High-stability semiconductor laser

Abstract

The utility model discloses a high-stability semiconductor laser, which comprises a laser main body, a right-side connector is connected with an optical fiber through a ceramic ferrule and a bayonet socket in a plugging manner, the bottom of the laser main body is provided with a heat dissipation base, two sides of the laser main body are provided with fixing plates, the outer side of the heat dissipation base is provided with an outer frame, and a bottom array outer grating is connected with a caulking groove of the laser main body in a nesting manner through a nesting plate. An aluminum alloy hollow structure is adopted to improve the heat dissipation efficiency, the fixing plate is provided with bolt holes for installation and fixation, the bottom of the laser main body is provided with the bottom plate and the middle installation plate, and the installation plate is provided with the inner grating and the detachable plate with the detachable outer side, so that the semiconductor laser effectively solves the problems of poor heat dissipation and insufficient stability of an existing product through unique structural design; and maintenance is convenient, and the practical value is high.

Description

Technical Field

[0001] This utility model belongs to the technical field of semiconductor lasers, specifically relating to a high-stability semiconductor laser. Background Technology

[0002] Semiconductor lasers, also known as laser diodes, are devices that use semiconductor materials as gain media to generate stimulated emission and thus output laser light. With their many advantages, semiconductor lasers play an extremely important role in many modern technological fields, and with the continuous development of technology, their performance and application scope are constantly expanding.

[0003] However, semiconductor lasers generate a lot of heat when they are working. If they cannot be dissipated in a timely and effective manner, it will lead to a decrease in the performance of the laser and a shortened lifespan. Some existing lasers have low heat dissipation efficiency. On the other hand, lasers are not stable enough during installation and use and are easily affected by external vibrations and other factors, resulting in unstable output performance of the laser. Utility Model Content

[0004] The purpose of this invention is to provide a highly stable semiconductor laser to solve the problems mentioned in the background art, such as low heat dissipation efficiency and insufficient stability during installation and use, which makes the laser output performance unstable due to external vibrations and other factors.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-stability semiconductor laser, comprising a laser body;

[0006] A connector is provided on the right side of the laser body, an optical fiber is provided on the right side of the connector, a ceramic ferrule is provided on the left side of the connector, and a socket is provided on the right side of the laser body. The connector is connected to the socket through the ceramic ferrule.

[0007] A heat dissipation base is provided at the bottom of the laser body, and a fixing plate is provided on the left and right sides of the heat dissipation base.

[0008] Preferably, an outer frame is provided on the outer side of the heat dissipation base, and an outer grille is arranged in an array at the bottom of the heat dissipation base.

[0009] Preferably, a nesting plate is provided above the heat dissipation base, and a groove is provided at the bottom of the laser body. The heat dissipation base and the laser body are connected by the nesting plate and the groove.

[0010] Preferably, the heat dissipation base is made of aluminum alloy and has a hollow internal structure.

[0011] Preferably, bolt holes are provided inside the fixing plate, and the heat dissipation base is installed and fixed through the bolt holes.

[0012] Preferably, a base plate is provided at the bottom of the laser body, and a mounting plate is provided at the middle of the base plate.

[0013] Preferably, an inner grille is provided at the middle position inside the mounting plate, and a disassembly plate is arranged in an array on the outer side of the mounting plate.

[0014] Preferably, the connector is fixed to the laser body by laser welding, an internal hex bolt is provided at the internal position of the disassembly plate, and the mounting plate is embedded in the base plate.

[0015] Compared with the prior art, this utility model provides a highly stable semiconductor laser with the following advantages:

[0016] The heat dissipation base, made of aluminum alloy, features a design incorporating a heat sink, mounting plates, an outer frame, an outer grille, nesting plates, slots, and bolt holes. The excellent thermal conductivity of aluminum alloy allows for rapid heat dissipation from the laser body. The internal hollow structure and the outer grille array at the bottom significantly increase the heat dissipation area, accelerating heat dissipation, effectively reducing the operating temperature of the laser body, and extending its service life. The heat sink and laser body are connected via nesting plates and slots, a tight and stable connection ensuring reliable contact and efficient heat transfer. This enhances the structural stability of both components, making the laser more stable and reliable during operation. Mounting plates on both sides of the heat sink have bolt holes, allowing for easy installation of the base using bolts and other connectors, facilitating laser installation and ensuring a secure fit. The outer frame on the outside of the heat sink provides protection against external impacts and scratches, improving the overall durability of the heat dissipation structure.

[0017] The base plate, mounting plate, inner grille, and disassembly plate at the bottom of the laser body provide a stable support foundation, enhancing the overall stability of the laser structure and reducing the impact of shaking or external impacts on laser performance. The inner grille in the middle of the mounting plate further increases the heat dissipation channel and area. During laser operation, heat can be quickly dissipated through the inner grille, assisting the heat dissipation base in better heat dissipation and ensuring stable operation of the laser body in a lower temperature environment. The disassembly plates arranged on the outer side of the mounting plate are fixed with hexagonal bolts as mentioned above. When maintenance, inspection, or replacement of parts is required, the hexagonal bolts can be easily unscrewed to remove the disassembly plates, allowing easy access to the internal structure of the mounting plate and related components of the laser body. This greatly reduces maintenance difficulty and improves maintenance efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model.

