Silicon wafer transfer device and turnover vehicle

Abstract

The utility model relates to a silicon wafer transfer device which comprises a transfer body. The box body is installed on the transferring body, and a containing space is defined by the box body; the drainage mechanism comprises a drainage box which is embedded in the bottom of the box body and is communicated with the accommodating space, and a first drainage valve which is communicated with the interior of the drainage box; the height of the bottom surface of the drainage tank relative to the ground is gradually reduced from the first side to the second side, and the first drainage valve is communicated with the second side of the drainage tank; and the filtering mechanism comprises a filtering piece which is detachably arranged between the drainage tank and the accommodating space. Through the arrangement, the cleaning liquid in the box body is completely discharged, and meanwhile, silicon wafers can be conveniently and quickly cleaned on the filtering piece in a concentrated manner.

Description

Technical Field

[0001] This application relates to the field of transfer device technology, and in particular to a silicon wafer transfer device. Background Technology

[0002] With the continuous development of technology, mobile robots are being used more and more widely in various fields. As mobile robots have evolved, they are playing a crucial role in the photovoltaic (PV) cell industry. In the PV cell production process, whole wafers are typically placed in a trolley, then lifted and carried by a mobile robot to the debinding station for debinding. After debinding, the wafers are placed back into the trolley, and finally, a mobile robot lifts and carries them to the cleaning station for cleaning, thus reducing the tediousness and time-consuming manual handling. The application of mobile robots in the PV cell production process not only improves production efficiency but also reduces labor costs and enhances work safety.

[0003] When traditional transfer carts transport silicon wafers, the inherent brittleness and fragility of the wafers inevitably leads to the generation of silicon fragments, which are difficult to clean up after falling to the bottom of the cart. Furthermore, since water needs to be added inside the transfer cart to keep the wafers clean after the adhesive has been removed, the water accumulation at the bottom of the cart further increases the difficulty of cleaning up the silicon fragments. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a silicon wafer transfer device and a turnover cart.

[0005] The technical solution adopted in this application is as follows: Firstly, a silicon wafer transfer device is provided, comprising:

[0006] transfer body;

[0007] A housing, mounted on the transfer body, encloses a receiving space;

[0008] The drainage mechanism includes a drainage tank embedded in the bottom of the housing and connected to the receiving space, and a first drainage valve connected to the drainage tank; the bottom surface of the drainage tank is lower than the ground from a first side to a second side, and the first drainage valve is connected to the second side of the drainage tank.

[0009] The filtration mechanism includes a filter element that is detachably disposed between the drain tank and the containment space.

[0010] In one embodiment of the present invention, the filter element extends with abutting portions along the sides of the first horizontal direction and / or the second horizontal direction, the abutting portions being inclined away from the middle of the filter element, and the abutting portions abutting against the inner sidewall of the drain tank; the filter element has a gap in the height direction with at least the bottom of the second side of the drain tank.

[0011] In one embodiment of this utility model, the box is provided with an overflow mechanism, the overflow mechanism including: an overflow pipe whose top end is connected to the accommodating space, an overflow box connected to the bottom end of the overflow pipe, and a second drain valve connected to the overflow box; the height of the top end of the overflow pipe relative to the ground is less than the height of the top of the box relative to the ground.

[0012] In one embodiment of the present invention, the box body is further provided with a limiting support mechanism, the limiting support mechanism including support plates installed on both sides of the box body, and the two ends of the support plates extending in the height direction have first limiting guide portions.

[0013] In one embodiment of the present invention, the housing is further provided with a limiting guide mechanism, the limiting guide mechanism comprising: a first guide block disposed on both sides of the housing along a first horizontal direction, and a second guide block disposed on both sides of the housing along a second horizontal direction; the first guide block and the second guide block are respectively provided with a second limiting guide portion and a third limiting guide portion extending in the height direction.

[0014] In one embodiment of the present invention, the transfer body includes: a frame and a roller assembly mounted on the frame, the frame being driven manually or by an external moving device, and the box being disposed on the frame.

[0015] In one embodiment of this utility model, the box body is provided with a first identification element.

[0016] In one embodiment of this utility model, the frame is provided with a second identification element.

