Chip dust removal device for COB light source production

Abstract

The utility model provides a chip dust removal device for COB light source production, and relates to the technical field of chip dust removal. The protective cover assembly is fixedly connected to the dust removal table through bolts, and the protective cover assembly is used for preventing dust and impurities from being blown away into air; the air blowing module is mounted in the protective cover assembly, and the air blowing module is used for blowing down dust on the chip; the filling opening is formed in one end of the dust removal table; the chip placement cavity is formed in the middle of the dust removal table; the fixing frame assembly is connected to the interior of the filling opening in a sliding mode, and the fixing frame assembly is used for placing a chip; the plurality of clamping assemblies are all arranged in the fixing frame assembly, and the clamping assemblies are used for clamping chips; and the dust collection module is mounted at the other end of the dust removal table. The clamping device is wider in application range and smaller in limitation, and energy consumption can be reduced through mechanical structure clamping.

Description

Technical Field

[0001] This utility model relates to the technical field of chip processing, specifically to a chip dust removal device for COB light source production. Background Technology

[0002] COB (Chip-on-Board) light sources are a new type of light source technology that directly mounts chips onto circuit boards. They have advantages such as high brightness, high reliability, and low thermal resistance, and are widely used in the lighting field. Because they make full use of the base materials, most of the chips are square. These chips need to be cleaned of dust before use, so a chip dust removal device is required.

[0003] A chip dust removal device for COB light source production, with announcement number CN222369824U, includes a base plate, a base frame, a side plate, a movable frame, and a movable air duct. The base frame is installed at the center of one top end of the base plate. A side plate is installed at the center of one side of the base frame on the top of the base plate. A movable frame is installed at the center of one side of the top of the side plate. Bearing seats are installed at the center of both ends of the movable frame. A screw is installed between the movable parts of the bearing seats, and a movable block is threaded through the screw. However, the aforementioned common chip dust removal devices still have shortcomings:

[0004] Although this device uses negative pressure to fix the chip, the diameter of the air vent is fixed. Chips smaller than the diameter of the air vent cannot be limited in this way, resulting in a small chip limiting range. Furthermore, this method of limiting the chip requires a high degree of flatness on the chip surface, which has significant limitations. In addition, cleaning directly with a blower will blow dust and impurities into the air, causing air pollution. Utility Model Content

[0005] This invention provides a chip dust removal device for COB light source production, which solves the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows:

[0007] An embodiment of this utility model provides a chip dust removal device for COB light source production, comprising:

[0008] Dust removal table;

[0009] A protective cover assembly is fixedly connected to the dust removal table by bolts, and the protective cover assembly is used to prevent dust and impurities from being blown into the air;

[0010] A blower module is installed inside the shield assembly and is used to blow away dust from the chip;

[0011] A filling port is located at one end of the dust removal table;

[0012] A chip placement cavity is located in the middle of the dust removal table;

[0013] A mounting bracket assembly is slidably connected inside the filling port and is used for chip placement.

[0014] Multiple clamping components are disposed inside the fixing frame assembly, and the clamping components are used to clamp the chip;

[0015] A dust collection module is installed at the other end of the dust collection station.

[0016] The above technical solution uses a convenient and quick clamping mechanism to hold the chip quickly, which can accommodate chips of more specifications, making it more practical. It is also equipped with a dust cover and a dust collection module, which can filter out the dust and impurities blown down to prevent air pollution.

[0017] Furthermore, the protective cover assembly includes a dust cover, a fixing plate is fixedly connected to the outside of the dust cover, and an observation port is provided on one side of the dust cover.

[0018] The above technical solutions help prevent dust and impurities from polluting the air.

[0019] Furthermore, the blower module is mounted on a dust cover, and a gas connecting pipe is fixedly connected to the middle of the top of the dust cover. One end of the gas connecting pipe is connected to the air inlet of the blower module.

[0020] The above technical solution is used to clean dust from the surface of the chip.

[0021] Furthermore, a dust suction port is provided on one side of the inner wall of the chip placement cavity extending to the outer side of the dust removal platform. The dust suction module is installed facing the dust suction port, and a reinforcing support plate is fixedly connected at the connection between the dust removal platform and the dust suction module.

[0022] The above technical solution allows for the rapid replacement of chips that need cleaning.

