Cooling instrument and shell

Abstract

The utility model relates to a cooling instrument and a shell, and the cooling instrument comprises a shell which is provided with a heat dissipation port communicated with the external environment; the semiconductor refrigeration structure is arranged in the shell; the heat dissipation fan is arranged in the shell, and an air outlet is formed in the heat dissipation fan; and the closed air duct structure is located in the shell, and the heat dissipation opening and the air outlet are communicated through the closed air duct structure. According to the utility model, the closed air duct structure is arranged, and the air outlet of the heat dissipation fan is connected with the heat dissipation opening of the shell in a one-way conducting physical isolation manner, so that hot air flow is forcibly restrained to directionally flow along the path of the closed air duct structure; the problems that cold air and hot air are mixed and hot air flows back into a product due to disordered diffusion of airflow in a traditional open heat dissipation system are solved, airflow turbulence loss and energy dissipation are reduced, meanwhile, the hot air exhaust speed and direction consistency are improved through the guiding effect of the inner wall of the closed air duct structure on the airflow, and therefore the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of cooling devices, and in particular to a cooling device and a housing. Background Technology

[0002] Most existing cooling devices use semiconductor refrigeration technology to achieve active cooling. The core of the device is to generate a temperature difference between the hot and cold ends through a semiconductor thermoelectric module, and rely on a cooling fan to expel the heat generated at the hot end to the outside of the device.

[0003] However, the airflow direction in existing cooling devices lacks effective constraint, causing some hot air to form vortices or reverse flow inside the casing, resulting in the mixing of hot and cold air. This not only weakens the actual cooling effect of the semiconductor cooling structure, but also exacerbates the rise in cold end temperature due to heat accumulation, forcing the cooling fan to operate continuously at high load to maintain heat dissipation efficiency, thereby increasing energy consumption and noise. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a cooling device and housing that prevents backflow and has good heat dissipation effect, aiming to solve at least one of the problems of the prior art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] This utility model provides a cooling device, comprising:

[0007] The casing is equipped with heat dissipation vents that communicate with the external environment;

[0008] A semiconductor cooling structure is disposed within the housing;

[0009] A cooling fan is disposed inside the housing, and the cooling fan is provided with an air outlet;

[0010] A closed-loop air duct structure is located inside the housing, and the closed-loop air duct structure connects the heat dissipation port and the air outlet.

[0011] In the above technical solution, one of the air outlet and the closed air duct structure extends into the other and the two abut against each other in the circumferential direction.

[0012] In any of the above technical solutions, one of the air outlet and the closed air duct structure is provided with a rib at the position where the two overlap, and the rib abuts against the other.

[0013] In any of the above technical solutions, the cross-section of the closed air duct structure gradually expands outward from the air outlet end to the heat dissipation outlet end.

[0014] In any of the above technical solutions, the inner wall surface of the housing is raised to form a first sealing baffle and a second sealing baffle. The first sealing baffle and the second sealing baffle extend from one side of the inner wall surface of the housing to the other side and are arranged opposite to each other and spaced apart. The closed air duct structure is defined by at least the first sealing baffle, the second sealing baffle and the inner wall surface of the housing.

[0015] In any of the above technical solutions, the side of the first sealing baffle facing the second sealing baffle has a first rib protruding.

[0016] The side of the second sealing baffle facing the first sealing baffle has a second rib protruding from it;

[0017] The inner wall surface of the housing has a third rib protruding from it, and the third rib transitions between the first rib and the second rib. At least a portion of the outer peripheral wall of the air outlet abuts against the first rib, the second rib and the third rib.

[0018] The above-mentioned technical solutions also include:

[0019] A heat sink is located above the semiconductor cooling structure, and a cooling fan is located above the heat sink.

[0020] The inner wall of the housing has an upwardly protruding third sealing baffle, which transitions between the first sealing baffle and the second sealing baffle. The top of the third sealing baffle extends beyond the heat sink to the air outlet, and the third sealing baffle constitutes part of the closed air duct structure.

[0021] In any of the above technical solutions, the heat sink includes a heat sink base plate, the heat sink base plate is provided with a plurality of heat sink fins distributed at intervals, and the heat sink base plate is provided with slots;

[0022] The third sealing baffle includes a plate body and a plurality of mutually spaced sealing teeth extending upward from the top of the plate body. The sealing teeth pass through the slot and are inserted into the gap between adjacent heat sinks. The sidewall of the sealing teeth abuts against the sidewall of the adjacent heat sink to seal the gap between the heat sinks.

[0023] In any of the above technical solutions, the heat dissipation base plate extends from the slot toward the air outlet in the air outlet direction to form an extension section, and the extension section is located within the closed air duct structure;

[0024] Some of the heat sinks are spaced apart on the extension section, and the heat sinks on the extension section extend along the air outlet direction to form an airflow channel extending along the air outlet direction.

[0025] In any of the above technical solutions, the housing includes:

[0026] The first housing is provided with a portion of the first sealing baffle and a portion of the second sealing baffle;

[0027] The second shell is provided with another part of the first sealing baffle and another part of the second sealing baffle;

[0028] The first shell and the second shell are closed such that a portion of the first sealing baffle abuts against another portion and a portion of the second sealing baffle abuts against another portion, so as to assemble the closed air duct structure;

[0029] One of the first shell and the second shell is provided with a positioning post, and the other is provided with a positioning groove. The positioning post is inserted into the positioning groove so that the first shell and the second shell are aligned and a portion of the first sealing baffle and a portion of the second sealing baffle are respectively aligned.

