Circuit board, display module and display device

Abstract

The embodiment of the utility model provides a circuit board, a display module and a display device, relates to the technical field of display, and is used for improving the noise suppression performance of the circuit board. The circuit board comprises an electromagnetic interference shielding layer, a dielectric layer and a conductive layer which are stacked along a first direction, and an electronic element which is arranged on one side, far away from the electromagnetic interference shielding layer, of the conductive layer. A first overlapping area of the plane where the electronic element and the dielectric layer are located in the first direction is not provided with a gap or provided with a gap, and the size of the gap in the first direction is smaller than the size of the dielectric layer in the first direction. The display module is used for displaying images.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a circuit board, a display module, and a display device. Background Technology

[0002] Circuit boards are widely used in electronic devices and are a key component of modern electronic products. Circuit boards typically integrate various electronic components to meet different circuit function requirements. However, some electronic components may vibrate during operation due to their physical or electrical characteristics, producing a weak whistling noise. Although this noise is usually minor, it can still adversely affect the user experience in high-sensitivity applications or quiet environments. Utility Model Content

[0003] The purpose of this disclosure is to provide a circuit board, a display module, and a display device for improving the noise suppression performance of the circuit board.

[0004] To achieve the above objectives, the embodiments of this disclosure provide the following technical solutions:

[0005] On one hand, a circuit board is provided for use in foldable displays. The circuit board includes: an electromagnetic interference shielding layer, a dielectric layer, and a conductive layer stacked along a first direction, and an electronic component disposed on the conductive layer on the side away from the electromagnetic interference shielding layer. In a first overlapping area between the electronic component and the plane of the dielectric layer in the first direction, there is no gap or a gap is provided, and the size of the gap in the first direction is smaller than the size of the dielectric layer in the first direction.

[0006] In the aforementioned display panel, when no gap is provided in the first overlapping area of ​​the plane where the electronic component and the dielectric layer are located in the first direction, that is, when there is no gap in the first overlapping area, the noise emitted by the electronic component during operation cannot be amplified. When a gap is provided in the first overlapping area of ​​the plane where the electronic component and the dielectric layer are located in the first direction, and the size of the gap in the first direction is smaller than the size of the dielectric layer in the first direction, although a gap is provided in the first overlapping area, the gap is small, thus the degree to which the gap amplifies noise is also small. Therefore, the circuit board provided in this embodiment has good noise suppression performance.

[0007] In some embodiments, a conductive material is provided in the first overlapping region.

[0008] In some embodiments, the conductive material is copper or conductive adhesive.

[0009] In some embodiments, a conductive material is disposed in the first overlapping region, wherein the size of the conductive material in the first direction is equal to the size of the dielectric layer in the first direction.

[0010] In some embodiments, the size of the conductive material in the first direction is smaller than the size of the dielectric layer in the first direction.

[0011] In some embodiments, the gap is located between the conductive material and the conductive layer; and / or, the gap is located between the conductive material and the electromagnetic interference shielding layer.

[0012] In some embodiments, an insulating material is provided in the first overlapping region, and the insulating material is the same as the material of the dielectric layer.

[0013] In some embodiments, the insulating material and the dielectric layer are an integral structure.

[0014] In some embodiments, the method further includes: a first adhesive layer, a reinforcing layer, and a second adhesive layer disposed on the side of the electromagnetic interference shielding layer away from the conductive layer, wherein the first adhesive layer, the reinforcing layer, and the second adhesive layer are disposed sequentially along a direction away from the electromagnetic interference shielding layer; a support member is disposed in the second overlapping region of the plane where the electronic component and the second adhesive layer are located in the first direction, wherein the volume compressibility coefficient of the material of the support member is less than the volume compressibility coefficient of the material of the second adhesive layer.

[0015] In some embodiments, the surface of the support member away from the reinforcing layer is non-adhesive.

[0016] In some embodiments, the side surface of the support member closest to the reinforcing layer is bonded to the reinforcing layer.

[0017] In some embodiments, when the surface of the second adhesive layer away from the reinforcing layer is in an unbonded state, the second adhesive layer has a first dimension in the first direction; when the surface of the second adhesive layer away from the reinforcing layer is in an bonded state, the second adhesive layer has a second dimension in the first direction; the second dimension is smaller than the first dimension, and the dimension of the support member in the first direction is equal to the second dimension.

[0018] In some embodiments, the ratio of the second dimension to the first dimension ranges from 5:8 to 7:8.

