Chip capacitor press-in mechanism based on thick rubber plate

Abstract

The utility model discloses a chip capacitor press-in mechanism based on a thick rubber plate. The chip capacitor press-in mechanism comprises a detection conveying device, a first cleaning device, a detection device, a press-in conveying device and a needle bed press-in device, the detection conveying device and the press-in conveying device are sequentially connected end to end, the press-in conveying device moves up and down relative to the detection conveying device, and the needle bed press-in device is located in the press-in conveying device; the first cleaning device and the detection device are sequentially arranged on the detection conveying device in the conveying direction of the detection conveying device. According to the scheme, firstly, the upper surface of the assembly is cleaned through the first cleaning device, so that products which are not implanted into the guide-in hole and / or products which are obliquely inserted into the guide-in hole on the surface of the guide-in plate are removed; and then whether foreign matters exist on the upper surface of the assembly is detected through the detection device, so that the subsequent press-in process is ensured to be smoothly carried out, and the conditions of product deformation, damaged needle of a needle bed, blockage of a guide-in hole / plate hole, damaged plate of a guide-in plate / thick rubber plate and the like can be effectively avoided.

Description

Technical Field

[0001] This utility model relates to the technical field of chip capacitor production equipment, and in particular to a chip capacitor pressing mechanism based on a thick adhesive plate. Background Technology

[0002] Currently, fully automated end-sealing machines / production lines for surface mount capacitors typically use a stencil as the carrier for transferring the capacitors. Specifically, as detailed in Chinese Utility Model Patent CN218849426U, the end-sealing process involves first applying an adhesive film to one side of the stencil to seal one end of the mesh. After the film is smoothly adhered, the surface mount capacitors are inserted into the mesh, and the adhesive film adheres hundreds of miniature capacitors to the stencil, preventing them from falling off. Then, the other end of the capacitors without adhesive film is dipped in resin for end-sealing. During this insertion process, the ends of the surface mount capacitors are aligned by the adhesive film. However, due to potential manufacturing tolerances (such as varying lengths) in the surface mount capacitors themselves, the ends to be sealed within the same stencil are difficult to align perfectly after insertion, resulting in poor consistency in the resin dipping process and significantly affecting the end-sealing quality.

[0003] Therefore, to ensure the sealing quality of surface mount capacitors, some manufacturers have begun to use thick plastic plates instead of stencils as the transport carrier for surface mount capacitors. The thick plastic plate is a carrier that fixes the surface mount capacitor using silicone clamps. Therefore, to successfully implant the surface mount capacitor into the holes of the thick plastic plate, a guide plate needs to be placed on top of the thick plastic plate. First, the surface mount capacitor is implanted into the guide hole of the guide plate by vibration. Then, a bed of needles presses the surface mount capacitor located in the guide plate into the hole of the thick plastic plate, thus completing the implantation process of the surface mount capacitor into the thick plastic plate.

[0004] During the capping process of surface mount capacitors, the step of pressing the capacitors located in the guide plate into the holes of the thick adhesive plate using a bed of needles often requires multiple manual checks and interventions. This is because the bed of needles is a mechanical, rigid pressing action driven by a motor. If the surface mount capacitors located in the guide plate are tilted at their implantation position, or even fail to implant and roll and remain on the surface of the guide plate, the pressing process may lead to product deformation, broken needles in the bed of needles, blockage of the guide holes / plate holes, and damage to the guide plate / thick adhesive plate. Utility Model Content

[0005] The purpose of this invention is to propose a chip capacitor pressing mechanism based on a thick adhesive plate, which can effectively avoid product deformation, broken needles in the needle bed, blockage of the inlet hole / plate hole, and broken inlet plate / thick adhesive plate, thereby overcoming the shortcomings of the prior art.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A chip capacitor pressing mechanism based on a thick adhesive plate includes a detection and conveying device, a first cleaning device, a detection device, a pressing and conveying device, and a needle bed pressing device.

[0008] The detection conveying device and the pressing conveying device are connected end to end in sequence, and the pressing conveying device moves up and down relative to the detection conveying device. The needle bed pressing device is located inside the pressing conveying device.