[0030] In any of the above technical solutions, the semiconductor cooling structure is at least partially located inside the first housing, and the heat dissipation fan is located above the semiconductor cooling structure and at least partially located inside the second housing;

[0031] The second housing is provided with the heat dissipation vent and the air inlet that communicates with the external environment.

[0032] In any of the above technical solutions, the cooling fan has an air inlet on the side facing the semiconductor cooling structure, the air outlet is located on the side of the cooling fan, and the heat dissipation port is located on the side wall of the second housing.

[0033] The above-mentioned technical solutions also include:

[0034] At least one power supply structure is electrically connected to the semiconductor cooling structure, the power supply structure being located within the housing between the air inlet and the cooling fan.

[0035] In any of the above technical solutions, the inner wall surface of the first shell is raised to form a plurality of spaced support ribs, and the power supply structure is disposed on the support ribs;

[0036] The inner wall of the second shell has multiple spaced ribs protruding from it. The first shell and the second shell cover each other, so that the ribs and the support ribs clamp the power supply structure.

[0037] The above-mentioned technical solutions also include:

[0038] The cooling structure has a contact portion and a cooling plate that are connected together;

[0039] The outer wall of the housing is recessed inward to form a mounting groove. The bottom wall of the mounting groove has a through opening. The peripheral sidewall of the through opening extends into the housing to form a fixing groove. The contact portion is disposed in the mounting groove, the cooling plate is disposed in the fixing groove, and at least a portion of the semiconductor cooling structure is disposed in the fixing groove and abuts against the cooling plate.

[0040] Another aspect of this utility model provides a housing for a cooling device. The housing is configured to accommodate a semiconductor cooling structure and a heat dissipation fan. The housing has a heat dissipation vent communicating with the external environment. The housing has a closed air duct structure inside. One end of the closed air duct structure is configured to abut against the air outlet of the heat dissipation fan, and the other end abuts against the heat dissipation vent, so as to connect the heat dissipation vent and the air outlet.

[0041] This invention uses a closed-loop air duct structure to connect the air outlet of the cooling fan to the heat dissipation port of the casing in a unidirectional, physically isolated manner. This forces the hot airflow to flow directionally along the path of the closed-loop air duct structure, avoiding the problems of hot and cold air mixing and hot air recirculation into the product caused by disordered airflow diffusion in traditional open-loop cooling systems. This reduces airflow turbulence losses and energy dissipation. At the same time, the guiding effect of the inner wall of the closed-loop air duct structure on the airflow improves the consistency of the hot air exhaust speed and direction, thereby enhancing the heat dissipation efficiency. Attached Figure Description

[0042] Figure 1 This is a perspective view of a cooling device proposed in one embodiment of the present invention;

[0043] Figure 2 This is a perspective view of a cooling device proposed in one embodiment of the present invention;

[0044] Figure 3 This is a front view of a cooling device according to an embodiment of the present invention;

[0045] Figure 4 for Figure 3 The sectional view of AA shown in the figure;

[0046] Figure 5 for Figure 4 An enlarged schematic diagram of part B shown in the image;

[0047] Figure 6 This is a top view of a cooling device according to an embodiment of the present invention;

[0048] Figure 7 for Figure 6 The cross-sectional view of CC shown in the figure;

[0049] Figure 8 This is an exploded view of a cooling device proposed in one embodiment of the present invention.

[0050] Figure 9 This is a perspective view of the housing according to an embodiment of the present invention.

[0051] Figure 10 This is a cross-sectional view of a housing according to an embodiment of the present invention;

[0052] Figure 11 This is a cross-sectional view of another housing according to one embodiment of the present invention;

[0053] Figure 12 This is a front view of the first shell according to an embodiment of the present invention;

[0054] Figure 13 A perspective view of the first shell proposed in an embodiment of the present invention;

[0055] Figure 14 This is a perspective view of the first shell proposed in one embodiment of the present invention.

[0056] Figure 15 This is a front view of the second shell according to an embodiment of the present invention;

[0057] Figure 16 This is a perspective view of the second shell proposed in an embodiment of the present invention;

[0058] Figure 17 This is a perspective view of a heat sink frame according to an embodiment of the present invention;

[0059] Figure 18 This is a perspective view of a heat sink according to an embodiment of the present invention.

[0060] Figure 19 This is a perspective view of a semiconductor cooling structure proposed in an embodiment of the present invention.

[0061] Figure 20 This is a three-dimensional structural diagram of a cooling fan proposed in an embodiment of the present invention.

[0062] The correspondence between the reference numerals and the component names is as follows:

[0063] 10. Cooling device; 100. Housing; 101. Heat dissipation vent; 102. Air inlet; 110. First housing; 111. Support rib; 120. Second housing; 121. Pressure rib; 130. Positioning post; 140. Positioning groove; 150. Mounting groove; 160. Through opening; 170. Fixing groove; 200. Semiconductor cooling structure; 300. Cooling fan; 301. Air outlet; 302. Air inlet; 400. Enclosed air duct structure; 401. First sealing baffle Plate; 402, Second sealing baffle; 403, Third sealing baffle; 4031, Plate body; 4032, Sealing teeth; 404, First rib; 405, Second rib; 406, Third rib; 407, Reinforcing rib; 500, Heat sink; 510, Heat sink base plate; 511, Slot; 512, Extension section; 520, Heat sink fin; 530, Airflow channel; 600, Power supply structure; 700, Cooling structure; 710, Contact part; 720, Cooling fin. Detailed Implementation

[0064] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0065] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0066] The following is a reference to the appendix. Figure 1 To be continued Figure 20 The present invention describes the cooling device 10 and the housing 100 according to some embodiments.

