Upper electrode device for wafer frequency sorting machine

Abstract

The utility model relates to an upper electrode device for a wafer frequency sorting machine, which comprises an upper electrode support, an air pipe and a test line, an upper electrode height adjusting support is arranged on the side edge of the upper electrode support, and an insulating spacer, a middle copper block and an upper electrode are sequentially arranged on one side of the bottom of the upper electrode height adjusting support from top to bottom. An air cavity is formed in the middle copper block in a hollowed-out mode, a center hole communicated with the air cavity is formed in the upper electrode, an integrated line pipe device is installed on the other side of the bottom of the upper electrode height adjusting support, and a connector is installed at the free end of the integrated line pipe device and arranged in the middle of the testing line. One end of the test wire penetrates through an inner hole of the integrated wire pipe device to be connected with the middle copper block, a groove is formed in the side edge of the free end of the integrated wire pipe device, one end of the air pipe is connected with an air source, and the other end of the air pipe penetrates through the integrated wire pipe device through the groove to be connected into an air cavity of the middle copper block. According to the utility model, the equipment utilization rate is greatly improved, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing equipment technology, and in particular to an upper electrode device for a wafer frequency sorting machine. Background Technology

[0002] During the wafer manufacturing process, the wafer frequency is constantly changing and being adjusted. Before adjusting the frequency, the wafers need to be classified according to the frequency range to confirm the initial frequency before adjustment. The principle of the wafer frequency sorting machine is as follows: multiple wafers are placed in the material tray. After the camera identifies the wafer position, the upper electrode suction nozzle picks up the wafer and places it on the lower electrode. The frequency is measured by the upper and lower electrodes, and the unloading arm puts the wafer into the material box of the corresponding frequency range.

[0003] In wafer sorting equipment, the traditional method for fixing the upper electrode test leads is to pass the test leads through a conduit and solder them to a central copper block. The conduit is then secured by copper clamps. However, after prolonged operation, excessive lateral sliding of the upper electrode assembly causes frequent bending of the test leads, leading to test lead breakage or deformation of the copper clamps and loosening of the conduit. The friction between the copper clamps and the conduit causes metal debris to fall and contaminate the wafers. Furthermore, replacing the test leads requires completely disassembling the upper electrode assembly and resoldering the test leads, which is cumbersome, time-consuming, and impacts machine output efficiency, resulting in low maintenance efficiency. Summary of the Invention

[0004] The technical problem to be solved by this utility model is to provide an upper electrode device for a wafer frequency sorter. The integrated conduit device integrates three components: conduit, fixing clamp, and conduit gasket, which simplifies the conduit installation steps.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: An upper electrode device for a wafer frequency sorter is provided, including an upper electrode support, an air pipe, and test leads. An upper electrode height adjustment bracket is installed on the side of the upper electrode support. An insulating pad, a middle copper block, and an upper electrode are sequentially installed from top to bottom on one side of the bottom of the upper electrode height adjustment bracket. The insulating pad is placed between the upper electrode height adjustment bracket and the middle copper block, cutting off the electrical connection between the upper electrode and other components. An air cavity is formed inside the middle copper block, and a central hole communicating with the air cavity is opened inside the upper electrode. An integrated conduit device is installed on the other side of the bottom of the upper electrode height adjustment bracket. The integrated conduit device is cylindrical, and a connector is installed at the free end of the integrated conduit device. The connector is located in the middle of the test line. One end of the test line passes through the inner hole of the integrated conduit device and is connected to the middle copper block. A slit is opened on the side of the free end of the integrated conduit device. One end of the air pipe is connected to an air source, and the other end passes through the slit through the inner hole of the integrated conduit device and enters the air cavity of the middle copper block to supply air to the upper electrode. It is responsible for blowing and sucking air into the upper electrode to achieve the purpose of picking up and placing the wafer.

[0006] As a supplement to the technical solution described in this utility model, a solder joint is provided on the side of the intermediate copper block, and the solder joint is welded to one end of the test line.

[0007] As a supplement to the technical solution described in this utility model, the upper electrode bracket is made of aluminum and its outer surface is blackened. A countersunk through hole is opened at each of the four corners of the upper electrode bracket. The upper electrode bracket is fixed to the electric cylinder through the countersunk through hole and fasteners. The upper electrode bracket moves laterally through the electric cylinder to control the left and right movement of the upper electrode. The upper electrode bracket is fixed to the upper electrode height adjustment bracket by screws.

