A thick rubber plate-based patch capacitor plate changing mechanism

Abstract

The utility model discloses a kind of patch capacitor plate changing mechanism based on thick rubber plate, including needle bed conveying device, partition frame clamping device, new board clamping device, new board conveying device and flattening device;Needle bed conveying device includes first conveying track and transfer platform, and transfer platform is horizontally movably installed in first conveying track;Partition frame clamping device and new board clamping device are successively erected above the end of first conveying track along the conveying direction of transfer platform, partition frame clamping device is used to clamp partition frame, new board clamping device is used to clamp empty thick rubber plate, and the clamp of partition frame clamping device and the clamp of new board clamping device can be moved up and down relative to transfer platform.This scheme changes the surface of patch capacitor from "same plate surface changing" to "plate changing", to avoid the problem that the edge of patch capacitor is exposed to porcelain, the end top appears crack, patch capacitor is pressed skew, etc., to ensure the end sealing quality of patch capacitor.

Description

Technical Field

[0001] This utility model relates to the technical field of chip capacitor production equipment, and in particular to a chip capacitor plate changing mechanism based on a thick adhesive plate. Background Technology

[0002] Currently, fully automated end-sealing machines / production lines for surface mount capacitors typically use a stencil as the carrier for transferring the capacitors. Specifically, as detailed in Chinese Utility Model Patent CN218849426U, the end-sealing process involves first applying an adhesive film to one side of the stencil to seal one end of the mesh. After the film is smoothly adhered, the surface mount capacitors are inserted into the mesh, and the adhesive film adheres hundreds of miniature capacitors to the stencil, preventing them from falling off. Then, the other end of the capacitors without adhesive film is dipped in resin for end-sealing. During this insertion process, the ends of the surface mount capacitors are aligned by the adhesive film. However, due to potential manufacturing tolerances (such as varying lengths) in the surface mount capacitors themselves, the ends to be sealed within the same stencil are difficult to align perfectly after insertion, resulting in poor consistency in the resin dipping process and significantly affecting the end-sealing quality.

[0003] Therefore, to ensure the sealing quality of surface mount capacitors, some manufacturers have begun to use thick plastic plates instead of stencils as the transport carrier for surface mount capacitors. The thick plastic plate is a carrier that fixes the surface mount capacitor using silicone clamps. Therefore, to successfully implant the surface mount capacitor into the holes of the thick plastic plate, a guide plate needs to be placed on top of the thick plastic plate. First, the surface mount capacitor is implanted into the guide hole of the guide plate by vibration. Then, a bed of needles presses the surface mount capacitor located in the guide plate into the hole of the thick plastic plate, thus completing the implantation process of the surface mount capacitor into the thick plastic plate.

[0004] In the existing technology, the face-changing process of surface mount capacitors is completed on the same thick plastic plate. That is, a bed of needles is used to press the sealed end of the surface mount capacitor directly down from above the hole of the thick plastic plate, so that the sealed end of the surface mount capacitor passes through the center of the hole of the thick plastic plate and reaches the bottom of the thick plastic plate, and the unsealed end of the surface mount capacitor protrudes from the lower surface of the thick plastic plate.

[0005] The above-mentioned face-changing steps have the following quality problems: 1. The hole depth of the thick rubber board is 8.9mm. Due to the characteristic that "within the same hole diameter, the elasticity and clamping force of the rubber in the center is greater than that at the edge", the sealed end of the chip capacitor is pressed directly down from above the hole of the thick rubber board, and pressed out through the center of the rubber to the lower surface of the thick rubber board. This causes excessive friction on the side of the sealed end, which is prone to causing the chip capacitor's edge to expose the porcelain; 2. The diameter of the needle bed is generally smaller than the diameter of the hole in the thick rubber board. When the needle tip contacts and presses down on the sealed end of the chip capacitor, it passes from above the hole through the center of the board to below the hole. Due to the high friction force in the center hole, the sealed end is prone to indentation damage. Utility Model Content

