Carrier for semiconductor laser performance test and test system

Abstract

The utility model belongs to the technical field of semiconductor laser testing, and discloses a carrier and a testing system for testing the performance of a semiconductor laser. The carrier comprises a base, a first installation part is arranged on the upper top face of the base, and a second installation part and a third installation part are arranged on the side wall of the base at intervals. A T0 packaged laser product can be inserted into the first mounting part, a COS packaged laser product can enter the third mounting part in a fixed position mode, and the second mounting part can be matched with fixed position entering of a vertical cavity surface emitting laser product, a distributed feedback laser product and a high-power laser product. According to the utility model, laser products with different packaging modes can be installed and positioned, and the integration degree and adaptability of the carrier are improved, so that the test efficiency can be improved and the test cost can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor laser testing technology, and in particular to a carrier and testing system for testing the performance of semiconductor lasers. Background Technology

[0002] With the rise of cloud computing, 5G, and the Internet of Things, the demand for high speed and high bandwidth is constantly increasing. Semiconductor optical communication technology is highly favored due to its high speed and high bandwidth characteristics. Similarly, with the rise of cloud services and big data, data centers are also continuously increasing their demand for high-performance optical communication products to support larger data storage, stronger processing, and faster transmission capabilities.

[0003] Laser products stand out among numerous semiconductor optical communication products due to their high reliability, easy coupling, low power consumption, low cost, and ease of integration into large-area arrays, and are widely used in the optical communication and consumer electronics industries. With the increasing market demand, verification during the manufacturing process of lasers is becoming increasingly important.

[0004] Currently, most testing equipment on the market uses circular tray-type carriers, resulting in extremely low product compatibility. They can only meet wafer-level testing needs and cannot be compatible with testing other package types or bare chips. This is particularly problematic for testing semiconductor lasers such as Vertical Cavity Surface Emitting Lasers (VCSELs), Distributed Feedback Lasers (DFBs), and High Power Lasers (HPLs), as well as for testing semiconductor lasers with various packaging forms. This directly leads to low integration, low efficiency, and high cost in the testing process. Utility Model Content

[0005] The purpose of this invention is to provide a carrier and testing system for testing the performance of semiconductor lasers, which is used to install and position laser products with different packaging methods, improve the integration and adaptability of the carrier, thereby increasing testing efficiency and reducing testing costs.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] Carriers used for performance testing of semiconductor lasers include:

[0008] The base has a first mounting part on its top surface and a second mounting part and a third mounting part spaced apart on its side walls. A TO packaged laser product can be inserted into the first mounting part, and a COS packaged laser product can be positioned into the third mounting part. The second mounting part can be adapted to position vertical cavity surface emission laser products, distributed feedback laser products, and high-power laser products.

[0009] As an alternative solution for a carrier used for testing the performance of semiconductor lasers, the upper surface of the base is provided with a mounting surface, on which a vertical cavity surface-emitting laser wafer can be placed.

[0010] As an alternative solution for a carrier used for testing the performance of semiconductor lasers, a first vacuum adsorption hole is provided on the mounting surface, through which the vertical cavity surface-emitting laser wafer can be fixed on the mounting surface.

[0011] As an alternative solution for a carrier used for testing the performance of semiconductor lasers, the first mounting portion includes a mounting block fixed on the base, the mounting block having mounting holes for the T0 packaged laser product to pass through, and the pins of the T0 packaged laser product being located outside the mounting holes.

[0012] As an alternative solution for a carrier used for semiconductor laser performance testing, the second mounting part includes a first mounting groove on the base, in which the vertical cavity surface-emitting laser product, the distributed feedback laser product, and the high-power laser product can all be embedded. The bottom surface of the first mounting groove is provided with a second vacuum adsorption hole, through which the vertical cavity surface-emitting laser product, the distributed feedback laser product, or the high-power laser product can be fixed in the first mounting groove.

[0013] As an alternative solution for a carrier used for semiconductor laser performance testing, the third mounting part includes a second mounting groove on the base, the COS packaged laser product can be embedded in the second mounting groove, and the bottom surface of the second mounting groove is provided with a third vacuum adsorption hole, through which the COS packaged laser product can be fixed in the second mounting groove.

[0014] As an alternative solution for a carrier used for testing the performance of semiconductor lasers, the base has an inclined surface along one end near the second mounting portion and the third mounting portion, and the angle between the inclined surface and the horizontal plane is not less than 20°.

[0015] As an alternative solution for a carrier used for semiconductor laser performance testing, the base has through holes extending along the extension direction of the second mounting portion and the third mounting portion. A thermoelectric cooler is installed inside the through holes, and the temperature field around the first mounting portion and the second mounting portion can be adjusted by the thermoelectric cooler.