[0023] Furthermore, the fixing frame assembly includes a chip placement frame with multiple chip slots inside. The surface of the chip placement frame is slidably connected to the inner wall of the chip placement cavity. A connecting plate is fixedly connected to one end of the chip placement frame. An annular hollow sealing sleeve is provided on one side of the connecting plate. A magnet is provided inside the annular hollow sealing sleeve. A limiting slider is fixedly connected to one end of the bottom of the chip placement frame. A limiting groove is provided at the bottom of the inner wall of the chip placement cavity. The surface of the limiting slider is slidably connected to the inside of the limiting groove.

[0024] The above technical solution is used to install clamping components and provide a dust removal platform.

[0025] Furthermore, the clamping assembly includes a chip placement plate and a screw support. Both the chip placement plate and the screw support are installed inside the chip slot. A clamping screw is rotatably connected between the chip placement plate and the screw support. A threaded block is threadedly connected to the surface of the clamping screw. Multiple connecting supports are fixedly connected to the outer side of the threaded block. Multiple clamping grooves are formed on the surface of the chip placement plate. Clamping components are slidably connected inside the multiple clamping grooves.

[0026] The above technical solution is conducive to the stable clamping of chips of various specifications.

[0027] Furthermore, the clamping component includes a clamping slider, a slider support is fixedly connected to the bottom of the clamping slider, a clamping support plate is fixedly connected to the top of the clamping slider, the clamping slider is slidably connected to the clamping groove, and a connecting rotating rod is provided between the slider support and the screw support.

[0028] The above technical solution enables the sliding clamping of chips.

[0029] The above-described solution of this utility model has at least the following beneficial effects:

[0030] This invention allows the entire chip placement rack to be pulled out and positioned using limiting grooves and limiting sliders. The chip requiring dust removal is then placed on the chip placement plate. At this point, rotating the clamping screw causes the threaded block to move downwards. The downward movement of the threaded block drives the four connecting rotating rods to move, causing the four clamping support plates to move towards the chip and clamp it. This method can accommodate chips of more sizes and specifications, has a wider range of applications, fewer limitations, and saves energy through mechanical clamping.

[0031] This invention adds a dust cover and a dust collection module, which can treat and discharge gases containing dust and impurities during the cleaning process, making it more environmentally friendly and helping to prevent air pollution. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the overall structure of the chip dust removal device of this utility model;

[0033] Figure 2 This is an exploded structural diagram of the chip dust removal device of this utility model;

[0034] Figure 3 This is a schematic diagram of the internal structure of the dust cover of the chip dust removal device of this utility model;

[0035] Figure 4 This is a top view of the fixing mechanism of the chip dust removal device of this utility model;

[0036] Figure 5 This is a bottom view of the fixing mechanism of the chip dust removal device of this utility model;

[0037] Figure 6 This is a top view of the clamping assembly of the chip dust removal device of this utility model;

[0038] Figure 7 This is a bottom view of the clamping assembly of the chip dust removal device of this utility model.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1. Dust removal table; 2. Chip placement cavity; 3. Limiting slide groove; 4. Filling port; 5. Chip placement rack; 6. Chip slot; 7. Connecting plate; 8. Annular hollow sealing sleeve; 9. Dust collection module; 10. Reinforcing support plate; 11. Chip placement plate; 12. Clamping slide groove; 13. Clamping support plate; 14. Clamping slider; 15. Slider support; 16. Connecting rotating rod; 17. Clamping screw; 18. Threaded block; 19. Connecting support; 20. Screw support; 21. Limiting slider; 22. Dust cover; 23. Observation port; 24. Blowing module; 25. Gas connecting pipe. Detailed Implementation

[0041] Exemplary embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0042] like Figures 1 to 7 As shown, an embodiment of this utility model provides a chip dust removal device for COB light source production, comprising:

[0043] Dust removal table 1;

[0044] The protective cover assembly is fixedly connected to the dust removal table 1 by bolts. The protective cover assembly is used to prevent dust and impurities from being blown into the air.

[0045] Blower module 24 is installed inside the shield assembly and is used to blow off dust from the chip.

[0046] Filling port 4 is located at one end of the dust removal table 1;

[0047] Chip placement cavity 2 is located in the middle of dust removal table 1;

[0048] The mounting bracket assembly is slidably connected inside the loading port 4 and is used for chip placement.

[0049] Multiple clamping components are disposed inside the fixture assembly, and the clamping components are used to clamp the chip;

[0050] The dust collection module 9 is installed at the other end of the dust collection table 1.

