Hot pressing device for capacitive touch screen processing

Abstract

The utility model relates to the technical field of capacitive touch screen production, in particular to a hot-pressing device for capacitive touch screen processing, which is used for performing vacuum hot lamination on a product to be hot-pressed and comprises a rack, a hot-pressing device, a hot-pressing device and a hot-pressing device, the bearing mechanism sequentially comprises a buffer assembly, a lower hot pressing plate and a movable carrying table from top to bottom; the movable carrying table is arranged on the rack and is in sliding connection with the conveying track; a heat conducting piece is arranged between the buffer assembly and the lower hot-pressing plate, and the heat conducting piece conducts heat of the lower hot-pressing plate to the first buffer layer; the vacuum pressing mechanism is arranged at the top of the rack and is positioned right above the conveying track; the vacuum pressing mechanism and the movable carrying table are pressed to form a closed hot-pressing cavity in a surrounding manner, and a to-be-hot-pressed product is contained in the hot-pressing cavity; and the to-be-hot-pressed product is extruded by the vacuum pressing mechanism to drive the first buffer layer to slide along the fixed frame body. According to the hot-pressing device for processing the capacitive touch screen, a product to be subjected to hot-pressing can be prevented from being damaged in the process, and meanwhile, the hot-pressing effect is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of capacitive touch screen manufacturing technology, and in particular to a hot pressing device for processing capacitive touch screens. Background Technology

[0002] The bonding between the ITO conductive glass and the glass cover in a capacitive touchscreen is a crucial component of the bonding process, and its precision and appearance directly affect product quality and yield. Currently, the industry is increasingly adopting solid-state SCA optical adhesive for bonding. After the conductive glass and glass cover are bonded together, the SCA optical adhesive requires heating and vacuuming to ensure complete bonding between the conductive glass and the glass cover.

[0003] Current lamination equipment mainly uses a moving platform to place the product to be hot-pressed, then moves it to the pressing position, and finally the upper pressing mechanism presses down to complete the vacuum hot-pressing operation. The surface of the moving platform is usually equipped with rubber pads to cushion and support the product being hot-pressed.

[0004] However, although existing bonding equipment uses rubber pads to protect the products to be hot-pressed, the thickness of the products varies with different specifications, resulting in different buffering forces generated by the rubber pads during hot pressing. When the thickness of the products to be hot-pressed is large, the buffering effect of a single rubber pad is limited, which may damage the products. On the other hand, if the rubber pad is thickened, the excessively thick rubber pad will reduce the heat transfer rate, ultimately leading to a decrease in bonding efficiency. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a hot pressing device for processing capacitive touch screens, which solves the problem that existing bonding equipment may cause damage to the products to be hot pressed and reduce bonding efficiency.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a hot pressing device for processing capacitive touch screens, used for vacuum heat bonding of products to be hot pressed, comprising:

[0007] The frame has internal conveyor tracks;

[0008] The supporting mechanism, from top to bottom, includes a buffer assembly, a lower hot press plate, and a movable platform; the movable platform is mounted on the frame and slidably connected to the conveyor rail; the buffer assembly includes a fixed frame, a first buffer layer, and a first spring; the first buffer layer is embedded in the fixed frame and slidably connected to the fixed frame, and the first spring is disposed between the first buffer layer and the fixed frame; a heat-conducting component is provided between the buffer assembly and the lower hot press plate, which conducts the heat from the lower hot press plate to the first buffer layer;

[0009] The vacuum pressing mechanism is located on the top of the frame, directly above the conveying track. After the vacuum pressing mechanism and the moving platform are pressed together, they form a sealed hot pressing cavity, in which the product to be hot pressed is contained. The product to be hot pressed is squeezed by the vacuum pressing mechanism, which causes the first buffer layer to slide along the fixed frame.

[0010] In one embodiment, a support plate is provided between the first spring and the first buffer layer, and the support plate and the bottom of the fixed frame form a sliding cavity, through which the heat-conducting component passes and is connected to the lower hot plate.

[0011] In one embodiment, a heat-conducting element is disposed vertically between a first buffer layer and a lower hot platen; the lower hot platen is provided with a sliding groove corresponding to the heat-conducting element, one end of the heat-conducting element extends into the sliding groove, and the other end of the heat-conducting element is connected to the first buffer layer.

[0012] In one embodiment, a second spring is provided between the heat-conducting element and the sliding groove.

[0013] In one embodiment, the buffer assembly further includes a heat spreader plate, which is distributed horizontally and disposed inside the first buffer layer, and a heat-conducting element passes through the first buffer layer and is connected to the heat spreader plate.

[0014] In one embodiment, the bottom of the heat spreader is provided with a connecting groove, and the heat-conducting component is nested in the connecting groove.