[0019] In some embodiments, the difference between the second dimension and the first dimension ranges from 0.01 mm to 0.03 mm.

[0020] In some embodiments, the second dimension ranges from 0.05 mm to 0.07 mm.

[0021] In some embodiments, the material of the support includes polyethylene terephthalate, copper, aluminum, polycarbonate, or steel sheet.

[0022] On the other hand, a display module is provided. The display module includes a display panel and a circuit board as described in any of the above embodiments. The display panel includes a display portion, a bending portion, and a bonding portion connected in sequence; the display portion has a light-emitting side and a backlight side; the bending portion is bendable so that the bonding portion bends to the backlight side of the display portion.

[0023] In some embodiments, the circuit board is bonded to the bonding portion and disposed on the backlight side of the display portion.

[0024] In some embodiments, the circuit further includes: a base layer disposed between the display portion and the circuit board, wherein the base layer is bonded to the surface of the second adhesive layer in the circuit board away from the reinforcing layer; and the surface of the support member of the circuit board away from the reinforcing layer abuts against the base layer.

[0025] The above-described display module has the same structure and beneficial technical effects as the circuit board provided in some of the above embodiments, and will not be described again here.

[0026] In another aspect, a display device is provided. The display device includes: a display module as described in any of the above embodiments; and a driving circuit coupled to the display module.

[0027] The above-described display device has the same structure and beneficial technical effects as the display module provided in some of the above embodiments, and will not be described again here. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual process of the method, etc. involved in the embodiments of this disclosure.

[0029] Figure 1 This is a structural diagram of a display device according to some embodiments;

[0030] Figure 2 for Figure 1 A sectional view of a portion of the display device along the AA direction;

[0031] Figure 3 for Figure 1 A structural diagram of the display device in its unbent state;

[0032] Figure 4 for Figure 3 A sectional view of a portion of the display device along the BB direction;

[0033] Figure 5 This is a structural diagram of a circuit board according to some embodiments;

[0034] Figure 6 This is a structural diagram of a circuit board according to some other embodiments;

[0035] Figure 7 This is a structural diagram of a circuit board according to some other embodiments;

[0036] Figure 8 This is a structural diagram of a circuit board according to some other embodiments;

[0037] Figure 9 This is a structural diagram of a circuit board in an unbonded state according to some embodiments;

[0038] Figure 10 This is a structural diagram of a circuit board in an adhesive state according to some other embodiments;

[0039] Figure 11 This is a structural diagram of a display module according to some embodiments;

[0040] Figure 12 This is a structural diagram of a display module according to some other embodiments;

[0041] Figure 13 This is a structural diagram of a display device according to some other embodiments. Detailed Implementation

[0042] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0043] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0044] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0045] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0046] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0047] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0048] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0049] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0050] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0051] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0052] refer to Figure 1 Embodiments of this disclosure provide a display device 1000, which is a product having an image display function. Exemplarily, the display device 1000 can be any device that displays either moving (e.g., video) or fixed (e.g., still image) content, and whether it is text or an image.

[0053] For example, the display device 1000 can be any product or component with display functionality, such as a television, laptop, tablet, personal digital assistant (PDA), mobile phone, watch, clock, calculator, GPS receiver / navigator, camera, camera view display (e.g., a rearview camera display in a vehicle), wearable device, augmented reality (AR) device, virtual reality (VR) device, in-vehicle display, or flight display. Figure 1 As shown, the display device 1000 can be a mobile phone.

[0054] Regarding the type of light emission of the display device 1000, it can be an OLED display device, a quantum dot light-emitting diode (QLED) display device, or a mini / micro light-emitting diode (MLED) display device, etc. Regarding the form of the display device 1000, it can be a flat panel display device, a curved display device, or a foldable display device, etc. Regarding the shape of the display device 1000, it can be rectangular or circular, etc. The embodiments disclosed herein do not impose specific limitations in these aspects.

[0055] refer to Figure 2 The display device 1000 includes a display panel PNL, which is the core component of the display device 1000. Its main function is to convert electrical signals into visual image or text information, providing users with an intuitive visual interactive interface. The display panel PNL includes a display section 01, a bending section 02, and a bonding section 03 connected in sequence. The display section 01 has a light-emitting side 001 and a backlight side 002. The bending section 02 is bendable so that the bonding section 03 bends to the backlight side 002 of the display section 01.