[0017] In one embodiment of the present invention, the frame is provided with docking mechanisms along a first horizontal direction and / or a second horizontal direction, and each docking mechanism includes: a first bearing rotatably connected to the frame along the horizontal plane, and a second bearing rotatably connected to the frame along the vertical direction; the first bearing and the second bearing are respectively used to position the frame in the horizontal and vertical directions.

[0018] Secondly, this application also provides a turnover vehicle, comprising:

[0019] Mobile devices;

[0020] The silicon wafer transfer device as described in the first aspect is disposed on a moving device.

[0021] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:

[0022] This utility model discloses a silicon wafer transfer device that uses a drainage tank in conjunction with a first drainage valve to discharge cleaning fluid from the tank. The drainage tank is configured such that its bottom surface gradually decreases in height from the first side to the second side, allowing the cleaning fluid to drain from the lower second side. Furthermore, during the drainage process, the cleaning fluid passes through a filter element within the tank's containment space before being discharged, enabling automatic filtration. This achieves complete drainage of the cleaning fluid from the tank and facilitates rapid and focused cleaning of the silicon wafers on the filter element. Attached Figure Description

[0023] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0024] Figure 1 This is a structural schematic diagram of the turnover cart of this utility model from the first angle;

[0025] Figure 2 This is a structural schematic diagram of the turnover cart of this utility model from a second angle;

[0026] Figure 3 This is a sectional view of the turnover cart of this utility model;

[0027] Figure 4 This is a utility model Figure 3 Enlarged view of point B in the middle;

[0028] Figure 5 This is a sectional view of the housing of this utility model;

[0029] Figure 6 This is a structural schematic diagram of the limiting support mechanism and the limiting guide mechanism of this utility model;

[0030] Figure 7 This is a utility model Figure 1 Enlarged view of point A in the middle.

[0031] Explanation of reference numerals in the accompanying drawings: 1. Transfer body; 11. Side frame; 12. Support leg; 13. Caster wheel; 14. Second identification element; 15. Frame; 2. Box; 21. First identification element; 22. Accommodation space; 3. Silicon wafer frame; 4. Docking mechanism; 41. First bearing; 42. Second bearing; 5. Drainage mechanism; 51. Drainage tank; 52. First drain valve; 6. Overflow mechanism; 61. Overflow pipe; 62. Overflow box; 63. Second drain valve; 64. Overflow port; 7. Filtering mechanism; 71. Support rod; 72. Filter element; 73. Abutment part; 74. Handle; 8. Limiting guide mechanism; 81. First guide block; 82. Second guide block; 83. Substrate; 84. Second limiting guide part; 85. Third limiting guide part; 9. Limiting support mechanism; 91. Support plate; 92. First limiting guide part. Detailed Implementation

[0032] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0033] Example

[0034] In this embodiment, for ease of understanding, Figure 1 Based on the reference, the X-axis direction is the first horizontal direction, the Y-axis direction is the second horizontal direction, and the Z-axis direction is the height direction.

[0035] Reference Figures 1-3 As shown, this embodiment provides a turnover cart, which includes a moving device (not shown) and a silicon wafer transfer device, wherein the silicon wafer transfer device is disposed on the moving device. Specifically, the silicon wafer transfer device is disposed above the moving device. The moving device is a mobile chassis. The mobile chassis is used to actively drive the silicon wafer transfer device to rotate within the workshop. The moving chassis's movement during turnover includes, but is not limited to, rollers or tracks; the navigation methods include, but are not limited to, laser, vision, or inertial navigation. Laser navigation has the advantages of high precision and high reliability, enabling fast and accurate positioning and navigation in complex workshop environments. For example, in workshops with many obstacles or compact equipment layouts, laser navigation can effectively avoid obstacles and guide the turnover cart along a preset path. Visual navigation relies on cameras installed on the turnover cart or within the workshop to identify and analyze features in the workshop environment, such as walls and marking lines, to determine the turnover cart's position and direction of travel. The inertial navigation system uses accelerometers and gyroscopes to measure the acceleration and angular velocity of the transfer vehicle, and calculates the position and attitude changes of the transfer vehicle through integration, making it suitable for short-distance transfers. The silicon wafer transfer device includes a transfer body 1, a housing 2, a drainage mechanism 5, and a filtration mechanism 7.

