Cold press forming die for inductance substrate
By introducing a coolant circulation system and a guiding buffer structure into the cold pressing mold of the inductor substrate, the problems of mold heat dissipation and mold closing misalignment are solved, thereby improving the molding quality of the inductor substrate and the mold life, and reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YANGZHOU JINGTE ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2025-05-20
- Publication Date
- 2026-04-24
AI Technical Summary
Existing molds have poor heat dissipation performance during the cold pressing process of inductor substrates, which leads to increased material temperature, affecting dimensional accuracy and surface quality. Furthermore, the lack of effective guiding and buffering mechanisms can easily cause mold displacement and damage, reducing product yield and mold life.
An inductor substrate cold-pressing mold with an upper mold and a guide buffer structure was designed. The heat is removed by the coolant circulation to ensure the mold temperature is stable, and the guide cylinder and buffer spring structure achieve precise mold closing and reduce the impact force of mold closing.
This improved the molding quality and product qualification rate of inductor substrates, extended the service life of molds, and reduced production costs.
Smart Images

Figure CN224157589U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of mold technology, and in particular to a cold pressing mold for inductor substrates. Background Technology
[0002] In the field of electronic component manufacturing, inductor substrates are an important component, and their molding quality directly affects the performance and reliability of electronic components. At present, inductor substrates are mostly formed by cold pressing using traditional molds.
[0003] However, existing molds have many problems: On the one hand, during the cold pressing process, a lot of heat is generated between the mold and the inductor substrate material due to friction. If the heat cannot be dissipated in time, the material temperature will rise, which will affect the dimensional accuracy and surface quality of the inductor substrate, and may even cause the material to deform, reducing the product qualification rate. On the other hand, traditional molds lack effective guiding and buffering mechanisms during the mold closing process, which can easily cause the upper and lower molds to shift or impact during mold closing, resulting in mold damage, shortening the mold life, and also affecting the molding quality of the inductor substrate.
[0004] To address these issues, a cold pressing mold for inductor substrates is proposed. Utility Model Content
[0005] In order to overcome the shortcomings of the existing technology and solve the problems of poor heat dissipation performance and lack of buffer protection in the existing technology, this utility model provides a cold pressing mold for inductor substrate.
[0006] This utility model is achieved using the following technical solution:
[0007] A cold pressing mold for an inductor substrate includes a base, two support columns at the upper end of the base, the support columns being symmetrically fixed on both sides of the base, a top plate at the top of the support columns, an electric hydraulic cylinder at the upper end of the top plate, a telescopic rod at the output end of the electric hydraulic cylinder, the telescopic rod penetrating the top plate, a connecting plate at the end of the telescopic rod, an upper mold on the connecting plate, a plurality of punching heads at the lower end of the upper mold, a matching lower mold on the base, a mold base on the lower mold, and a plurality of mold cavities matching the punching heads.
[0008] The upper mold has an internal cavity filled with coolant. The upper surface of the upper mold has two symmetrical through holes that are connected to the cavity. The two through holes are respectively provided with an inlet pipe and an outlet pipe, which are connected to an external cooling box.
[0009] The connecting plate is provided with guide cylinders on both sides, and the lower mold is provided with a matching guide rod. The guide rod is fixed on the lower mold. When the upper mold and the lower mold are closed, the guide cylinder is inserted into the guide rod.
[0010] A buffer spring is fitted onto the guide rod. The bottom of the buffer spring is fixed to the lower mold, and a slip ring is fixed to the top of the buffer spring.
[0011] The guide rod is provided with a limiting plate at its top, and the slip ring is located below the limiting plate.
[0012] The upper surface of the lower mold is provided with an installation groove, and the mold base is engaged in the installation groove;
[0013] The upper mold is fixedly connected to the connecting plate by bolts.
[0014] The present invention has the following advantages over the prior art:
[0015] 1. By setting a cavity filled with coolant inside the upper mold and connecting it to an external cooling box through inlet and outlet pipes, the coolant is circulated, which can effectively remove the heat generated by the upper mold during operation, reduce the mold temperature, and prevent deformation of the inductor substrate material due to excessive temperature, thereby improving the molding quality and product qualification rate of the inductor substrate.