[0016] The testing system includes a six-degree-of-freedom adjustment stage and a carrier for testing the performance of semiconductor lasers as described in any of the above embodiments. The base is disposed on the six-degree-of-freedom adjustment stage, and the six-degree-of-freedom adjustment stage is used to adjust the spatial position of the base.

[0017] As an optional embodiment of the testing system, the testing system further includes a free probe and a receiver. The free probe is used to electrically connect to the pins of the T0 packaged laser product under test, the pins of the vertical-cavity surface-emitting laser product, the pins of the distributed feedback laser product, the pins of the high-power laser product, or the pins of the COS packaged laser on the carrier for testing semiconductor laser performance. The receiver is capable of receiving the light emitted by the pins of the T0 packaged laser product under test, the vertical-cavity surface-emitting laser product, the distributed feedback laser product, the high-power laser product, or the COS packaged laser.

[0018] Beneficial effects:

[0019] In the first aspect, a first mounting portion is provided on the upper surface of the base. This first mounting portion provides a mounting position for inserting a type of laser product in a T0 package. Additionally, a second and a third mounting portion are provided on the side wall of the base. The second mounting portion provides mounting positions for three types of bar-shaped test structures: vertical-cavity surface-emitting laser (VCSEL) array clips, distributed feedback laser (DFB) bars, and high-power laser (HPL) chips, effectively expanding the types of laser products the carrier can accommodate. The third mounting portion provides a mounting position for a type of laser product in a COS package, further expanding the carrier's capacity to accommodate various types of laser products under test. This carrier can accommodate laser products with different packaging methods for installation and positioning, improving the carrier's integration and adaptability, thereby increasing testing efficiency and reducing testing costs.

[0020] Secondly, the test system equipped with the above-mentioned carriers for testing the performance of semiconductor lasers can improve the compatibility of a single carrier for testing multiple laser products, increase the integration of testing, and save costs. Attached Figure Description

[0021] Figure 1This is a top view of the carrier for testing the performance of semiconductor lasers provided in this embodiment of the present invention;

[0022] Figure 2 This is a cross-sectional view of a carrier for testing the performance of semiconductor lasers provided in an embodiment of this utility model;

[0023] Figure 3 This is a side view of a carrier for testing the performance of semiconductor lasers provided in an embodiment of this utility model.

[0024] In the picture:

[0025] 1. Base; 11. First mounting part; 111. Mounting block; 12. Second mounting part; 13. Third mounting part; 14. Mounting surface; 15. Angled surface; 16. Through hole; 2. Thermoelectric cooler. Detailed Implementation

[0026] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not the entire structure.

[0027] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0030] Please see the appendix Figure 1 -Appendix Figure 3 The first aspect of this embodiment relates to a carrier (hereinafter referred to as "carrier") for testing the performance of semiconductor lasers. The carrier includes a base 1, a first mounting portion 11 is provided on the top surface of the base 1, and a second mounting portion 12 and a third mounting portion 13 are respectively provided at intervals on the side wall of the base 1. A TO packaged laser product can be inserted into the first mounting portion 11, a COS packaged laser product can be positioned in the third mounting portion 13, and the second mounting portion 12 can be adapted to position vertical cavity surface emission laser products, distributed feedback laser products, and high power laser products.

[0031] In this embodiment, the base 1 is a cuboid block structure. The bottom surface of the base 1 extends outward with a mounting plate. The mounting plate is provided with a connecting hole. Threaded fasteners can pass through the connecting hole and connect to the top surface of the six-degree-of-freedom adjustment table. The six-degree-of-freedom adjustment table can realize the translational adjustment of the base 1 in space, thereby enabling the laser located on the base 1 to flexibly adjust its position.

[0032] A first mounting portion 11 is provided on the upper surface of the base 1. The first mounting portion 11 provides a mounting position for inserting a type of laser product in a TO package. In addition, a second mounting portion 12 and a third mounting portion 13 are provided on the side wall of the base 1. The second mounting portion 12 and the third mounting portion 13 are spaced apart. The second mounting portion 12 can provide a mounting position for three types of bar-shaped test structures: vertical cavity surface emission laser products (VCSEL array clip), distributed feedback laser products (DFB bar), and high power laser products (HPL chip), effectively expanding the types of laser products that the carrier can support. The third mounting portion 13 can provide a mounting position for a type of laser product in a COS package, further expanding the types of laser products that the carrier can support. The carrier of this embodiment can adapt to the installation and positioning of laser products with different packaging methods, improve the integration and adaptability of the carrier, thereby improving testing efficiency and reducing testing costs.

[0033] Optionally, a mounting surface 14 is provided on the upper top surface of the base 1, and the vertical cavity surface-emitting laser chip can be placed on the mounting surface 14.

[0034] In this embodiment, the upper top surface of the base 1 is also provided with a mounting surface 14, which allows the vertical cavity surface emitting laser (VCSEL) wafer to be placed directly on the mounting surface 14. In this embodiment, the size of the mounting surface 14 can accommodate the placement of VCSEL wafers of various sizes.