[0056] Continue to refer to Figure 2 On the light-emitting side 001 of the display panel PNL, along the direction away from the display panel PNL, the display device 1000 further includes: a polarizer POL, an optical adhesive layer OCA, and a cover plate CG. The cover plate CG is attached to the side of the polarizer POL away from the display panel PNL via the optical adhesive layer OCA.

[0057] Among them, the polarizer POL is mainly used to shield the ambient light that shines into the display panel PNL, thereby achieving an anti-reflection effect.

[0058] The cover plate CG provides support and protection for the display panel PNL, ensuring that the display panel PNL maintains good display performance even when subjected to impact or scratches. The cover plate CG can be, but is not limited to, glass or transparent resin materials, as long as it has good light transmittance. The embodiments of this application do not specifically limit this.

[0059] Reference Figure 2 and Figure 3 The display device 1000 further includes a substrate layer M and a circuit board 100. The substrate layer M is disposed between the display section 01 and the circuit board 100, and the circuit board 100 is bonded to the bonding section 03 of the display panel PNL and disposed on the backlight side 002 of the display section 01 of the display panel PNL.

[0060] The base layer M serves as support, buffer, heat dissipation, and shielding on the backlight side 002 of the display panel PNL. The base layer M can be a support layer (Bracket, abbreviated as BKT) or super clean foam (SCF). The circuit board 100 is used to input various signals required for displaying the image to the display panel PNL, such as control signals, power supply voltage signals, and data signals.

[0061] Reference Figure 3 and Figure 4 The circuit board 100 typically integrates various electronic components Q to meet different circuit function requirements. Among them, electronic components Q may include: resistors, capacitors, inductors, flash memory, and touch integrated circuit (TIC).

[0062] refer to Figure 4 The circuit board 100 includes: a second adhesive layer 11, a reinforcing layer 12, a first adhesive layer 13, an electromagnetic interference shielding layer 14, a dielectric layer 15, a conductive layer 16, and a body layer 17 stacked along a first direction X, and an electronic component Q disposed on the side of the body layer 17 away from the electromagnetic interference shielding layer 14.

[0063] The second adhesive layer 11 is bonded to the reinforcing layer 12 on one side and to the base layer M on the other side, serving to fix and reinforce the structure of the circuit board 100. The reinforcing layer 12 increases the mechanical strength of the circuit board 100, preventing damage when bent or folded. The first adhesive layer 13 bonds the reinforcing layer 12 and the electromagnetic interference shielding layer, providing mechanical strength and stability to the circuit board 100. The electromagnetic interference shielding layer 14 reduces electromagnetic interference and improves the circuit's anti-interference capability. The dielectric layer 15 typically isolates different conductive layers, preventing short circuits in the circuit board 100. The conductive layer 16 is typically etched to form the desired circuit pattern for transmitting electrical signals. The body layer 17 is the main structural layer of the circuit board 100, typically composed of conductive materials (such as copper) and insulating materials (such as polyimide), providing conductive paths and mechanical support for the circuit.

[0064] Because the circuit board 100 needs to meet the requirements of electrostatic discharge (ESD), a window is made in the dielectric layer 15 beneath the electronic component Q. After the window is made, part of the electromagnetic interference shielding layer 14 in the circuit board 100 will be connected to the conductive layer 16, thus releasing static electricity. However, at the window location, a gap V will be formed where the electromagnetic interference shielding layer 14 and the conductive layer 16 are not connected. Since some electronic components Q may vibrate due to physical or electrical characteristics during operation, generating a weak whistling noise, this gap V will amplify the whistling noise of the electronic component Q. Although such noise is usually relatively mild, it may still adversely affect the user experience in high-sensitivity applications or quiet environments.

[0065] The aforementioned "electrostatic discharge" refers to the phenomenon where an object carrying static electricity (such as a human body, tools, equipment, etc.) suddenly releases static energy when it comes into contact with or near the circuit board 100, which may cause damage to the circuit board 100 or a decrease in its performance.

[0066] To address the aforementioned technical problems, embodiments of this disclosure also provide a circuit board 100 for use in foldable displays, see reference. Figures 5-9 The circuit board 100 includes: an electromagnetic interference shielding layer 14, a dielectric layer 15, and a conductive layer 16 stacked along a first direction X, and an electronic component Q disposed on the conductive layer 16 on the side away from the electromagnetic interference shielding layer 14. The first overlap region E1 between the electronic component Q and the plane of the dielectric layer 15 in the first direction X has no gap or has a gap V, and the size of the gap V in the first direction X is smaller than the size of the dielectric layer 15 in the first direction X.

