High-performance sound-insulation earphone monomer

Abstract

The utility model discloses a high-performance sound-proof earphone monomer, which comprises a sound-proof earmuff, the inner wall of the sound-proof earmuff is fixedly connected with a shell, and the inner wall of the shell is fixedly connected with a silica gel mounting piece. The double-layer composite shell structure and the surrounding type sound insulation earmuffs are designed, the active noise reduction technology is combined, external noise of different frequencies can be effectively blocked, a quiet listening environment is provided for a user, then the earmuffs are filled with memory sponge, the surfaces of the earmuffs are covered with skin-friendly leather materials, the burden of the ears can be effectively relieved, and the listening effect is good. The memory sponge firstly absorbs a part of sound energy; unabsorbed sound is transmitted into the shell, the aluminum alloy inner layer can reflect part of sound, the damping rubber outer layer absorbs sound energy through elastic deformation of the damping rubber outer layer, the sound absorption cotton ring absorbs the sound through a porous structure, the honeycomb-shaped sound insulation ring reflects and absorbs the sound multiple times through the unique structure of the honeycomb-shaped sound insulation ring, and therefore efficient sound insulation is achieved.

Description

Technical Field

[0001] This utility model relates to the field of headphone technology, specifically to a high-performance sound-insulating headphone driver. Background Technology

[0002] As people's demands for quality of life continue to rise, their requirements for headphone noise isolation performance are also increasing. In everyday use scenarios, such as commuting, noisy office environments, and bustling public places, external noise can severely interfere with the user's experience when listening to music, watching videos, or making voice calls.

[0003] Most existing headphone drivers use simple physical enclosures and filling materials to achieve sound insulation. However, these conventional designs are less than satisfactory when facing high-intensity, complex-frequency noise. Some headphones have poorly designed sound insulation structures that not only fail to effectively block external noise but also negatively impact sound quality. Therefore, it is necessary to research a high-performance sound-insulating headphone driver. Utility Model Content

[0004] To address the problems mentioned in the background art, the purpose of this utility model is to provide a high-performance noise-isolating headphone driver that possesses the advantages of [previous technology] and solves the problems.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-performance sound-insulating headphone unit, including a sound-insulating earcup, an outer shell fixedly connected to the inner wall of the sound-insulating earcup, a silicone mounting component fixedly connected to the inner wall of the outer shell, a driving unit fixedly connected to the inner side of the silicone mounting component, a buffer mechanism sleeved on the outer side of the driving unit, a snap-fit ​​cavity opened in the inner wall of the outer shell, a sound-absorbing cotton ring fixedly connected inside the snap-fit ​​cavity, a sound-insulating ring fixedly connected to the outer side of the sound-absorbing cotton ring, and the sound-insulating ring is composed of a number of honeycomb-shaped hexagonal strips evenly arrayed together.

[0006] As a preferred embodiment of the present invention, the soundproof earmuff includes a connecting ring, which is fixedly connected to the outer shell. A wearing sleeve is fixedly connected to the surface of the connecting ring, and a filling cavity is formed inside the wearing sleeve, which is filled with memory foam.

[0007] As a preferred embodiment of the present invention, the outer shell includes an aluminum alloy inner layer, and a damping rubber outer layer is fixedly connected to the outer side of the aluminum alloy inner layer.

[0008] As a preferred embodiment of this invention, the inner side of the soundproof earmuff and the surface of the outer shell are both provided with sealing grooves, and a sealing strip is provided inside the sealing groove.

[0009] As a preferred embodiment of this utility model, the buffer mechanism includes two buffer frames, which are respectively fixedly connected to the silicone mounting part and the inner side of the outer shell. A telescopic rod buffer is fixedly connected between the two buffer frames, and a buffer spring is sleeved on the surface of the telescopic rod buffer.

[0010] As a preferred embodiment of this invention, a rubber pad ring is provided between the two buffer frames, and the two sides of the rubber pad ring are fixedly connected to the two buffer frames respectively.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] This utility model features a double-layer composite shell structure and a wraparound sound-isolating earmuff design, combined with active noise cancellation technology. This effectively blocks external noise of different frequencies, providing users with a quiet listening environment. The earmuffs are filled with memory foam and covered with skin-friendly leather, which effectively reduces ear burden. The memory foam absorbs some of the sound energy; the unabsorbed sound is transmitted to the shell. The aluminum alloy inner layer reflects some of the sound, the damping rubber outer layer absorbs sound energy through its elastic deformation, and the sound-absorbing cotton rings absorb sound through their porous structure. The honeycomb sound-isolating rings reflect and absorb sound multiple times through their unique structure, thus achieving highly efficient sound insulation. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 This is a partial three-dimensional cross-sectional view of the soundproof earmuffs, outer shell, and cushioning mechanism used in conjunction with the present invention.