[0036] Reference Figures 1-3As shown, the transfer body 1 includes a frame 15 and a roller assembly mounted on the frame 15. The frame 15 includes a platform and multiple support legs 12 to support the weight of components such as silicon wafers, cleaning fluid, and the housing 2. A mobile chassis can move under the platform to lift it, allowing the support legs 12 to detach from the ground. The platform is driven by the mobile chassis, and its load-bearing capacity is improved by using reinforcing ribs or side frame 11 skeletons. The roller assembly includes multiple rollers mounted on the bottom of the support legs 12. All rollers are omnidirectional casters 13, allowing the platform to move flexibly in all directions, greatly improving the operational flexibility of the transfer cart within the workshop. Furthermore, the frame 15 can also be moved manually by pushing and pulling. The housing 2 is mounted on the transfer body 1. Specifically, the housing 2 is mounted on the platform of the frame 15. The housing 2 encloses a space 22 for holding silicon wafers and cleaning fluid, allowing the silicon wafers to be immersed in the cleaning fluid for cleaning. The material of the housing 2 needs to have good corrosion resistance to prevent damage from the cleaning fluid. Common materials include stainless steel, engineering plastics, etc., or a corrosion-resistant coating can be applied to the inside of the enclosure 2.

[0037] Reference Figures 3-4 As shown, a drainage tank 51 is embedded in the bottom of the box 2, and the drainage tank 51 is connected to the receiving space 22 of the box 2. The top of the drainage tank 51 has an opening and communicates with the receiving space 22 through the top opening. The height of the bottom surface of the drainage tank 51 relative to the ground gradually decreases from its first side to its second side, as detailed in [reference needed]. Figure 3 or Figure 4 The bottom surface of the drainage tank 51 gradually slopes downward from right to left. The slope can be stepped, concave, convex, or inclined. In this embodiment, the slope of the drainage tank 51 is planar.

[0038] Reference Figure 4As shown, to drain the cleaning fluid from the containing space 22, a first drain valve 52 is connected to the bottom of the drain tank 51. The first drain valve 52 is located at the lowest point of the drain tank 51, i.e., on the second side of the drain tank 51, so that water flow can collect at the lowest point and be discharged through the first drain valve 52 to form the drain mechanism 5. This avoids the problem of cleaning fluid residue caused by improper drain valve position. During the silicon wafer cleaning process, residual cleaning fluid may cause secondary contamination of the silicon wafer, affecting product quality. By placing the drain valve at the lowest point, it can ensure that the cleaning fluid is discharged as completely as possible, reducing the amount of residue and providing a cleaner environment for subsequent processing of the silicon wafer. The first drain valve 52 can be a manual valve or a solenoid valve. In this embodiment, considering the needs of automated operation and the accuracy of drainage control, a solenoid valve is preferred. In large-scale production scenarios, frequent manual operation increases the labor intensity of operators, is prone to operational errors, and affects production efficiency and drainage effect. In contrast, solenoid valves have significant advantages, especially suitable for modern automated production environments. Solenoid valves can control the opening and closing of the valve through electrical signals, with fast response speed and high control accuracy. According to a preset program, the system can achieve timed and quantitative drainage, meeting the precise requirements of different cleaning processes for drainage time and flow rate. Simultaneously, the solenoid valve can be integrated with other automated equipment and control systems to automate the entire cleaning process, reducing manual intervention and improving production stability and reliability.

[0039] Reference Figures 3-4As shown, a filter element 72 is detachably installed between the drain tank 51 and the receiving space 22 to filter the cleaning fluid discharged from the tank 2 and to collect silicon wafers and impurities within the tank 2. The bottom of the filter element 72 is positioned horizontally, so the gap between the bottom of the filter element 72 and the bottom surface of the drain tank 51 gradually increases towards the first drain valve 52. The filter element 72 includes a bottom with multiple filter holes for filtration and sides arranged around the bottom. A first end of the bottom of the filter element 72 abuts against the bottom surface of the drain tank 51 to form a support. A support rod 71 is provided on the second side of the drain tank 51, supporting the second end of the bottom of the filter element 72, so that the filter element 72 and the bottom of the second side of the drain tank 51 have a gap in the height direction, thereby forming a downward-sloping drainage channel between the filter element 72 and the bottom of the drain tank 51 to form a filtration mechanism 7. The end of the support rod 71 is made of a material with low hardness to avoid damaging the filter element 72. The filter element 72 has abutment portions 73 extending from its sides along the first horizontal direction and / or the second horizontal direction. The abutment portions 73 are bent into shape with the filter element 72. The abutment portions 73 are inclined away from the filter element 72, allowing them to elastically abut against the inner wall of the drain tank 51. When the filter element 72 is installed downwards into the drain tank 51, the abutment portions 73 are compressed and deformed by the inner wall of the drain tank 51, generating an elastic restoring force. This allows the filter element 72 to elastically engage with the drain tank 51, enabling detachable installation and improving the ease of use of the filter element 72. Furthermore, the filter element 72 is also provided with a handle 74 for easier handling.