[0067] like Figure 1 , Figure 3 and Figure 4 As shown, an embodiment of this utility model proposes a cooling device 10, including: a housing 100, a semiconductor cooling structure 200, a heat dissipation fan 300, and a closed air duct structure 400.

[0068] like Figure 3 As shown, the housing 100 is provided with a heat dissipation vent 101, which communicates with the external environment. More specifically, the wall of the housing 100 is provided with a heat dissipation vent 101 that penetrates the inside and outside of the housing 100, so that the space inside the housing 100 communicates with the external environment. For example, the heat dissipation vent 101 is a grid structure or a porous structure.

[0069] like Figure 19As shown, the semiconductor cooling structure 200 is disposed within the housing 100. More specifically, the semiconductor cooling structure 200 is an active thermal management component based on the Peltier effect. It achieves directional heat transfer by driving charge carriers to exchange energy at the interface of two different semiconductor materials through current. Specifically, when current flows through a thermoelectric module composed of alternating N-type semiconductors (electron-rich) and P-type semiconductors (hole-rich), electrons and holes absorb or release lattice energy at the material junction, resulting in heat absorption and cooling at one junction (cold end) and heat release and heating at the other junction (hot end). The cold end can release cold energy to achieve cooling, while the hot end relies on a heat sink to dissipate heat to the external environment.

[0070] It should be noted that although the present invention is named Cooling Device 10, based on the working principle of the semiconductor cooling structure 200, the Cooling Device 10 can also be designed to include a controller. The controller is electrically connected to the semiconductor cooling structure 200 and is configured to switch the direction of the power supply current of the semiconductor cooling structure 200, thereby directly changing the position of the cold end and the hot end of the semiconductor cooling structure 200, so as to realize the function of cooling or heating on demand on the side in contact with the user, thus enriching the product's functions.

[0071] like Figure 4 As shown, a cooling fan 300 is disposed inside the housing 100, and the cooling fan 300 has an air outlet 301. When the cooling device 10 is cooling, the cooling fan 300 drives the airflow to promptly expel the heat generated at the hot end of the semiconductor cooling structure 200 outside the housing 100, thereby achieving cooling of the housing 100. For example, the cooling fan 300 is a blower; more specifically, the cooling fan 300 is a centrifugal fan.

[0072] The closed air duct structure 400 is located inside the housing 100. The closed air duct structure 400 connects the heat dissipation port 101 and the air outlet 301, so that the cooling fan 300 drives the airflow through the air outlet 301 and along the closed air duct structure 400 to the heat dissipation port 101 to discharge outside the housing 100.

[0073] It should be noted that the closed-loop air duct structure 400 refers to the airflow passage formed by physical enclosure, connecting the heat dissipation port 101 and the air outlet 301. It can be an independently installed component, such as a guide shroud fixed to the housing 100 by clips or bolts, or it can be a cavity structure formed by the housing 100 or the cooling fan 300 itself through integrated processing (such as injection molding or stamping). The closed-loop air duct structure 400 is generally closed to limit the unidirectional flow path of airflow from the air outlet 301 to the heat dissipation port 101. However, its "closed" nature does not require absolute airtightness; gaps caused by process errors that do not affect the core backflow prevention function are allowed. Of course, a completely sealed effect can also be achieved by adding elastic sealing elements (such as rubber strips or silicone pads) to fill gaps or cover interfaces.

[0074] By setting up a closed air duct structure 400, the air outlet 301 of the cooling fan 300 is connected to the heat dissipation port 101 of the housing 100 in a unidirectional physical isolation manner. This forces the hot airflow to flow directionally along the path of the closed air duct structure 400, avoiding the problems of hot and cold air mixing and hot air recirculation into the product caused by disordered airflow diffusion in traditional open heat dissipation systems. This reduces airflow turbulence loss and energy dissipation. At the same time, the guiding effect of the inner wall of the closed air duct structure 400 on the airflow improves the consistency of the hot air exhaust speed and direction, thereby enhancing heat dissipation efficiency.

[0075] In one embodiment, such as Figure 4 and Figure 5 As shown, one of the air outlet 301 and the enclosed air duct structure 400 extends into the other and the two abut against each other in the circumferential direction.

[0076] It should be noted that one of the air outlet 301 and the closed air duct structure 400 does not need to extend completely into the other. It is sufficient to ensure that the end area of ​​the air outlet 301 and the end area of ​​the closed air duct structure 400 are in circumferential contact, so that the airflow discharged from the air outlet 301 can all enter the closed air duct structure 400.

[0077] In detail, the air outlet 301 of the cooling fan 300 can be designed with different structures according to specific requirements. The air outlet 301 can be designed as a protruding opening structure on one side wall of the cooling fan 300 (such as a rectangular opening, a circular opening, or a volute-type opening). This allows the protruding opening structure to extend into the closed air duct structure 400, or vice versa, without the cooling fan 300 body needing to cooperate with the closed air duct structure 400; for example... Figure 20As shown, one side wall of the cooling fan 300 can also be designed as a frame, with the air outlet 301 directly enclosed by the frame side wall. This allows one end of the frame side wall of the cooling fan 300 to extend into the closed air duct structure 400, or the closed air duct structure 400 to extend into one end of the frame side wall of the cooling fan 300.

