Wire harness-free signal integration transmission structure and connector applying same

Abstract

The utility model discloses a signal integration transmission structure without a wire harness and a connector using the same. The connector comprises a signal integration transmission structure without a wire harness. A PCBA board of the signal integration transmission structure is installed in a cavity surrounded by a front installation board and a rear installation board. The signal output plug shaft is sleeved on the upper through hole of the front mounting plate, and the rear end of the connecting pin is connected with the PCBA plate; the rear end of the low-voltage terminal is connected with the PCBA board through a switching patch; the high-voltage interlocking part is connected with the rear wall of the PCBA board; a patch temperature sensor of the temperature detection part is welded to the rear side of the PCBA board and is attached to the output end of a heat-conducting fin, and an acquisition end ring of the heat-conducting fin is attached to the rear end of a power terminal in a sleeving manner; the PCBA board integrates collected temperature signals, high-voltage interlocking signals and low-voltage signals and outputs the signals to the control unit through the signal output plug. The utility model has the advantages of simple structure, convenient assembly and maintenance, convenient use, and stable and reliable low-voltage signal output.

Description

Technical Field

[0001] This utility model relates to the field of connectors, and in particular to a wireless beam signal integrated transmission structure and a connector using the same. Background Technology

[0002] The development of new energy electric vehicles is currently rapid. Electric vehicles typically use DC or AC charging sockets. The low-voltage signals of these sockets include high-voltage interlock signals, temperature detection signals from the power terminals, and signals from the low-voltage terminals. Currently, all types of low-voltage signal transmission use low-voltage wiring harnesses exiting from the rear. The drawbacks are twofold: firstly, the transmission of these low-voltage signals requires complex wiring structures and numerous sealing components for fixation, resulting in complex assembly, high labor costs, low assembly efficiency, and high costs; secondly, replacing the external low-voltage cables requires complete disassembly and reassembly of the charging socket, making disassembly and maintenance inconvenient. Utility Model Content

[0003] To address one or more of the aforementioned problems, this utility model provides a wireless beam signal integrated transmission structure and a connector using the same.

[0004] According to one aspect of the present invention, the wireless beam signal integrated transmission structure includes: a PCBA board, a signal output plug, several low-voltage terminals, an adapter patch, a high-voltage interlocking part, and a temperature detection part.

[0005] The PCBA board is installed in the cavity surrounded by the front mounting plate and the rear mounting plate.

[0006] The middle section of the output socket of the signal output plug is sleeved in the upper hole of the front mounting plate, and several of its connecting pins are connected to the PCBA board at the rear end.

[0007] The low-voltage terminal is fitted onto the low-voltage tube of the front mounting plate, and its rear end is connected to the PCBA board via an adapter patch.

[0008] The high-voltage interlock pin of the high-voltage interlock section is connected to the rear wall of the PCBA board;

[0009] The temperature detection unit includes a surface-mount temperature sensor and a heat-conducting sheet. The surface-mount temperature sensor is soldered to the back of the PCBA board and faces the output end of the heat-conducting sheet. The acquisition end of the heat-conducting sheet is wrapped around and connected to the rear end of the power terminal.

[0010] The PCBA board integrates and collects temperature signals, high-voltage interlock signals, and low-voltage signals, and outputs them to the control unit via the signal output connector.

[0011] This wireless signal integrated transmission structure integrates temperature signals, high-voltage interlock signals, and low-voltage signals through a PCBA board, and transmits signals wirelessly via a signal output plug at the top. Various low-voltage signal transmissions can be achieved simply by plugging and unplugging. Its advantages are: First, this integrated signal transmission structure eliminates the need for various low-voltage cables, copper busbars, and seals used for signal output, occupying less space, simplifying the assembly structure, reducing labor time, increasing assembly efficiency, and lowering assembly and component costs; Second, the plug-in structure simplifies the assembly sequence, facilitating assembly and maintenance; Third, the connection pins of the signal output plug are effectively protected in the output socket, preventing damage, and ensuring high positional accuracy, thus guaranteeing the stability and reliability of signal transmission.