[0009] The first cleaning device and the detection device are sequentially arranged on the detection conveying device along the conveying direction of the detection conveying device. The detection conveying device is used to convey the assembly. The first cleaning device is used to clean the upper surface of the assembly. The detection device is used to detect whether there are foreign objects on the upper surface of the assembly placed on the detection conveying device. The assembly includes a thick adhesive plate and a guide plate that are attached from bottom to top. The guide hole of the guide plate accommodates a chip capacitor.

[0010] The needle bed pressing device includes an upper platform and a lower platform arranged opposite each other in the vertical direction, with the upper platform located above the lower platform. The upper platform moves up and down relative to the lower platform, and the holding surface of the lower platform is within the vertical movement range of the pressing and conveying device. The upper platform is used to press the chip capacitors located in the guide plate in the assembly into the plate hole of the thick adhesive plate.

[0011] Preferably, the detection device includes a detection platform and a displacement detection probe;

[0012] The detection platform is located above the detection conveying device, and the detection platform can move up and down relative to the detection conveying device;

[0013] Multiple displacement detection probes are provided and are embedded inside the detection platform. The displacement detection probes are used to detect whether there are foreign objects on the upper surface of the assembly placed on the detection and conveying device.

[0014] Preferably, it further includes a detection limiting block, and the detection limiting block is located on the front side of the detection device;

[0015] The detection limiting block is movably installed inside the detection conveying device, and the detection limiting block can extend and retract from the conveying surface of the detection conveying device.

[0016] Preferably, it further includes a second cleaning device, which is located between the detection conveying device and the pressing conveying device, and the cleaning surface of the second cleaning device is flush with the conveying surface of the detection conveying device;

[0017] The second cleaning device is used to clean the lower surface of the assembly.

[0018] Preferably, the first cleaning device includes a first roller brush and a first receiving tray arranged vertically opposite each other, with the first roller brush located above the detection conveying device and the first receiving tray located below the detection conveying device;

[0019] The second cleaning device includes a second roller brush and a second receiving tray arranged vertically opposite each other, and the cleaning surface of the second roller brush is flush with the conveying surface of the detection conveying device, and the second receiving tray is located at the bottom of the second roller brush.

[0020] Preferably, it further includes a pressing-in limiting block, and the pressing-in limiting block is located on the front side of the needle bed pressing device;

[0021] The pressing limit block is movably installed inside the pressing conveying device, and the pressing limit block can extend and retract on the conveying surface of the pressing conveying device.

[0022] Preferably, the upper platform includes a platform mounting plate and a mesh plate, the mesh plate being telescopically mounted below the platform mounting plate by a spring; the lower surface of the platform mounting plate is provided with multiple pressure pins, the mesh plate has multiple through holes, and one pressure pin corresponds to one through hole, the through holes being used for the pressure pins to pass through the mesh plate.

[0023] The technical solution provided by this utility model can include the following beneficial effects:

[0024] This solution first cleans the upper surface of the assembly using a first cleaning device to remove products not inserted into the inlet holes and / or products inserted at an angle into the inlet holes from the surface of the inlet plate. Then, a detection device is used to detect whether there are foreign objects on the upper surface of the assembly to ensure the smooth progress of the subsequent pressing process. This effectively avoids product deformation, broken needles on the needle bed, blockage of inlet holes / plate holes, and broken inlet plates / thick plastic plates. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the guide plate and the thick adhesive plate in this utility model.

[0026] Figure 2 This is a side view of a chip capacitor pressing mechanism based on a thick adhesive plate according to this utility model.

[0027] Figure 3 This is a schematic diagram of the structure of a chip capacitor pressing mechanism based on a thick adhesive plate according to this utility model.

[0028] Figure 4This is a partial structural schematic diagram of a chip capacitor pressing mechanism based on a thick adhesive plate according to this utility model.

[0029] Figure 5 This is a partial structural schematic diagram of a chip capacitor pressing mechanism based on a thick adhesive plate according to this utility model.

[0030] Among them: detection conveying device 31, first cleaning device 32, first roller brush 321, first receiving tray 322, detection device 33, detection platform 331, pressing conveying device 34, needle bed pressing device 35, upper platform 351, platform mounting plate 3511, mesh plate 3512, lower platform 352, detection limiting block 36, second cleaning device 37, second roller brush 371, second receiving tray 372, pressing limiting block 38;

[0031] Import plate 92, thick glue plate 93. Detailed Implementation

[0032] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0033] This technical solution provides a chip capacitor pressing mechanism based on a thick adhesive plate, including a detection and conveying device 31, a first cleaning device 32, a detection device 33, a pressing and conveying device 34, and a needle bed pressing device 35.