[0078] By nesting the air outlet 301 with the enclosed air duct structure 400, the physical limit of the circumferential contact between the two is used to achieve contact sealing, effectively reducing the assembly gap at the connection, resulting in better sealing effect and avoiding air leakage caused by interface misalignment or gaps in the transmission path, thus achieving compact assembly.

[0079] Of course, in other embodiments, the air outlet 301 and the closed air duct structure 400 can be designed not to be nested, but rather the end of the closed air duct structure 400 can be designed to abut against the end of the air outlet 301. Furthermore, the cooling device 10 can also be designed to include an elastic sealing element located between the end of the closed air duct structure 400 and the end of the air outlet 301, and clamped and fixed by the two, which can also achieve the connection between the air outlet 301 and the closed air duct structure 400 to prevent air leakage.

[0080] In one embodiment, such as Figure 10 and Figure 11 As shown, one of the air outlet 301 and the closed air duct structure 400 has a raised rib at the overlapping position (the raised rib can be understood by referring to the first raised rib 404, the second raised rib 405, and the third raised rib 406 in the attached drawings), and the raised rib abuts against the other. In a specific embodiment, the air outlet 301 extends into the closed air duct structure 400, and the inner wall surface of the closed air duct structure 400 is raised to form a raised rib, which is adapted to and abuts against at least a portion of the outer peripheral wall of the air outlet 301. By setting a raised rib in the overlapping area of ​​the air outlet 301 or the closed air duct structure 400, the planar contact is optimized into a linear contact, and the concentrated pressure of the raised rib enhances the sealing tightness of the abutment part, significantly improving the airtightness at the interface.

[0081] Based on any of the above embodiments, combined with Figure 12 and Figure 15 As shown, the cross-section of the closed air duct structure 400 gradually expands outward from the air outlet 301 end to the heat dissipation outlet 101 end, thereby causing the airflow to naturally decelerate and increase static pressure within the closed air duct structure 400, effectively reducing kinetic energy loss, while enhancing the diffusion uniformity of hot air discharge and improving heat dissipation efficiency.

[0082] Based on any of the above embodiments, such as Figure 10 , Figure 12 , Figure 14 , Figure 15and Figure 16 As shown, a first sealing baffle 401 and a second sealing baffle 402 are formed on the inner wall surface of the housing 100. The first sealing baffle 401 and the second sealing baffle 402 extend from one side of the inner wall surface of the housing 100 to the other side and are arranged opposite to each other and spaced apart. The closed air duct structure 400 is defined by at least the first sealing baffle 401, the second sealing baffle 402 and the inner wall surface of the housing 100.

[0083] In one specific embodiment, the housing 100 has an upper wall and a lower wall that are relatively spaced apart, and a peripheral sidewall connecting the upper wall and the lower wall. A heat dissipation opening 101 is provided on the peripheral sidewall. The upper end of the first sealing baffle 401 is connected to the upper wall of the housing 100, and the lower end is connected to the lower wall of the housing 100. The upper end of the second sealing baffle 402 is connected to the upper wall of the housing 100, and the lower end is connected to the lower wall of the housing 100. The first sealing baffle 401 and the second sealing baffle 402 extend into the peripheral sidewall of the housing 100 where the heat dissipation opening 101 is located. The first sealing baffle 401 and the second sealing baffle 402 are positioned and connected to the peripheral side wall of the housing 100. The ends of the first sealing baffle 401 and the second sealing baffle 402 away from the heat dissipation port 101 extend to the air outlet 301 of the heat dissipation fan 300 and are connected to the side wall of the air outlet 301. This allows the first sealing baffle 401, the second sealing baffle 402, the area between the first sealing baffle 401 and the second sealing baffle 402 in the upper wall of the housing 100, and the area between the first sealing baffle 401 and the second sealing baffle 402 in the lower wall of the housing 100 to jointly define the closed air duct structure 400. Of course, the above is only one embodiment of the closed air duct structure 400. Those skilled in the art can also design it according to actual needs. For example, the heat dissipation port 101 can be designed to be located on the upper wall of the housing 100 or at the transition between the upper wall and the peripheral side wall of the housing 100. Then, the positions of the first sealing baffle 401 and the second sealing baffle 402 can be designed and planned according to the position of the heat dissipation port 101, so as to ensure that the closed air duct structure 400 enclosed by the first sealing baffle 401, the second sealing baffle 402 and the inner wall of the housing 100 can guide the airflow discharged from the air outlet 301 into the heat dissipation port 101.

[0084] By directly forming the first sealing baffle 401 and the second sealing baffle 402 as an integral protrusion from the inner wall of the housing 100, the processing and assembly steps of the independent air duct components are eliminated, simplifying the overall structure and reducing the number of parts in the product. At the same time, the air guide wall is formed by utilizing the spatial layout of the housing 100 itself, making full use of the internal space of the housing 100, which is conducive to achieving a compact layout.

[0085] Furthermore, such as Figure 15 and Figure 16As shown, the first sealing baffle 401 has a first rib 404 protruding on the side facing the second sealing baffle 402, the second sealing baffle 402 has a second rib 405 protruding on the side facing the first sealing baffle 401, and the inner wall surface of the housing 100 has a third rib 406 protruding. The third rib 406 transitions between the first rib 404 and the second rib 405, and at least a portion of the outer peripheral wall of the air outlet 301 abuts against the first rib 404, the second rib 405 and the third rib 406.

[0086] By setting interconnected rib structures on the first sealing baffle 401, the second sealing baffle 402 and the inner wall of the housing 100, on the one hand, the planar contact is further optimized into linear contact, which enhances airtightness and effectively prevents airflow leakage. On the other hand, the ribs can also serve as reinforcing ribs 407, which can also improve the bending resistance of the sealing baffle and the housing 100 and prevent deformation.

