Glass micro-melting temperature and pressure integrated sensor

Abstract

The utility model discloses a glass micro-melting temperature and pressure integrated sensor, which relates to the field of sensors and comprises a shell, a mounting sleeve is fixed at the bottom of the shell, external threads are formed on the outer wall of the mounting sleeve, and the mounting sleeve can be directly screwed on a pipeline through the external threads. Temperature and pressure in the pipeline are detected; according to the utility model, the temperature measuring sensor for measuring temperature, the pressure sensing plate for measuring pressure and the silicon strain gauge are all arranged in the shell, and the two sensors are combined, so that the installation work of the two sensors can be completed only by one-time installation during installation, the installation occupied space is reduced, and the installation efficiency is improved. Particularly, when the intelligent water meter is installed in the intelligent water meter, the difficulty of installation position planning is reduced.

Description

Technical Field

[0001] This utility model relates to the field of sensors, and in particular to a glass micro-melting temperature and pressure integrated sensor. Background Technology

[0002] With the accelerated development of smart water meters, high-precision multi-parameter sensing has become a key technological requirement for improving metering reliability. To address the complex operating conditions of water supply networks (such as fluid density changes caused by temperature fluctuations and metering distortion due to pressure anomalies), it is necessary to integrate simultaneous detection of both temperature and pressure on the same terminal. However, current technologies generally employ a discrete sensor architecture: the temperature probe and pressure transmitter are independently packaged and installed separately inside the meter body. This approach increases installation steps and space requirements, posing challenges to installation location planning. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, the purpose of this utility model is to provide an integrated glass micro-melting temperature and pressure sensor, which solves the problem that existing technologies that simultaneously measure temperature and pressure require two separate sensors, resulting in increased installation space requirements and difficulties in planning the installation location.

[0004] To address the problems in the existing technology, the technical solution of this utility model is as follows:

[0005] A glass micro-melting temperature and pressure integrated sensor includes a housing, a mounting sleeve fixed to the bottom of the housing, a temperature and pressure base fixed to the top surface of the mounting sleeve, an annular groove formed on the bottom surface of the temperature and pressure base, the annular groove connecting to the inner cavity of the mounting sleeve, a pressure-sensing plate on the top plate of the temperature and pressure base, the top surface of the annular groove and the bottom surface of the pressure-sensing plate being coplanar to form a pressure-sensing surface, a pressure measuring unit installed on the top surface of the pressure-sensing plate, the pressure measuring unit sensing the deformation of the pressure-sensing plate to detect pressure, a temperature measuring component installed at the center of the bottom surface of the temperature and pressure base, the temperature measuring component passing through the mounting sleeve and extending to the bottom of the mounting sleeve.

[0006] Optionally, the axis of the annular groove, the axis of the temperature and pressure base, and the axis of the mounting sleeve coincide. The outer wall of the mounting sleeve is formed with an external thread. Through the external thread, the mounting sleeve can be directly tightened onto the pipeline to perform temperature and pressure detection work inside the pipeline.

[0007] Optionally, the pressure measuring unit includes silicon strain gauges bonded to the top surface of the pressure-sensing plate using glass micro-fusion. The number of silicon strain gauges is at least two, and all silicon strain gauges are distributed at equal angular intervals on the top surface of the pressure-sensing plate, so that the pressure measuring results can be more uniform.

[0008] Optionally, a through hole is provided at the axis of the temperature and pressure base, and the temperature measuring component includes a temperature measuring shell that is inserted into the shoulder of the through hole, and a temperature measuring sensor is installed inside the temperature measuring shell.

[0009] Optionally, an encapsulation body and a signal processing board are sequentially inserted and fixed at the upper end of the inner cavity of the outer shell from top to bottom, and the silicon strain gauge and temperature sensor are electrically connected to the signal processing board.

[0010] Compared with the prior art, the advantages of this utility model are as follows:

[0011] This invention combines a temperature sensor for measuring temperature with a pressure sensor and a silicon strain gauge for measuring pressure, all housed within a single housing. This allows for installation of both sensors in a single setup, reducing installation space requirements. In particular, it simplifies the planning of installation locations when used in smart water meters. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0013] Figure 2 This is a side sectional view of the present invention.

[0014] Figure 3 This is a schematic diagram of the silicon strain gauge structure of this utility model.

[0015] Reference numerals: 1. Housing; 2. Mounting sleeve; 3. External thread; 4. Temperature and pressure base; 5. Annular groove; 6. Pressure sensing plate; 7. Pressure sensing surface; 8. Silicon strain gauge; 9. Through hole; 10. Temperature measuring housing; 11. Temperature sensor; 12. Signal processing board; 13. Package. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0017] Please see Figures 1 to 3 This embodiment provides a glass micro-melting temperature and pressure integrated sensor, including a housing 1, with an installation sleeve 2 fixed to the bottom of the housing 1. The outer wall of the installation sleeve 2 has an external thread 3. Through the external thread 3, the installation sleeve 2 can be directly tightened onto the pipeline to perform temperature and pressure detection work inside the pipeline.

[0018] The top surface of the mounting sleeve 2 is fixed with a thermo-pressure base 4, and the bottom surface of the thermo-pressure base 4 forms an annular groove 5. The annular groove 5 connects to the inner cavity of the mounting sleeve 2. The axis of the annular groove 5, the axis of the thermo-pressure base 4, and the axis of the mounting sleeve 2 coincide. The coincidence of the axes eliminates redundant assembly gaps. The axial overlapping design makes the thermo-pressure base 4, the annular groove 5, and the sleeve form a nested integrated structure, which saves space compared to the split layout.

