Informatization sensor integrated assembly with multiple sensor joints

By using a packaged structure for fixed connection with the base, along with heat dissipation fins and fixing posts, the structural stability and protection issues of the sensor integrated assembly are solved, enabling convenient docking and enhanced heat dissipation performance, thereby improving the lifespan and installation stability of the assembly.

CN224163203UActive Publication Date: 2026-04-24GUIZHOU ANLONG YUDEAN NEW ENERGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUIZHOU ANLONG YUDEAN NEW ENERGY CO LTD
Filing Date
2025-06-23
Publication Date
2026-04-24

AI Technical Summary

Technical Problem

Existing sensor integration components lack structural stability and are easily damaged by external factors. Furthermore, the connectors are open structures, making them susceptible to damage.

Method used

The device employs an encapsulated structure that is fixedly connected to the base. Heat dissipation fins are attached to both sides, and the fixing posts and pins are arranged at equal intervals. Miniature hinges work in conjunction with the protective plate to provide structural protection and convenient docking. The connector matrix extends through rectangular openings, and the protective plate provides shielding protection. Heat dissipation fins and fixing posts enhance the stability of the component.

Benefits of technology

It improves the structural stability and lifespan of the sensor integration components, provides good heat dissipation and impact protection, and facilitates easy sensor connection, ensuring secure installation and ease of use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an informatization sensor integration assembly of multi-sensor joint relates to sensor integration technical field, including base and packaging structure, the external upper end of base is connected with the packaging structure, and the left side and the right side of packaging structure are attached with radiating fin, the front side and the back side of base are provided with fixed pile, and the fixed pile is connected with the packaging structure. The middle parts of the front and rear sides of the base are connected with pins, and the top surface of the packaging structure is provided with a top plate. According to the informatization sensor integrated assembly with the multiple sensor connectors, the protection plates are arranged at the positions, extending out of the connector matrixes, of the openings in the front side and the rear side of the packaging structure, a certain degree of structural protection effect can be provided for the connector matrixes, and meanwhile, the protection plates can conveniently cause structural interference when the connector matrixes are used in cooperation with micro hinges; and the fixing piles on the two sides of the base can assist the pins to provide enough structural fixation for the whole assembly structure so as to ensure the mounting stability.
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Description

Technical Field

[0001] This utility model relates to the field of sensor integration technology, specifically to an information sensor integration component with multiple sensor connectors. Background Technology

[0002] Information-based sensor integration components refer to sensors that integrate multiple sensors onto a single chip, manufactured using silicon semiconductor integration technology. These sensors not only detect various physical quantities but also process the acquired signals in real time, achieving a high degree of functional integration and optimized signal processing capabilities. Multi-sensor connector information-based sensor integration components mainly consist of multiple identical sensors arranged on the same plane, forming a sensor array. These sensors can be configured in a row, called a single-element sensor array, or in a matrix, called a binary sensor array.

[0003] Conventional sensor integration components are connected to circuit boards or mounting structures using a welded structure. The stability of the welded structure is relatively limited to a certain extent. At the same time, the joints of the sensor integration components themselves use an open structure, which makes them susceptible to structural damage due to external factors.

[0004] Therefore, in view of this, we have studied and improved the existing structure and its shortcomings, and proposed an information sensor integration component with a multi-sensor connector. Utility Model Content

[0005] The purpose of this invention is to provide an information-integrated sensor component with a multi-sensor connector to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an information sensor integration component with a multi-sensor connector, comprising a base and an encapsulation structure. The upper outer end of the base is connected to the encapsulation structure, and heat dissipation fins are attached to the left and right sides of the encapsulation structure. Fixing posts are provided on the front and rear sides of the base, and pins are connected to the middle of the front and rear sides of the base. A top plate is provided on the top surface of the encapsulation structure, and micro hinges are installed at the front and rear ends of the top of the encapsulation structure. A protective plate is connected to the end of the micro hinge away from the encapsulation structure.

[0007] Furthermore, the encapsulation structure is fixedly connected to the base, and the heat dissipation fins are simultaneously attached to the left and right sides of the encapsulation structure and the base, and the heat dissipation fins are also embedded in the left and right sides of the base.

[0008] Furthermore, the fixed piles are symmetrically connected to both ends of one side of the base, and the fixed piles are fixedly connected to the base. Moreover, the lower ends of the fixed piles are provided with corner plate structures with holes on both the left and right sides for the fixed installation of the entire component.

[0009] Furthermore, the pins are fitted inside the front and rear sides of the base, and the pins are arranged in an equidistant structure.