[0087] Depending on the actual needs, part of the outer peripheral wall of the air outlet 301 can be designed to abut against the first rib 404, the second rib 405 and the third rib 406. Alternatively, the inner wall surface of the shell 100 can be designed to form a fourth rib. The fourth rib and the third rib 406 are distributed opposite to each other and transitionally connected to the first rib 404 and the second rib 405, so that the first rib 404, the second rib 405, the third rib 406 and the fourth rib form a frame structure, thereby completely abutting against the air outlet 301 in the circumferential direction.

[0088] Optionally, such as Figure 15 and Figure 16 As shown, the side of the first sealing plate opposite to the second sealing plate has at least one reinforcing rib 407 protruding.

[0089] Optionally, such as Figure 15 and Figure 16 As shown, the side of the second sealing plate opposite to the first sealing plate has at least one reinforcing rib 407 protruding.

[0090] The design of the reinforcing rib 407 strengthens the first sealing plate and the second sealing plate, preventing deformation of the first sealing plate and the second sealing plate. Furthermore, the reinforcing rib 407 is set on the outside of the closed air duct structure 400 to ensure the smooth flow within the closed air duct structure 400 and to prevent the reinforcing rib 407 from obstructing the flow of gas.

[0091] Based on any of the foregoing embodiments, such as Figure 8As shown, the cooling device 10 also includes a heat sink 500, which is located above the semiconductor cooling structure 200. A cooling fan 300 is located above the heat sink 500. The heat sink 500 can absorb the heat generated by the hot end of the semiconductor cooling structure 200. The cooling fan 300 drives the gas flow to fully exchange heat with the heat sink 500, thereby improving the heat dissipation efficiency. At the same time, it achieves a compact arrangement, which is conducive to the miniaturization design of the product.

[0092] Furthermore, such as Figure 10 , Figure 11 and Figure 12 As shown, a third sealing baffle 403 is formed by an upward protrusion on the inner wall surface of the housing 100. The third sealing baffle 403 transitions and connects to the first sealing baffle 401 and the second sealing baffle 402. The top of the third sealing baffle 403 extends beyond the heat sink 500 to the air outlet 301. The third sealing baffle 403 constitutes part of the closed air duct structure 400. That is, the closed air duct structure 400 is defined by at least the first sealing baffle 401, the second sealing baffle 402, the third sealing baffle 403 and the inner wall surface of the housing 100.

[0093] More specifically, the third sealing baffle 403 extends upward from the bottom wall of the housing 100, passes over the heat sink 500, and abuts against the bottom end of the air outlet 301. In this way, the upper end of the air outlet 301 is abutted by the top wall of the housing 100, the left and right ends of the air outlet 301 are abutted by the first sealing baffle 401 and the second sealing baffle 402, and the lower end of the air outlet 301 is abutted by the third sealing baffle 403 to prevent air leakage.

[0094] Further optionally, in embodiments where the first sealing baffle 401 and the second sealing baffle 402 are provided with the first protruding rib 404 and the second protruding rib 405, the third sealing baffle 403 can be designed to connect with the first protruding rib 404 and the second protruding rib 405, such that the first protruding rib 404, the second protruding rib 405, the third protruding rib 406 and the third sealing baffle 403 form a frame to abut against the air outlet 301 in the circumferential direction.

[0095] Based on the above embodiments, such as Figure 17 and Figure 18 As shown, the heat sink 500 includes a heat sink base 510, which is located above and in contact with the semiconductor cooling structure 200. This increases the direct contact area between the heat sink 500 and the semiconductor cooling structure 200, resulting in higher heat transfer efficiency. More specifically, the heat sink base 510 covers the semiconductor cooling structure 200 and extends outward on at least one side, further increasing the area of ​​the heat sink base 510 and improving heat dissipation efficiency.

[0096] The heat dissipation base plate 510 is provided with a plurality of heat dissipation fins 520 spaced apart from each other. The heat dissipation fins 520 further increase the contact surface between the airflow and the heat dissipation frame 500, thereby improving the heat dissipation efficiency. More specifically, the plurality of heat dissipation fins 520 can be designed to be distributed in rows, with the heat dissipation fins 520 spaced apart between rows and within each row. In this way, the heat dissipation fins 520 are evenly spaced in both the horizontal and vertical directions. The cooling fan 300 drives the airflow to flow through the gaps, thereby improving the heat dissipation efficiency. Of course, there are various ways to arrange the heat dissipation fins 520. Those skilled in the art can design it according to the actual space requirements. For example, the heat dissipation fins 520 can also be designed to be distributed in a ring shape.

[0097] Furthermore, such as Figure 6 , Figure 7 and Figure 14 As shown, the heat dissipation base plate 510 is provided with a slot 511, and the third sealing baffle 403 includes a plate body 4031 and a plurality of mutually spaced sealing teeth 4032 extending upward from the top of the plate body 4031. The sealing teeth 4032 pass through the slot 511 and are inserted into the gap between adjacent heat sinks 520. The sealing teeth 4032 and the heat sinks 520 are arranged alternately. The sidewall of the sealing teeth 4032 abuts against the sidewall of the adjacent heat sinks 520 to seal the gap between the heat sinks 520.

