Back pressure type temperature and pressure integrated sensor

Abstract

The utility model discloses a back pressure type temperature and pressure integrated sensor, and relates to the sensor field, the back pressure type temperature and pressure integrated sensor comprises a housing, the bottom of the housing is fixedly provided with an installation sleeve, the outer wall of the lower end of the installation sleeve is provided with external threads, the top surface of the installation sleeve is fixedly provided with a temperature and pressure pedestal, and the temperature and pressure pedestal is arranged in the inner cavity of the housing; according to the utility model, the temperature measuring structure and the pressure measuring structure are arranged in the same shell, so that the occupation of the whole sensor during installation is greatly reduced, the flexibility is improved, the installation steps are reduced, the installation process is simplified, and the space planning difficulty and the assembly complexity during installation are also reduced because the installation occupation is reduced.

Description

Technical Field

[0001] This utility model relates to the field of sensors, and more particularly to a back pressure integrated temperature and pressure sensor. Background Technology

[0002] With the accelerated development of smart water meters, high-precision multi-parameter sensing has become a key technological requirement for improving metering reliability. To address the complex operating conditions of water supply networks (such as fluid density changes caused by temperature fluctuations and metering distortion due to pressure anomalies), it is necessary to integrate simultaneous detection of both temperature and pressure on the same terminal. However, current technologies generally employ a discrete sensor architecture: temperature probes and pressure transmitters are independently packaged and installed separately inside the meter body via cables. This approach increases installation steps and space requirements, posing challenges to installation location planning. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, the purpose of this utility model is to provide a back-pressure integrated temperature and pressure sensor that can simultaneously measure temperature and pressure parameters in a confined space, simplifying the installation process and reducing production costs and maintenance difficulties.

[0004] To address the problems in the existing technology, the technical solution of this utility model is as follows:

[0005] A back-pressure integrated temperature and pressure sensor includes a housing, a mounting sleeve fixed to the lower end of the housing, a temperature and pressure base fixed to the top of the mounting sleeve, a temperature measuring component mounted on the axis of the temperature and pressure base, the temperature measuring component being located inside the mounting sleeve, a pressure measuring channel forming on the bottom surface of the temperature and pressure base communicating with the inner cavity of the mounting sleeve, and a pressure measuring component fixed on the top surface of the temperature and pressure base directly opposite the upper opening of the pressure measuring channel. The temperature and pressure base and the mounting sleeve cooperate to seal the lower opening of the housing.

[0006] Optionally, a through hole is formed at the axial position of the temperature and pressure base, and the temperature measuring component includes a temperature measuring shell that is interference-fitted into the shoulder position at the lower end of the through hole. A temperature measuring sensor is installed inside the temperature measuring shell, and the lower end of the temperature measuring shell extends to the bottom of the mounting sleeve to realize the temperature detection work in the pipeline.

[0007] Optionally, the pressure measuring channel includes an annular pressure measuring groove formed on the bottom surface of the temperature and pressure base. The top surface of the pressure measuring groove has a pressure measuring hole that penetrates the temperature and pressure base. The axis of the pressure measuring groove, the axis of the mounting sleeve, and the axis of the temperature and pressure base coincide. The pressure measuring assembly includes a silicon pressure sensor fixed on the top surface of the temperature and pressure base, directly opposite the pressure measuring hole, to realize the detection of the internal pressure of the pipeline.

[0008] Compared with the prior art, the advantages of this utility model are as follows:

[0009] This invention arranges the temperature measurement structure and pressure measurement structure in the same housing, which greatly reduces the space occupied by the entire sensor during installation, improves flexibility, reduces installation steps, and simplifies the installation process. Due to the reduced installation space, the difficulty of space planning and assembly complexity during installation are also reduced. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0011] Figure 2 This is a schematic diagram of the pressure measuring groove structure of this utility model.

[0012] Figure 3 This is a side sectional view of the present invention.

[0013] Reference numerals: 1. Housing; 2. Mounting sleeve; 3. External thread; 4. Temperature and pressure base; 5. Pressure measuring groove; 6. Through hole; 7. Temperature measuring housing; 8. Temperature sensor; 9. Signal processing board; 10. Pressure measuring hole; 11. Silicon pressure sensor; 12. Filler adhesive; 13. Signal wire. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0015] Please see Figures 1 to 3 This embodiment provides a back pressure type integrated temperature and pressure sensor, including a housing 1. A mounting sleeve 2 is fixed to the bottom of the housing 1. An external thread 3 is formed on the outer wall of the lower end of the mounting sleeve 2. A temperature and pressure base 4 is fixed to the top surface of the mounting sleeve 2. The temperature and pressure base 4 is located in the inner cavity of the housing 1. An annular pressure measuring groove 5 is formed on the bottom surface of the temperature and pressure base 4. The axis of the pressure measuring groove 5, the axis of the temperature and pressure base 4, and the axis of the mounting sleeve 2 coincide. The pressure measuring groove 5 is connected to the inner cavity of the mounting sleeve 2. A through hole 6 is formed at the axis of the temperature and pressure base 4. The through hole 6 connects to the inner cavity of the mounting sleeve 2. A temperature measuring housing 7 is provided at the axis of the mounting sleeve 2. The upper end of the temperature measuring housing 7 is interference-fitted into the shoulder of the lower end of the through hole 6. A temperature sensor 8 is installed inside the temperature measuring housing 7.