[0051] In this embodiment, the chip is quickly clamped by a convenient and quick clamping component, which can accommodate chips of more specifications and is more practical. It is also equipped with a dust cover 22 and a dust suction module 9, which can filter the blown dust and impurities to prevent air pollution.

[0052] like Figure 1 , Figure 2 and Figure 3 As shown, the protective cover assembly includes a dust cover 22, a fixing plate is fixedly connected to the outside of the dust cover 22, an observation port 23 is opened on one side of the dust cover 22, a blowing module 24 is installed on the dust cover 22, a gas connecting pipe 25 is fixedly connected to the middle of the top of the dust cover 22, one end of the gas connecting pipe 25 is connected to the air inlet of the blowing module 24, a dust suction port is opened on one side of the inner wall of the chip placement cavity 2 extending to the outside of the dust removal table 1, a dust suction module 9 is installed facing the dust suction port, and a reinforcing support plate 10 is fixedly connected at the connection between the dust removal table 1 and the dust suction module 9.

[0053] In this embodiment, a control system is installed on the device. After the chip is fixedly placed in the chip placement cavity 2, a clean gas source is connected through the gas connection pipe 25. At this time, the blowing module 24 is activated to spray gas onto the chip surface below, cleaning away dust and impurities on the chip surface. At the same time, the dust suction module 9 sucks in the gas containing dust and impurities through the suction port. After being processed by the dust suction module 9, the clean gas is discharged to the outside. The reinforcing support plate 10 can provide a stable working platform for the dust suction module 9.

[0054] like Figures 4 to 7As shown, the fixing frame assembly includes a chip placement rack 5, which has multiple chip slots 6 inside. The surface of the chip placement rack 5 is slidably connected to the inner wall of the chip placement cavity 2. A connecting plate 7 is fixedly connected to one end of the chip placement rack 5. An annular hollow sealing sleeve 8 is provided on one side of the connecting plate 7. A magnet is provided inside the annular hollow sealing sleeve 8. A limit slider 21 is fixedly connected to one end of the bottom of the chip placement rack 5. A limit groove 3 is provided at the bottom of the inner wall of the chip placement cavity 2. The surface of the limit slider 21 is slidably connected to the inside of the limit groove 3. The clamping assembly includes a chip placement plate 11 and a screw support 20. Both the chip placement plate 11 and the screw support 20 are mounted on... Inside the chip slot 6, a clamping screw 17 is rotatably connected between the chip placement plate 11 and the screw support 20. A threaded block 18 is threadedly connected to the surface of the clamping screw 17. Multiple connecting supports 19 are fixedly connected to the outside of the threaded block 18. Multiple clamping grooves 12 are opened on the surface of the chip placement plate 11. Clamping components are slidably connected inside the multiple clamping grooves 12. The clamping components include a clamping slider 14. A slider support 15 is fixedly connected to the bottom of the clamping slider 14. A clamping support plate 13 is fixedly connected to the top of the clamping slider 14. The clamping slider 14 is slidably connected to the clamping grooves 12. A connecting rotating rod 16 is provided between the slider support 15 and the screw support 20.

[0055] In this embodiment, when installing the chip, a handle is connected to the connecting plate 7. Pulling the handle forcefully pulls the chip placement holder 5 out of the chip placement cavity 2. The annular hollow sealing sleeve 8 contains a magnet, and the surface of the dust removal table 1 is metal. Therefore, the magnetic force can limit the movement, and the connection between the magnet and the dust removal table 1 will compress the annular hollow sealing sleeve 8, forming a seal to prevent external dust from entering the chip placement cavity 2. After being pulled open, the limiting slider 21 will be stuck in the limiting groove 3. At this time, the chip is placed on the chip placement plate 11, and the clamping screw 17 is used. A handle is fixedly connected to the end of the device. When the handle is turned, the clamping screw 17 rotates. At this time, the threaded block 18 is connected to four connecting rods 16 and cannot rotate on its own. Therefore, the threaded block 18 moves downward and pulls the connecting rods 16. The movement of the connecting rods 16 pulls the slider support 15 to move, thereby causing the clamping slider 14 and the clamping support plate 13 to move and clamp the square chip. The two ends of the connecting rods 16 are rotatably connected to the slider support 15 and the connecting support 19. The entire chip clamping assembly is smaller than the chip slot 6 to prevent interference with the movement of the chip placement rack 5.