[0010] Furthermore, the top plate is fixedly connected to the top surface of the encapsulation structure, and the top surface of the top plate has a groove structure that matches the upper surface structure of the protective plate.

[0011] Furthermore, the micro-hinges are symmetrically mounted on one end of the top of the encapsulation structure, and the encapsulation structure and the micro-hinges are fixedly connected.

[0012] Furthermore, the encapsulation structure has a connector base inside, and a connector matrix is ​​symmetrically installed on the top surface of the connector base.

[0013] Furthermore, the connector base is fixedly installed at the top center of the base, and the connector base and the base are welded together. The connector matrix is ​​electrically connected to the base through the connector base. The front and rear sides of the encapsulation structure are provided with rectangular openings for the connector matrix to extend out.

[0014] This utility model provides an information-integrated sensor component with a multi-sensor connector, which has the following advantages:

[0015] 1. This utility model features rectangular openings on both the front and rear sides of the encapsulation structure, allowing one end of the connector matrix to extend outwards for connecting multiple sensors. A protective plate is also provided on the side of the encapsulation structure corresponding to the connector matrix, covering the extended end of the connector matrix and providing good shielding protection. The protective plate is connected to the encapsulation structure using micro-hinges. The flexibility of these micro-hinges allows for structural flipping when connecting the connector matrix to external sensors. This design ensures both ease of use and structural protection, thus extending the structure's lifespan.

[0016] 2. This utility model features heat dissipation fins fitted and connected to the left and right sides of the base. By attaching the heat dissipation fins to the side surfaces of the base and the encapsulation structure, it can effectively provide good heat dissipation protection for the entire component structure. At the same time, the heat dissipation fins can also provide good anti-collision protection on the left and right sides of the base. Furthermore, by symmetrically setting fixing posts at the left and right ends of the front and rear of the base, after the entire component structure is welded and installed using pins, it can be further fixed by using bolts in conjunction with the corner plate structure with holes on the left and right sides of the lower end of the fixing posts, so as to ensure the structural stability and installation firmness of the entire component. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the main body of an information sensor integration component with a multi-sensor connector according to the present invention.

[0018] Figure 2 This is a schematic diagram of the main body of an information sensor integration component with a multi-sensor connector according to the present invention.

[0019] Figure 3 This is a schematic diagram of the internal structure of the information sensor integration component with a multi-sensor connector according to this utility model.

[0020] In the diagram: 1. Base; 2. Encapsulation structure; 3. Heat dissipation fins; 4. Fixing post; 5. Pin; 6. Top plate; 7. Miniature hinge; 8. Protective plate; 9. Connector base; 10. Connector matrix. Detailed Implementation

[0021] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0022] like Figures 1 to 3 As shown, an information sensor integration component with a multi-sensor connector includes a base 1 and an encapsulation structure 2. The encapsulation structure 2 is connected to the upper outer end of the base 1, and heat dissipation fins 3 are attached to the left and right sides of the encapsulation structure 2. Fixing posts 4 are provided on the front and rear sides of the base 1, and pins 5 are connected to the middle of the front and rear sides of the base 1. A top plate 6 is provided on the top surface of the encapsulation structure 2, and micro hinges 7 are installed at the front and rear ends of the top of the encapsulation structure 2. A protective plate 8 is connected to the end of the micro hinge 7 away from the encapsulation structure 2. The micro hinges 7 are symmetrically installed on the top end of the encapsulation structure 2, and the encapsulation structure 2 and the micro hinges 7 are fixedly connected. A connector base 9 is provided inside the encapsulation structure 2, and the top surface of the connector base 9 is on the left... A connector matrix 10 is symmetrically installed on the right. The connector base 9 is fixedly installed at the top center of the base 1, and the connector base 9 and the base 1 are welded together. The connector matrix 10 is electrically connected to the base 1 through the connector base 9. Rectangular openings are provided on both the front and rear sides of the encapsulation structure 2 for the connector matrix 10 to extend out. By providing rectangular openings on both the front and rear sides of the encapsulation structure 2, one end of the connector matrix 10 can extend out to facilitate the connection of multiple sensors. At the same time, a protective plate 8 is provided on the side of the encapsulation structure 2 at the position corresponding to the connector matrix 10. The protective plate 8 covers the extended end of the connector matrix 10, thereby providing good shielding protection for the connector matrix 10.