[0034] The detection conveying device 31 and the pressing conveying device 34 are connected end to end in sequence, and the pressing conveying device 34 moves up and down relative to the detection conveying device 31. The needle bed pressing device 35 is located inside the pressing conveying device 34.

[0035] The first cleaning device 32 and the detection device 33 are sequentially arranged on the detection conveying device 31 along the conveying direction of the detection conveying device 31. The detection conveying device 31 is used to convey the assembly. The first cleaning device 32 is used to clean the upper surface of the assembly. The detection device 33 is used to detect whether there are foreign objects on the upper surface of the assembly placed on the detection conveying device 31. The assembly includes a thick adhesive plate 93 and an inlet plate 92 that are attached from bottom to top. The inlet hole of the inlet plate 92 accommodates a chip capacitor.

[0036] The needle bed pressing device 35 includes an upper platform 351 and a lower platform 352 arranged opposite each other in the vertical direction, with the upper platform 351 located above the lower platform 352. The upper platform 351 moves up and down relative to the lower platform 352, and the holding surface of the lower platform 352 is located within the vertical movement range of the pressing and conveying device 34. The upper platform 351 is used to press the chip capacitor located in the guide plate 92 in the assembly into the plate hole of the thick adhesive plate 93.

[0037] During the capping process of surface mount capacitors, the process of pressing the surface mount capacitor located in the guide plate 92 into the hole of the thick adhesive plate 93 using a bed of needles often requires multiple manual checks and interventions. This is because the bed of needles presses in a mechanical, rigid manner driven by a motor. If the surface mount capacitor located in the guide plate 92 is tilted at its implantation position, or even fails to implant and rolls and remains on the surface of the guide plate 92, the pressing process may lead to product deformation, broken needles in the bed of needles, blockage of the guide hole / plate hole, and damage to the guide plate / thick adhesive plate.

[0038] To avoid the above situation, this technical solution proposes a pressing mechanism, such as... Figure 2-5 As shown, the assembly includes a conveying device 31, a first cleaning device 32, a detection device 33, a pressing conveying device 34, and a needle bed pressing device 35. Before pressing the chip capacitors located in the guide plate 92 into the holes of the thick adhesive plate 93 using the needle bed pressing device 35, this solution first cleans the upper surface of the assembly using the first cleaning device 32 to remove products not inserted into the guide holes and / or products tilted into the guide holes from the surface of the guide plate 92; then, the detection device 33 detects whether there are foreign objects on the upper surface of the assembly to ensure the smooth progress of the subsequent pressing process.

[0039] Specifically, the pressing process of the pressing mechanism in this solution includes the following steps:

[0040] (1) The assembly formed by combining the guide plate 92 and the thick rubber plate 93 using the detection and conveying device 31 (e.g. Figure 1 (As shown) is conveyed to the first cleaning device 32, and the first cleaning device 32 is used to clean the upper surface of the assembly;

[0041] (2) The assembly is transported to the bottom of the detection device 33 using the detection conveying device 31, and the detection device 33 detects whether there are foreign objects on the upper surface of the assembly;

[0042] (3) The assembly is continued to be conveyed forward by the detection conveying device 31, and the conveying surface of the pressing conveying device 34 is moved to be flush with the conveying surface of the detection conveying device 31, and the assembly is received by the pressing conveying device 34.

[0043] (4) The assembly is transported to the top of the lower platform 352 by the pressing conveyor 34, and then the pressing conveyor 34 moves downward so that the assembly located on the pressing conveyor 34 is placed on the holding surface of the lower platform 352.

[0044] (5) The upper platform 351 moves downward relative to the lower platform 352, and the chip capacitor located in the guide plate 92 in the assembly is pressed into the plate hole of the thick adhesive plate 93 through the upper platform 351.

[0045] (6) After pressing is completed, the upper platform 351 is reset upward, and the pressing conveyor 34 is reset upward and the assembly is removed from the holding surface of the lower platform 352. Finally, the pressing conveyor 34 transports the assembly to the next process.