[0006] The purpose of this invention is to propose a chip capacitor replacement mechanism based on a thick adhesive plate, which improves the chip capacitor replacement process from "replacing the chip capacitor with the same plate" to "replacing the plate", so as to avoid problems such as exposed ceramic at the chip capacitor edges, cracks at the top of the chip capacitor, and chip capacitor being skewed during replacement, thereby ensuring the sealing quality of the chip capacitor and overcoming the shortcomings of the prior art.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] A chip capacitor board changing mechanism based on a thick adhesive plate includes a needle bed conveying device, a separator frame clamping device, a new board clamping device, a new board conveying device, and a flattening device.

[0009] The needle bed conveying device includes a first conveying track and a transfer platform. The transfer platform is horizontally movably mounted on the first conveying track. The transfer platform includes a platform mounting base for placing a thick rubber plate and a perforated plate. The perforated plate is telescopically mounted above the platform mounting base by a spring. Multiple ejector pins are protruding from the upper surface of the platform mounting base. The perforated plate has multiple perforations, with one ejector pin corresponding to one perforation. The perforations are used for the ejector pins to pass through the perforated plate.

[0010] The separator frame clamping device and the new board clamping device are sequentially mounted above the end of the first conveying track along the conveying direction of the transfer platform. The separator frame clamping device is used to clamp the separator frame, and the new board clamping device is used to clamp the empty thick board. Both the clamps of the separator frame clamping device and the clamps of the new board clamping device can move up and down relative to the transfer platform.

[0011] The new board conveying device includes a second conveying track and a support bar. The support bar is horizontally movably installed on both sides of the interior of the second conveying track. The loading end of the second conveying track and the end of the first conveying track are arranged from top to bottom below the clamp of the new board clamping device, and the clamp of the new board clamping device can pass through the conveying surface of the second conveying track.

[0012] The flattening device is located at the end of the second conveying track. The flattening device includes a flattening clamp and a flattening platform arranged opposite each other in the vertical direction. The flattening clamp is located above the second conveying track and can move up and down relative to the second conveying track. The flattening clamp is used to clamp the thick rubber sheet, and the flattening platform is located below the second conveying track.

[0013] Preferably, the needle bed conveying device further includes a photoelectric sensor, which is mounted on top of the first conveying track and located between the separator frame clamping device and the new board clamping device;

[0014] The photoelectric sensor is used to detect whether there are residual chip capacitors on the upper surface of the thick plastic plate.

[0015] Preferably, it also includes a first brush, which is located between the photoelectric sensor and the new board clamping device;

[0016] The first brush is used to clean the upper surface of the thick rubber sheet.

[0017] Preferably, it also includes a second brush, which is installed at the bottom of the second conveying track and is located between the new plate clamping device and the flattening device;

[0018] The second brush is used to clean the lower surface of the thick rubber sheet.

[0019] Preferably, the first conveying track and the second conveying track are perpendicular to each other.

[0020] Preferably, the photoelectric sensor is a through-beam photoelectric sensor.

[0021] The technical solution provided by this utility model can include the following beneficial effects:

[0022] This solution improves the reversing process of surface mount capacitors from "same board reversing" to "board reversing" to avoid problems such as exposed ceramic edges, cracks at the top of the capacitor, and the capacitor being bent due to pressure during reversing, thereby ensuring the sealing quality of surface mount capacitors. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a chip capacitor switching mechanism based on a thick adhesive plate according to this utility model.

[0024] Figure 2 This is a schematic diagram of another perspective of a chip capacitor replacement mechanism based on a thick adhesive plate in this utility model.

[0025] Figure 3 This is a partial structural schematic diagram of a chip capacitor replacement mechanism based on a thick adhesive plate according to this utility model.

[0026] Figure 4 This is a partial structural schematic diagram of a chip capacitor replacement mechanism based on a thick adhesive plate according to this utility model.