[0019] Figure 2 This is a schematic diagram of the connector structure in this utility model.

[0020] Figure 3 This is a schematic diagram of the heat dissipation base in this utility model.

[0021] Figure 4 This is a schematic diagram of the structure of the base plate in this utility model.

[0022] In the diagram: 1. Laser body; 2. Heat sink base; 3. Optical fiber; 4. Connector; 5. Ceramic ferrule; 6. Socket; 7. Fixing plate; 8. Bolt hole; 9. Nesting plate; 10. Outer grille; 11. Outer frame; 12. Base plate; 13. Slot; 14. Mounting plate; 15. Removal plate; 16. Socket head bolt; 17. Inner grille. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] This utility model provides, for example Figure 1-4 The high-stability semiconductor laser shown includes a laser body 1;

[0025] A connector 4 is located on the right side of the laser body 1, an optical fiber 3 is located on the right side of the connector 4, a ceramic ferrule 5 is located on the left side of the connector 4, and a socket 6 is located on the right side of the laser body 1. The connector 4 is connected to the socket 6 through the ceramic ferrule 5.

[0026] A heat dissipation base 2 is provided at the bottom of the laser body 1, and a fixing plate 7 is provided on the left and right sides of the heat dissipation base 2.

[0027] An outer frame 11 is provided on the outer side of the heat dissipation base 2, and an outer grille 10 is arranged in an array at the bottom of the heat dissipation base 2.

[0028] A nesting plate 9 is provided above the heat dissipation base 2, and a groove 13 is provided at the bottom of the laser body 1. The heat dissipation base 2 and the laser body 1 are nested and connected by the nesting plate 9 and the groove 13.

[0029] The heat dissipation base 2 is made of aluminum alloy and has a hollow internal structure.

[0030] Bolt holes 8 are provided inside the fixing plate 7, and the heat dissipation base 2 is installed and fixed through the bolt holes 8.

[0031] A base plate 12 is provided at the bottom of the laser body 1, and a mounting plate 14 is provided in the middle of the base plate 12.

[0032] An inner grille 17 is provided in the middle of the mounting plate 14, and a disassembly plate 15 is arranged in an array on the outer side of the mounting plate 14.

[0033] The connector 6 is fixed to the laser body 1 by laser welding. An internal hex bolt 16 is provided inside the disassembly plate 15. The mounting plate 14 is embedded in the base plate 12.

[0034] In this embodiment, the specific implementation steps of a high-stability semiconductor laser are as follows: The heat sink 2 is placed in a suitable installation position. Through the bolt holes 8 inside the fixing plate 7, the heat sink 2 is firmly fixed to the mounting surface using corresponding bolts, ensuring the mounting surface is flat and has sufficient strength to support the entire laser. The nesting plate 9 above the heat sink 2 is aligned with the groove 13 at the bottom of the laser body 1. Then, the laser body 1 is slowly lowered so that the nesting plate 9 is completely embedded in the groove 13, completing the nesting connection between the laser body 1 and the heat sink 2. At this point, the laser body 1 achieves initial installation positioning and support through the heat sink 2. The base plate 12 of the laser body 1 is pre-installed on the laser body 1. The mounting plate 14 in the middle position is embedded in the base plate 12. The disassembly plates 15 arranged in an array on the outside of the mounting plate 14 are fixed to the mounting plate 14 by internal hexagonal bolts 16. In this step, it is ensured that the mounting plate 14 and the disassembly plate 15 are installed firmly without any looseness. Align the ceramic ferrule 5 on the left side of the connector 4 at one end of the optical fiber 3 with the plug 6 on the right side of the laser body 1, and then insert the ceramic ferrule 5 into the plug 6 to complete the plug connection between the optical fiber 3 and the laser body 1. Since the plug 6 and the laser body 1 are fixed by laser welding, this connection method ensures the stability and reliability of the connection.

[0035] like Figure 1 and Figure 3 As shown, a heat dissipation base 2 is provided at the bottom of the laser body 1. Fixing plates 7 are provided on the left and right sides of the heat dissipation base 2. An outer frame 11 is provided on the outer side of the heat dissipation base 2. An outer grid 10 is arranged in an array at the bottom of the heat dissipation base 2. A nesting plate 9 is provided on the top of the heat dissipation base 2. A groove 13 is provided at the bottom of the laser body 1. The heat dissipation base 2 and the laser body 1 are nested and connected by the nesting plate 9 and the groove 13. The heat dissipation base 2 is made of aluminum alloy and has a hollow structure inside. Bolt holes 8 are provided inside the fixing plate 7. The heat dissipation base 2 is installed and fixed through the bolt holes 8.