[0098] On the one hand, the sealing teeth 4032 of the third sealing baffle 403 are inserted into the slots 511 of the heat sink base plate 510 to achieve the purpose of limiting and fixing the heat sink bracket 500. On the other hand, the sealing teeth 4032 and the heat sink 520 are arranged alternately to block the gaps between the heat sink 520. In the air outlet direction, this prevents the airflow from flowing back through the gaps between the heat sink 520. Furthermore, the sealing teeth 4032 only block the gap at the end of the heat sink 520 below the air outlet 301, while most other positions are open to ensure that the flow of heat dissipation air is unobstructed and to ensure the heat dissipation effect.

[0099] Based on the above embodiment, the heat dissipation base plate 510 extends from the slot 511 toward the air outlet 301 to form an extension section 512. The extension section 512 is located within the closed air duct structure 400. Some heat sinks 520 are distributed at intervals on the extension section 512, and the heat sinks 520 disposed on the extension section 512 extend along the air outlet 301 to form an airflow channel 530 extending along the air outlet 301.

[0100] Furthermore, the top of the heat sink 520 located on the extension section 512 is adapted to the inner wall surface of the housing 100, so that this part of the heat sink 520 is more adapted to the shape of the housing 100 and maximizes the heat dissipation area.

[0101] On the one hand, the extension section 512 not only directly increases the distribution length of the heat sink 520, increases the contact area with the airflow, and improves the heat dissipation efficiency, but also the heat sink 520 on the extension section is positioned opposite the air outlet 301, so that after the airflow undergoes initial heat exchange through the heat sink 500, it continues to flow along the air duct and makes secondary contact with the heat sink 520 on the extension section 512, further absorbing residual heat and achieving multi-stage heat dissipation with better heat dissipation effect. On the other hand, the layout of the heat sink 520 extending in the direction of air outlet forms a linear airflow channel 530, which guides the airflow along the extension direction of the heat sink 520 through the surface of the heat sink 520, reducing turbulence and kinetic energy loss. At the same time, the inertia of the airflow is used to maintain the trajectory of the airflow discharged through the heat dissipation port 101, avoiding the problem of reverse flow of the airflow discharged to the outside. In summary, by extending the heat dissipation base plate 510 toward the air outlet 301 to form an extension section 512 located within the closed air duct structure 400, and arranging heat dissipation fins 520 parallel to the air outlet direction at intervals along the extension section 512, the heat dissipation area is effectively expanded and the airflow path is optimized, achieving efficient air outlet, low resistance, and backflow prevention within a limited space.

[0102] Based on any of the above embodiments, such as Figure 12 and Figure 16 As shown, the housing 100 includes a first housing 110 and a second housing 120. The first housing 110 is provided with a portion of a first sealing baffle 401 and a portion of a second sealing baffle 402, and the second housing 120 is provided with another portion of the first sealing baffle 401 and another portion of the second sealing baffle 402. The first housing 110 and the second housing 120 are closed such that a portion of the first sealing baffle 401 and another portion abut against each other, and a portion of the second sealing baffle 402 and another portion abut against each other, to form a closed air duct structure 400.

[0103] In this embodiment, the housing 100 is a split structure. The corresponding parts of the first sealing baffle 401 and the second sealing baffle 402 are pre-formed on the first housing 110 and the second housing 120, respectively. When the first housing 110 and the second housing 120 are closed, the first sealing baffle 401 and the second sealing baffle 402 automatically abut and fit together. A complete closed air duct structure 400 can be formed without additional connecting parts, which eliminates the installation steps of the closed air duct structure 400, reduces the complexity of the mold and the manufacturing cost, and improves the assembly efficiency.

[0104] Optionally, one of the first shell 110 and the second shell 120 is provided with a positioning post 130, and the other is provided with a positioning groove 140. The positioning post 130 is inserted into the positioning groove 140, so that the first shell 110 and the second shell 120 are aligned, and a portion of the first sealing baffle 401 and a portion of the second sealing baffle 402 are respectively aligned. The precise guidance of the positioning post 130 and the positioning groove 140 ensures that the segmented interfaces of the sealing baffles are seamlessly connected when the first shell 110 and the second shell 120 are closed, eliminating manual adjustment errors. The insertion and cooperation of the positioning post 130 and the positioning groove 140 enables rapid alignment and assembly, simplifies the manufacturing process and assembly flow, and improves assembly efficiency and airtightness of the air duct.

[0105] Based on the above embodiments, such as Figure 3 and Figure 4 As shown, the semiconductor cooling structure 200 is at least partially located inside the first housing 110, and the heat dissipation fan 300 is located above the semiconductor cooling structure 200 and at least partially located inside the second housing 120, thus making full use of the space of the first housing 110 and the second housing 120 to achieve a compact layout.

[0106] Furthermore, such as Figure 6 As shown, the second shell 120 is provided with a heat dissipation port 101 and an air inlet 102 that communicates with the external environment, which reduces the number of openings in the first shell 110 and helps to ensure the strength of the first shell 110.

[0107] Furthermore, such as Figure 3 , Figure 4 As shown, the cooling fan 300 has an air inlet 302 on the side facing the semiconductor cooling structure 200, an air outlet 301 is located on the side of the cooling fan 300, and a heat dissipation port 101 is located on the side wall of the second shell 120.

[0108] The air inlet 302 of the cooling fan 300 faces the lower semiconductor cooling structure 200, and the side air outlet 301 is directly aligned with the heat dissipation vent 101 on the side wall of the second shell 120. When the cooling fan 300 is working, it can directly drive the gas inside the shell 100 to flow towards the semiconductor cooling structure 200 for sufficient heat exchange. At the same time, the side air outlet design allows the cooling fan 300 and the closed air duct structure 400 to be arranged compactly in the horizontal direction, reducing the vertical space of the shell 100 (that is, reducing the vertical space shown in the attached figure), thereby achieving the thickness reduction design of the shell 100. Understandably, the increase in the lateral dimension of the shell 100 can increase the contact area between the cooling device 10 and the user, thereby improving the cooling effect. The vertical thickness reduction design realizes the miniaturization and portability of the product, making it more convenient to use.