[0067] In the circuit board 100 provided in the embodiments of this disclosure, when no gap V is provided in the first overlapping region E1 of the plane where the electronic component Q and the dielectric layer 15 are located in the first direction X, that is, when there is no gap in the first overlapping region E1, the noise emitted by the electronic component Q during operation cannot be amplified because there is no gap V. When a gap V is provided in the first overlapping region E1 of the plane where the electronic component Q and the dielectric layer 15 are located in the first direction X, and the size of the gap V in the first direction X is smaller than the size of the dielectric layer in the first direction X, although a gap V is provided in the first overlapping region E1, the gap V is small, so the degree of noise amplification by the gap V is also small. Therefore, the circuit board 100 provided in this embodiment has good noise suppression performance.

[0068] In some embodiments, where the electrostatic discharge requirements of the circuit board 100 are not high, the first overlapping region E1 can be provided with insulating material J1. This eliminates the need for additional anti-static treatment steps, and the cost of the insulating material is low, which can also save on the manufacturing cost of the circuit board 100.

[0069] refer to Figure 5 When insulating material J1 is provided in the first overlapping region E1, there is no gap V in the first overlapping region E1, meaning that the insulating material J1 completely fills the first overlapping region E1. Since there is no gap V, the noise emitted by the electronic component Q during operation cannot be amplified, thus improving the noise suppression performance of the circuit board 100.

[0070] When insulating material J1 is provided in the first overlapping region E1, a gap V (not shown in this embodiment) can be provided in the first overlapping region E1, and the size of the gap V in the first direction X is smaller than the size of the dielectric layer 15 in the first direction X. That is, the insulating material J1 fills part of the first overlapping region E1. Although a gap V is provided in the first overlapping region E1, the gap V is small, so the degree of noise amplification by the gap V is also small, thereby improving the noise suppression performance of the circuit board 100.

[0071] In some embodiments, the insulating material J1 is made of the same material as the dielectric layer 15. This ensures that, on the one hand, the insulating material J1 and the dielectric layer 15 have the same coefficient of thermal expansion and mechanical properties, preventing warping due to temperature changes; on the other hand, the insulating material J1 and the dielectric layer 15 also have the same chemical properties, preventing corrosion or chemical reactions at the interface between them. Furthermore, since no additional materials are required, the procurement cost of manufacturing the circuit board 100 can be reduced. In other embodiments, the insulating material J1 can be other materials that provide insulation.

[0072] Continue to refer to Figure 5When the insulating material J1 and the dielectric layer 15 are made of the same material, the insulating material J1 and the dielectric layer 15 are integrated into one structure. This avoids the etching and refilling process, eliminates the need for a dedicated mask for etching and filling, simplifies the fabrication process of the circuit board 100, and reduces manufacturing costs. Secondly, the integrated structure also improves the reliability of the circuit board 100 structure.

[0073] refer to Figure 6 In some embodiments, the first overlapping region E1 is provided with a conductive material J2. This not only improves the noise suppression performance of the circuit board 100, but also enables the circuit board 100 to meet the requirements of electrostatic discharge.

[0074] For example, the conductive material J2 is copper or conductive adhesive. In other embodiments, the conductive material J2 may be other materials capable of conducting electricity, which are not limited here.

[0075] refer to Figure 6 In some embodiments, when a conductive material J2 is provided in the first overlapping region E1, the dimension H1 of the conductive material J2 in the first direction X is equal to the dimension H2 of the dielectric layer 15 in the first direction X. This eliminates gaps V in the first overlapping region E1. Because there are no gaps V, the noise emitted by the electronic component Q during operation cannot be amplified. Furthermore, the conductive material J2 in the first overlapping region E1 also ensures that the circuit board 100 meets the requirements for electrostatic discharge. Therefore, the circuit board 100 provided in this embodiment not only meets the requirements for electrostatic discharge but also improves the noise suppression performance of the circuit board 100.

