to be processed is fixed on the upper mounting plate, thus achieving continuous processing.

[0010] As a further improvement to the above solution, there are two mounting plates, which are symmetrically distributed around the connecting plate. One end of the threaded rod extends to the inner wall of the limiting groove and is rotatably connected to the inner wall of the sliding block.

[0011] The above technical solution uses a limiting groove to limit the sliding block, thus ensuring the stability of the sliding block during movement.

[0012] As a further improvement to the above solution, the number of L-shaped baffles is set to several, and the number of L-shaped baffles is set to several, and the number of clamping plates is set to several, and the number of clamping plates is also ...

[0013] The above technical solution uses an L-shaped baffle to block one side of the HDI circuit board, thus limiting the movement of the HDI circuit board.

[0014] As a further improvement to the above solution, the stirring assembly includes a drive motor, the output end of which is fixedly connected to a transmission rod, the top of which is fixedly connected to a fixing block, and the surface of which is fixedly connected to a stirring blade.

[0015] The above technical solution uses a drive motor to rotate a transmission rod, which in turn rotates a fixed block. This causes several stirring blades to rotate inside the electroplating tank, stirring the electroplating solution and ensuring its uniform distribution, thereby improving the quality of copper plating.

[0016] As a further improvement to the above solution, the bottom of the drive motor is fixedly connected to the top of the fixed base plate, and the surface of the transmission rod is rotatably connected to the inner wall of the electroplating tank.

[0017] As a further improvement to the above solution, both the fixing block and the stirring plate are located inside the electroplating tank, and the number of stirring plates is set to several.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] This invention utilizes a clamping assembly. Specifically, the HDI circuit board is placed between an L-shaped baffle and a clamping plate. Rotating the threaded rod causes the sliding block to move, allowing the clamping plate to move in conjunction with the L-shaped baffle to clamp and fix the HDI circuit board. This facilitates the fixing of multiple HDI circuit boards, offering simple and quick operation and improving copper plating efficiency. Activating the servo motor rotates the fixing rod, causing the connecting plate to rotate and rotate the clamped HDI circuit board into the electroplating tank for copper plating. When one mounting plate enters the electroplating tank, another mounting plate is positioned above it, fixing the HDI circuit board to be processed. This enables continuous processing, thereby improving production efficiency.

[0020] This invention improves the quality of copper plating by setting up a stirring assembly, specifically by starting a drive motor, which drives a transmission rod to rotate, causing a fixed block to rotate, so that several stirring blades rotate inside the electroplating tank to stir the electroplating solution, ensuring that the electroplating solution is evenly distributed. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a schematic cross-sectional view of the present invention.

[0023] Figure 3 This is a schematic diagram of the clamping component structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the mounting plate structure of this utility model;

[0025] Figure 5 This is a schematic diagram of the stirring assembly structure of this utility model.

[0026] Explanation of key symbols:

[0027] 1. Electroplating tank; 2. Support column; 3. Fixed base plate; 4. Clamping assembly; 401. Servo motor; 402. Fixing rod; 403. Connecting plate; 404. Mounting plate; 405. Limiting groove; 406. Threaded rod; 407. Sliding block; 408. L-shaped baffle; 409. Clamping plate; 410. Through hole; 5. Stirring assembly; 501. Drive motor; 502. Transmission rod; 503. Fixing block; 504. Stirring blade. Detailed Implementation

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0029] Example:

[0030] Please combine Figure 1-5 This embodiment of a multilayer high-order HDI micro-hole fine copper plating device includes an electroplating tank 1, a support column 2 fixedly connected to the bottom of the electroplating tank 1, a fixed base plate 3 fixedly connected to the bottom of the support column 2, a clamping assembly 4 provided inside the electroplating tank 1, and a stirring assembly 5 provided at the upper end of the fixed base plate 3.

[0031] The clamping assembly 4 includes a servo motor 401. A fixing rod 402 is fixedly connected to the output end of the servo motor 401. A connecting plate 403 is fixedly connected to the surface of the fixing rod 402. Mounting plates 404 are fixedly connected to both ends of the connecting plate 403. A limiting groove 405 is formed in the inner wall of the mounting plate 404. A threaded rod 406 is threadedly connected to the inner wall of the mounting plate 404. A sliding block 407 is slidably connected to the inner wall of the limiting groove 405. An L-shaped baffle 408 is fixedly connected to the upper surface of the mounting plate 404. A clamping plate 409 is fixedly connected to the upper surface of the sliding block 407. Several through holes 410 are formed in the inner bottom wall of the limiting groove 405. The HDI circuit board is placed between the L-shaped baffle 408 and the clamping plate 409, and then the threaded rod 406 is rotated. The threaded rod 406 drives the sliding block 407 to move, causing the clamping plate 409 to move and cooperate with the L-shaped baffle 408 to clamp and fix the HDI circuit board. This facilitates the fixing of multiple HDI circuit boards, making the operation simple and quick and improving the copper plating efficiency. The servo motor 401 is started, which drives the fixing rod 402 to rotate, causing the connecting plate 403 to rotate and rotate the clamped and fixed HDI circuit board into the electroplating tank 1 for copper plating. When one mounting plate 404 enters the electroplating tank 1, the other mounting plate 404 will be located above the electroplating tank 1. The HDI circuit board to be processed is fixed on the upper mounting plate 404, realizing continuous processing and thus improving production efficiency.