[0036] Preferably, the heat dissipation base 2 is made of aluminum alloy. The excellent thermal conductivity of aluminum alloy can quickly conduct the heat generated by the laser body 1 away. The hollow internal structure and the outer grille 10 set at the bottom array greatly increase the heat dissipation area, accelerate the heat dissipation speed, effectively reduce the working temperature of the laser body 1, and extend its service life. The heat dissipation base 2 and the laser body 1 are nested and connected by nesting plates 9 and grooves 13. This connection method is tight and stable, which can ensure reliable contact between the laser body 1 and the heat dissipation base 2, ensure efficient heat transfer, and enhance the structural stability between the two, making the laser more stable and reliable in operation. The fixing plates 7 are set on the left and right sides of the heat dissipation base 2. The fixing plates 7 have bolt holes 8 inside. The heat dissipation base 2 can be easily installed in a suitable position using bolts and other connecting parts through the bolt holes 8, which provides convenience for the installation of the laser and ensures the firmness of the installation. The outer frame 11 set on the outer side of the heat dissipation base 2 can play a certain role in protecting the heat dissipation base 2 from external collisions or scratches, improving the durability of the entire heat dissipation structure.

[0037] like Figure 1 and Figure 4 As shown, a base plate 12 is provided at the bottom of the laser body 1, a mounting plate 14 is provided in the middle of the base plate 12, an inner grid 17 is provided in the middle of the inner part of the mounting plate 14, and a disassembly plate 15 is arranged in an array on the outer side of the mounting plate 14.

[0038] Preferably, the base plate 12 at the bottom of the laser body 1 provides a stable support foundation for the entire laser body 1, which helps to improve the stability of the overall structure of the laser and reduce the impact of shaking or external impact on the laser performance. The inner grid 17 located in the middle of the mounting plate 14 further increases the heat dissipation channel and heat dissipation area. During the operation of the laser, heat can be quickly dissipated through the inner grid 17, which helps the heat dissipation base 2 to better achieve the heat dissipation function and ensures that the laser body 1 operates stably in a low-temperature environment. The disassembly plate 15 arranged in an array on the outside of the mounting plate 14 is fixed by the hexagonal bolts mentioned above. When it is necessary to maintain, inspect or replace the internal parts of the laser, the hexagonal bolts can be easily unscrewed and the disassembly plate 15 can be removed, so as to easily access the internal structure of the mounting plate 14 and the relevant parts of the laser body 1, which greatly reduces the maintenance difficulty and improves the maintenance efficiency.

[0039] like Figure 1-4 As shown, the connector 6 is fixed to the laser body 1 by laser welding, and an internal hex bolt 16 is provided inside the disassembly plate 15. The mounting plate 14 is embedded in the base plate 12.

[0040] Optionally, the connector 6 is fixed to the laser body 1 by laser welding to ensure a stable and high-strength connection between the connector 6 and the laser body 1. The mounting plate 14 is embedded in the base plate 12, making the overall structure layout more compact and orderly. This embedded design not only saves space but also helps to improve the integrity and stability of the structure. At the same time, the embedded structure can also play a certain role in protecting the mounting plate 14, preventing it from being affected by external environmental factors, ensuring that the internal grid 17 and other structures on the mounting plate 14 function properly, and also facilitating the neat arrangement and protection of internal circuits and components.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-stability semiconductor laser, comprising a laser body (1); A connector (4) is provided on the right side of the laser body (1), an optical fiber (3) is provided on the right side of the connector (4), a ceramic ferrule (5) is provided on the left side of the connector (4), and a socket (6) is provided on the right side of the laser body (1). The connector (4) is connected to the socket (6) by the ceramic ferrule (5). Its features are: A heat dissipation base (2) is provided at the bottom of the laser body (1), and a fixing plate (7) is provided on the left and right sides of the heat dissipation base (2).

2. The high-stability semiconductor laser according to claim 1, characterized in that: An outer frame (11) is provided on the outer side of the heat dissipation base (2), and an outer grille (10) is arranged in an array at the bottom of the heat dissipation base (2).

3. A high-stability semiconductor laser according to claim 2, characterized in that: A nested plate (9) is provided above the heat dissipation base (2), and a groove (13) is provided at the bottom of the laser body (1). The heat dissipation base (2) and the laser body (1) are nested and connected by the nested plate (9) and the groove (13).

4. A high-stability semiconductor laser according to claim 3, characterized in that: The heat dissipation base (2) is made of aluminum alloy and has a hollow structure inside.

5. A high-stability semiconductor laser according to claim 4, characterized in that: The fixing plate (7) has bolt holes (8) inside, and the heat dissipation base (2) is installed and fixed through the bolt holes (8).

6. A high-stability semiconductor laser according to claim 1, characterized in that: A base plate (12) is provided at the bottom of the laser body (1), and a mounting plate (14) is provided at the middle of the base plate (12).

7. A high-stability semiconductor laser according to claim 6, characterized in that: An inner grille (17) is provided in the middle of the mounting plate (14), and a disassembly plate (15) is arranged in an array on the outer side of the mounting plate (14).

8. A high-stability semiconductor laser according to claim 7, characterized in that: The connector (6) is fixed to the laser body (1) by laser welding. The disassembly plate (15) is provided with an internal hex bolt (16). The mounting plate (14) is embedded in the base plate (12).

Images