[0109] Based on any of the foregoing embodiments, such as Figure 7As shown, the cooling device 10 also includes at least one power supply structure 600, for example, a battery. The power supply structure 600 is electrically connected to the semiconductor cooling structure 200 to supply power to the conductor cooling structure, enabling the conductor cooling structure to cool at the cold end. The power supply structure 600 is located between the air inlet 102 and the cooling fan 300 inside the housing 100.

[0110] In one specific embodiment, the cooling fan 300 has a first sidewall, a second sidewall and a third sidewall located at both ends of the first sidewall and respectively connected to both ends of the first sidewall, wherein the first sidewall is provided with an air outlet 301, and the housing 100 is provided with at least two air inlets 102, one of which is opposite to the second sidewall and the other is opposite to the third sidewall.

[0111] There are two power supply structures 600, one of which is located on the side of the second side wall and the other on the side of the third side wall. This increases the power supply capacity of the power supply structure 600 and also makes full use of the space inside the housing 100 to achieve a compact layout.

[0112] By placing the power supply structure 600 in the air intake path between the air inlet 102 and the cooling fan 300, the cooling fan 300 operates, and external cold air enters the housing 100, flows over the surface of the power supply structure 600, and is then drawn in by the cooling fan 300, thereby achieving heat dissipation for the power supply components, further reducing the temperature of the housing 100, thus ensuring the cooling effect and extending the service life of the power supply structure 600. At the same time, there is no need to add heat dissipation components for the power supply structure 600, simplifying the structure and reducing energy consumption. Through the rational planning of the airflow path, without interfering with the heat dissipation of the hot end of the semiconductor cooling structure 200, the same airflow is used to simultaneously complete the heat dissipation of the power supply structure 600 and the semiconductor cooling structure 200. Furthermore, the power supply structure 600 is placed close to the semiconductor cooling module, shortening the power supply line layout distance, thereby improving heat dissipation efficiency, extending service life, and achieving space compactness.

[0113] Optionally, such as Figure 14 As shown, the inner wall surface of the first shell 110 has a plurality of spaced support ribs 111 protruding, and the power supply structure 600 is disposed on the support ribs 111.

[0114] Optionally, such as Figure 16 As shown, the inner wall surface of the second shell 120 has multiple spaced ribs 121 protruding, and the first shell 110 and the second shell 120 cover each other, so that the ribs 121 and the support ribs 111 clamp the power supply structure 600.

[0115] By providing spaced-apart support ribs 111 on the inner wall of the first shell 110 to support the power supply structure 600, and corresponding pressure ribs 121 on the inner wall of the second shell 120, the power supply module is stably installed by the clamping action of the pressure ribs 121 and the support ribs 111 when the shell 100 is closed. At the same time, the gaps between the support ribs 111 and the pressure ribs 121 form a three-dimensional airflow channel 530 that runs through the top and bottom of the power supply structure 600. After external cold air enters from the air inlet 102, part of it flows along the gaps in the support ribs 111 through the bottom of the power supply structure 600 and absorbs heat from its lower surface, while the other part flows through the gaps in the pressure ribs 121 through the top of the power supply structure 600 and carries away heat from its upper surface. This bidirectional airflow contact maximizes the heat dissipation area and heat exchange efficiency.

[0116] Of course, the above is only a preferred embodiment of the present invention. In other embodiments, only the support rib 111 or only the pressure rib 121 may be designed.

[0117] Based on any of the foregoing embodiments, such as Figure 2 As shown, the cooling device 10 also includes a cooling structure 700, which has a contact portion 710 and a cooling plate 720 connected to each other. Figure 9 and Figure 13 As shown, the outer wall of the housing 100 is recessed inward to form a mounting groove 150. The bottom wall of the mounting groove 150 is provided with a through opening 160. The peripheral side wall of the through opening 160 extends into the housing 100 to form a fixing groove 170. The contact portion 710 is disposed in the mounting groove 150, the cooling plate 720 is disposed in the fixing groove 170, and at least a portion of the semiconductor cooling structure 200 is disposed in the fixing groove 170 and abuts against the cooling plate 720.

[0118] By embedding the contact portion 710 into the recessed mounting groove 150 on the outside of the housing 100, the user can contact the contact portion 710 to achieve cooling of the corresponding part. The fixing groove 170 extends into the housing 100, and the cooling plate 720 abuts against the semiconductor cooling structure 200 to achieve efficient heat transfer and compact space layout.

[0119] like Figures 1 to 20 As shown, this utility model also provides a housing 100 for a cooling device 10. The housing 100 is configured to house a semiconductor cooling structure 200 and a cooling fan 300. The housing 100 has a heat dissipation port 101 that communicates with the external environment. The housing 100 has a closed air duct structure 400 inside. One end of the closed air duct structure 400 is configured to abut against the air outlet 301 of the cooling fan 300, and the other end abuts against the heat dissipation port 101 to connect the heat dissipation port 101 and the air outlet 301.

[0120] The specific structure and effect of the housing 100 provided in this embodiment can be referred to the housing 100 of the cooling device 10 above, and will not be repeated here.