[0008] As a supplement to the technical solution described in this utility model, the upper electrode height adjustment bracket is made of aluminum and its outer surface is blackened. The upper electrode height adjustment bracket moves up and down along the side of the upper electrode bracket and is locked to the upper electrode bracket by screws.

[0009] As a supplement to the technical solution described in this utility model, the insulating gasket is made of white Teflon and is used for electrical isolation between the upper and lower layers.

[0010] As a supplement to the technical solution described in this utility model, the intermediate copper block is made of brass and has a hollow interior to allow gas to pass through. There are two threaded holes on the top of the intermediate copper block, which are fixedly connected to the upper electrode height adjustment bracket above by fasteners. There is a threaded hole in the center of the bottom of the intermediate copper block, which is used to fix the upper electrode by fasteners.

[0011] As a supplement to the technical solution described in this utility model, the upper electrode is made of brass, and the diameter of the central hole is 0.2mm, which allows gas to pass through and adsorb the wafer. It works in conjunction with the lower electrode to measure the wafer frequency.

[0012] As a supplement to the technical solution described in this utility model, one end of the integrated conduit device is provided with an "Ω"-shaped support, and both ends of the support are provided with a mounting through hole. The mounting through hole is used to fix the support to the upper electrode height adjustment bracket by screws. The integrated conduit device is made of stainless steel.

[0013] As a supplement to the technical solution described in this utility model, a fixing cylinder is installed at one end of the connector and sleeved outside the integrated conduit device. The fixing cylinder is fixed to the integrated conduit device by a locking screw.

[0014] As a supplement to the technical solution described in this utility model, the connector is a four-hole square double female connector, and the end face of the fixed cylinder is provided with four threaded holes, which are aligned with the holes of the four-hole square double female connector and fixed with fasteners.

[0015] Beneficial Effects: This utility model relates to an upper electrode device for a wafer frequency sorter. The test lead is easy to replace; simply unscrew the connectors at both ends of the test lead, separate the fixing cylinder from the integrated conduit device and connectors, and replace with a new lead. The new test lead has a connector; one end of the test lead passes through the fixing cylinder and integrated conduit device and connects to the central copper block. Then, the fixing cylinder and integrated conduit device are fixed together. There is no need to disassemble the upper electrode assembly for welding. Previously, replacing a test lead took about 30 minutes; now it only takes 3 minutes. It also reduces the failure rate, material waste, and product contamination: the copper clamps used to fix the conduit were prone to deformation, causing the conduit to loosen, affecting the lifespan of the test lead and the cleanliness of the product, requiring replacement with new clamps. The integrated conduit device eliminates this loosening issue. Furthermore, the conduit structure is simplified and easy to install. The integrated conduit device combines the conduit, fixing clamps, and conduit gaskets into one unit, simplifying the conduit installation process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the integrated conduit device described in this utility model;

[0018] Figure 3 This is a structural schematic diagram of the upper electrode bracket, the upper electrode height adjustment bracket, and the integrated conduit device described in this utility model.

[0019] Illustration: 1. Upper electrode bracket, 2. Upper electrode height adjustment bracket, 3. Insulating pad, 4. Middle copper block, 5. Upper electrode, 6. Solder joint, 7. Integrated conduit assembly, 8. Air pipe, 9. Test lead, 10. Connector, 11. Fixing cylinder, 12. Split, 13. Countersunk through hole, 14. Center hole, 15. Support, 16. Mounting through hole, 17. Notch. Detailed Implementation

[0020] The present invention will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that after reading the teachings of this invention, those skilled in the art can make various alterations or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims.

[0021] The embodiments of this utility model relate to an upper electrode device for a wafer frequency sorting machine, such as... Figure 1-3 As shown, the device includes an upper electrode bracket 1, an air tube 8, and a test lead 9. An upper electrode height adjustment bracket 2 is mounted on the side of the upper electrode bracket 1 to adjust the electrode head height. From top to bottom, an insulating pad 3, a middle copper block 4, and an upper electrode 5 are sequentially mounted on one side of the bottom of the upper electrode height adjustment bracket 2. The insulating pad 3 is placed between the upper electrode height adjustment bracket 2 and the middle copper block 4, cutting off the electrical connection between the upper electrode 5 and other components. The middle copper block 4 has a hollowed-out air cavity. The upper electrode 5 has a central hole 14 communicating with the air cavity. The upper electrode height adjustment bracket... An integrated conduit device 7 is installed on the other side of the bottom of the frame 2. The integrated conduit device 7 is cylindrical. A connector 10 is installed on the free end of the integrated conduit device 7. The connector 10 is located in the middle of the test line 9. One end of the test line 9 passes through the inner hole of the integrated conduit device 7 and is connected to the middle copper block 4. A slit 12 is opened on the side of the free end of the integrated conduit device 7. One end of the air pipe 8 is connected to the air source, and the other end passes through the slit 12 through the inner hole of the integrated conduit device 7 and enters the air cavity of the middle copper block 4 to supply air to the upper electrode 5, which is responsible for blowing and sucking air to the upper electrode 5.