[0035] Optionally, the surface of base 1 is gold-plated.

[0036] In this embodiment, the surface of the base 1 is gold-plated. Gold has low impedance, which can reduce the line resistance of the laser during testing. In addition, gold has a high thermal conductivity, which is beneficial for rapid control of the surrounding temperature field during laser testing. At the same time, gold has stable chemical properties and is not easily oxidized and degraded, ensuring the stability of the testing environment.

[0037] Furthermore, a first vacuum adsorption hole is provided on the mounting surface 14, through which the vertical cavity surface-emitting laser chip can be fixed on the mounting surface 14.

[0038] Multiple first vacuum adsorption holes are opened on the mounting surface 14. Through the vacuuming action, the wafer can be stably fixed on the mounting surface 14 in a non-contact manner.

[0039] Optionally, the first mounting part 11 includes a mounting block 111 fixed on the base 1. The mounting block 111 has mounting holes for the T0 packaged laser product to pass through, and the pins of the T0 packaged laser product are located outside the mounting holes.

[0040] In this embodiment, the mounting block 111 has a stepped structure, with a mounting hole on the top step. The size of the mounting hole is adapted to the cylindrical outer wall size of the T0 packaged laser product, so that the T0 packaged laser to be tested can be directly inserted into the mounting hole, while exposing the pins to facilitate contact and power-on with the free probe.

[0041] Optionally, the second mounting part 12 includes a first mounting groove on the base 1, in which the vertical cavity surface emitting laser (VCSEL array clip), distributed feedback laser (DFB bar), and high power laser (HPL chip) can all be embedded. The bottom surface of the first mounting groove is provided with a second vacuum adsorption hole, through which the VCSEL array clip, DFB bar, and HPL chip can be fixed in the first mounting groove.

[0042] For the VCSEL array clip, DFB bar, and HPL chip, which are all strip-shaped test structures, a first mounting slot is used for reliable positioning. In addition, the vacuum effect of the second vacuum adsorption hole ensures that the VCSEL array clip, DFB bar, and HPL chip are stably fixed in the first mounting slot.

[0043] Optionally, the third mounting part 13 includes a second mounting groove on the base 1, in which the COS packaged laser product can be embedded. The bottom surface of the second mounting groove is provided with a third vacuum adsorption hole, through which the COS packaged laser product can be fixed in the second mounting groove.

[0044] Similarly, in this embodiment, the COS-packaged laser product is positioned by the second mounting groove, and the COS-packaged laser product is adsorbed by the third vacuum adsorption hole located on the bottom surface of the second mounting groove, thereby ensuring that the COS-packaged laser product is stably fixed in the second mounting groove.

[0045] Optionally, the base 1 has an inclined surface 15 along one end near the second mounting part 12 and the third mounting part 13, and the angle between the inclined surface 15 and the horizontal plane is not less than 20°.

[0046] In this embodiment, since the light emitted by the laser is emitted outward at a certain angle to the horizontal plane, a slope 15 of not less than 20° is provided at one end of the base 1 near the second mounting part 12 and the third mounting part 13. This can prevent the light emitted by the laser from being blocked by the base 1, ensuring that the light emitted from the laser at a large angle can still be captured by the laser, which is beneficial for the laser to be fully coupled. In addition, by providing this slope 15, the adjustment space of the light can be increased, reducing the risk of collision between the receiver and the laser.

[0047] In this embodiment, the angle between the inclined plane 15 and the horizontal plane is 55°.

[0048] Optionally, the base 1 has a through hole 16 extending along the direction of the second mounting part 12 and the third mounting part 13. A thermoelectric cooler 2 is installed inside the through hole 16, and the temperature field around the first mounting part 11 and the second mounting part 12 can be adjusted by the thermoelectric cooler 2.

[0049] In this embodiment, a through hole 16 is also opened inside the base 1. The thermoelectric cooler 2 is a straight rod mechanism. The thermoelectric cooler 2 passes through the through hole 16 and is locked at both ends by nuts. The thermoelectric cooler 2 is a small heat pump based on semiconductor materials that can realize both cooling and heating functions at the same time. It is often used in electronic components with precise temperature control. In this embodiment, the use of thermoelectric cooler 2 can realize the adjustment of the temperature field around the base 1 by adjusting the current, so that the corresponding lasers located in the first mounting part 11 and the second mounting part 12 can be tested under the set temperature conditions, thereby obtaining the measurement parameters at a specific temperature.

[0050] The second aspect of this embodiment also relates to a testing system, which includes a six-degree-of-freedom adjustment table and a carrier of more than one, with a base 1 disposed on the six-degree-of-freedom adjustment table, which is used to adjust the spatial position of the base 1.