[0027] Figure 5 This is a schematic diagram of the flattening device in this utility model.

[0028] Figure 6 This is a schematic diagram of a chip capacitor replacement mechanism based on a thick adhesive plate, according to this utility model.

[0029] Among them: needle bed conveying device 71, first conveying track 711, transfer platform 712, platform mounting base 7121, mesh plate 7122, photoelectric sensor 713, separator frame clamping device 72, new board clamping device 73, new board conveying device 74, second conveying track 741, support bar 742, flattening device 75, flattening fixture 751, flattening platform 752, first brush 76, second brush 77;

[0030] Surface mount capacitor 91, thick plastic board 93, separator frame 94. Detailed Implementation

[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0032] This technical solution provides a chip capacitor board changing mechanism based on a thick adhesive plate, including a needle bed conveying device 71, a separator frame clamping device 72, a new board clamping device 73, a new board conveying device 74, and a flattening device 75.

[0033] The needle bed conveying device 71 includes a first conveying track 711 and a transfer platform 712. The transfer platform 712 is horizontally movably mounted on the first conveying track 711. The transfer platform 712 includes a platform mounting base 7121 for placing a thick rubber plate 93 and a perforated plate 7122. The perforated plate 7122 is spring-loaded and telescopically mounted above the platform mounting base 7121. Multiple ejector pins are protruding from the upper surface of the platform mounting base 7121. The surface of the perforated plate 7122 has multiple perforations, and one ejector pin corresponds to one perforation. The perforations are used for the ejector pins to pass through the perforated plate 7122.

[0034] The separator frame clamping device 72 and the new board clamping device 73 are sequentially mounted above the end of the first conveying track 711 along the conveying direction of the transfer platform 712. The separator frame clamping device 72 is used to clamp the separator frame 94, and the new board clamping device 73 is used to clamp the empty thick plastic board 93. Both the clamps of the separator frame clamping device 72 and the clamps of the new board clamping device 73 can move up and down relative to the transfer platform 712.

[0035] The new board conveying device 74 includes a second conveying track 741 and a support bar 742. The support bar 742 is horizontally movably installed on both sides inside the second conveying track 741. The loading end of the second conveying track 741 and the end of the first conveying track 711 are arranged from top to bottom below the clamp of the new board clamping device 73, and the clamp of the new board clamping device 73 can pass through the conveying surface of the second conveying track 741.

[0036] The flattening device 75 is disposed at the end of the second conveying track 741. The flattening device 75 includes a flattening clamp 751 and a flattening platform 752 arranged opposite each other in the vertical direction. The flattening clamp 751 is located above the second conveying track 741 and can move up and down relative to the second conveying track 741. The flattening clamp 751 is used to clamp the thick rubber plate 93. The flattening platform 752 is located below the second conveying track 741.

[0037] In the existing technology, the face-changing process of surface mount capacitors is completed on the same thick plastic plate. That is, a bed of needles is used to press the sealed end of the surface mount capacitor directly down from above the hole of the thick plastic plate, so that the sealed end of the surface mount capacitor passes through the center of the hole of the thick plastic plate and reaches the bottom of the thick plastic plate, and the unsealed end of the surface mount capacitor protrudes from the lower surface of the thick plastic plate.

[0038] The above-mentioned face-changing steps have the following quality problems: 1. The hole depth of the thick rubber board is 8.9mm. Due to the characteristic that "within the same hole diameter, the elasticity and clamping force of the rubber in the center is greater than that at the edge", the sealed end of the chip capacitor is pressed directly down from above the hole of the thick rubber board, and pressed out through the center of the rubber to the lower surface of the thick rubber board. This causes excessive friction on the side of the sealed end, which is prone to causing the chip capacitor's edge to expose the porcelain; 2. The diameter of the needle bed is generally smaller than the diameter of the hole in the thick rubber board. When the needle tip contacts and presses down on the sealed end of the chip capacitor, it passes from above the hole through the center of the board to below the hole. Due to the high friction force in the center hole, the sealed end is prone to indentation damage.