[0046] It should be noted that the detection conveying device 31 and the pressing conveying device 34 used in this solution are conventional conveying devices in the art, and can be conveyor belts, which are not limited here.

[0047] To further explain, the detection device 33 includes a detection platform 331 and a displacement detection probe;

[0048] The detection platform 331 is located above the detection conveying device 31, and the detection platform 331 can move up and down relative to the detection conveying device 31;

[0049] Multiple displacement detection probes are provided, and the multiple displacement detection probes are embedded in the inside of the detection platform 331. The displacement detection probes are used to detect whether there are foreign objects on the upper surface of the assembly placed on the detection conveying device 31.

[0050] In this embodiment, the displacement detection probe (not shown in the figure) is used to detect whether there are products or other impurities on the surface of the inlet plate 92. The data fed back by the displacement detection probe can detect problems in time and alarm in time when problems occur, so that the relevant personnel can handle them. In the subsequent product pressing, it can effectively reduce the probability of product deformation, broken needles in the needle bed, blockage of inlet holes / plate holes, and broken inlet plates / thick plastic plates.

[0051] It should be noted that the displacement detection probe used in this solution is a commonly used sensor in this field, specifically a capacitive displacement sensor, which is not limited here.

[0052] Furthermore, it also includes a detection limiting block 36, and the detection limiting block 36 is located on the front side of the detection device 33;

[0053] The detection limiting block 36 is movably installed inside the detection conveying device 31, and the detection limiting block 36 can extend and retract on the conveying surface of the detection conveying device 31.

[0054] In a preferred embodiment of this technical solution, by setting the detection limit block 36, the positioning and conveying of the assembly can be achieved without stopping the detection conveying device 31, thereby avoiding the frequent start and stop of the detection conveying device 31, which would have adverse effects on mechanical performance, service life, energy consumption and maintenance costs.

[0055] Furthermore, it also includes a second cleaning device 37, which is located between the detection conveying device 31 and the pressing conveying device 34, and the cleaning surface of the second cleaning device 37 is flush with the conveying surface of the detection conveying device 31.

[0056] The second cleaning device 37 is used to clean the lower surface of the assembly.

[0057] As a preferred embodiment of this technical solution, a second cleaning device 37 for cleaning the lower surface of the assembly is added between the detection conveying device 31 and the pressing conveying device 34 to further ensure the smooth progress of the pressing step and further avoid product deformation, broken needles in the needle bed, blockage of the inlet hole / plate hole, and broken inlet plate / thick glue plate.

[0058] To further explain, the first cleaning device 32 includes a first roller brush 321 and a first receiving tray 322 arranged vertically opposite each other, with the first roller brush 321 located above the detection conveying device 31 and the first receiving tray 322 located below the detection conveying device 31.

[0059] The second cleaning device 37 includes a second roller brush 371 and a second receiving tray 372 arranged vertically opposite each other, and the cleaning surface of the second roller brush 371 is flush with the conveying surface of the detection conveying device 31, and the second receiving tray 372 is located at the bottom of the second roller brush 371.

[0060] This facilitates the effective cleaning and collection of the product, thereby avoiding waste.

[0061] To further explain, it also includes a pressing limit block 38, and the pressing limit block 38 is located on the front side of the needle bed pressing device 35;

[0062] The pressing limit block 38 is movably installed inside the pressing conveying device 34, and the pressing limit block 38 can extend and retract on the conveying surface of the pressing conveying device 34.

[0063] In another preferred embodiment of this technical solution, by setting the pressing limit block 38, the positioning and conveying of the assembly can be realized without stopping the pressing conveying device 34, thereby avoiding the frequent start and stop of the pressing conveying device 34, which has adverse effects on mechanical performance, service life, energy consumption and maintenance costs.

[0064] To further explain, the upper platform 351 includes a platform mounting plate 3511 and a mesh plate 3512. The mesh plate 3512 is installed below the platform mounting plate 3511 by means of a spring. The lower surface of the platform mounting plate 3511 is provided with multiple pressure pins. The surface of the mesh plate 3512 is provided with multiple through holes, and one pressure pin corresponds to one through hole. The through holes are used for the pressure pins to pass through the mesh plate 3512.