[0051] Furthermore, the test system also includes a free probe and a receiver. The free probe is used to electrically connect to the pins of the T0 packaged laser product under test, the pins of the VCSEL array clip, the pins of the DFB bar, the pins of the HPL chip, or the pins of the COS packaged laser. The receiver can receive the light emitted by the T0 packaged laser product, VCSEL array clip, DFB bar, HPL chip, or COS packaged laser under test.

[0052] In this embodiment, after the T0-packaged laser product, vertical-cavity surface-emitting laser product (VCSEL array clip), distributed feedback laser product (DFB bar), high-power laser product (HPL chip), and COS-packaged laser product under test are installed with the carrier, power can be supplied to the laser by contacting the corresponding laser pins through a free probe. The free probe can be driven by a conventional robotic arm to precisely control its movement position, ensuring reliable contact between the free probe and the pin. Additionally, the receiver can receive the light emitted by the T0-packaged laser product, VCSEL array clip, DFB bar, HPL chip, and COS-packaged laser product for performance testing and analysis. Taking an 850nm VCSEL product for data communication applications as an example, the performance tests required from R&D to mass production mainly include bandwidth testing, eye diagram testing, LIV testing, spectral testing, and divergence angle testing. The testing system may differ for different tests.

[0053] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A carrier for performance testing of a semiconductor laser, characterized in that include: The base (1) has a first mounting part (11) on its top surface and a second mounting part (12) and a third mounting part (13) on its side wall at intervals. The T0 packaged laser product can be inserted into the first mounting part (11) and the COS packaged laser product can be positioned in the third mounting part (13). The second mounting part (12) can be adapted to position the vertical cavity surface emission laser product, the distributed feedback laser product and the high power laser product.

2. The carrier for semiconductor laser performance testing according to claim 1, wherein, The base (1) has a mounting surface (14) on its top surface, and the vertical cavity surface-emitting laser wafer can be placed on the mounting surface (14).

3. The carrier for semiconductor laser performance testing according to claim 2, wherein, A first vacuum adsorption hole is provided on the mounting surface (14). The vertical cavity surface-emitting laser wafer can be fixed on the mounting surface (14) through the first vacuum adsorption hole.

4. The carrier for semiconductor laser performance testing of claim 1, wherein, The first mounting part (11) includes a mounting block (111) fixed on the base (1). The mounting block (111) is provided with mounting holes for the T0 packaged laser product to pass through, and the pins of the T0 packaged laser product are located outside the mounting holes.

5. The carrier for semiconductor laser performance testing of claim 1, wherein, The second mounting part (12) includes a first mounting groove on the base (1). The vertical cavity surface emission laser product, the distributed feedback laser product, and the high-power laser product can all be embedded in the first mounting groove. The bottom surface of the first mounting groove is provided with a second vacuum adsorption hole. Through the second vacuum adsorption hole, the vertical cavity surface emission laser product, the distributed feedback laser product, or the high-power laser product can be fixed in the first mounting groove.

6. The carrier for semiconductor laser performance testing of claim 1, wherein, The third mounting part (13) includes a second mounting groove on the base (1), the COS packaged laser product can be embedded in the second mounting groove, the bottom surface of the second mounting groove is provided with a third vacuum adsorption hole, and the COS packaged laser product can be fixed in the second mounting groove through the third vacuum adsorption hole.

7. The carrier for semiconductor laser performance testing of claim 1, wherein, The base (1) has an inclined surface (15) along one end near the second mounting part (12) and the third mounting part (13), and the angle between the inclined surface (15) and the horizontal plane is not less than 20°.

8. The carrier for semiconductor laser performance testing of claim 1, wherein, The base (1) has a through hole (16) extending along the direction of the second mounting part (12) and the third mounting part (13). A thermoelectric cooler (2) is installed inside the through hole (16). The temperature field around the first mounting part (11) and the second mounting part (12) can be adjusted by the thermoelectric cooler (2).

9. Test system comprising a six degrees of freedom adjustment stage, characterized in that, It also includes a carrier for testing the performance of semiconductor lasers as described in any one of claims 1-8, wherein the base (1) is disposed on the six-degree-of-freedom adjustment stage, and the six-degree-of-freedom adjustment stage is used to adjust the spatial position of the base (1).

10. The test system of claim 9, wherein, The testing system further includes a free probe and a receiver. The free probe is used to electrically connect to the pins of the T0 packaged laser product under test, the pins of the vertical-cavity surface-emitting laser product, the pins of the distributed feedback laser product, the pins of the high-power laser product, or the pins of the COS packaged laser on the carrier for testing semiconductor laser performance. The receiver is capable of receiving the light emitted by the pins of the T0 packaged laser product under test, the vertical-cavity surface-emitting laser product, the distributed feedback laser product, the high-power laser product, or the COS packaged laser.

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