[0039] Therefore, in order to reduce damage to the sealed ends of surface mount capacitors during the resurfacing process, this technical solution proposes a resurfacing mechanism, such as... Figure 1-5 As shown, the downward pressure of the clamps in the new board clamping device 73 causes the pins of the transfer platform 712 to penetrate into the hole of the thick plastic plate 93 (hereinafter referred to as the "old board") where the chip capacitor 91 is implanted, and directly acts on the unsealed end of the chip capacitor 91. After the downward pressure is reset, the sealed end of the chip capacitor 91, which protrudes from the upper surface of the old board, is accommodated in the hole of the hollow thick plastic plate 93 (hereinafter referred to as the "new board") in the new board clamping device 73, and the unsealed end protrudes from the lower surface of the new board, thereby completing the flipping step of the chip capacitor 91. Figure 6As shown. This solution improves the face-changing process of the surface mount capacitor 91 from "face-changing on the same board" to "board changing", so as to avoid problems such as exposed ceramic at the edges of the surface mount capacitor, cracks at the top, and the surface mount capacitor being pressed crooked during face-changing, thereby ensuring the sealing quality of the surface mount capacitor.

[0040] Furthermore, this solution also adds a flattening device 75 after the board replacement step to achieve flushing of the unsealed ends, so as to further ensure the sealing quality of the chip capacitors.

[0041] Specifically, the plate-changing process in the plate-changing mechanism of this solution includes the following steps:

[0042] (1) Place the old board to be replaced on the top of the transfer platform 712. At this time, the sealed end of the chip capacitor 91 protrudes from the upper surface of the old board.

[0043] (2) Use the transfer platform 712 to move the old board to the bottom of the separator frame clamping device 72, and use the clamps of the separator frame clamping device 72 to place the separator frame 94 on top of the old board.

[0044] (3) Use the transfer platform 712 to move the old board to the bottom of the new board clamping device 73. At the same time, the clamp of the new board clamping device 73 presses down and makes the new board held by the clamp abut against the partition frame 94 until the pin of the transfer platform 712 transfers the chip capacitor 91 to the new board and the unsealed end of the chip capacitor 91 protrudes from the lower surface of the new board.

[0045] (4) The new board is placed on the support bar 742 of the new board conveying device 74 using the clamp of the new board clamping device 73. The support bar 742 conveys the new board to the flattening device 75. The flattening clamp 751 clamps the new board and presses it down so that the unsealed end protruding from the lower surface of the new board abuts against the flattening platform 752, thus achieving the flattening of the end.

[0046] Meanwhile, the transfer platform 712 is used to move the separator frame 94 to below the separator frame clamping device 72, and the separator frame clamping device 72 is used to retrieve it; then the transfer platform 712 is used to move the empty old board to below the new board clamping device 73, and the new board clamping device 73 is used to retrieve it.

[0047] (5) The transfer platform 712 moves to the loading end of the first conveying track 711 and waits for the next old board to be replaced.

[0048] It should be noted that the clamps of the separator frame clamping device 72, the clamps of the new plate clamping device 73, and the pressure equalizing clamp 751 in this solution are conventional clamps in the art. All of the above clamps can clamp and release the clamped object. The specific structure of the clamps will not be described in detail here.

[0049] Furthermore, the needle bed conveying device 71 also includes a photoelectric sensor 713, which is mounted on top of the first conveying track 711 and is located between the separator frame clamping device 72 and the new board clamping device 73.

[0050] The photoelectric sensor 713 is used to detect whether there are residual chip capacitors 91 on the upper surface of the thick plastic plate 93.

[0051] This can be used to detect whether there are bad pins on the transfer platform 712, so as to perform timely maintenance.