[0012] In some implementations, the signal output plug includes an output socket and a plurality of connecting pins. The middle section of the connecting pin is integrally injection molded and connected to the output socket. The rear end of the connecting pin extends out of the rear wall of the output socket and is connected to the PCBA board. The front end of the connecting pin is exposed outside the output socket of the output socket.

[0013] The upper part of the PCBA board has several first connection holes, and the rear foot and rear sleeve are connected to the first connection holes and are welded together.

[0014] In some implementations, a rectangular array at the front end of the output socket is provided with several output jacks, and a rectangular array of several connecting pins is integrally injection molded and connected to the output socket. A rectangular array at the top end of the PCBA board is provided with several first connecting holes.

[0015] In some embodiments, a rectangular groove-shaped sealing groove is concentrically provided on the edge of the upper perforation, and the end face sealing ring is interference-fitted into the sealing groove.

[0016] In some implementations, the adapter patch is a bent copper busbar, one end of which is laser-welded to the rear end of the low-voltage terminal, and the other end is inserted into the second connection hole of the PCBA board and welded together.

[0017] In some embodiments, the high-voltage interlock pin of the high-voltage interlock unit is integrally injection molded to the interlock end seat, and its front end is sleeved and welded to the third joint hole of the PCBA board. The rear end of the high-voltage interlock pin extends out of the interlock end seat and is inserted into the high-voltage interlock socket.

[0018] In some implementations, the PCBA board gap is placed in the receiving groove of the front mounting plate, and the groove wall is provided with a number of clearance grooves, each clearance groove corresponding to the first connecting hole, the second connecting hole and the third connecting hole of the PCBA board.

[0019] In some embodiments, an injection-molded substrate is also attached to the front end of the front mounting plate. The injection-molded substrate has two first through holes for connecting power terminals, several second through holes for connecting adapter patches, a third through hole for connecting low-voltage terminals, and a fourth through hole for connecting interlocking terminals. The third through hole is located on one side of the second through holes.

[0020] The pins of the injection molded substrate are interference fits with the pin holes of the PCBA board.

[0021] In some embodiments, the heat-conducting sheet is integrally injection molded to the injection molding substrate, the sensing end protrudes from the first through hole to connect to the power terminal, the output end is directly opposite the rectangular detection groove of the injection molding substrate and there is an ultra-thin wall layer between the two, and the patch temperature sensor enters the detection groove and the gap between the sensor and the detection groove is bonded together with thermally conductive silicone.

[0022] A connector, comprising any of the aforementioned signal integrated transmission structures, wherein the connector is an AC or DC socket with a connector structure. Its advantages are: the connector eliminates the need for various low-voltage cables, copper busbars, and seals used for signal output, thus occupying less space, simplifying the assembly structure, reducing labor time, increasing assembly efficiency, and lowering assembly and component costs; simultaneously, the plug-in structure facilitates assembly and maintenance, and improves the stability and reliability of signal transmission. Attached Figure Description

[0023] Figure 1 This is a three-dimensional schematic diagram of a wireless beam signal integrated transmission structure according to one embodiment of the present invention.

[0024] Figure 2 for Figure 1 The diagram shows a three-dimensional exploded view of a wireless beam signal integrated transmission structure.

[0025] Figure 3 for Figure 2 A 3D schematic diagram of the PCBA board shown;

[0026] Figure 4 for Figure 2 A three-dimensional schematic diagram of the signal output plug shown;

[0027] Figure 5 for Figure 2 A three-dimensional schematic diagram of the injection-molded substrate shown;

[0028] Figure 6 for Figure 1 The diagram shows a three-dimensional representation of the integrated signal transmission structure mounted on the connector.

[0029] Signal integrated transmission structure 00,

[0030] PCBA board 1, first connecting hole 10, second connecting hole 11, third connecting hole 12, pin hole 13;

[0031] Signal output plug 2, output socket 20, output jack 201, connecting pin 21, rear lead 211, end face sealing ring 22, low-voltage terminal 3, adapter patch 4, injection molded substrate 5, first through hole 51, second through hole 52, third through hole 53, fourth through hole 54, pin 55, rectangular groove 56, detection groove 57.