[0015] In one embodiment, the sliding cavity is filled with a second buffer layer, the first buffer layer is made of high-temperature resistant rubber, and the second buffer layer is made of high-temperature resistant sponge.

[0016] In one embodiment, the vacuum pressing mechanism includes a cover, an upper hot press plate, a vacuum component, and a lifting component. The fixed end of the lifting component is connected to the frame, and the output end of the lifting component is connected to the cover. The upper hot press plate is disposed inside the cover. The cover and the movable platform abut against each other to form a hot press cavity, and the vacuum component communicates with the hot press cavity through the cover.

[0017] In one embodiment, a sealing ring is provided on the movable platform, and a sealing groove is provided on the cover corresponding to the sealing ring.

[0018] In one embodiment, a limiting mechanism is also included, which is disposed at the end of the conveying track.

[0019] The beneficial effects of this utility model are as follows: Existing capacitive touch screen hot-pressing bonding equipment typically uses high-temperature resistant rubber to support and buffer the product to be hot-pressed. However, the overall thickness of the high-temperature resistant rubber is fixed, and when the product thickness is large, it is easy to exceed the deformation range of the high-temperature resistant rubber, resulting in excessive pressure on the product to be hot-pressed. Therefore, this utility model adopts a fixed frame to support the first buffer layer and the first spring, so that the first buffer layer supports the product to be hot-pressed. After the first buffer layer is compressed, it transmits the force to the first spring, and the product to be hot-pressed is subjected to two-stage buffering. At the same time, the expansion and contraction margin in the buffering process is large, which can accommodate products with greater thickness and size specifications to be hot-pressed.

[0020] Furthermore, the bearing mechanism of this utility model uses a fixed frame to limit the position of the first buffer layer, which can effectively prevent the first buffer layer from shifting during the movement of the moving platform, ensuring the accuracy of hot pressing and preventing damage to the product to be hot-pressed due to shifting. At the same time, when the product to be hot-pressed comes into contact with the vacuum pressing mechanism, it can prevent the first buffer layer from twisting and shifting, further ensuring the hot pressing effect.

[0021] After setting the first spring and the fixed frame, the first buffer layer needs to slide relative to the fixed frame. Therefore, the first buffer layer cannot directly contact the lower hot platen, resulting in the heat from the lower hot platen not being directly conducted to the first buffer layer, which easily affects the hot pressing efficiency. Therefore, this utility model sets a heat-conducting component between the buffer assembly and the lower hot platen to transfer heat through the heat-conducting component, effectively improving the hot pressing efficiency. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0024] Figure 2 This is a schematic diagram of the structure during hot pressing according to an embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of the buffer component in one embodiment of the present invention;

[0026] Figure 4 This is a top view of the buffer component in one embodiment of the present invention.

[0027] Label Explanation:

[0028] 1. Frame; 11. Conveyor rail; 2. Bearing mechanism; 21. Buffer assembly; 211. Fixed frame; 212. First buffer layer; 213. First spring; 214. Heat-conducting component; 215. Support plate; 216. Heat-spreading plate; 217. Second buffer layer; 22. Lower hot press plate; 221. Sliding groove; 222. Second spring; 23. Moving platform; 231. Sealing ring; 3. Vacuum pressing mechanism; 31. Cover; 311. Sealing groove; 32. Upper hot press plate; 33. Vacuum assembly; 34. Lifting assembly; 4. Limiting mechanism; 5. Product to be hot-pressed. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0030] In the description of this utility model, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0031] Please refer to Figures 1 to 4 A hot-pressing apparatus for processing capacitive touch screens, used for vacuum heat bonding of the product 5 to be hot-pressed, comprising:

[0032] Frame 1, with conveyor rails 11 inside;

[0033] The supporting mechanism 2, from top to bottom, includes a buffer assembly 21, a lower hot press plate 22, and a movable platform 23. The movable platform 23 is mounted on the frame 1 and is slidably connected to the conveying track 11. The buffer assembly 21 includes a fixed frame 211, a first buffer layer 212, and a first spring 213. The first buffer layer 212 is embedded in the fixed frame 211 and is slidably connected to the fixed frame 211. The first spring 213 is disposed between the first buffer layer 212 and the fixed frame 211. A heat-conducting element 214 is provided between the buffer assembly 21 and the lower hot press plate 22, and the heat-conducting element 214 conducts the heat from the lower hot press plate 22 to the first buffer layer 212.

[0034] The vacuum pressing mechanism 3 is set on the top of the frame 1, directly above the conveying track 11. After the vacuum pressing mechanism 3 and the moving platform 23 are pressed together, they form a closed hot pressing cavity, in which the product to be hot pressed 5 is contained. The product to be hot pressed 5 is squeezed by the vacuum pressing mechanism 3, which causes the first buffer layer 212 to slide along the fixed frame 211.