[0052] To further explain, it also includes a first brush 76, which is located between the photoelectric sensor 713 and the new board clamping device 73;

[0053] The first brush 76 is used to clean the upper surface of the thick plastic sheet 93.

[0054] Furthermore, it also includes a second brush 77, which is installed at the bottom of the second conveying track 741 and is located between the new plate clamping device 73 and the flattening device 75.

[0055] The second brush 77 is used to clean the lower surface of the thick rubber plate 93.

[0056] To further ensure the smooth progress of the board replacement and flattening steps, this solution also adds a first brush 76 and a second brush 77 to the board replacement mechanism, thereby preventing abnormal products or impurities remaining on the upper and lower surfaces of the thick adhesive plate 93 from affecting the board replacement and flattening of the chip capacitors.

[0057] To further explain, the first conveying track 711 and the second conveying track 741 are perpendicular to each other.

[0058] This allows for a more compact structure in the plate-changing mechanism.

[0059] To further clarify, the photoelectric sensor 713 is a through-beam photoelectric sensor.

[0060] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0061] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0062] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0063] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0064] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0065] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0066] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A thick-gel-based patch capacitor plate changing mechanism, characterized by: It includes a needle bed conveying device, a separator frame clamping device, a new board clamping device, a new board conveying device, and a flattening device; The needle bed conveying device includes a first conveying track and a transfer platform. The transfer platform is horizontally movably mounted on the first conveying track. The transfer platform includes a platform mounting base for placing a thick rubber plate and a perforated plate. The perforated plate is telescopically mounted above the platform mounting base by a spring. Multiple ejector pins are protruding from the upper surface of the platform mounting base. The perforated plate has multiple perforations, with one ejector pin corresponding to one perforation. The perforations are used for the ejector pins to pass through the perforated plate. The separator frame clamping device and the new board clamping device are sequentially mounted above the end of the first conveying track along the conveying direction of the transfer platform. The separator frame clamping device is used to clamp the separator frame, and the new board clamping device is used to clamp the empty thick board. Both the clamps of the separator frame clamping device and the clamps of the new board clamping device can move up and down relative to the transfer platform. The new board conveying device includes a second conveying track and a support bar. The support bar is horizontally movably installed on both sides of the interior of the second conveying track. The loading end of the second conveying track and the end of the first conveying track are arranged from top to bottom below the clamp of the new board clamping device, and the clamp of the new board clamping device can pass through the conveying surface of the second conveying track. The flattening device is located at the end of the second conveying track. The flattening device includes a flattening clamp and a flattening platform arranged opposite each other in the vertical direction. The flattening clamp is located above the second conveying track and can move up and down relative to the second conveying track. The flattening clamp is used to clamp the thick rubber sheet, and the flattening platform is located below the second conveying track.

2. The thick-gel-based patch capacitor plate changing mechanism according to claim 1, characterized in that: The needle bed conveying device also includes a photoelectric sensor, which is mounted on top of the first conveying track and located between the separator frame clamping device and the new board clamping device. The photoelectric sensor is used to detect whether there are residual chip capacitors on the upper surface of the thick plastic plate.

3. The thick-gel-based patch capacitor plate changing mechanism according to claim 2, characterized in that: It also includes a first brush, which is located between the photoelectric sensor and the new board clamping device; The first brush is used to clean the upper surface of the thick rubber sheet.

4. The thick-gel-based patch capacitor plate changing mechanism according to claim 1, characterized in that: It also includes a second brush, which is installed at the bottom of the second conveying track and is located between the new plate clamping device and the flattening device; The second brush is used to clean the lower surface of the thick rubber sheet.

5. The thick-gel-based patch capacitor plate changing mechanism according to claim 1, characterized in that: The first conveying track and the second conveying track are perpendicular to each other.

6. The thick-gel-based patch capacitor plate changing mechanism according to claim 2, characterized in that: The photoelectric sensor is a through-beam photoelectric sensor.

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