[0032] High-voltage interlocking part 01, interlocking end seat 8, high-voltage interlocking pin 9;

[0033] Temperature detection unit 02, patch temperature sensor 6, thermal conductive sheet 7, output terminal 71, acquisition terminal ring 72;

[0034] Front mounting plate 03, low-pressure connector 030, upper through hole 031, sealing groove 032, power connector 033;

[0035] Rear mounting plate 04; Power terminal 05. Detailed Implementation

[0036] The present invention will now be described in further detail with reference to the accompanying drawings. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to the directions in the accompanying drawings, while the terms "inner" and "outer" refer to the directions toward or away from the geometric center of a specific component, respectively.

[0037] Figures 1 to 6 The diagram schematically illustrates a wireless beam signal integrated transmission structure according to one embodiment of the present invention. As shown, the wireless beam signal integrated transmission structure includes: a PCBA board 1, a signal output plug 2, several low-voltage terminals 3, an adapter patch 4, a high-voltage interlocking part 01, and a temperature detection part 02;

[0038] PCBA board 1 is installed in the cavity surrounded by front mounting plate 03 and rear mounting plate 04;

[0039] The middle section of the output socket 20 of the signal output plug 2 is sleeved in the upper through hole 031 of the front mounting plate 03, and its several connecting pins 21 are connected to the PCBA board 1 at the rear end.

[0040] The front end of the low-voltage terminal 3 is sleeved on the low-voltage tube 030 of the front mounting plate 03 and its rear end is connected to the PCBA board 1 through the adapter patch 4.

[0041] The high-voltage interlock pin 9 of the high-voltage interlock section 01 is connected to the rear wall of the PCBA board 1;

[0042] The temperature detection unit 02 includes a surface-mount temperature sensor 6 and a heat-conducting sheet 7. The surface-mount temperature sensor 6 is soldered to the back side of the PCBA board 1 and faces the output end 71 of the heat-conducting sheet 7. The acquisition end ring 72 of the heat-conducting sheet 7 is attached to the rear end of the power terminal 05. The front end of the power terminal 05 is preferably attached to the power connector 033 of the front mounting plate 03.

[0043] PCBA board 1 integrates and collects temperature signals, high-voltage interlock signals, and low-voltage signals, and outputs them to the control unit via signal output plug 2.

[0044] This wireless signal integrated transmission structure integrates temperature signals, high-voltage interlock signals, and low-voltage signals through a PCBA board, and transmits signals wirelessly via the signal output plug 2 at the top. Various low-voltage signal transmissions can be achieved simply by plugging and unplugging. Its advantages are: First, this integrated signal transmission structure eliminates the need for various low-voltage cables, copper busbars, and seals used for signal output, occupying less space, simplifying the assembly structure, reducing labor time, and increasing assembly efficiency, while also lowering assembly and component costs; Second, the plug-in structure simplifies the assembly sequence, facilitating assembly and maintenance; Third, the connecting pins 21 of the signal output plug 2 are effectively protected in the output socket 20, preventing damage, and ensuring high positional accuracy, thus guaranteeing the stability and reliability of signal transmission.

[0045] Furthermore, the signal output plug 2 includes an output socket 20 and several connecting pins 21. The middle section of the connecting pins 21 is integrally injection molded and connected to the output socket 20. The rear end pin 211 of the connecting pin 21 extends out of the rear wall of the output socket 20 and connects to the PCBA board 1. The front end surface of the connecting pin 21 protrudes from the output socket 201 of the output socket 20. Its advantages are: this design reduces assembly steps, improves the precision of components, and facilitates insertion applications.

[0046] Preferably, the upper end of the PCBA board 1 is provided with several first connection holes 10, and the rear end pin 211 inserts into the first connection holes 10 and is welded together. The beneficial effect is that this connection structure is robust, ensuring the stability and reliability of signal transmission.

[0047] Preferably, the front end of the output socket 20 has a rectangular array of several output holes 201, and a rectangular array of several connecting pins 21 are integrally injection molded onto the output socket 20. The upper end of the PCBA board 1 has a rectangular array of several first connecting holes 10. The output socket 20 is a rectangular base, and the upper through hole 031 is a rectangular through hole. The output socket 20 is fitted into the upper through hole 031 with gaps. The beneficial effects are: this configuration facilitates modular processing of the product, ensuring the yield rate of parts and the assembly yield rate.

