Wafer degumming and cleaning all-in-one machine

Abstract

The utility model relates to a wafer degumming and cleaning all-in-one machine in the wafer cleaning field, which comprises a machine body, a material area, a cleaning area, a carrying area and a pipeline area are arranged in the machine body, the carrying area is located between the material area and the cleaning area, the pipeline area is located on the left side of the material area, the cleaning area and the carrying area, and a mechanical arm is arranged in the carrying area. A material platform and an orientation calibrator are arranged in the material area, the material platform is located at the end, away from the pipeline area, of the material area, the orientation calibrator is located at the end, close to the pipeline area, of the material area, and the material platform is used for temporarily storing materials to be cleaned and cleaned materials; the soaking tank is located at the end, close to the pipeline area, of the cleaning area, the cleaning chamber is located at the end, away from the pipeline area, of the cleaning area, the cleaning chamber and the material platform are correspondingly located on the two sides of the carrying area, space layout is optimized, the material area, the cleaning area and the carrying area are distributed in parallel, and the carrying area is arranged in the middle, so that the total moving stroke of the mechanical arm is shortened by more than half.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning, and in particular to an integrated wafer desmearing and cleaning machine. Background Technology

[0002] In semiconductor wafer manufacturing processes, photoresist coating is a crucial step in forming circuit patterns. After pattern transfer, the residual photoresist layer on the wafer surface must be thoroughly removed using physical or chemical methods—a process known as photoresist removal. Incomplete removal can lead to defects in subsequent processes such as ion implantation and thin film deposition, and may even result in wafer scrap. Therefore, efficient photoresist removal equipment is essential for ensuring wafer yield.

[0003] Existing adhesive stripping machines typically consist of five main modules: a wafer carrier stage, a wafer edge-finding and alignment stage, an immersion unit, a high-pressure adhesive stripping unit, and a cleaning unit. The workflow is as follows: after the robotic arm picks up the wafer from the carrier stage, it passes through the edge-finding and alignment stage for positioning, then enters the immersion tank to soften the adhesive layer, followed by high-pressure spraying to peel off the adhesive, and finally, after removing residue in the cleaning unit, it returns to the carrier stage. The functional units are mostly arranged in a linear series layout.

[0004] Traditional layouts suffer from significant efficiency bottlenecks. With the loading and unloading platforms located at opposite ends of the machine, the robotic arm must move back and forth along a straight path. After picking up the wafer and completing all processes, it must return to the starting point, traversing the entire length of the equipment. This process involves a large proportion of idle travel by the robotic arm, and the relatively large spacing between the soaking, desmearing, and cleaning units further extends the cycle time. The linear arrangement also results in a dispersed piping system, increasing maintenance complexity. Utility Model Content

[0005] To overcome the shortcomings of existing technical solutions, this utility model provides an integrated wafer desmearing and cleaning machine, which can effectively solve the technical problem of a large proportion of idle movement of the robotic arm during the cleaning process.

[0006] The technical solution adopted by this utility model to solve its technical problem is:

[0007] A wafer desmearing and cleaning integrated machine includes a machine body, within which are arranged a material area, a cleaning area, a transport area, and a pipeline area. The material area, cleaning area, and transport area are distributed parallel to each other within the machine body. The transport area is located between the material area and the cleaning area, and the pipeline area is located to the left of the material area, cleaning area, and transport area. A robotic arm is installed in the transport area, which can move left and right within the transport area. A material platform and an orientation calibrator are installed in the material area. The material platform is located at the end of the material area away from the pipeline area, and the orientation calibrator is located at the end of the material area closer to the pipeline area. The material platform is used to temporarily store the material to be cleaned and the cleaned material. An immersion tank and a cleaning chamber are installed in the cleaning area. The immersion tank is located at the end of the cleaning area closer to the pipeline area, and the cleaning chamber is located at the end of the cleaning area away from the pipeline area. The cleaning chambers are located on both sides of the transport area, corresponding to the material platform.

[0008] Furthermore, the material platform includes two material storage sections, both of which can be used to place materials to be cleaned and materials after cleaning.

[0009] Furthermore, a transfer platform is provided in the transport area, and the robotic arm moves left and right in the transport area via the transfer platform. A liquid collection tray is installed below the robotic arm, and the liquid collection tray is provided with an upward-facing dripping chamber.

[0010] Furthermore, a drip storage tank is provided at the bottom of the collection tray. The drip storage tank is connected to the drip chamber and is connected to a return pipe that extends into the pipeline area.

[0011] Furthermore, the robotic arm is provided in two sets, which are used for material handling in the material area and the cleaning area, respectively.

[0012] Furthermore, the cleaning chamber consists of a degumming chamber and a cleaning chamber. The degumming chamber is located at the end of the cleaning chamber closer to the soaking tank, and the cleaning chamber is located at the end of the cleaning chamber farther from the soaking tank.

[0013] Furthermore, both the degumming chamber and the cleaning chamber are individually connected to an air supply device and an exhaust port.