[0056] In this embodiment of the invention, the working principle is as follows: the chip that needs to be dusted is placed on the chip mounting plate 11. At this time, the screw 17 is rotated by the handle to move the threaded block 18 downward. The downward movement of the threaded block 18 drives the four connecting rods 16 to move through the connecting support 19, so that the four clamping support plates 13 move towards the chip and clamp it. This method can be used for chips of more sizes and specifications, has a wider range of applications, fewer limitations, and saves energy through mechanical clamping.

[0057] In this embodiment of the invention, a clean gas source is connected via a gas connection pipe 25. At this time, the blowing module 24 is activated, spraying gas onto the chip surface below to remove dust and impurities. Simultaneously, the dust extraction module 9 draws in the gas containing dust and impurities through the suction port. After processing by the dust extraction module 9, the clean gas is discharged to the outside. It should be noted that this invention is a chip dust removal device for COB light source production. All components are general standard parts or parts known to those skilled in the art. Their structure and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods. In the idle space of this device, all the aforementioned electrical components (referring to power elements, electrical components, and the compatible monitoring computer and power supply) are connected via wires. Specific connection methods should refer to the working principle described above, where the electrical connections between the various electrical components are completed in sequence. The detailed connection methods are known technologies in the field.

[0058] The above are preferred embodiments of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A chip dust removal device for COB light source production, characterized in that, include: Dust removal table (1); A protective cover assembly is fixedly connected to the dust removal table (1) by bolts. The protective cover assembly is used to prevent dust and impurities from being blown into the air. A blower module (24) is installed inside the shield assembly and is used to blow off dust from the chip; A filling port (4) is located at one end of the dust removal table (1); A chip placement cavity (2) is located in the middle of the dust removal table (1); A mounting bracket assembly is slidably connected inside the loading port (4) and is used for chip placement; Multiple clamping components are disposed inside the fixing frame assembly, and the clamping components are used to clamp the chip; A dust collection module (9) is installed at the other end of the dust collection platform (1).

2. The chip dust removal device for COB light source production according to claim 1, characterized in that, The protective cover assembly includes a dust cover (22), a fixing plate is fixedly connected to the outside of the dust cover (22), and an observation port (23) is opened on one side of the dust cover (22).

3. The chip dust removal device for COB light source production according to claim 2, characterized in that, The blower module (24) is installed on the dust cover (22). A gas connection pipe (25) is fixedly connected to the middle of the top of the dust cover (22). One end of the gas connection pipe (25) is connected to the air inlet of the blower module (24).

4. The chip dust removal device for COB light source production according to claim 1, characterized in that, A dust suction port is provided on one side of the inner wall of the chip placement cavity (2) extending to the outer side of the dust removal platform (1). The dust suction module (9) is installed opposite to the dust suction port. A reinforcing support plate (10) is fixedly connected at the connection between the dust removal platform (1) and the dust suction module (9).

5. The chip dust removal device for COB light source production according to claim 1, characterized in that, The mounting bracket assembly includes a chip placement bracket (5), which has multiple chip slots (6) inside. The surface of the chip placement bracket (5) is slidably connected to the inner wall of the chip placement cavity (2). A connecting plate (7) is fixedly connected to one end of the chip placement bracket (5). An annular hollow sealing sleeve (8) is provided on one side of the connecting plate (7). A magnet is provided inside the annular hollow sealing sleeve (8). A limiting slider (21) is fixedly connected to one end of the bottom of the chip placement bracket (5). A limiting groove (3) is provided at the bottom of the inner wall of the chip placement cavity (2). The surface of the limiting slider (21) is slidably connected to the inside of the limiting groove (3).

6. The chip dust removal device for COB light source production according to claim 5, characterized in that, The clamping assembly includes a chip mounting plate (11) and a screw support (20). Both the chip mounting plate (11) and the screw support (20) are installed inside the chip slot (6). A clamping screw (17) is rotatably connected between the chip mounting plate (11) and the screw support (20). A threaded block (18) is threadedly connected to the surface of the clamping screw (17). Multiple connecting supports (19) are fixedly connected to the outside of the threaded block (18). Multiple clamping grooves (12) are opened on the surface of the chip mounting plate (11). Clamping components are slidably connected inside the multiple clamping grooves (12).

7. A chip dust removal device for COB light source production according to claim 6, characterized in that, The clamping component includes a clamping slider (14), a slider support (15) is fixedly connected to the bottom of the clamping slider (14), a clamping support plate (13) is fixedly connected to the top of the clamping slider (14), the clamping slider (14) is slidably connected to the clamping groove (12), and a connecting rod (16) is provided between the slider support (15) and the screw support (20).

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