[0032] The left end of the servo motor 401 is fixedly connected to the right end of the electroplating tank 1, and the surface of the fixing rod 402 is rotatably connected to the inner wall of the electroplating tank 1.

[0033] There are two mounting plates 404, which are symmetrically distributed around the connecting plate 403. One end of the threaded rod 406 extends to the inner wall of the limiting groove 405 and is rotatably connected to the inner wall of the sliding block 407.

[0034] There are several L-shaped baffles 408, which are evenly distributed. There are also several clamping plates 409, which are evenly distributed.

[0035] The stirring assembly 5 includes a drive motor 501. A transmission rod 502 is fixedly connected to the output end of the drive motor 501. A fixed block 503 is fixedly connected to the top of the transmission rod 502. A stirring blade 504 is fixedly connected to the surface of the fixed block 503. When the drive motor 501 is started, it drives the transmission rod 502 to rotate, which in turn drives the fixed block 503 to rotate. This causes several stirring blades 504 to rotate inside the electroplating tank 1, stirring the electroplating solution and ensuring that the electroplating solution is evenly distributed, thereby improving the copper plating quality.

[0036] The bottom of the drive motor 501 is fixedly connected to the top of the fixed base plate 3, and the surface of the transmission rod 502 is rotatably connected to the inner wall of the electroplating tank 1.

[0037] Both the fixing block 503 and the stirring plate 504 are located inside the electroplating tank 1, and the number of stirring plates 504 is set to several.

[0038] The implementation principle of the multilayer high-order HDI micro-via fine copper plating device in this embodiment is as follows: First, the HDI circuit board is placed between the L-shaped baffle 408 and the clamping plate 409. Then, the threaded rod 406 is rotated, causing the sliding block 407 to move, thus moving the clamping plate 409 to cooperate with the L-shaped baffle 408 to clamp and fix the HDI circuit board. This facilitates the fixing of multiple HDI circuit boards, making the operation simple and quick, and improving copper plating efficiency. The servo motor 401 is then started, causing the fixing rod 402 to rotate, which in turn rotates the connecting plate 403, thus clamping and fixing the HDI circuit board. The HDI circuit board rotates into the electroplating tank 1 for copper plating. When one mounting plate 404 enters the electroplating tank 1, the other mounting plate 404 will be positioned above the electroplating tank 1. The HDI circuit board to be processed is fixed on the upper mounting plate 404, realizing continuous processing and thus improving production efficiency. The drive motor 501 is started, which drives the transmission rod 502 to rotate, causing the fixed block 503 to rotate. This causes several stirring blades 504 to rotate inside the electroplating tank 1, stirring the electroplating solution and ensuring that the electroplating solution is evenly distributed, thereby improving the copper plating quality.

[0039] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A multi-layer high-order HDI micro-hole fine copper plating device, characterized in that, The electroplating tank (1) is provided with a support column (2) fixedly connected to the bottom of the electroplating tank (1), a fixed base plate (3) fixedly connected to the bottom of the support column (2), a clamping assembly (4) is provided inside the electroplating tank (1), and a stirring assembly (5) is provided at the upper end of the fixed base plate (3). The clamping assembly (4) includes a servo motor (401), the output end of which is fixedly connected to a fixing rod (402), the surface of which is fixedly connected to a connecting plate (403), the two ends of which are fixedly connected to mounting plates (404), the inner wall of which is provided with a limiting groove (405), the inner wall of which is threadedly connected to a threaded rod (406), the inner wall of which is slidably connected to a sliding block (407), the upper surface of which is fixedly connected to an L-shaped baffle (408), the upper surface of which is fixedly connected to a clamping plate (409), and the inner bottom wall of which is provided with several through holes (410).

2. The multi-layer high-order HDI micro-hole fine copper plating device according to claim 1, characterized in that: The left end of the servo motor (401) is fixedly connected to the right end of the electroplating tank (1), and the surface of the fixing rod (402) is rotatably connected to the inner wall of the electroplating tank (1).

3. The multi-layer high-order HDI micro-hole fine copper plating device of claim 1, wherein: There are two mounting plates (404), which are symmetrically distributed around the connecting plate (403). One end of the threaded rod (406) extends to the inner wall of the limiting groove (405) and is rotatably connected to the inner wall of the sliding block (407).

4. The multi-layer high-order HDI micro-hole fine copper plating device of claim 1, wherein: The number of L-shaped baffles (408) is set to a certain extent, and the number of L-shaped baffles (408) is set to a certain extent, and the number of clamping plates (409 ...

5. The multi-layer high-order HDI micro-hole fine copper plating device of claim 1, wherein: The stirring assembly (5) includes a drive motor (501), the output end of the drive motor (501) is fixedly connected to a transmission rod (502), the top of the transmission rod (502) is fixedly connected to a fixing block (503), and the surface of the fixing block (503) is fixedly connected to a stirring blade (504).

6. The multi-layer high-order HDI micro-hole fine copper plating device according to claim 5, characterized in that: The bottom of the drive motor (501) is fixedly connected to the top of the fixed base plate (3), and the surface of the transmission rod (502) is rotatably connected to the inner wall of the electroplating tank (1).

7. The multi-layer high-order HDI micro-via fine copper plating device of claim 5, wherein: The fixing block (503) and the stirring plate (504) are both located inside the electroplating tank (1), and the number of stirring plates (504) is set to several.

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