[0015] Figure 3 This utility model Figure 2 Enlarged view of point A in the middle;

[0016] Figure 4 This is a three-dimensional schematic diagram of the sound-absorbing cotton ring and the sound-insulating ring used in conjunction with this utility model.

[0017] In the diagram: 1. Noise-canceling earmuffs; 2. Outer shell; 3. Silicone mounting hardware; 4. Drive unit; 5. Buffer mechanism; 6. Sealing strip; 7. Snap-fit ​​cavity; 8. Sound-absorbing cotton ring; 9. Noise-canceling ring; 11. Connecting ring; 12. Wearing cover; 13. Memory foam; 21. Aluminum alloy inner layer; 22. Damping rubber outer layer; 51. Buffer frame; 52. Telescopic rod buffer; 53. Buffer spring; 54. Rubber pad ring. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] like Figures 1 to 4 As shown, this utility model provides a high-performance sound-isolating headphone unit, including a sound-isolating earcup 1. A shell 2 is fixedly connected to the inner wall of the sound-isolating earcup 1. A silicone mounting component 3 is fixedly connected to the inner wall of the shell 2. A drive unit 4 is fixedly connected to the inner side of the silicone mounting component 3. The silicone mounting component 3 not only reduces energy loss of the drive unit 4 during vibration but also effectively isolates external vibrations from interfering with the drive unit 4, further improving sound quality. A buffer mechanism 5 is sleeved on the outer side of the drive unit 4. A snap-fit ​​cavity 7 is formed on the inner wall of the shell 2. A sound-absorbing cotton ring 8 is fixedly connected inside the snap-fit ​​cavity 7. A sound-isolating ring 9 is fixedly connected to the outer side of the sound-absorbing cotton ring 8. The sound-isolating ring 9 is shaped as several honeycomb-shaped hexagonal strips evenly distributed. The array is composed of multiple units. The top of the outer shell 2 can be connected to another earphone unit via the headband. The driver unit 4 uses existing mature technology and adopts a new graphene diaphragm, which has lighter weight, higher rigidity and better conductivity, enabling faster and more accurate sound response, thereby improving sound quality. At the same time, the driver unit 4 is equipped with an active noise cancellation chip and multiple microphones. The active noise cancellation chip uses an advanced adaptive algorithm to analyze the frequency and amplitude of external noise in real time and generate the opposite canceling sound wave, thereby realizing the active noise cancellation function. Multiple microphones are evenly distributed inside the driver unit 4, which can collect external noise signals from all directions, providing more accurate data support for the active noise cancellation chip.

[0020] refer to Figure 2 and Figure 3 The soundproof earmuff 1 includes a connecting ring 11, which is fixedly connected to the outer shell 2. A wearing sleeve 12 is fixedly connected to the surface of the connecting ring 11. A filling cavity is opened inside the wearing sleeve 12, and the filling cavity is filled with memory foam 13.

[0021] As a technical optimization of this utility model, by setting up the connecting ring 11, the wearing sleeve 12 and the memory foam 13, the soundproof earmuff 1 is filled with memory foam 13, which can make the soundproof earmuff 1 fit the ear tightly. At the same time, the memory foam 13 can absorb some sound energy and reduce the transmission of external sound.

[0022] refer to Figure 2 and Figure 3The outer shell 2 includes an aluminum alloy inner layer 21, and a damping rubber outer layer 22 is fixedly connected to the outside of the aluminum alloy inner layer 21.

[0023] As a technical optimization of this utility model, the aluminum alloy inner layer 21 can effectively block mid-to-high frequency noise, and the damping rubber outer layer 22 can absorb and attenuate low frequency noise, while also playing a buffering and protective role, thereby enabling the outer shell 2 to further enhance the absorption and blocking effect of noise.

[0024] refer to Figure 3 The inner side of the soundproof earmuff 1 and the surface of the outer shell 2 are both provided with sealing grooves, and sealing strips 6 are provided inside the sealing grooves.

[0025] As a technical optimization of this utility model, the sealing groove and sealing strip 6 can effectively prevent sound from entering from the connection between the soundproof earmuff 1 and the outer shell 2, thereby further improving the sound insulation effect.

[0026] refer to Figure 2 The buffer mechanism 5 includes two buffer frames 51, which are fixedly connected to the inner side of the silicone mounting part 3 and the outer shell 2 respectively. The same telescopic rod buffer 52 is fixedly connected between the two buffer frames 51, and a buffer spring 53 is sleeved on the surface of the telescopic rod buffer 52.