[0065] Specifically, the upper platform 351 of this solution includes a platform mounting plate 3511 for mounting the pressure pin (not shown in the figure) and a mesh plate 3512 for the pressure pin to pass through. The upper platform 351 moves downward relative to the lower platform 352, and when the upper platform 351 and the assembly are in contact, the platform mounting plate 3511 compresses the spring and continues to move downward. At this time, the pressure pin can pass through the through hole and exit the mesh plate 3512, and press the chip capacitor implanted in the guide plate 92 into the plate hole of the thick adhesive plate 93, thereby realizing the pressing process.

[0066] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0067] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0068] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0069] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0070] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0071] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0072] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A chip capacitor pressing mechanism based on a thick adhesive plate, characterized in that: It includes a detection conveying device, a first cleaning device, a detection device, a pressing conveying device, and a needle bed pressing device; The detection conveying device and the pressing conveying device are connected end to end in sequence, and the pressing conveying device moves up and down relative to the detection conveying device. The needle bed pressing device is located inside the pressing conveying device. The first cleaning device and the detection device are sequentially arranged on the detection conveying device along the conveying direction of the detection conveying device. The detection conveying device is used to convey the assembly. The first cleaning device is used to clean the upper surface of the assembly. The detection device is used to detect whether there are foreign objects on the upper surface of the assembly placed on the detection conveying device. The assembly includes a thick adhesive plate and a guide plate that are attached from bottom to top. The guide hole of the guide plate accommodates a chip capacitor. The needle bed pressing device includes an upper platform and a lower platform arranged opposite each other in the vertical direction, with the upper platform located above the lower platform. The upper platform moves up and down relative to the lower platform, and the holding surface of the lower platform is within the vertical movement range of the pressing and conveying device. The upper platform is used to press the chip capacitor located in the guide plate in the assembly into the plate hole of the thick adhesive plate.

2. The chip capacitor pressing mechanism based on a thick adhesive plate according to claim 1, characterized in that: The detection device includes a detection platform and a displacement detection probe; The detection platform is located above the detection conveying device, and the detection platform can move up and down relative to the detection conveying device; Multiple displacement detection probes are provided, and the multiple displacement detection probes are embedded in the inside of the detection platform. The displacement detection probes are used to detect whether there are foreign objects on the upper surface of the assembly placed on the detection and conveying device.

3. The chip capacitor pressing mechanism based on a thick adhesive plate according to claim 1, characterized in that: It also includes a detection limiting block, and the detection limiting block is located on the front side of the detection device; The detection limiting block is movably installed inside the detection conveying device, and the detection limiting block can extend and retract from the conveying surface of the detection conveying device.

4. The chip capacitor pressing mechanism based on a thick adhesive plate according to claim 1, characterized in that: It also includes a second cleaning device, which is located between the detection conveying device and the pressing conveying device, and the cleaning surface of the second cleaning device is flush with the conveying surface of the detection conveying device; The second cleaning device is used to clean the lower surface of the assembly.

5. The chip capacitor pressing mechanism based on a thick adhesive plate according to claim 4, characterized in that: The first cleaning device includes a first roller brush and a first receiving tray arranged vertically opposite each other, with the first roller brush located above the detection conveying device and the first receiving tray located below the detection conveying device; The second cleaning device includes a second roller brush and a second receiving tray arranged vertically opposite each other, and the cleaning surface of the second roller brush is flush with the conveying surface of the detection conveying device, and the second receiving tray is located at the bottom of the second roller brush.

6. The chip capacitor pressing mechanism based on a thick adhesive plate according to claim 1, characterized in that: It also includes a pressing-in limiting block, and the pressing-in limiting block is located on the front side of the needle bed pressing device; The pressing limit block is movably installed inside the pressing conveying device, and the pressing limit block can extend and retract on the conveying surface of the pressing conveying device.

7. The chip capacitor pressing mechanism based on a thick adhesive plate according to claim 1, characterized in that: The upper platform includes a platform mounting plate and a mesh plate. The mesh plate is installed below the platform mounting plate by means of a spring. Multiple pressure pins are protruding from the lower surface of the platform mounting plate. Multiple through holes are opened on the surface of the mesh plate, and one pressure pin corresponds to one through hole. The through holes are used for the pressure pins to pass through the mesh plate.

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