[0076] refer to Figure 7 In some embodiments, when a conductive material J2 is provided in the first overlapping region E1, the dimension H1 of the conductive material J2 in the first direction X is smaller than the dimension H2 of the dielectric layer 15 in the first direction X. That is, the first overlapping region E1 has a gap V, and the dimension H3 of the gap V in the first direction X is smaller than the dimension H2 of the dielectric layer 15 in the first direction X. Although the first overlapping region E1 has a gap V, the gap V is small, so the degree of noise amplification by the gap V is also small, thereby improving the noise suppression performance of the circuit board 100.

[0077] refer to Figure 7 When a conductive material J2 is provided in the first overlapping region E1, and the size H1 of the conductive material J2 in the first direction X is smaller than the size H2 of the dielectric layer 15 in the first direction X, the gap V can be located between the conductive material J2 and the conductive layer 16. This also reduces the volume of the gap V, reduces the degree of noise amplification by the gap V, and improves the noise suppression performance of the circuit board 100.

[0078] refer to Figure 8When a conductive material J2 is provided in the first overlapping region E1, and the dimension H1 of the conductive material J2 in the first direction X is smaller than the dimension H2 of the dielectric layer 15 in the first direction X, the gap V can also be located between the conductive material J2 and the electromagnetic interference shielding layer 14. This reduces the volume of the gap V, reduces the degree of noise amplification by the gap V, and improves the noise suppression performance of the circuit board 100.

[0079] In some embodiments, when a conductive material J2 is provided in the first overlapping region E1, and the dimension H1 of the conductive material J2 in the first direction X is smaller than the dimension H2 of the dielectric layer 15 in the first direction X, the gap V can also be located between the conductive material J2 and the conductive layer 16, and between the conductive material J2 and the electromagnetic interference shielding layer 14. This can also reduce the volume of the gap V, reduce the degree of noise amplification by the gap V, and improve the noise suppression performance of the circuit board 100.

[0080] refer to Figure 8 The circuit board 100 further includes: a first adhesive layer 13, a reinforcing layer 12, and a second adhesive layer 11 disposed on the side of the electromagnetic interference shielding layer 14 away from the conductive layer 16; and the first adhesive layer 13, the reinforcing layer 12, and the second adhesive layer 11 are arranged sequentially in a direction away from the electromagnetic interference shielding layer 14. The second adhesive layer 11 is located on the side of the reinforcing layer 12 away from the first adhesive layer 13. When the circuit board 100 is assembled into the display device, the surface of the second adhesive layer 11 away from the reinforcing layer 12 in the circuit board 100 is bonded to the base layer M. In order to prevent damage to the electronic component Q, during the bonding process, the areas of the circuit board 100 that overlap with the electronic component Q along the first direction X cannot be squeezed. Therefore, the size of the area of ​​the circuit board 100 that overlaps with the electronic component Q along the first direction X is larger than the size of the area of ​​the circuit board 100 that does not overlap with the electronic component Q. This results in a gap V between the second adhesive layer 11 and the base layer M. This gap will amplify the howling of the electronic component Q, which will have an adverse effect on the user experience.

[0081] To solve the above-mentioned technical problems, the circuit board 100 provided in this embodiment can be referred to as follows: Figure 9 In the second overlapping region E2 of the plane where the electronic component Q and the second adhesive layer 11 are located in the first direction X, a support member J3 is provided. The volume compressibility coefficient of the material of the support member J3 is less than that of the material of the second adhesive layer 11. In this way, when the surface of the second adhesive layer 11 away from the reinforcing layer 12 is in an adhesive state, the thickness of the second adhesive layer 11 and the thickness of the support member J3 can be consistent or substantially consistent. Therefore, there will be no gaps between the second adhesive layer 11 and the support member J3 and between them and the substrate layer N. Since there are no gaps, the noise generated by the electronic component Q will not be amplified. Therefore, the noise suppression performance of the circuit board 100 is further improved.

[0082] In some embodiments, the surface of the support member J3 near the reinforcing layer 12 is bonded to the reinforcing layer 12, while the surface of the support member J3 away from the reinforcing layer 12 is non-adhesive. This prevents gaps from forming between the second adhesive layer 11 and the support member J3 and between the support member J3 and the base layer M when the circuit board 100 is applied in the display device 1000 and bonded to the base layer M, thereby preventing amplification of noise generated by the electronic component Q.

