Printed circuit board with bonding pad plated with lead and tin

Abstract

The utility model belongs to the technical field of printed circuit boards, and discloses a printed circuit board with a bonding pad plated with lead and tin, which comprises a printed circuit board, buffer assemblies are arranged at four corners of the printed circuit board, each buffer assembly comprises a limiting ring, the outer surface of each limiting ring is connected with the inner wall of the printed circuit board, and the inner wall of the printed circuit board is connected with the limiting ring. Connecting frames are arranged above and below the limiting ring, protective rings are arranged on the inner walls of the connecting frames, and movable blocks located on the outer sides of the protective rings are movably connected to inner cavities of the connecting frames. According to the utility model, the connecting plate and the movable block are arranged, when equipment carrying the printed circuit board is vibrated, the connecting part of the equipment is extruded in different directions, then the connecting plate and the movable block are extruded by the equipment shell mounting column, and the generated elastic force counteracts the external acting force through the elastic force action of the protective pad and the protective ring, so that the equipment is protected. Therefore, the damage to the printed circuit board caused by vibration is reduced, the influence on subsequent use is avoided, and the printed circuit board has a good protection effect.

Description

Technical Field

[0001] This utility model belongs to the field of printed circuit board technology, specifically a printed circuit board with lead-tin plated pads. Background Technology

[0002] Printed circuit boards are important electronic components and serve as the support for electronic devices. Almost every electronic device, from small electronic watches and calculators to large computers and communication devices, uses integrated circuits and other electronic components to enable electrical interconnection between various components.

[0003] In existing technologies, lead-tin plated printed circuit boards (PCBs) involve plating a layer of lead-tin alloy onto the pads to enhance their conductivity and solderability. However, in these systems, the PCBs are typically connected to the housing using bolts. Consequently, when subjected to vibration or impact, the force is transmitted to the PCB, causing damage or breakage and rendering the entire device unusable. Therefore, improvements are needed. Utility Model Content

[0004] To address the problems mentioned in the background section, this invention provides a lead-tin plated printed circuit board with solder pads.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a lead-tin plated printed circuit board, comprising a printed circuit board, wherein buffer components are provided at each of the four corners of the printed circuit board;

[0006] The buffer assembly includes a limiting ring, the outer surface of which is connected to the inner wall of the printed circuit board. Connecting frames are provided above and below the limiting ring, and protective rings are provided on the inner walls of the connecting frames. A movable block located outside the protective rings is movably connected to the inner cavity of the connecting frames. A protective pad is provided on the inner side of the limiting ring, and a connecting plate is provided on the inner side of the protective pad.

[0007] Preferably, there are eight connecting plates arranged in a circle.

[0008] Preferably, the bottom of each of the eight connecting plates is set as an inclined surface, and the eight connecting plates are arranged in close succession.

[0009] Preferably, the limiting ring has a groove inside, and a limiting rod is provided inside the groove. The inner side of the limiting rod extends into the inner cavity of the protective pad and is connected to the outer side of the connecting plate.

[0010] Preferably, a limiting block is provided on the outer side of the movable block, and the outer side of the limiting block is movably connected to the inner wall of the connecting frame.

[0011] Preferably, two protective rings are provided, and both protective rings and protective pads are made of rubber.

[0012] Preferably, the outer surface of the printed circuit board is provided with a lead-tin alloy.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] This utility model is equipped with a connecting plate and a movable block. When the device carrying the printed circuit board is subjected to vibration, its connecting part will be squeezed in different directions. Then, the mounting column of the device housing squeezes the connecting plate and the movable block. Through the elastic force of the protective pad and the protective ring, the elastic force generated is offset by the external force and buffered, thereby reducing the damage to the printed circuit board caused by vibration and avoiding affecting subsequent use, thus giving it a good protective effect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the buffer assembly of this utility model;

[0017] Figure 3 This is a cross-sectional view of the limiting ring of this utility model;

[0018] Figure 4 This is an exploded view of the structure of the buffer component of this utility model.

[0019] In the diagram: 1. Printed circuit board; 2. Buffer assembly; 201. Limiting ring; 202. Protective pad; 203. Connecting plate; 204. Groove; 205. Limiting rod; 206. Connecting frame; 207. Protective ring; 208. Movable block. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1

[0022] like Figures 1 to 4 As shown, this is the first embodiment of the utility model, which provides a lead-tin plated printed circuit board with solder pads, including a printed circuit board 1, and buffer components 2 are provided at the four corners of the printed circuit board 1.

[0023] The buffer assembly 2 includes a limiting ring 201. The outer surface of the limiting ring 201 is connected to the inner wall of the printed circuit board 1. A connecting frame 206 is provided above and below the limiting ring 201. A protective ring 207 is provided on the inner wall of the connecting frame 206. A movable block 208 located outside the protective ring 207 is movably connected to the inner cavity of the connecting frame 206. A protective pad 202 is provided on the inner side of the limiting ring 201. A connecting plate 203 is provided on the inner side of the protective pad 202.

[0024] When the printed circuit board 1 is subjected to the force generated by vibration, the force is generated on the connecting plate 203, which in turn squeezes the protective pad 202, thus buffering the horizontal vibration through the protective pad 202. At the same time, when the printed circuit board 1 vibrates up and down, the upper and lower movable blocks 208 are squeezed. At this time, the protective ring 207 buffers the movable blocks 208, so as to prevent the equipment from being damaged at the connection between the printed circuit board 1 and the equipment when the equipment is subjected to vibration, preventing the equipment from becoming unusable, and bringing convenience to the operator.