[0016] 2. Guide cylinders are installed on both sides of the connecting plate, and guide rods that are compatible with them are installed on the lower mold. When the mold is closed, the guide cylinders are inserted into the guide rods, which ensures the precise alignment of the upper and lower molds during the mold closing process. This avoids the size deviation and surface quality problems of the inductor substrate caused by mold closing misalignment, improves the molding accuracy of the product, and the buffer spring and slip ring structure sleeved on the guide rod play a buffering role when the upper mold is closed, reducing the impact force of mold closing, reducing the risk of mold damage due to impact, extending the service life of the mold, and reducing production costs. Attached Figure Description
[0017] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;
[0018] Figure 2 This is an exploded three-dimensional structural diagram of this utility model;
[0019] Figure 3 This is a front view of the utility model;
[0020] Figure 4 This is a utility model Figure 2 Enlarged schematic diagram of the structure at point A in the middle;
[0021] In the diagram: 1. Electric hydraulic cylinder; 11. Telescopic rod; 2. Top plate; 3. Connecting plate; 31. Bolt; 32. Inlet pipe; 33. Outlet pipe; 34. Guide cylinder; 4. Upper mold; 5. Lower mold; 51. Mounting groove; 6. Mold base; 61. Mold cavity; 7. Base; 71. Support column; 8. Buffer spring; 81. Slip ring; 82. Guide rod; 83. Limiting plate. Detailed Implementation
[0022] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0023] The present invention will be further described below with reference to the accompanying drawings.
[0024] like Figures 1 to 4 As shown, an inductor substrate cold pressing forming mold includes a base 7. The upper end of the base 7 is provided with two support columns 71, which are symmetrically fixed on both sides of the base 7 to provide stable support. The top of the support columns 71 is provided with a top plate 2, and the upper end of the top plate 2 is provided with an electric hydraulic cylinder 1. The output end of the electric hydraulic cylinder 1 is provided with a telescopic rod 11, which passes through the top plate 2. The electric hydraulic cylinder 1 drives the telescopic rod 11 to move up and down. The end of the telescopic rod 11 is provided with a connecting plate 3, and the connecting plate 3 is provided with an upper mold 4. The lower end of the upper mold 4 is provided with multiple stamping heads for stamping and forming the inductor substrate material. The base 7 is provided with a matching lower mold 5, and the lower mold 5 is provided with a mold base 6. The mold base 6 is provided with multiple mold cavities 61 that are compatible with the stamping heads.
[0025] The upper mold 4 has an internal cavity filled with coolant. The upper surface of the upper mold 4 has two symmetrical through holes that communicate with the cavity. The two through holes are respectively provided with an inlet pipe 32 and an outlet pipe 33, which are connected to an external cooling box. During operation, the external cooling box delivers coolant to the cavity of the upper mold 4 through the inlet pipe 32. After absorbing the heat generated by the upper mold 4 during operation, the coolant flows back to the external cooling box through the outlet pipe 33 for cooling. This cycle is repeated to effectively cool the upper mold 4, ensuring that the mold operates at a suitable temperature and improving the molding quality of the inductor substrate.
[0026] The connecting plate 3 is provided with guide cylinders 34 on both sides, and the lower mold 5 is provided with a matching guide rod 82. The guide rod 82 is fixed on the lower mold 5. When the upper mold 4 and the lower mold 5 are closed, the guide cylinder 34 is inserted into the guide rod 82. The cooperation between the guide cylinder 34 and the guide rod 82 plays a precise guiding role, ensuring that the upper and lower molds 5 will not shift during the mold closing process, improving the mold closing accuracy, and thus ensuring the molding quality of the inductor substrate.
[0027] A buffer spring 8 is sleeved on the guide rod 82. The bottom of the buffer spring 8 is fixed on the lower mold 5, and a slip ring 81 is fixed on the top of the buffer spring 8.
[0028] The top of the guide rod 82 is provided with a limiting plate 83, and the slip ring 81 is located below the limiting plate 83. When the upper mold 4 moves downward to close the mold, the guide cylinder 34 first contacts the slip ring 81. As the upper mold 4 continues to move downward, the guide cylinder 34 compresses the buffer spring 8. The buffer spring 8 plays a buffering role, reducing the impact force when the mold closes, avoiding damage to the mold due to impact, and extending the service life of the mold. At the same time, the limiting plate 83 can prevent the slip ring 81 from sliding off the guide rod 82, ensuring the normal operation of the guide buffer structure.