[0048] Preferably, a rectangular groove-shaped sealing groove 032 is concentrically provided on the edge of the upper through hole 031, and the end face sealing ring 22 is interference-fitted into the sealing groove 032. Its beneficial effect is that the end face sealing ring 22 improves signal transmission connection by preventing interference from foreign objects, thus achieving accurate transmission.

[0049] Furthermore, the adapter patch 4 is a bent copper busbar. One end of the adapter patch 4 is laser-welded to the rear end of the low-voltage terminal 3, and the other end is inserted into the second connection hole 11 of the PCBA board 1 and welded together. The beneficial effects are: the connection is firm and the signal transmission accuracy is high.

[0050] Furthermore, the high-voltage interlocking unit 01 includes a high-voltage interlocking socket and a high-voltage interlocking pin 9. The high-voltage interlocking socket is located at the plug portion with power wires. The high-voltage interlocking pin 9 is integrally injection molded to connect to the interlocking end seat 8, and its front end is sleeved and soldered to the third connecting hole 12 of the PCBA board 1. The rear end of the high-voltage interlocking pin 9 extends outward from the interlocking end seat 8 and inserts into the high-voltage interlocking socket. Its beneficial effect is that this arrangement enables good high-voltage interlocking signal transmission.

[0051] Furthermore, the front mounting plate 03 has a receiving groove in the middle, and the PCBA board 1 is placed in the receiving groove with gaps. The groove wall has several clearance grooves, each of which corresponds to the first connecting hole 10, the second connecting hole 11, and the third connecting hole 12 of the PCBA board 1. The beneficial effect is that this setting enables high-precision installation of the PCBA board 1 while reducing the size of the equipment.

[0052] Furthermore, the front mounting plate 03 is also fitted with an injection-molded substrate 5. The injection-molded substrate 5 has two first through holes 51 for connecting power terminals 05, several second through holes 52 for connecting adapter patches 4, a third through hole 53 for connecting low-voltage terminals 3, and a fourth through hole 54 for connecting interlocking end seats 8. Each third through hole 53 is located on one side of a second through hole 52. The pins 55 of the injection-molded substrate 5 are interference-fitted into the pin holes 13 of the PCBA board 1. The beneficial effect is that this arrangement integrates all signal transmission components into one unit.

[0053] Preferably, a rectangular groove 56 for accommodating the middle section of the adapter patch 4 is provided between the third through hole 53 and the second through hole 52, and the second through hole 52 is a rectangular through hole. The advantages of this design are: it facilitates positioning and installation while reducing the thickness of the equipment.

[0054] Furthermore, the heat-conducting sheet 7 is integrally injection molded to the injection-molded substrate 5. The sensing end ring 72 protrudes from the first through hole 51 and is fitted with the power terminal 05. The output end 71 is directly opposite the rectangular groove structure detection slot 57 of the injection-molded substrate 5, with an ultra-thin wall layer between them. The patch temperature sensor 6 enters the detection slot 57, and the gap between it and the detection slot 57 is bonded together with thermally conductive silicone. Its beneficial effect is that this setup has good temperature detection accuracy.

[0055] like Figure 6 As shown, a connector includes any of the above-mentioned signal integrated transmission structures 00. The connector is an AC socket or DC socket with a connector structure. Its advantages are: this connector eliminates the need for various low-voltage cables, copper busbars, and seals used for signal output, occupies less space, has a simple assembly structure, requires less labor, and has high assembly efficiency, while reducing assembly costs and component costs; at the same time, the plug-in structure facilitates assembly and maintenance, and improves the stability and reliability of signal transmission.