[0121] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0122] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A cryogenic device, characterized by, include: The casing is equipped with heat dissipation vents that communicate with the external environment; A semiconductor cooling structure is disposed within the housing; A cooling fan is disposed inside the housing, and the cooling fan is provided with an air outlet; A closed-loop air duct structure is located inside the housing, and the closed-loop air duct structure connects the heat dissipation port and the air outlet.

2. The cooling device according to claim 1, characterized in that, One of the air outlet and the enclosed air duct structure extends into the other and the two abut against each other in the circumferential direction.

3. The cooling device according to claim 2, characterized in that, One of the air outlet and the enclosed air duct structure has a raised rib at the overlapping position, and the raised rib abuts against the other.

4. The cooling device according to any one of claims 1 to 3, characterized in that, The cross-section of the closed air duct structure gradually expands outward from the air outlet end to the heat dissipation outlet end.

5. The cooling device according to any one of claims 1 to 3, characterized in that, The inner wall surface of the housing has a protrusion forming a first sealing baffle and a second sealing baffle. The first sealing baffle and the second sealing baffle extend from one side of the inner wall surface of the housing to the other side and are arranged opposite to each other and spaced apart. The closed air duct structure is defined by at least the first sealing baffle, the second sealing baffle and the inner wall surface of the housing.

6. The cooling device according to claim 5, characterized in that, The side of the first sealing baffle facing the second sealing baffle has a first rib protruding from it; The side of the second sealing baffle facing the first sealing baffle has a second rib protruding from it; The inner wall surface of the housing has a third rib protruding from it, and the third rib transitions between the first rib and the second rib. At least a portion of the outer peripheral wall of the air outlet abuts against the first rib, the second rib and the third rib.

7. The cooling apparatus of claim 5, wherein, Also includes: A heat sink is located above the semiconductor cooling structure, and a cooling fan is located above the heat sink. The inner wall of the housing has an upwardly protruding third sealing baffle, which transitions between the first sealing baffle and the second sealing baffle. The top of the third sealing baffle extends beyond the heat sink to the air outlet, and the third sealing baffle constitutes part of the closed air duct structure.

8. The cooling device according to claim 7, characterized in that, The heat sink includes a heat sink base plate, on which a plurality of heat sink fins are arranged at intervals, and the heat sink base plate is provided with slots; The third sealing baffle includes a plate body and a plurality of mutually spaced sealing teeth extending upward from the top of the plate body. The sealing teeth pass through the slot and are inserted into the gap between adjacent heat sinks. The sidewall of the sealing teeth abuts against the sidewall of the adjacent heat sink to seal the gap between the heat sinks.

9. The cooling device according to claim 8, characterized in that, The heat dissipation base plate extends from the slot toward the air outlet in the air outlet direction to form an extension section, and the extension section is located within the closed air duct structure; Some of the heat sinks are spaced apart on the extension section, and the heat sinks on the extension section extend along the air outlet direction to form an airflow channel extending along the air outlet direction.

10. The cooling apparatus of claim 5, wherein, The housing includes: The first housing is provided with a portion of the first sealing baffle and a portion of the second sealing baffle; The second shell is provided with another part of the first sealing baffle and another part of the second sealing baffle; The first shell and the second shell are closed such that a portion of the first sealing baffle abuts against another portion and a portion of the second sealing baffle abuts against another portion, so as to assemble the closed air duct structure; One of the first shell and the second shell is provided with a positioning post, and the other is provided with a positioning groove. The positioning post is inserted into the positioning groove so that the first shell and the second shell are aligned and a portion of the first sealing baffle and a portion of the second sealing baffle are respectively aligned.

11. The cooling device according to claim 10, characterized in that, The semiconductor cooling structure is at least partially located within the first housing, and the heat dissipation fan is located above the semiconductor cooling structure and at least partially located within the second housing; The second housing is provided with the heat dissipation vent and the air inlet that communicates with the external environment.

12. The cooling device according to claim 11, characterized in that, The cooling fan has an air inlet on the side facing the semiconductor cooling structure, the air outlet is located on the side of the cooling fan, and the heat dissipation port is located on the side wall of the second housing.

13. The cooling apparatus of claim 11, wherein, Also includes: At least one power supply structure is electrically connected to the semiconductor cooling structure, the power supply structure being located within the housing between the air inlet and the cooling fan.

14. The cooling device according to claim 13, characterized in that, The inner wall surface of the first shell has a plurality of spaced support ribs protruding from it, and the power supply structure is disposed on the support ribs; The inner wall of the second shell has multiple spaced ribs protruding from it. The first shell and the second shell cover each other, so that the ribs and the support ribs clamp the power supply structure.

15. The cooling apparatus according to any one of claims 1 to 3, wherein Also includes: The cooling structure has a contact portion and a cooling plate that are connected together; The outer wall of the housing is recessed inward to form a mounting groove. The bottom wall of the mounting groove has a through opening. The peripheral sidewall of the through opening extends into the housing to form a fixing groove. The contact portion is disposed in the mounting groove, the cooling plate is disposed in the fixing groove, and at least a portion of the semiconductor cooling structure is disposed in the fixing groove and abuts against the cooling plate.

16. A housing for a hypothermia unit, characterized by The housing is configured to house a semiconductor cooling structure and a heat dissipation fan. The housing has a heat dissipation vent that communicates with the external environment. The housing has a closed air duct structure inside. One end of the closed air duct structure is configured to abut against the air outlet of the heat dissipation fan, and the other end is configured to abut against the heat dissipation vent, so as to connect the heat dissipation vent and the air outlet.

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