[0019] The top plate of the thermo-pressure base 4 is a pressure-sensing plate 6. The top surface of the annular groove 5 and the bottom surface of the pressure-sensing plate 6 are coplanar to form a pressure-sensing surface 7. A silicon strain gauge 8 is bonded to the top surface of the pressure-sensing plate 6 using glass micro-melting. The different materials (silicon strain gauge 8 and pressure-sensing plate 6) are seamlessly combined by melting the glass medium at high temperature, which has both mechanical strength and long-term stability. There are two silicon strain gauges 8. All the silicon strain gauges 8 are distributed at equal angular intervals on the top surface of the pressure-sensing plate 6, so that the pressure measurement results can be more uniform. The entire sensor is installed in the pipeline. The medium in the pipeline passes through the inner cavity of the installation sleeve 2 to the annular groove 5. The pressure-sensing plate 6 is squeezed in the annular groove 5. The pressure-sensing plate 6 is deformed due to the pressure. The silicon strain gauge 8 will change its resistance with the deformation. The pressure value can be calculated by measuring the resistance change.

[0020] A through hole 9 is provided at the axis of the temperature and pressure base 4. The upper end of the through hole 9 passes through the pressure sensing plate 6. The shoulder of the lower end of the through hole 9 is interference-fitted with a temperature measuring shell 10. A temperature measuring sensor 11 is installed inside the temperature measuring shell 10. The lower end of the temperature measuring shell 10 extends through the mounting sleeve 2 to the bottom of the mounting sleeve 2. After the mounting sleeve 2 is installed on the pipeline, the temperature measuring shell 10 extends into the pipeline, so that the temperature inside the pipeline can be detected by the temperature measuring sensor 11, thus realizing the temperature detection work.

[0021] An encapsulation body 13 and a signal processing board 12 are sequentially inserted and fixed at the upper end of the inner cavity of the outer shell 1 from top to bottom. The silicon strain gauge 8 and the temperature sensor 11 are electrically connected to the signal processing board 12. The encapsulation body 13 seals the outside, and the temperature and pressure signals are transmitted to the signal processing board 12 for processing. Then, the signal transmission wires of the signal processing board 12 pass through the encapsulation body 13 and are transmitted to the outside of the outer shell 1 to complete the temperature and pressure measurement work in the pipeline. The signal processing board 12 is essentially a customized circuit board that integrates multiple circuit modules and is specifically used to process the signals collected by the sensors. Taking traditional temperature and pressure sensors as an example, in split-type measuring equipment, the analog signal output by the temperature sensor is easily affected by environmental interference and has limited accuracy; the weak analog signal output by the pressure sensor also needs to be amplified and filtered before it can be transmitted accurately.

[0022] In summary, this utility model's integrated packaging structure integrates a temperature sensor (temperature sensing element) and a pressure sensing assembly (including a pressure sensing plate 6 and a silicon strain gauge 8) into a single housing, achieving simultaneous detection of both temperature and pressure parameters. This integrated design reduces the sensor installation process to a single positioning operation, effectively reducing space occupation. It is particularly suitable for miniaturized devices such as smart water meters, eliminating spatial interference problems in multi-sensor collaborative layouts and improving assembly efficiency and system reliability.

[0023] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. Glass micro-fritted pyroelectric sensor comprising a housing (1), characterized in that, The bottom of the outer shell (1) is fixed with an installation sleeve (2), and the top surface of the installation sleeve (2) is fixed with a temperature and pressure base (4). The bottom surface of the temperature and pressure base (4) forms an annular groove (5), which connects to the inner cavity of the installation sleeve (2). The top plate of the temperature and pressure base (4) is a pressure-sensing plate (6). The top surface of the annular groove (5) and the bottom surface of the pressure-sensing plate (6) are coplanar to form a pressure-sensing surface (7). A pressure measuring unit is installed on the top surface of the pressure-sensing plate (6). The pressure measuring unit senses the deformation of the pressure-sensing plate (6) to detect the pressure. A temperature measuring component is installed at the center of the bottom surface of the temperature and pressure base (4). The temperature measuring component passes through the installation sleeve (2) and extends to the bottom of the installation sleeve (2).

2. The glass micro-fritted, integrally bonded sensor of claim 1, wherein, The axis of the annular groove (5), the axis of the thermo-pressure base (4), and the axis of the mounting sleeve (2) coincide.

3. The glass micro-fritted, integrally bonded sensor of claim 2, wherein, The outer wall of the mounting sleeve (2) is formed with external threads (3).

4. The glass micro-fritted, integrally bonded sensor of claim 1, wherein, The pressure measuring unit includes a silicon strain gauge (8) bonded to the top surface of the pressure-sensing plate (6) using glass micro-fusion bonding, and the number of silicon strain gauges (8) is at least two.

5. The glass micro-fritted, integrally thermally cycled sensor of claim 3, wherein, A through hole (9) is provided at the axis of the temperature and pressure base (4), and the temperature measuring component is inserted into the lower end of the through hole (9).

6. The glass micro-fritted, integrally thermally cycled sensor of claim 4, wherein, The temperature measurement assembly includes a temperature measuring housing (10) inserted into the shoulder of the through hole (9), and a temperature sensor (11) is installed inside the temperature measuring housing (10).

7. The glass micro-melting temperature and pressure integrated sensor according to claim 6, characterized in that, The upper end of the inner cavity of the outer shell (1) is sequentially connected to the encapsulation body (13) and the signal processing board (12) from top to bottom. The silicon strain gauge (8) and the temperature sensor (11) are electrically connected to the signal processing board (12).

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