[0056] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A wireless beam signal integrated transmission structure, characterized in that, Includes: PCBA board (1), signal output plug (2), several low-voltage terminals (3), adapter patch (4), high-voltage interlocking part (01) and temperature detection part (02); The PCBA board (1) is installed in the cavity surrounded by the front mounting plate (03) and the rear mounting plate (04); The middle section of the output socket (20) of the signal output plug (2) is sleeved in the upper through hole (031) of the front mounting plate (03), and its several connecting pins (21) are connected to the PCBA board (1) at the rear end. The low-voltage terminal (3) is sleeved on the low-voltage tube (030) of the front mounting plate (03) and its rear end is connected to the PCBA board (1) through the adapter patch (4). The high-voltage interlock pin (9) of the high-voltage interlock part (01) is connected to the rear wall of the PCBA board (1); The temperature detection unit (02) includes a patch temperature sensor (6) and a heat-conducting sheet (7). The patch temperature sensor (6) is soldered to the back side of the PCBA board (1) and faces the output end (71) of the heat-conducting sheet (7). The collection end ring (72) of the heat-conducting sheet (7) is attached to the rear end of the power terminal (05). The PCBA board (1) integrates the collected temperature signal, high voltage interlock signal, and low voltage signal, and outputs them to the control unit via the signal output plug (2).

2. The wireless beam signal integrated transmission structure according to claim 1, characterized in that, The signal output plug (2) includes an output socket (20) and a plurality of connecting pins (21). The middle section of the connecting pin (21) is integrally injection molded and connected to the output socket (20). The rear end foot (211) of the connecting pin (21) extends out of the rear wall of the output socket (20) and is connected to the PCBA board (1). The front end surface of the connecting pin (21) is exposed to the output socket (201) of the output socket (20). The upper end of the PCBA board (1) is provided with several first connecting holes (10), and the rear end foot (211) is inserted into the first connecting holes (10) and welded together.

3. The wireless beam signal integrated transmission structure according to claim 2, characterized in that, The front rectangular array of the output socket (20) is provided with several output holes (201), and the rectangular array of several connecting pins (21) is integrally injection molded and connected to the output socket (20). The upper rectangular array of the PCBA board (1) is provided with several first connecting holes (10).

4. The wireless beam signal integration and transmission structure according to claim 1, characterized in that, The upper perforation (031) has a rectangular groove-shaped sealing groove (032) concentrically provided on its edge, and the end face sealing ring (22) is interference-fitted to the sealing groove (032).

5. The wireless beam signal integrated transmission structure according to claim 1, characterized in that, The adapter patch (4) is a bent copper busbar, one end of which is laser-welded to the rear end of the low-voltage terminal (3), and the other end is inserted into the second connection hole (11) of the PCBA board (1) and welded together.

6. The wireless beam signal integrated transmission structure according to claim 1, characterized in that, The high-voltage interlocking pin (9) of the high-voltage interlocking part (01) is integrally injection molded to the interlocking end seat (8), and its front end is sleeved and welded to the third connecting hole (12) of the PCBA board (1). The rear end of the high-voltage interlocking pin (9) extends out of the interlocking end seat (8) and is inserted into the high-voltage interlocking socket.

7. The wireless beam signal integrated transmission structure according to claim 1, characterized in that, The gap of the PCBA board (1) is placed in the receiving groove of the front mounting plate (03). The groove wall of the receiving groove is provided with several clearance grooves, each clearance groove corresponding to the first connecting hole (10), the second connecting hole (11), and the third connecting hole (12) of the PCBA board (1).

8. The wireless beam signal integrated transmission structure according to claim 7, characterized in that, The front mounting plate (03) is also fitted with an injection molding substrate (5). The injection molding substrate (5) is provided with two first through holes (51) for connecting power terminals (05), several second through holes (52) for connecting adapter patches (4), a third through hole (53) for connecting low-voltage terminals (3), and a fourth through hole (54) for connecting interlocking end seats (8). The third through hole (53) is located on one side of the second through hole (52). The pin (55) of the injection molded substrate (5) is press-fitted into the pin hole (13) of the PCBA board (1).

9. The wireless beam signal integration and transmission structure according to claim 1, characterized in that, The heat-conducting sheet (7) is integrally injection molded to the injection molding substrate (5). The collection end ring (72) protrudes from the first through hole (51) and is sleeved with the power terminal (05). The output end (71) is directly opposite the rectangular detection groove (57) of the injection molding substrate (5) and there is an ultra-thin wall layer between them. The patch temperature sensor (6) enters the detection groove (57) and the gap between it and the detection groove (57) is bonded together by thermally conductive silicone.

10. A connector, characterized in that, Includes the signal integrated transmission structure (00) as described in any one of claims 1 to 9, wherein the connector is an AC socket or a DC socket having a connector structure.

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