[0025] Example 2

[0026] like Figure 2 and Figure 3 As shown, this embodiment includes the features of embodiment 1, the distinguishing technical feature being that there are eight connecting plates 203 arranged in a circle;

[0027] By arranging the eight connecting plates 203 in a circle, it is easier for the operator to insert the housing mounting post of the device into the center of the eight connecting plates 203. At the same time, since the circle of the eight connecting plates 203 is smaller than the size of the mounting post, the eight connecting plates 203 are stretched open after installation. This allows the device to be more tightly connected to the printed circuit board 1 through the restoring force generated by the protective pad 202, and also facilitates the overall installation and use of the printed circuit board 1.

[0028] Among them, the bottom of each of the eight connecting plates 203 is set as a slope, and the eight connecting plates 203 are adjacent to each other in sequence;

[0029] When the printed circuit board 1 is installed as a whole, the inclined pressing mounting posts provided at the bottom of the eight connecting plates 203 make it easy to snap the equipment mounting posts into the inside of the eight connecting plates 203, making it convenient for installation.

[0030] The limiting ring 201 has a groove 204 inside, and a limiting rod 205 is provided inside the groove 204. The inner side of the limiting rod 205 extends to the inner cavity of the protective pad 202 and is connected to the outer side of the connecting plate 203.

[0031] When the printed circuit board 1 is subjected to vibration, the connecting plate 203 presses against the protective pad 202 to cushion it. At the same time, the connecting plate 203 drives the limiting rod 205 to move inside the groove 204, which cushions the connecting plate 203 as a whole, preventing displacement during subsequent reset that could affect its use. Furthermore, during the installation of the printed circuit board 1, the limiting rod 205 ensures that the protective pad 202 has a good supporting effect, preventing deformation of the protective pad 202 during the installation of the printed circuit board 1, which would complicate the installation process and affect installation efficiency.

[0032] Among them, a limit block is provided on the outer side of the movable block 208, and the outer side of the limit block is movably connected to the inner wall of the connecting frame 206;

[0033] When the printed circuit board 1 vibrates as a whole, the bolts and equipment mounting posts squeeze the movable block 208, causing the movable block 208 to move inside the connecting frame 206. The movable block 208 squeezes the protective ring 207, causing the protective ring 207 to deform and buffer the impact, thus preventing the printed circuit board 1 from being damaged as a whole.

[0034] Among them, there are two protective rings 207, and both protective rings 207 and protective pads 202 are made of rubber;

[0035] Because rubber has good elasticity, when subjected to external force, the rubber pad can undergo large elastic deformation, which allows it to absorb and disperse the energy of the external force, converting kinetic energy into elastic potential energy inside the rubber, and reducing the vibration transmitted to the printed circuit board 1.

[0036] The outer surface of the printed circuit board 1 is provided with a lead-tin alloy.

[0037] Lead-tin alloy has excellent conductivity, solderability, and oxidation resistance. Plating lead-tin on solder pads forms a coating that resists copper oxidation and provides good solderability, facilitating soldering operations. Lead-tin alloy melts at relatively low temperatures, making it easier to form a good bond with the solder pads. It ensures smooth current transmission between different parts of the printed circuit board. Since solder pads on printed circuit boards are typically made of copper, which is prone to oxidation in air, the resulting copper oxide reduces solderability and increases contact resistance, affecting the normal operation of the circuit. Plating a lead-tin layer isolates the copper solder pads from the air, effectively preventing copper oxidation, protecting the pads' performance, and extending the lifespan of the printed circuit board.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A lead-tin plated printed circuit board, comprising a printed circuit board (1), characterized in that: The printed circuit board (1) is provided with buffer components (2) at all four corners; The buffer assembly (2) includes a limiting ring (201), the outer surface of which is connected to the inner wall of the printed circuit board (1). A connecting frame (206) is provided above and below the limiting ring (201), and a protective ring (207) is provided on the inner wall of the connecting frame (206). A movable block (208) located outside the protective ring (207) is movably connected to the inner cavity of the connecting frame (206). A protective pad (202) is provided on the inner side of the limiting ring (201), and a connecting plate (203) is provided on the inner side of the protective pad (202).

2. The lead-tin plated printed circuit board with solder pads according to claim 1, characterized in that: There are eight connecting plates (203), which are arranged in a circle.

3. The lead-tin plated printed circuit board with solder pads according to claim 2, characterized in that: The bottom of each of the eight connecting plates (203) is set as a slope, and the eight connecting plates (203) are arranged in close succession.

4. The lead-tin plated printed circuit board with solder pads according to claim 1, characterized in that: The limiting ring (201) has a groove (204) inside, and a limiting rod (205) is provided inside the groove (204). The inner side of the limiting rod (205) extends to the inner cavity of the protective pad (202) and is connected to the outer side of the connecting plate (203).

5. The lead-tin plated printed circuit board with solder pads according to claim 1, characterized in that: A limiting block is provided on the outside of the movable block (208), and the outside of the limiting block is movably connected to the inner wall of the connecting frame (206).

6. The lead-tin plated printed circuit board with solder pads according to claim 1, characterized in that: Two protective rings (207) are provided, and both protective rings (207) and protective pads (202) are made of rubber.

7. The lead-tin plated printed circuit board with solder pads according to claim 1, characterized in that: The outer surface of the printed circuit board (1) is provided with a lead-tin alloy.

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