[0016] A channel for supplying the medium is formed between the outer wall of the temperature measuring housing 7 and the inner wall of the mounting sleeve 2. The medium enters the pressure measuring tank 5 through the pressure measuring channel, and a pressure measuring hole 10 is formed on the top surface of the pressure measuring tank 5, which penetrates the temperature and pressure base 4. A silicon pressure sensor 11 is fixed by adhesive at the position on the top surface of the temperature and pressure base 4 directly opposite the pressure measuring hole 10. The silicon pressure sensor 11 seals the end of the pressure measuring hole 10, which can effectively measure pressure without leakage.

[0017] After the mounting sleeve 2 is fixed to the pipeline to be measured using the external thread 3, the temperature measuring shell 7 and the temperature measuring sensor 8 form a temperature measuring probe that extends into the medium to measure the temperature. The medium in the pipeline is pressed into the channel by the pressure in the pipeline, enters the pressure measuring groove 5, and then enters the pressure measuring hole 10 to squeeze the silicon pressure sensor 11 to achieve pressure measurement.

[0018] A filler 12 is inserted into the opening at the upper end of the outer casing 1. A signal wire 13 is connected to the filler 12. One end of the signal wire 13 is located on the outside of the outer casing 1, and the other end is located on the inside of the outer casing 1 and electrically connected to the signal processing board 9. The silicon pressure sensor 11 and the temperature sensor are also electrically connected to the signal processing board 9, which is installed in the inner cavity of the outer casing 1. The signal processing board 9 is essentially a custom circuit board that integrates multiple circuit modules specifically for processing the signals acquired by the sensors. Taking traditional temperature and pressure sensors as examples, in split-type measuring devices, the analog signal output by the temperature sensor (such as a thermistor sensor) is easily affected by environmental interference and has limited accuracy; the weak analog signal output by the pressure sensor (such as a piezoresistive pressure sensor) also needs to be amplified and filtered before it can be transmitted accurately.

[0019] Compared to traditional separate measurement technologies, this back-pressure integrated temperature and pressure sensor integrates temperature and pressure detection modules into a single housing. In confined installation spaces, this significantly reduces installation footprint, simplifies the installation process, lowers space planning difficulty and assembly complexity, and enhances equipment installation flexibility.

[0020] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A back pressure temperature and pressure integrated sensor comprising a housing (1), characterized in that, The lower end of the outer shell (1) is fixed with an installation sleeve (2), and the top of the installation sleeve (2) is fixed with a temperature and pressure base (4). A temperature measuring component is installed at the axis of the temperature and pressure base (4). The temperature measuring component is located inside the installation sleeve (2). The bottom surface of the temperature and pressure base (4) forms a pressure measuring channel that connects to the inner cavity of the installation sleeve (2). The top surface of the temperature and pressure base (4) is fixed with a pressure measuring component at the position of the upper opening of the pressure measuring channel. The temperature and pressure base (4) and the installation sleeve (2) cooperate to seal the lower opening of the outer shell (1).

2. The back pressure type temperature and pressure integrated sensor according to claim 1, wherein A through hole (6) is formed at the axial position of the temperature and pressure base (4). The temperature measuring component includes a temperature measuring shell (7) that is interference-fitted into the shoulder position at the lower end of the through hole (6). A temperature sensor (8) is installed inside the temperature measuring shell (7).

3. The back pressure type temperature and pressure integrated sensor according to claim 2, characterized by The lower end of the temperature measuring housing (7) extends below the mounting sleeve (2).

4. The backside pressure temperature and pressure integrated sensor according to claim 1, wherein The pressure measuring channel includes an annular pressure measuring groove (5) opened on the bottom surface of the temperature and pressure base (4), and a pressure measuring hole (10) penetrating the temperature and pressure base (4) is opened on the top surface of the pressure measuring groove (5).

5. The back pressure type temperature and pressure integrated sensor according to claim 4, wherein The axis of the pressure measuring groove (5), the axis of the mounting sleeve (2), and the axis of the temperature and pressure base (4) coincide.

6. The backside pressure temperature-pressure integrated sensor according to claim 5, wherein The pressure measuring assembly includes a silicon pressure sensor (11) fixed on the top surface of the thermo-pressure base (4) directly opposite the pressure measuring hole (10).

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