[0023] like Figures 1 to 3As shown, the encapsulation structure 2 is fixedly connected to the base 1, and the heat dissipation fins 3 are simultaneously attached to the left and right sides of the encapsulation structure 2 and the base 1. The heat dissipation fins 3 are also embedded in the left and right sides of the base 1. The fixing posts 4 are symmetrically connected to the two ends of one side of the base 1, and the fixing posts 4 are fixedly connected to the base 1. The lower left and right sides of the fixing posts 4 are provided with corner plate structures with holes for the fixed installation of the entire component. The pins 5 are embedded in the interior of the front and rear sides of the base 1, and the pins 5 are arranged in an equidistant structure. The top plate 6 is fixedly connected to the top surface of the encapsulation structure 2, and the top surface of the top plate 6 has a groove structure that matches the upper surface structure of the protective plate 8. By embedding and connecting the heat dissipation fins 3 on the left and right sides of the base 1, and by attaching the heat dissipation fins 3 to the side surfaces of the base 1 and the encapsulation structure 2, the entire component structure can be effectively protected by heat dissipation. At the same time, the heat dissipation fins 3 can also provide good anti-collision protection on the left and right sides of the base 1.

[0024] In summary, as Figures 1 to 3 As shown, the information sensor integration component of the multi-sensor connector can be used by first welding the entire component structure with the pins 5 on the front and rear sides of the base 1 as needed. Then, the corner plate structure with holes on the lower side of the fixing pile 4 can be used with screws for further structural fixation, thereby maximizing the installation firmness of the entire component structure.

[0025] When the connector matrix 10 on the top of the connector base 9 is needed, simply use the rotational nature of the micro hinge 7 structure used to connect the encapsulation structure 2 and the protective plate 8 to flip the protective plate 8 upward and snap the protective plate 8 into the groove structure opened on the surface of the top plate 6, thereby limiting the structure of the protective plate 8. Then the connector matrix 10 can be used to connect and combine with external sensors.

[0026] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. An information sensor integrated assembly of a multi-sensor joint, comprising a base (1) and a packaging structure (2), characterized in that: The upper outer end of the base (1) is connected to the encapsulation structure (2), and heat dissipation fins (3) are attached to the left and right sides of the encapsulation structure (2). Fixing posts (4) are provided on the front and rear sides of the base (1), and pins (5) are connected to the middle of the front and rear sides of the base (1). A top plate (6) is provided on the top surface of the encapsulation structure (2), and micro hinges (7) are installed at the front and rear ends of the top of the encapsulation structure (2). A protective plate (8) is connected to the end of the micro hinge (7) away from the encapsulation structure (2).

2. The information sensor integration component with a multi-sensor connector according to claim 1, characterized in that, The encapsulation structure (2) is fixedly connected to the base (1), and the heat dissipation fins (3) are attached to the left and right sides of the encapsulation structure (2) and the base (1), and the heat dissipation fins (3) are embedded in the left and right sides of the base (1).

3. The informationized sensor integrated assembly of a multi-sensor joint according to claim 1, wherein, The fixed pile (4) is symmetrically connected to both ends of one side of the base (1), and the fixed pile (4) and the base (1) are fixedly connected. Moreover, the lower left and right sides of the fixed pile (4) are provided with corner plate structures with holes for the fixed installation of the entire component.

4. The informationized sensor integrated assembly of a multi-sensor junction according to claim 1, wherein, The pins (5) are fitted inside the front and rear sides of the base (1), and the pins (5) are arranged in an equidistant structure.

5. The informationized sensor integrated assembly of a multi-sensor junction according to claim 1, wherein, The top plate (6) is fixedly connected to the top surface of the encapsulation structure (2), and the top surface of the top plate (6) is provided with a groove structure that matches the upper surface structure of the protective plate (8).

6. The informationized sensor integrated assembly of a multi-sensor junction according to claim 1, wherein, The micro hinge (7) is symmetrically installed on the top end of the encapsulation structure (2), and the encapsulation structure (2) and the micro hinge (7) are fixedly connected.

7. The informationized sensor integrated assembly of a multi-sensor junction according to claim 1, wherein, The encapsulation structure (2) has a connector base (9) inside, and a connector matrix (10) is symmetrically installed on the top surface of the connector base (9).

8. An informationized sensor integrated assembly of a multi-sensor joint according to claim 7, characterized in that, The connector base (9) is fixedly installed at the top center of the base (1), and the connector base (9) and the base (1) are welded together. The connector matrix (10) is electrically connected to the base (1) through the connector base (9). The front and rear sides of the encapsulation structure (2) are provided with rectangular openings for the connector matrix (10) to extend out.