Multilayer buried blind hole circuit board structure

Abstract

The utility model relates to a multilayer buried blind hole circuit board structure, which comprises a multilayer circuit board and a shaping piece, a plurality of electronic devices are mounted on the surface of the multi-layer circuit board; the two sides of the multilayer circuit board are respectively provided with a fixing piece penetrating through the multilayer circuit board. One side of the multi-layer circuit board is also provided with a shaping piece for pressing and shaping the fixing piece; compared with the prior art, the multilayer circuit board has the advantages that the fixing holes are drilled in the two sides of the multilayer circuit board, the fixing pieces are inserted into the fixing holes, the fixing pieces are shaped through the shaping pieces, at the moment, the two sides of the multilayer circuit board can be reinforced, and the whole integrity of the multilayer circuit board is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and in particular to a multilayer buried blind via circuit board structure. Background Technology

[0002] Blind and buried via circuit boards, also known as HDI boards (high-density interconnect boards), are a special type of circuit board with blind and buried vias inside to connect the circuitry between different layers. Blind and buried via circuit boards are often used in high-end products, especially high-density electronic products with high requirements for size, weight, performance, and functional density. Due to the use of blind and buried via technology, the wiring of the circuit board can be more refined and dense, thereby improving the performance and stability of the entire electronic product.

[0003] Because blind and buried via circuit boards are made of multi-layer substrates, separation may occur between the substrates during long-term use or in harsh environments. Substrate separation is most likely to occur on both sides of the circuit board. Therefore, a multi-layer buried and blind via circuit board structure is proposed to address the above problem. Utility Model Content

[0004] In view of the above-mentioned problems in the prior art, the main purpose of this utility model is to provide a multi-layer buried blind via circuit board structure, in which fixing members are inserted into the inside of both sides of the circuit board, and the fixing members are shaped by the molding members to reinforce both sides of the multi-layer circuit board, which helps to ensure the overall integrity of the multi-layer circuit board.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a multilayer buried blind via circuit board structure, comprising a multilayer circuit board and a molding component;

[0006] Multiple electronic components are mounted on the surface of a multilayer circuit board;

[0007] Both sides of the multilayer circuit board are equipped with fasteners that penetrate the multilayer circuit board;

[0008] One side of the multilayer circuit board is also provided with a molding part for pressing and shaping the fixing part.

[0009] Furthermore, the fastener is cylindrical before it is fixed to the multilayer circuit board, and the two sides of the fastener are bucket-shaped after it is fixed to the multilayer circuit board.

[0010] Because blind and buried via circuit boards are made of multi-layer substrates, separation between the substrates may occur during long-term use or in harsh environments. Substrate separation is most likely to occur on both sides of the circuit board. Fixing holes are drilled on both sides of the multi-layer circuit board, and fixing components are inserted into the fixing holes. The fixing components are shaped by molding components. At this time, the two sides of the multi-layer circuit board can be reinforced, which helps to maintain the overall integrity of the multi-layer circuit board.

[0011] Furthermore, the molding part includes two sets of symmetrically arranged pressing plates, one end of each pressing plate is fixedly connected to a flexible connector, and the opposite side of each pressing plate is fixedly connected to a molding stage.

[0012] Furthermore, the same spring is fixedly connected to both sides of the pressing plate.

[0013] Furthermore, there are two shaping platforms, both of which are arranged in a gyroscope shape.

[0014] Furthermore, the flexible connectors are made of soft, flexible rubber sheets.

[0015] The molding part uses two sets of pressing plates, and a molding stage is set on one side of the pressing plate. The molding stage is inserted into both sides of the fixing part and force is applied. At this time, the two sides of the fixing part are opened, thereby effectively fixing the two sides of the multilayer circuit board.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] Fixing holes are drilled on both sides of the multilayer circuit board, and fixing parts are inserted into the fixing holes. The fixing parts are shaped by the molding part. At this time, the two sides of the multilayer circuit board can be reinforced, which helps to ensure the overall integrity of the multilayer circuit board.

[0018] The molding part uses two sets of pressing plates, and a molding stage is set on one side of the pressing plate. The molding stage is inserted into both sides of the fixing part and force is applied. At this time, the two sides of the fixing part are opened, thereby effectively fixing the two sides of the multilayer circuit board. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the structure of the molded part of this utility model;

[0021] Figure 3 This is a schematic diagram of the shaping platform structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the fixing component after molding according to this utility model.