[0083] In some embodiments, reference Figure 9 When the surface of the second adhesive layer 11 away from the reinforcing layer 12 is in an unbonded state, the second adhesive layer 11 has a first dimension L1 in the first direction X; Reference Figure 10 When the surface of the second adhesive layer 11 away from the reinforcing layer 12 is in an adhesive state, the second adhesive layer 11 has a second dimension L2 in the first direction X; the second dimension L2 is smaller than the first dimension L1, and the dimension of the support member J3 in the first direction X is equal to the second dimension L2. In this way, when the circuit board 100 is bonded to the base layer M in the display device, gaps can be avoided between the second adhesive layer 11 and the support member J3 and between the support member J3 and the base layer M, thereby avoiding amplification of noise generated by the electronic component Q.

[0084] In some embodiments, the ratio of the second dimension L2 to the first dimension L1 is in the range of 5:8 to 7:8, for example, the ratio of the second dimension L2 to the first dimension L1 is 5:8, 6:8, 6.5:8 or 7:8.

[0085] In some embodiments, the difference between the second dimension L2 and the first dimension L1 ranges from 0.01 mm to 0.03 mm. This ensures that the circuit board 100 is fully bonded to the substrate layer M in the display device, thereby improving the structural stability of the display device using the circuit board 100.

[0086] For example, the difference between the second dimension L2 and the first dimension L1 can be 0.01mm, 0.02mm, or 0.03mm, etc., and there are no restrictions here.

[0087] For example, the second dimension L2 ranges from 0.05 mm to 0.07 mm.

[0088] For example, the second dimension L2 can be 0.05mm, 0.06mm, or 0.07mm, etc., and there are no restrictions here.

[0089] For example, when the second dimension L2 is 0.05mm, the first dimension L1 can be 0.07mm; when the second dimension L2 is 0.06mm, the first dimension L1 can be 0.08mm; when the second dimension L2 is 0.07mm, the first dimension L1 can be 0.09mm.

[0090] In some embodiments, the material of the support member J3 includes: polyethylene terephthalate (PET), copper (CU), aluminum (AL), polycarbonate (PC), or steel sheet (SUS). Using the above materials for the support member J3 can meet the requirements for fixing and reinforcing the structure of the circuit board 100.

[0091] Embodiments of this disclosure also provide a display module 200, see reference. Figure 11 The display module 200 includes a display panel PNL and a circuit board 100. The display panel PNL includes a display section 01, a bending section 02, and a bonding section 03 connected in sequence; the display section 01 has a light-emitting side 001 and a backlight side 002; the bending section 02 is bendable so that the bonding section 03 bends to the backlight side 002 of the display section 01. The circuit board 100 is the circuit board 100 described in any of the above embodiments.

[0092] In some embodiments, reference Figure 11 or Figure 12 The circuit board 100 is bonded to the bonding part 03 and is located on the backlight side 002 of the display part 01.

[0093] For example, refer to Figure 11 When the binding part 03 is bent to the backlight side 002 of the display part 01, a portion of the circuit board 100 is provided on the side of the binding part 03 away from the display part 01, and another portion of the circuit board is provided on the backlight side 002 of part of the display part 01, and the orthographic projection of the circuit board 100 on the display part 01 does not overlap.

[0094] For example, refer to Figure 12 When the bonding portion 03 is bent to the backlight side 002 of the display portion 01, the circuit board 100 is bonded to the side of the bonding portion 03 away from the display portion 01, and bent to the side of the bonding portion 03 closer to the display portion 01. That is, the orthographic projection of the circuit board 100 on the display portion 01 partially overlaps.

[0095] Among them, continue to refer to Figure 12An ultra-thin functional film P1 is also provided between the circuit board 100 and the bonding part 03. The ultra-thin functional film P1 can be used for signal transmission between the circuit board 100 and the display panel PNL, provide mechanical buffering and insulation protection.

[0096] Reference Figure 10 and Figure 11 The display module 200 further includes a base layer M, which is disposed between the display unit 01 and the circuit board 100, and the base layer M is bonded to the surface of the second adhesive layer 11 in the circuit board 100 away from the reinforcing layer 12; the surface of the support member J3 of the circuit board 100 away from the reinforcing layer 12 abuts against the base layer M. In this way, there is no gap between the surface of the support member J3 of the circuit board 100 away from the reinforcing layer 12 and the base layer M, avoiding amplification of noise generated by the electronic components Q and improving the noise suppression performance of the display module 200.

[0097] The base layer M can be either a support layer (Bracket, or BKT) or superclean foam (SCF).

[0098] Continue to refer to Figure 11 or Figure 12 A flexible substrate P2 is also provided between the display unit 01 and the base layer M. The flexible substrate P2 can provide mechanical support and stress buffer for the display module 200.