[0029] The upper surface of the lower mold 5 is provided with an installation groove 51, and the mold base 6 is engaged in the installation groove 51. This design facilitates the installation and replacement of the mold base 6, and the corresponding mold base 6 can be quickly replaced according to the molding requirements of different specifications of inductor substrates.
[0030] The upper mold 4 is fixedly connected to the connecting plate 3 by bolts 31. This detachable connection method facilitates the installation, disassembly and maintenance of the upper mold 4.
[0031] The working principle of this utility model is as follows: When in use, the inductor substrate material to be formed is placed in the mold cavity 61 of the lower mold 5, the electric hydraulic cylinder 1 is started, the electric hydraulic cylinder 1 drives the telescopic rod 11 to move downward, and drives the connecting plate 3 and the upper mold 4 to move downward together.
[0032] During the mold closing process, the guide cylinders 34 on both sides of the connecting plate 3 are gradually inserted into the guide rods 82 on the lower mold 5, which plays a precise guiding role and ensures that the upper and lower molds 5 are accurately aligned. When the guide cylinders 34 contact the slip rings 81, as the upper mold 4 continues to move downward, the guide cylinders 34 compress the buffer springs 8, which play a buffering role and reduce the impact force of mold closing.
[0033] When the punch head of the upper mold 4 is fully inserted into the cavity 61 of the lower mold 5, the inductor substrate material is stamped and formed. During the stamping process, the upper mold 4 generates heat due to friction with the material. The external cooling box delivers coolant to the cavity of the upper mold 4 through the inlet pipe 32. After absorbing the heat, the coolant flows back to the external cooling box through the outlet pipe 33 for cooling. This cycle continues to maintain the stable temperature of the upper mold 4.
[0034] After molding is completed, the electric hydraulic cylinder 1 drives the telescopic rod 11 to move upward, which in turn drives the upper mold 4 to rise and remove the molded inductor substrate, thus completing one work cycle.
[0035] When it is necessary to produce inductor substrates of different specifications, simply loosen the bolts 31 between the upper mold 4 and the connecting plate 3, remove the original upper mold 4, and replace it with the corresponding upper mold 4; at the same time, remove the original mold base 6 from the mounting slot 51 of the lower mold 5 and replace it with the appropriate new mold base 6, so as to quickly complete the mold replacement and meet different production needs.
[0036] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.
Claims
1. A cold pressing mold for an inductor substrate, comprising a base (7), wherein two support columns (71) are provided at the upper end of the base (7), the support columns (71) are symmetrically fixed on both sides of the base (7), a top plate (2) is provided at the top of the support columns (71), an electric hydraulic cylinder (1) is provided at the upper end of the top plate (2), and a telescopic rod (11) is provided at the output end of the electric hydraulic cylinder (1), the telescopic rod (11) penetrating the top plate (2), characterized in that, The telescopic rod (11) has a connecting plate (3) at its end. The connecting plate (3) has an upper mold (4). The lower end of the upper mold (4) has multiple stamping heads. The base (7) has a matching lower mold (5). The lower mold (5) has a mold base (6). The mold base (6) has multiple mold cavities (61) that are compatible with the stamping heads. The upper mold (4) has a cavity inside, and the cavity is filled with coolant. The upper surface of the upper mold (4) has two symmetrical through holes, which are connected to the cavity. The two through holes are respectively provided with an inlet pipe (32) and an outlet pipe (33), which are connected to an external cooling box.
2. The inductor substrate cold pressing mold according to claim 1, characterized in that: The connecting plate (3) has guide cylinders (34) on both sides, and the lower mold (5) has a matching guide rod (82). The guide rod (82) is fixed on the lower mold (5). When the upper mold (4) and the lower mold (5) are closed, the guide cylinder (34) is inserted into the guide rod (82).
3. The inductor substrate cold pressing mold according to claim 2, characterized in that: A buffer spring (8) is fitted on the guide rod (82). The bottom of the buffer spring (8) is fixed on the lower mold (5), and a slip ring (81) is fixed on the top of the buffer spring (8).
4. The inductor substrate cold pressing mold according to claim 3, characterized in that: The top of the guide rod (82) is provided with a limiting plate (83), and the slip ring (81) is located below the limiting plate (83).
5. The cold pressing mold for an inductor substrate according to claim 1, characterized in that: The upper surface of the lower mold (5) is provided with an installation groove (51), and the mold base (6) is engaged in the installation groove (51); The upper mold (4) is fixedly connected to the connecting plate (3) by bolts (31).