[0027] As a technical optimization of this utility model, by setting up the buffer frame 51, the telescopic rod buffer 52 and the buffer spring 53, when the outer shell 2 is subjected to external impact or vibration, the buffer frame 51 transmits the impact force to the telescopic rod buffer 52 and the buffer spring 53, which absorb the energy of the impact force through compression and extension, thereby reducing the impact force on the drive unit 4.

[0028] refer to Figure 2 A rubber pad ring 54 is provided between the two buffer frames 51, and the two sides of the rubber pad ring 54 are fixedly connected to the two buffer frames 51 respectively.

[0029] As a technical optimization of this utility model, the rubber pad ring 54 can buffer vibration to a certain extent and protect the normal operation of the drive unit 4.

[0030] The working principle and usage process of this utility model are as follows: When using this earphone unit, first install it with another earphone unit via a headband, then wear both earphone units until the earcups 1 completely cover the ears. When using this earphone unit, when external sound reaches the earcups 1, the memory foam 13 inside absorbs some of the sound energy. The unabsorbed sound enters the outer shell 2, where the aluminum alloy inner layer 21 reflects some of the sound. The damping rubber outer layer 22 absorbs sound energy through its elastic deformation. Then, the sound-absorbing cotton ring 8 absorbs sound through its porous structure, and the honeycomb sound-absorbing ring 9 absorbs sound through its unique structure. By reflecting and absorbing sound multiple times, a highly efficient sound insulation effect can be achieved. When the headphones are subjected to external impact or vibration, the buffer frame 51 transmits the impact force to the telescopic rod buffer 52 and the buffer spring 53. They absorb the energy of the impact force through compression and extension, reducing the impact force on the driver unit 4. The rubber pad ring 54 can also buffer vibration to a certain extent, protecting the normal operation of the driver unit 4. The audio signal generated by the driver unit 4 is transmitted through media such as air. Due to the presence of the buffer mechanism 5, the sound is blocked when it propagates out of the ear, reducing sound leakage. At the same time, the sound treated by the sound insulation is transmitted to the ear more purely, giving the user a better audio experience.

[0031] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-performance sound-insulating headphone driver, comprising sound-insulating earcups (1), characterized in that: The inner wall of the soundproof earmuff (1) is fixedly connected to the outer shell (2), the inner wall of the outer shell (2) is fixedly connected to the silicone mounting part (3), the inner side of the silicone mounting part (3) is fixedly connected to the drive unit (4), the outer side of the drive unit (4) is fitted with a buffer mechanism (5), the inner wall of the outer shell (2) is provided with a snap-fit ​​cavity (7), the inside of the snap-fit ​​cavity (7) is fixedly connected to the sound-absorbing cotton ring (8), the outer side of the sound-absorbing cotton ring (8) is fixedly connected to the sound-insulating ring (9), and the sound-insulating ring (9) is composed of several honeycomb-shaped hexagonal strips evenly arrayed together.

2. The high-performance sound-insulating headphone driver according to claim 1, characterized in that: The soundproof earmuff (1) includes a connecting ring (11), which is fixedly connected to the outer shell (2). A wearing sleeve (12) is fixedly connected to the surface of the connecting ring (11). A filling cavity is opened inside the wearing sleeve (12), and the filling cavity is filled with memory foam (13).

3. The high-performance sound-insulating headphone driver according to claim 1, characterized in that: The outer shell (2) includes an aluminum alloy inner layer (21), and a damping rubber outer layer (22) is fixedly connected to the outside of the aluminum alloy inner layer (21).

4. The high-performance sound-insulating headphone driver according to claim 1, characterized in that: The inner side of the soundproof earmuff (1) and the surface of the outer shell (2) are both provided with sealing grooves, and a sealing strip (6) is provided inside the sealing groove.

5. The high-performance sound-insulating headphone driver according to claim 1, characterized in that: The buffer mechanism (5) includes two buffer frames (51), which are fixedly connected to the silicone mounting part (3) and the inner side of the outer shell (2) respectively. The same telescopic rod buffer (52) is fixedly connected between the two buffer frames (51), and a buffer spring (53) is sleeved on the surface of the telescopic rod buffer (52).

6. The high-performance sound-insulating headphone driver according to claim 5, characterized in that: A rubber pad ring (54) is provided between the two buffer frames (51), and the two sides of the rubber pad ring (54) are fixedly connected to the two buffer frames (51) respectively.

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