[0099] Embodiments of this disclosure also provide a display device 1000, see reference. Figure 13 The display device 1000 includes: a display module 200 as described in any of the above embodiments; and a driving circuit 300 coupled to the display module 200. The driving circuit 300 can provide stable voltage and current to the display module 200.

[0100] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A circuit board for use in foldable displays, characterized in that, include: An electromagnetic interference shielding layer, a dielectric layer, and a conductive layer are stacked along a first direction, and an electronic component is disposed on the side of the conductive layer away from the electromagnetic interference shielding layer. The first overlapping area of ​​the plane where the electronic component and the dielectric layer are located in the first direction has no gap or has a gap, and the size of the gap in the first direction is smaller than the size of the dielectric layer in the first direction.

2. The circuit board according to claim 1, characterized in that, A conductive material is provided in the first overlapping region.

3. The circuit board according to claim 2, characterized in that, The conductive material is copper or conductive adhesive.

4. The circuit board according to claim 2 or 3, characterized in that, The dimensions of the conductive material in the first direction are equal to the dimensions of the dielectric layer in the first direction.

5. The circuit board according to claim 2 or 3, characterized in that, The size of the conductive material in the first direction is smaller than the size of the dielectric layer in the first direction.

6. The circuit board according to claim 5, characterized in that, The gap is located between the conductive material and the conductive layer; and / or, the gap is located between the conductive material and the electromagnetic interference shielding layer.

7. The circuit board according to claim 1, characterized in that, An insulating material is provided in the first overlapping region, and the insulating material is the same as the material of the dielectric layer.

8. The circuit board according to claim 7, characterized in that, The insulating material and the dielectric layer are an integral structure.

9. The circuit board according to any one of claims 1 to 3, characterized in that, Also includes: A first adhesive layer, a reinforcing layer, and a second adhesive layer are disposed on the side of the electromagnetic interference shielding layer away from the conductive layer; and the first adhesive layer, the reinforcing layer, and the second adhesive layer are arranged sequentially along the direction away from the electromagnetic interference shielding layer. A support member is provided in the second overlapping area of ​​the plane where the electronic component and the second adhesive layer are located in the first direction. The volume compressibility coefficient of the material of the support member is less than that of the material of the second adhesive layer.

10. The circuit board according to claim 9, characterized in that, The surface of the support member away from the reinforcing layer is non-adhesive.

11. The circuit board according to claim 9, characterized in that, The support member is bonded to the reinforcing layer on the side surface closest to the reinforcing layer.

12. The circuit board according to claim 9, characterized in that, When the surface of the second adhesive layer away from the reinforcing layer is in an unbonded state, the second adhesive layer has a first dimension in the first direction; When the surface of the second adhesive layer away from the reinforcing layer is in an adhesive state, the second adhesive layer has a second dimension in the first direction; The second dimension is smaller than the first dimension, and the dimension of the support member in the first direction is equal to the second dimension.

13. The circuit board according to claim 12, characterized in that, The ratio of the second dimension to the first dimension is in the range of 5:8 to 7:

8.

14. The circuit board according to claim 12 or 13, characterized in that, The difference between the second dimension and the first dimension ranges from 0.01 mm to 0.03 mm.

15. The circuit board according to claim 12 or 13, characterized in that, The second dimension ranges from 0.05 mm to 0.07 mm.

16. The circuit board according to any one of claims 9 to 13, characterized in that, The materials of the support include: polyethylene terephthalate, copper, aluminum, polycarbonate, or steel sheet.

17. A display module, characterized in that, include: The display panel includes a display section, a bending section, and a bonding section connected in sequence; the display section has a light-emitting side and a backlight side. The bending portion is bendable, so that the bonding portion bends to the backlight side of the display portion; The circuit board as described in any one of claims 1 to 16.

18. The display module according to claim 17, characterized in that, The circuit board is bonded to the bonding part and is located on the backlight side of the display part.

19. The display module according to claim 17, characterized in that, Also includes: A base layer is disposed between the display unit and the circuit board, and the base layer is bonded to the surface of the second adhesive layer in the circuit board away from the reinforcing layer. The surface of the support member of the circuit board away from the reinforcing layer abuts against the base layer.

20. A display device, characterized in that, include: The display module as described in any one of claims 17 to 19; as well as, The driving circuit is coupled to the display module.

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