[0040] When impurities or silicon wafer fragments smaller than the filter element 7 pass through it, the bottom surface of the drain tank 51 gradually slopes downwards from right to left. During the flow of the cleaning fluid, the impact force generated by the water flow propels these small impurities and fragments downwards along the inclined plane. This prevents the accumulation of impurities or fragments from clogging the bottom surface of the filter element 7 and the drain tank 51. Specifically, the cleaning fluid flows towards the lower part of the drain tank 51 under gravity, creating a certain flow velocity. The impact force generated by this flow velocity is sufficient to move small impurities and fragments along with it. Without this inclined design, impurities and fragments might accumulate below the filter element 7, gradually clogging the drainage channel over time, affecting the normal discharge of the cleaning fluid, and even potentially causing the cleaning fluid to overflow, damaging the working environment and equipment.

[0041] Continue to refer to Figures 3-4As shown, the maximum height of both the drainage tank 51 and the filter element 72 is less than the height of the bottom surface of the tank 2 relative to the ground. This spatial arrangement places the drainage tank 51 and the filter element 72 below the bottom plane of the tank 2, forming a relatively low-lying area for drainage and impurity collection, constituting a sunken drainage channel. Simultaneously, during drainage, debris and other impurities are blocked and trapped on the filter element 72. Because the filter element 72 is low and forms a stepped surface between it and the bottom surface of the tank 2, when the trolley moves within the workshop or the tank 2 shakes due to operation, debris, due to the obstruction of the stepped surface, is less likely to be dislodged from the filter element 72 by the fluctuation of the cleaning fluid and slide onto the bottom surface of the tank 2, facilitating subsequent collection and centralized cleaning of debris. Furthermore, the sunken drainage channel structure makes the drainage path smoother. Since the drainage tank 51 and the filter element 72 are lower than the bottom surface of the tank 2, even if there is a brief water flow impact or fluctuation during drainage, it is less likely for the cleaning fluid to flow back into the tank 2.

[0042] Reference Figure 3 , Figure 5 As shown, the containing space 22 is connected to an overflow pipe 61 to automatically discharge cleaning fluid when the water level in the tank 2 is too high. The top end of the overflow pipe 61 is the input end, and the top end of the overflow pipe 61 is set at the warning liquid level line inside the tank 2. The bottom end of the overflow pipe 61 is the output end, and the bottom end of the overflow pipe 61 is connected to an overflow box 62. The height of the top end of the overflow pipe 61 relative to the ground is less than the height of the top of the tank 2 relative to the ground. An overflow port 64 corresponding to the overflow pipe 61 is opened inside the tank 2 at the preset warning liquid level. When the cleaning fluid level in the tank 2 is too high, that is, exceeding the preset warning liquid level line, the excess cleaning fluid enters the input port at the top end of the overflow pipe 61 through the overflow port 64, and is discharged into the lower overflow box 62 through the overflow pipe 61, so as to ensure that the cleaning fluid in the tank 2 never exceeds the warning line and prevent the tilted liquid from spilling out of the tank 2 and causing pollution or corrosion. The overflow tank 62 is equipped with a second drain valve 63 to connect to the outside, forming the overflow mechanism 6. The second drain valve 63 can be a manual valve or a solenoid valve; in this embodiment, considering the need for automated operation, a solenoid valve is preferred. Furthermore, a water level sensor can be installed inside the tank 2 and used in conjunction with the second drain valve 63 to achieve automatic drainage. The water level sensor can monitor the water level in the tank 2 in real time. When the water level reaches a preset value, the sensor transmits a signal to the second drain valve 63, which automatically opens to drain water until the water level drops to a suitable level and then closes. Alternatively, the second drain valve 63 can be opened periodically to drain the cleaning fluid from the overflow tank 62.