[0023] Legend: 1. Multilayer circuit board; 2. Electronic components; 3. Fixing components; 4. Shaping components; 401. Pressing plate; 402. Flexible connecting plate; 403. Shaping stage; 404. Spring. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments. Example

[0025] A multilayer buried blind via circuit board structure, such as Figure 1-4 As shown, it includes a multilayer circuit board 1 and a molded part 4;

[0026] A variety of electronic devices 2 are mounted on the surface of the multilayer circuit board 1;

[0027] Both sides of the multilayer circuit board 1 are equipped with fasteners 3 that penetrate the multilayer circuit board 1;

[0028] One side of the multilayer circuit board 1 is also provided with a shaping part 4 for pressing and shaping the fixing part 3.

[0029] Before fixing the multilayer circuit board 1, the fastener 3 is arranged in a straight cylindrical shape. After fixing the multilayer circuit board 1, the two sides of the fastener 3 are arranged in a bucket shape.

[0030] Because blind and buried via circuit boards are made of multi-layer substrates, separation between the substrates may occur during long-term use or in harsh environments. Substrate separation is most likely to occur on both sides of the circuit board. Fixing holes are drilled on both sides of the multi-layer circuit board 1, and fixing parts 3 are inserted into the fixing holes. The fixing parts 3 are shaped by the shaping parts 4. At this time, the two sides of the multi-layer circuit board 1 can be reinforced, which helps to maintain the integrity of the multi-layer circuit board 1 as a whole.

[0031] When the molding part 4 shapes the fixing part 3, the two sides of the fixing part 3 are stretched open and set in an unfolded state. It is possible that the two sides of the fixing part 3 will crack, but it can still achieve the purpose of fixing the circuit board 1.

[0032] The shaping part 4 includes two sets of symmetrically arranged pressing plates 401. One end of each pressing plate 401 is fixedly connected to a flexible connector 402, and the opposite side of the pressing plate 401 is fixedly connected to a shaping stage 403.

[0033] The same spring 404 is fixedly connected to both sides of the pressing plate 401.

[0034] There are two shaping tables 403, both of which are arranged in a gyroscope shape.

[0035] The flexible connector 402 is made of a soft, flexible rubber sheet.

[0036] The molding part 4 uses two sets of pressing plates 401, and a molding stage 403 is provided on one side of the pressing plate 401. The molding stage 403 is inserted into the two sides of the fixing part 3 and force is applied. At this time, the two sides of the fixing part 3 are spread open, thereby effectively fixing the two sides of the multilayer circuit board 1. The two sides of the fixing part 3 are spread out and in close contact with the circuit board 1, which is used to fix the circuit board 1.

[0037] The spring 404 is used to reset the pressing plate 401 to ensure its subsequent use. The flexible connector 402 has a certain degree of toughness, which can drive the pressing plate 401 to rotate to a certain extent.

[0038] Finally, it should be noted that the above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A multilayer buried blind via circuit board structure, characterized in that: Includes a multilayer circuit board (1) and a molded part (4); A variety of electronic devices (2) are mounted on the surface of a multilayer circuit board (1); Both sides of the multilayer circuit board (1) are fitted with fasteners (3) that penetrate the multilayer circuit board (1). One side of the multilayer circuit board (1) is also provided with a molding part (4) for pressing and shaping the fixing part (3).

2. The multilayer buried blind via circuit board structure according to claim 1, characterized in that: Before fixing the multilayer circuit board (1), the fastener (3) is set in a straight cylindrical shape. After fixing the multilayer circuit board (1), the two sides of the fastener (3) are set in a bucket shape.

3. The multilayer buried blind via circuit board structure according to claim 1, characterized in that: The molding part (4) includes two sets of symmetrically arranged pressing plates (401). One end of each pressing plate (401) is fixedly connected to a flexible connector (402), and the opposite side of the pressing plate (401) is fixedly connected to a molding stage (403).

4. The multilayer buried blind via circuit board structure according to claim 3, characterized in that: The same spring (404) is fixedly connected to both sides of the pressing plate (401).

5. The multilayer buried blind via circuit board structure according to claim 3, characterized in that: There are two shaping tables (403), both of which are arranged in a gyroscope shape.

6. The multilayer buried blind via circuit board structure according to claim 3, characterized in that: The flexible connector (402) is made of a soft, flexible rubber sheet.

Images