[0022] The intermediate copper block 4 has a solder point 6 on its side, which is welded to one end of the test line 9.

[0023] The upper electrode bracket 1 is made of aluminum and its outer surface is blackened. A countersunk through hole 13 is opened at each of the four corners of the upper electrode bracket 1. The upper electrode bracket 1 is fixed to the electric cylinder through the countersunk through hole 13 and fasteners. The upper electrode bracket 1 moves laterally through the electric cylinder to control the left and right movement of the upper electrode 5. The upper electrode bracket 1 is fixed to the upper electrode height adjustment bracket 2 by screws.

[0024] The upper electrode height adjustment bracket 2 is made of aluminum and its outer surface is treated with blackening.

[0025] The insulating pad 3 is made of white Teflon and is used for electrical isolation between the upper and lower layers.

[0026] The intermediate copper block 4 is made of brass and has a hollow interior to allow gas to pass through. There are two threaded holes on the top of the intermediate copper block 4, which are fixedly connected to the upper electrode height adjustment bracket 2 above by fasteners. There is a threaded hole in the center of the bottom of the intermediate copper block 4, which is used to fix the upper electrode 5 by fasteners.

[0027] The upper electrode 5 is made of brass, and the central hole 14 has a diameter of 0.2 mm, which allows gas to pass through and adsorb the wafer. It works in conjunction with the lower electrode to measure the wafer frequency.

[0028] The integrated conduit device 7 is provided with an "Ω"-shaped support 15 at one end. Both ends of the support 15 are provided with a mounting through hole 16. The mounting through hole 16 is used to fix the support 15 to the upper electrode height adjustment bracket 2 by screws. The integrated conduit device 7 is made of stainless steel.

[0029] One end of the connector 10 is fitted with a fixing cylinder 11 that is sleeved on the integrated conduit device 7. The fixing cylinder 11 is fixed to the integrated conduit device 7 by a locking screw.

[0030] The connector 10 is an SMA four-hole square double female connector. The end face of the fixing cylinder 11 is provided with four threaded holes, which are aligned with the holes of the four-hole square double female connector and fixed with fasteners.

[0031] The bottom of the upper electrode bracket 1 is provided with a notch 17 for the integrated conduit device 7 to pass through.

[0032] The upper electrode support 1 is fixed to the electric cylinder, which controls the left and right movement of the upper electrode 5 and the upper electrode support 1. The upper electrode height adjustment support 2 is fixed to the side of the upper electrode support 1 and moves up and down along the side of the upper electrode support 1. The upper electrode height adjustment support 2 is locked to the upper electrode support 1 with screws and is responsible for adjusting the height of the electrode head of the upper electrode 5. The insulating pad 3 is placed between the upper electrode height adjustment support 2 and the intermediate copper block 4 to disconnect the upper electrode 5 from other components. The intermediate copper block 4 is located below the insulating pad 3 and is responsible for the electrical connection between the test line 9 and the upper electrode 5. The integrated conduit device 7 is fixed to the bottom of the upper electrode height adjustment support 2 with screws. The integrated conduit device 7 is responsible for constraining the air pipe 8 and the test line 9. One end of the air pipe 8 is connected to the air source, and the other end is connected to the intermediate copper block 4 to supply air to the upper electrode 5, which is responsible for blowing and sucking air into the upper electrode 5 to achieve the purpose of picking up and putting down the wafer.

[0033] Test line 9 is divided into two sections by an SMA four-hole square double female connector. One end of test line 9 is soldered to the middle copper block 4, which is responsible for transmitting electrical signals to test the chip frequency. The fixing cylinder 11 is sleeved on the integrated conduit device 7 and fixed by a stop screw. The threaded hole on the end face of the fixing cylinder 11 is aligned with the hole of the four-hole square double female connector and fixed with fasteners.