[0043] Reference Figures 5-6As shown, whole silicon wafers are generally placed in the silicon wafer frame 3 for centralized placement and removal. To limit and guide the whole silicon wafers when they are placed into the housing 2, the housing 2 is also equipped with a limiting support mechanism 9 and a limiting guide mechanism 8. The limiting support mechanism 9 includes support plates 91 installed on both sides of the housing 2, with the bottom of the silicon wafer frame 3 resting on the support plates 91. First limiting guide portions 92 extend vertically from both ends of the support plates 91, and each end of the first limiting guide portion 92 has opposing inclined surfaces, narrowing the distance between the first limiting guide portions 92 downwards to guide the bottom of the silicon wafer frame 3. The bottom distance between the two sets of limiting portions is adapted to the bottom dimensions of the silicon wafer frame 3, limiting the silicon wafer frame 3. The housing 2 is also equipped with a limiting guide mechanism 8, which includes a first guide block 81 and a second guide block 82. The first guide blocks 81 are respectively disposed on both sides of the housing 2 along a first horizontal direction. Two first guide blocks 81 are provided in each group and are attached to both ends of the support plate 91 along its length, providing reinforcement to the support plate 91. A corresponding, downwardly narrowing second limiting guide portion 84 is provided on one side of each of the two groups of first guide blocks 81. A limiting member (not shown in the figure) corresponding to the first guide block 81 can be provided at the bottom of the silicon wafer frame 3, limiting and guiding the silicon wafer frame 3 in the first horizontal direction when it is placed. Second guide blocks 82 are respectively provided on both sides of the housing 2 along the second horizontal direction. The second guide blocks 82 are attached to the inner sidewalls of the housing 2 along the second horizontal direction. The second guide blocks 82 on both sides also have corresponding, downwardly narrowing third limiting guide portions 85. The height of the third limiting guide portion 85 of the second guide block 82 relative to the ground is greater than the height of the first limiting guide portion 92 relative to the ground. When the silicon wafer frame 3 is placed on the support plate 91, it can be guided by the second guide blocks 82 to avoid scratching the inner wall of the housing 2 and collisions that could cause the silicon wafer to break. Based on this, guide ramps (not shown in the figure) adapted to the second guide block 82 can be opened on both sides of the bottom of the silicon wafer frame 3 along the second horizontal direction. The base plate 83 is mounted on the ground of the housing 2, and the first guide block 81, the second guide block 82 and the support plate 91 can be detachably mounted on the base plate 83.

[0044] Reference Figure 2As shown, the housing 2 is equipped with a first identification element 21. The frame 15 is equipped with a second identification element 14. The first identification element 21 and the second identification element 24 can employ various technologies to achieve identification functions. For example, a QR code identification tag can be used, which involves affixing a QR code pattern containing specific information to the surface area of ​​the housing 2 or the frame 15. A scanning device can quickly read the stored data about the housing 2, such as the model, size, applicable silicon wafer specifications, number of uses, and last maintenance time; or the load-bearing capacity, size, and maintenance records of the frame 15, and transmit this data to the reading device, thereby achieving identification and information acquisition of the frame 15. Alternatively, a radio frequency identification (RFID) tag can be used, which stores an integrated circuit chip and achieves non-contact automatic data identification through radio frequency signal interaction with a reader. RFID tags have waterproof, anti-magnetic, and high-temperature resistance characteristics, making them suitable for complex industrial environments. Alternatively, an optical character recognition (OCR) technology can be used, which involves printing easily machine-readable characters on the surface of the housing 2, using optical devices such as cameras to capture images and perform character recognition to obtain information about the housing 2. In addition, an identification module based on Near Field Communication (NFC) technology can also be considered. It features short identification distance and high security, making it suitable for scenarios requiring precise close-range identification of information on the rack 15 or box 2. Taking RFID as an example, when the trolley enters the radio frequency signal coverage area of ​​the reader, the antenna inside the RFID tag receives the radio frequency signal emitted by the reader and transmits the box 2 information stored within it back to the reader in the form of a radio frequency signal. The reader then transmits the received signal to the back-end management system for processing and analysis, thereby achieving rapid and accurate identification of the box 2 information.