[0014] Furthermore, the surface of the machine body is provided with an inspection port corresponding to the soaking tank and the cleaning chamber, a water and air adjustment panel corresponding to the soaking tank and the cleaning chamber, and an electrical control panel.

[0015] Compared with the prior art, the beneficial effects of this utility model are: optimized spatial layout. By distributing the material area, cleaning area and transport area in parallel and setting the transport area in the center, the total travel distance of the robotic arm is shortened by more than half. The orientation calibrator and immersion tank that are connected to each other are located on the side close to the pipeline area. When the wafer moves from the orientation calibrator to the immersion tank, the robotic arm does not need to move in the transport area. The cleaning chamber and the material platform are located on both sides of the transport area. After cleaning, the robotic arm can rotate in place. The material to be cleaned and the cleaned material are placed on the material platform. During the cleaning process, the starting point and the ending point of the robotic arm coincide. The wafer transfer path is fast and efficient, while also reducing the floor space. Attached Figure Description

[0016] Figure 1 This is the front view of the present invention;

[0017] Figure 2 This is a top view of the present invention;

[0018] Figure 3 This is a schematic diagram of the robotic arm in this utility model;

[0019] Numbering in the diagram: 1-Main body, 2-Material area, 3-Cleaning area, 4-Transfer area, 5-Pipeline area, 6-Material platform, 7-Soaking tank, 8-Material storage section, 9-Transfer platform, 10-Collection tray, 11-Drip storage tank, 12-Grip arm, 13-Suction cup arm, 14-Degumming chamber, 15-Cleaning chamber, 16-Air supply device, 17-Exhaust vent. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] The following is combined Figures 1-3 This invention provides a detailed description of an integrated wafer desmearing and cleaning machine:

[0022] A wafer desmearing and cleaning integrated machine includes a body 1. The body 1 contains a material area 2, a cleaning area 3, a transport area 4, and a pipeline area 5. These three areas are arranged in parallel within the body 1. The transport area 4 is located between the material area 2 and the cleaning area 3. The pipeline area 5 is located to the left of the material area 2, cleaning area 3, and transport area 4. A robotic arm is installed in the transport area 4, and the robotic arm can move left and right within the transport area 4. The material area 2 contains a material platform 6 and an orientation calibrator. The material platform 6 is located at the end of the material area 2 furthest from the pipeline area 5, and the orientation calibrator is located at the end of the material area 2 closest to the pipeline area 5. The material platform 6 is used to temporarily store the material to be cleaned and the cleaned material. The cleaning area 3 contains an immersion tank 7 located at the end of the cleaning area 3 closest to the pipeline area 5, and the cleaning chamber located at the end of the cleaning area 3 furthest from the pipeline area 5.

[0023] The spatial layout is optimized by distributing the material area 2, cleaning area 3, and transport area 4 in parallel, with the transport area 4 centrally located. This reduces the total travel distance of the robotic arm by more than half. The interconnected orientation calibrator and immersion tank 7 are both located on the side close to the pipeline area 5. When the wafer moves from the orientation calibrator to the immersion tank 7, the robotic arm does not need to translate within the transport area 4. The cleaning chamber and material platform 6 are located on opposite sides of the transport area 4. After cleaning, the robotic arm can rotate in place. Both the material to be cleaned and the cleaned material are placed on the material platform 6. During the cleaning process, the starting and ending points of the robotic arm coincide, making the wafer transfer path fast and efficient, while also reducing the floor space.

[0024] The material platform 6 includes two material storage sections 8, both of which can be used to place materials to be cleaned and cleaned materials. The two material storage sections 8 can simultaneously store wafers to be cleaned and those already cleaned, and can flexibly switch functions according to production needs, avoiding the risk of cross-contamination. The robotic arm does not need to switch paths between multiple platforms, reducing the time required for each wafer pick-up and drop.

[0025] The transfer area 4 is equipped with a transfer platform 9. A robotic arm moves left and right within the transfer area 4 via the transfer platform 9. A collection tray 10 is installed below the robotic arm, and the collection tray 10 has an upward-facing dripping chamber. A dripping storage tank 11 is located at the bottom of the collection tray 10, communicating with the dripping chamber. The dripping storage tank 11 is connected to a return pipe, which extends into the pipeline area 5. The transfer platform 9 ensures the robotic arm's movement accuracy, and the collection tray 10 continuously collects the dripping liquid from the robotic arm during wafer transfer. The waste liquid is then collected and recycled back to the pipeline area 5 via the dripping storage tank 11 and the return pipe. This reduces the risk of internal equipment contamination, improves waste liquid recovery rate, and reduces the frequency of downtime for cleaning.

[0026] The robotic arm is provided in two sets, namely a gripper arm 12 and a suction cup arm 13. The suction cup arm 13 is used to move the wafer from the material platform 6 to the orientation calibrator and from the cleaning chamber 15 to the material platform 6. The gripper arm 12 is used to hold the wafer and move it between the orientation calibrator, the immersion tank 7, the desmearing chamber 14 and the cleaning chamber 15, so as to avoid the cleaning liquid on the surface of the gripper arm 12 from contaminating the material to be cleaned and the material after cleaning, thus separating dry and wet materials.