[0035] Since the first buffer layer 212 is made of a flexible material, it provides flexible support for the product 5 to be hot-pressed. The first buffer layer 212 is made of high-temperature resistant rubber that combines elasticity and support. Within the fixed frame 211, the first buffer layer 212 is located away from the bottom of the fixed frame 211 under the force of the first spring 213. However, due to the small contact area between the first spring 213 and the first buffer layer 212, the first buffer layer 212 is prone to local sagging when the first spring 213 is not present or when the gap is large, resulting in insufficient support for the product 5 to be hot-pressed. Therefore, a support plate 215 is provided between the first spring 213 and the first buffer layer 212. The support plate 215 forms a sliding cavity with the bottom of the fixed frame 211, and the heat-conducting component 214 passes through the sliding cavity and connects to the lower hot-pressing plate 22. This allows the support plate 215 to fully support the first buffer layer 212, preventing local sagging of the first buffer layer 212.

[0036] In this embodiment, since the first buffer layer 212 needs to slide relative to the fixed frame 211, if the heat-conducting component 214 is fixed to the lower hot plate 22, the first buffer layer 212 needs to slide to a set position to contact the heat-conducting component 214, resulting in insufficient heat conduction. Therefore, to ensure heat conduction, the heat-conducting component 214 slides together with the first buffer layer 212. The heat-conducting component 214 is vertically disposed between the first buffer layer 212 and the lower hot plate 22; the lower hot plate 22 has a sliding groove 221 corresponding to the heat-conducting component 214, one end of the heat-conducting component 214 extends into the sliding groove 221, and the other end of the heat-conducting component 214 is connected to the first buffer layer 212. The heat-conducting component 214 is a vertically arranged heat-conducting plate distributed along the width direction of the first buffer layer 212. It extends from the top of the lower hot press plate 22 into the sliding groove 221. The heat-conducting component 214 slides in the lower hot press plate 22, and at the same time conducts heat to the first buffer layer 212, thereby ensuring the buffering effect, improving the hot pressing efficiency, and reducing heat loss.

[0037] In this embodiment, a second spring 222 is provided between the heat-conducting component 214 and the sliding groove 221. The second spring 222 not only prevents the heat-conducting component 214 from rigidly contacting the lower hot plate 22, but also serves as a supplement to the first spring 213, providing elastic force to the first buffer layer 212 and further improving the buffering effect.

[0038] After the heat-conducting components 214 are installed, the heat conduction capacity in the areas between them is relatively low due to their spacing. Therefore, the buffer assembly 21 also includes a heat-spreading plate 216, which is distributed horizontally and disposed inside the first buffer layer 212. The heat-conducting components 214 pass through the first buffer layer 212 and are connected to the heat-spreading plate 216. Meanwhile, since the products 5 to be hot-pressed are also placed at intervals on the surface of the first buffer layer 212, the first buffer layer 212 is subjected to localized pressure during hot pressing. With the heat-spreading plate 216 installed, after different areas of the first buffer layer 212 are subjected to pressure, an integral planar support is formed within the first buffer layer 212, which can evenly distribute and conduct the pressure, preventing excessive localized stress on the first buffer layer 212 that could cause torsion or tilting, thus ensuring the buffering effect.

[0039] In this embodiment, the bottom of the heat spreader 216 is provided with a connecting groove, and the heat conduction component 214 is nested in the connecting groove.

[0040] In this embodiment, the sliding cavity is filled with a second buffer layer 217. The material of the first buffer layer 212 is high-temperature resistant rubber, and the material of the second buffer layer 217 is high-temperature resistant sponge.

[0041] In this embodiment, the fixed frame 211 has a transition chamfer on the side near the first buffer layer 212.

[0042] In this embodiment, the vacuum pressing mechanism 3 includes a cover 31, an upper hot press plate 32, a vacuum component 33, and a lifting component 34. The fixed end of the lifting component 34 is connected to the frame 1, and the output end of the lifting component 34 is connected to the cover 31. The upper hot press plate 32 is disposed inside the cover 31. The cover 31 abuts against the movable platform 23 to form a hot press cavity, and the vacuum component 33 communicates with the hot press cavity through the cover 31. Those skilled in the art can select appropriate vacuum components 33 and lifting components 34 as needed, without specific limitations.

[0043] In this embodiment, a sealing ring 231 is provided on the movable platform 23, and a sealing groove 311 is provided on the cover 31 corresponding to the sealing ring 231. During hot pressing, the sealing ring 231 is fitted into the sealing groove 311 to ensure a sealing effect.