[0034] In a specific example, the entire upper electrode device is moved left and right by an electric cylinder. The height of the upper electrode 5 is adjusted according to the wafer thickness. When it is moved above the wafer, the center hole 14 of the upper electrode 5 picks up the wafer and then returns to be placed directly above the lower electrode. The upper and lower electrodes are connected to the measurement system through test lines to measure the wafer frequency in sequence.

[0035] The test lead 9 of this utility model is easy to replace. When replacing the test lead 9, simply unscrew the connectors at both ends of the test lead 9, then separate the fixing cylinder 11 from the integrated conduit device 7 and the connector 10, and replace it with a new lead. The new test lead 9 has a connector 10. One end of the test lead 9 passes through the fixing cylinder 11 and the integrated conduit device 7 and connects to the middle copper block 4. The fixing cylinder 11 is fixed to the connector 10, and then the fixing cylinder 11 is fixed to the integrated conduit device 7. There is no need to disassemble the upper electrode assembly for welding. Previously, replacing a test lead took about 30 minutes, but now it only takes 3 minutes. It reduces the failure rate, material waste, and product contamination: The copper clamps that used to fix the conduit were prone to deformation, causing the conduit to loosen, which affected the life of the test lead and the cleanliness of the product. New clamps had to be replaced. The integrated conduit device 7 eliminates the problem of the conduit loosening. The conduit structure is simplified and easy to install. The integrated conduit device 7 integrates the conduit, fixing clamps, and conduit gaskets into one unit, simplifying the conduit installation steps.

[0036] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0037] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0038] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0039] The above provides a detailed description of the upper electrode device for a wafer frequency sorter provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An upper electrode device for a wafer frequency sorter, comprising an upper electrode support (1), an air tube (8), and a test line (9), characterized in that: An upper electrode height adjustment bracket (2) is installed on the side of the upper electrode bracket (1). An insulating pad (3), a middle copper block (4), and an upper electrode (5) are sequentially installed from top to bottom on one side of the bottom of the upper electrode height adjustment bracket (2). The insulating pad (3) is placed between the upper electrode height adjustment bracket (2) and the middle copper block (4). The middle copper block (4) has a hollowed-out air cavity. The upper electrode (5) has a central hole (14) communicating with the air cavity. An integrated conduit device (7) is installed on the other side of the bottom of the upper electrode height adjustment bracket (2). The conduit device (7) is cylindrical. The free end of the integrated conduit device (7) is equipped with a connector (10). The connector (10) is located in the middle of the test line (9). One end of the test line (9) passes through the inner hole of the integrated conduit device (7) and is connected to the middle copper block (4). The side of the free end of the integrated conduit device (7) is provided with a slit (12). One end of the air pipe (8) is connected to the air source, and the other end passes through the slit (12) through the inner hole of the integrated conduit device (7) and enters the air cavity of the middle copper block (4) to supply air to the upper electrode (5), which is responsible for blowing and sucking air to the upper electrode (5).

2. The upper electrode device for a wafer frequency sorter according to claim 1, characterized in that: The intermediate copper block (4) has a solder joint (6) on its side, which is welded to one end of the test line (9).

3. The upper electrode device for a wafer frequency sorter according to claim 1, characterized in that: The upper electrode height adjustment bracket (2) moves up and down along the side of the upper electrode bracket (1), and the upper electrode height adjustment bracket (2) and the upper electrode bracket (1) are locked together by screws.

4. The upper electrode device for a wafer frequency sorter according to claim 1, characterized in that: The insulating pad (3) is made of white Teflon.

5. The upper electrode device for a wafer frequency sorter according to claim 1, characterized in that: The upper electrode (5) is made of brass, and the diameter of the central hole (14) is 0.2 mm.

6. The upper electrode device for a wafer frequency sorter according to claim 1, characterized in that: The integrated conduit device (7) is provided with an "Ω"-shaped support (15) at one end. Both ends of the support (15) are provided with an installation through hole (16). The installation through hole (16) is used to fix the support (15) to the upper electrode height adjustment bracket (2) by screws.

7. The upper electrode device for a wafer frequency sorter according to claim 1, characterized in that: One end of the connector (10) is fitted with a fixing cylinder (11) that is sleeved on the integrated conduit device (7). The fixing cylinder (11) is fixed to the integrated conduit device (7) by a locking screw.

8. The upper electrode device for a wafer frequency sorter according to claim 7, characterized in that: The connector (10) is a four-hole square double female connector. The end face of the fixed cylinder (11) is provided with four threaded holes, which are aligned with the holes of the four-hole square double female connector and fixed with fasteners.

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