[0045] Reference Figure 1 , Figure 7As shown, to ensure accurate docking between the trolley and the docking mechanism 4, the frame 15 is equipped with docking mechanisms 4 along both the first and second horizontal directions. Specifically, the frame 15 is rotatably connected to a first bearing 41 along the horizontal plane. The docking mechanism 4 has corresponding transversely opened V-grooves. When the first bearing 41 slides against the docking mechanism 4 in the corresponding direction, it enters the transverse V-grooves and is limited, thus preventing it from easily disengaging. Furthermore, by applying a contact force to the trolley, it can achieve automatic positioning in the planar direction, ensuring the reliability of the docking even in complex production environments or under conditions of vibration. Similarly, the frame 15 is rotatably connected to a second bearing 42 along the vertical direction. The frame 15 is equipped with brackets for mounting the first bearing 41 and the second bearing 42. The first bearing 41 and the second bearing 42 are used to position the frame 15 in the first horizontal and vertical directions, respectively. It has strong versatility and adaptability. The size, angle and bearing specifications of the V-groove can be adjusted according to different docking mechanism shapes, sizes and production process requirements to adapt to a variety of different docking scenarios.

[0046] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A silicon wafer transfer device, characterized in that, include: transfer body(1); The box (2) is installed on the transfer body (1), and the box (2) encloses a receiving space (22); The drainage mechanism (5) includes a drainage tank (51) embedded in the bottom of the box (2) and connected to the receiving space (22), and a first drainage valve (52) connected to the drainage tank (51); the bottom surface of the drainage tank (51) is lowered from the ground from its first side to its second side, and the first drainage valve (52) is connected to the second side of the drainage tank (51); The filtration mechanism (7) includes a filter element (72) detachably disposed between the drain tank (51) and the receiving space (22).

2. The silicon wafer transfer device according to claim 1, characterized in that, The filter element (72) has abutment portions (73) extending along the sides of the first horizontal direction and / or the second horizontal direction, respectively. The abutment portions (73) are inclined away from the middle of the filter element (72) and abut against the inner sidewall of the drain tank (51). The filter element (72) has a gap in the height direction with the bottom of the second side of the drain tank (51).

3. The silicon wafer transfer device according to claim 1, characterized in that, The box (2) is provided with an overflow mechanism (6), which includes: an overflow pipe (61) whose top end is connected to the accommodating space (22), an overflow box (62) connected to the bottom end of the overflow pipe (61), and a second drain valve (63) connected to the overflow box (62); the height of the top end of the overflow pipe (61) relative to the ground is less than the height of the top of the box (2) relative to the ground.

4. The silicon wafer transfer device according to claim 1, characterized in that, The housing (2) is also provided with a limiting support mechanism (9), which includes a support plate (91) installed on both sides inside the housing (2), and the two ends of the support plate (91) extend in the height direction with a first limiting guide part (92).

5. The silicon wafer transfer device according to claim 1, characterized in that, The housing (2) is also provided with a limiting guide mechanism (8), which includes: a first guide block (81) disposed on both sides of the housing (2) along a first horizontal direction, and a second guide block (82) disposed on both sides of the housing (2) along a second horizontal direction; the first guide block (81) and the second guide block (82) are respectively provided with a second limiting guide part (84) and a third limiting guide part (85) extending in the height direction.

6. The silicon wafer transfer device according to claim 1, characterized in that, The transfer body (1) includes: a frame (15) and a roller assembly mounted on the frame (15), the frame (15) being driven manually or by an external moving device, and the box (2) being disposed on the frame (15).

7. The silicon wafer transfer device according to claim 1, characterized in that, The housing (2) is provided with a first identification element (21).

8. The silicon wafer transfer device according to claim 6, characterized in that, The frame (15) is provided with a second identification element (14).

9. The silicon wafer transfer device according to claim 6, characterized in that, The frame (15) is provided with docking mechanisms (4) along the first horizontal direction and / or the second horizontal direction respectively. Each docking mechanism (4) includes: a first bearing (41) rotatably connected to the frame (15) along the horizontal plane, and a second bearing (42) rotatably connected to the frame (15) along the vertical direction. The first bearing (41) and the second bearing (42) are used to position the frame (15) in the horizontal and vertical directions respectively.

10. A turnover vehicle, characterized in that, include: Mobile devices; The silicon wafer transfer device as described in any one of claims 1-9, wherein the silicon wafer transfer device is disposed on the moving device.

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