[0044] In this embodiment, a limiting mechanism 4 is also included, which is located at the end of the conveying track 11. Specifically, the limiting mechanism 4 adopts a telescopic structure, with its fixed end connected to the frame 1 and its telescopic end elastically connected to the fixed end via a telescopic rod. After the telescopic end contacts the moving platform 23, it buffers and decelerates the moving platform 23 until the telescopic end abuts against the fixed end. This design avoids rigid contact between the moving platform 23 and the limiting mechanism 4, reduces mechanical vibration, improves the service life of the equipment, and prevents vibration from causing internal separation of the product 5 to be hot-pressed, thus ensuring the hot-pressing effect.

[0045] Although this document uses terms such as frame, conveyor track, load-bearing mechanism, and buffer assembly frequently, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this invention; interpreting them as any additional limitation would contradict the spirit of this invention.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A hot-pressing device for processing capacitive touch screens, used for vacuum heat bonding of products (5) to be hot-pressed, characterized in that, include: The frame (1) has a conveyor track (11) inside. The supporting mechanism (2) includes, from top to bottom, a buffer assembly (21), a lower hot press plate (22), and a movable platform (23); the movable platform (23) is mounted on the frame (1) and slidably connected to the conveying track (11); the buffer assembly (21) includes a fixed frame (211), a first buffer layer (212), and a first spring (213); the first buffer layer (212) is embedded in the fixed frame (211) and slidably connected to the fixed frame (211); the first spring (213) is disposed between the first buffer layer (212) and the fixed frame (211); a heat-conducting component (214) is provided between the buffer assembly (21) and the lower hot press plate (22), and the heat-conducting component (214) conducts the heat of the lower hot press plate (22) to the first buffer layer (212). The vacuum pressing mechanism (3) is located on the top of the frame (1) and directly above the conveying track (11). After the vacuum pressing mechanism (3) and the moving platform (23) are pressed together, they form a closed hot pressing cavity. The product to be hot pressed (5) is contained in the hot pressing cavity. The product to be hot pressed (5) is squeezed by the vacuum pressing mechanism (3) and the first buffer layer (212) slides along the fixed frame (211).

2. The hot pressing device for processing capacitive touch screens according to claim 1, characterized in that: A support plate (215) is provided between the first spring (213) and the first buffer layer (212). The support plate (215) and the bottom of the fixed frame (211) form a sliding cavity. The heat-conducting component (214) passes through the sliding cavity and is connected to the lower hot plate (22).

3. The hot pressing device for processing capacitive touch screens according to claim 2, characterized in that: The heat-conducting component (214) is vertically disposed between the first buffer layer (212) and the lower hot plate (22); the lower hot plate (22) is provided with a sliding groove (221) corresponding to the heat-conducting component (214), one end of the heat-conducting component (214) extends into the sliding groove (221), and the other end of the heat-conducting component (214) is connected to the first buffer layer (212).

4. The hot pressing device for processing capacitive touch screens according to claim 3, characterized in that: A second spring (222) is provided between the heat-conducting component (214) and the sliding groove (221).

5. The hot pressing device for processing capacitive touch screens according to claim 3, characterized in that: The buffer assembly (21) further includes a heat spreader (216), which is distributed horizontally and disposed inside the first buffer layer (212). The heat conductor (214) passes through the first buffer layer (212) and is connected to the heat spreader (216).

6. The hot pressing device for processing capacitive touch screens according to claim 5, characterized in that: The bottom of the heat spreader (216) is provided with a connecting groove, and the heat-conducting component (214) is nested in the connecting groove.

7. The hot pressing device for processing capacitive touch screens according to claim 2, characterized in that: The sliding cavity is filled with a second buffer layer (217). The material of the first buffer layer (212) is high-temperature resistant rubber, and the material of the second buffer layer (217) is high-temperature resistant sponge.

8. The hot pressing device for processing capacitive touch screens according to claim 1, characterized in that: The vacuum pressing mechanism (3) includes a cover (31), an upper hot press plate (32), a vacuum component (33), and a lifting component (34). The fixed end of the lifting component (34) is connected to the frame (1), and the output end of the lifting component (34) is connected to the cover (31). The upper hot press plate (32) is disposed inside the cover (31). The cover (31) and the movable platform (23) abut against each other to form the hot press cavity. The vacuum component (33) communicates with the hot press cavity through the cover (31).

9. The hot pressing device for processing capacitive touch screens according to claim 8, characterized in that: The movable platform (23) is provided with a sealing ring (231), and the cover (31) is provided with a sealing groove (311) corresponding to the sealing ring (231).

10. The hot pressing device for processing capacitive touch screens according to claim 1, characterized in that: It also includes a limiting mechanism (4), which is located at the end of the conveying track (11).

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