[0027] The cleaning chamber consists of a desmearing chamber 14 and a cleaning chamber 15. The desmearing chamber 14 is located at the end of the cleaning chamber closer to the immersion tank 7, and the cleaning chamber 15 is located at the end of the cleaning chamber farther from the immersion tank 7. Both the desmearing chamber 14 and the cleaning chamber 15 are individually connected to an air supply device 16 and an exhaust port 17. The desmearing chamber 14 and the cleaning chamber 15 are physically isolated, and high-pressure desmearing and fine cleaning are completed in stages to prevent desmearing particles from re-adhering to the wafer surface. The independent air supply and exhaust systems of the two chambers can separate and treat the desmearing exhaust gas and the cleaning water mist. The desmearing chamber 14 uses negative pressure air supply to prevent the diffusion of desmearing debris, while the cleaning chamber 15 uses directional air supply to accelerate wafer drying. The airflow in the two chambers does not interfere with each other.

[0028] The surface of the body 1 is provided with an inspection port corresponding to the soaking tank 7 and the cleaning chamber, a water and air adjustment panel corresponding to the soaking tank 7 and the cleaning chamber, and an electrical control panel.

[0029] The working process of a wafer desmearing and cleaning integrated machine is as follows: The 6-inch wafer to be cleaned is placed in the material storage section 8 near the orientation calibrator in two material storage sections 8. The suction arm 13 picks up the wafer to be cleaned and moves it to the orientation calibrator. After the wafer is placed down and the positioning is completed, the suction arm picks up the wafer again and transports it to the immersion tank 7. In the immersion tank 7, the loose metal film and polymer on the surface of the wafer are removed. After immersion, the gripper arm 12 moves the wafer sequentially to the desmearing chamber 14 and the cleaning chamber 15. After the wafer is cleaned in the cleaning chamber 15, the residual chemical solution on the surface is removed through the nitrogen nozzle for drying. After drying, the cleaning wafer is placed in the material storage section 8 away from the orientation calibrator in two material storage sections 8 by the suction arm 13.

[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A wafer degreasing and cleaning all-in-one machine, comprising a machine body, a material area, a cleaning area, a conveying area and a pipeline area are arranged in the machine body, characterized in that: The material zone, cleaning zone, and transport zone are distributed parallel to each other within the machine body. The transport zone is located between the material zone and the cleaning zone, and the pipeline zone is located to the left of the material zone, cleaning zone, and transport zone. A robotic arm is installed in the transport zone, which can move left and right within the transport zone. A material platform and an orientation calibrator are installed in the material zone. The material platform is located at the end of the material zone away from the pipeline zone, and the orientation calibrator is located at the end of the material zone closer to the pipeline zone. The material platform is used to temporarily store materials to be cleaned and materials after cleaning. A soaking tank and a cleaning chamber are installed in the cleaning zone. The soaking tank is located at the end of the cleaning zone closer to the pipeline zone, and the cleaning chamber is located at the end of the cleaning zone away from the pipeline zone. The cleaning chambers are located on both sides of the transport zone, corresponding to the material platform.

2. The wafer cleaning and degreasing all-in-one machine of claim 1, wherein: The material platform includes two material storage sections, both of which can be used to place materials to be cleaned and materials that have been cleaned.

3. The wafer cleaning and degreasing all-in-one machine of claim 1, wherein: The transport area is equipped with a transfer platform. The robotic arm moves left and right in the transport area via the transfer platform. A liquid collection tray is installed below the robotic arm, and the liquid collection tray is equipped with an upward-facing dripping chamber.

4. The wafer cleaning and degreasing all-in-one machine of claim 3, wherein: The bottom of the collection tray is equipped with a drip storage tank, which is connected to the drip chamber. The drip storage tank is connected to a return pipe that extends into the pipeline area.

5. The wafer cleaning and degreasing all-in-one machine according to any one of claims 1-4, characterized in that: The robotic arm is provided in two sets, which are used for material handling in the material area and the cleaning area, respectively.

6. The wafer cleaning and degreasing all-in-one machine according to any one of claims 1-4, characterized in that: The cleaning chamber consists of a degumming chamber and a cleaning chamber. The degumming chamber is located at the end of the cleaning chamber closer to the soaking tank, and the cleaning chamber is located at the end of the cleaning chamber farther from the soaking tank.

7. The wafer cleaning and degreasing all-in-one machine of claim 6, wherein: Both the glue removal chamber and the cleaning chamber are individually connected to an air supply device and an air exhaust port.

8. The wafer cleaning and degreasing all-in-one machine according to any one of claims 1-4, characterized in that: The surface of the machine body is provided with inspection ports corresponding to the soaking tank and the cleaning chamber, as well as water and air adjustment panels and electrical control panels corresponding to the soaking tank and the cleaning chamber.

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