Heat dissipation device

Abstract

The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device. The heat dissipation device is used for heat dissipation of the electronic equipment and comprises a main body area and a protruding area, and the protruding area is connected to one side of the main body area and protrudes relative to the main body area; the main body area is attached to the middle area of the back of the electronic equipment, and the protruding area is attached to a heating area on one side of the top of the back of the electronic equipment; a heat dissipation device is arranged in the protruding area. The heat dissipation device is divided into the main body area and the protruding area, the protruding area is connected to one side of the main body area and protrudes relative to the main body area, when the heat dissipation device is used, the main body area is attached to the middle area of the back of the electronic equipment, and the protruding area can be attached to a heating area on one side of the top of the back of the electronic equipment. And the heat dissipation device is arranged in the protruding area, so that a heating area on one side of the top of the back of the electronic equipment can be subjected to targeted heat dissipation, and the heat dissipation effect is better.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to a heat dissipation device. Background Technology

[0002] As the performance of electronic devices such as smartphones continues to improve, the problem of overheating has become increasingly serious. External heat dissipation devices for mobile phones have emerged to help users maintain a suitable temperature for their phones when under heavy load.

[0003] Current heat dissipation devices are generally installed directly on the back of electronic devices to dissipate heat, but such devices are not very targeted at the heat-generating areas and have poor heat dissipation effects. Utility Model Content

[0004] This utility model provides a heat dissipation device to solve the problem that the heat dissipation devices in the prior art are not targeted at the heat-generating locations and have poor heat dissipation effect.

[0005] This utility model discloses a heat dissipation device for heat dissipation of electronic devices, including a main body area and a protruding area. The protruding area is connected to one side of the main body area and protrudes from the main body area. The main body area is used to attach to the middle area of ​​the back of the electronic device, and the protruding area is used to attach to the heat-generating area on the top side of the back of the electronic device. A heat dissipation device is provided in the protruding area.

[0006] Optionally, the heat dissipation device includes an inner bracket and a base;

[0007] The heat dissipation device is installed on the protruding area of ​​the first side of the inner bracket, and the base is installed on the second side of the inner bracket in conjunction with the inner bracket; a liquid cooling channel is provided between the inner bracket and the base, and the liquid cooling channel flows through the protruding area of ​​the inner bracket on the second side.

[0008] Optionally, the heat dissipation device includes a wireless charging module installed in the main body area on the second side of the inner bracket; the liquid cooling channel flows through the main body area of ​​the inner bracket on the second side.

[0009] Optionally, the heat dissipation device also includes a circuit board connected to the wireless charging module; a sealed cavity is provided in the main body area between the base and the inner bracket, which is sealed and isolated from the liquid cooling channel, and the circuit board is installed in the sealed cavity.

[0010] Optionally, the heat dissipation device is provided with a liquid inlet and a liquid outlet; the liquid cooling channel is connected to the liquid inlet and then to the protruding area, and then from the protruding area to the main body area, and then around the side of the sealing cavity to the side of the main body area away from the protruding area and then connected to the liquid outlet.

[0011] Optionally, the liquid cooling channel on the side of the main body area away from the protruding area is arranged in a multi-segment reciprocating bend.

[0012] Optionally, the heat dissipation device also includes a conduit, which has an inlet channel and an outlet channel along the axial direction. The conduit is mounted on an inner support, with the inlet channel communicating with the inlet port and the outlet channel communicating with the outlet port.

[0013] Optionally, the conduit is provided with a wire channel along the axial direction, and the heat dissipation device includes a first wire, which is electrically connected to the circuit board; the first wire passes through the wire channel.

[0014] Optionally, a first mounting groove is provided at the protruding area on the first side of the inner bracket, and a second mounting groove is provided at the main body area on the first side of the inner bracket; the first mounting groove and the second mounting groove are connected by a first wire groove.

[0015] The heat dissipation device is a semiconductor cooling device; the heat dissipation device is installed in the first mounting slot, and the second wire of the heat dissipation device is laid from the first wire slot to the second mounting slot. The wireless charging module is installed in the second mounting slot.

[0016] The second mounting slot has a first wire passage opening and a second wire passage opening that connect to the sealed cavity; the second wire is electrically connected to the circuit board through the first wire passage opening, and the third wire of the wireless charging module is electrically connected to the circuit board through the second wire passage opening.

[0017] Optionally, a second wire groove is provided in the second mounting groove, and the second wire groove connects the wire channel and the first wire passage opening; after the first wire is electrically connected to the circuit board, it passes through the first wire passage opening and the second guide groove in sequence and enters the wire channel.

[0018] Compared with the prior art, the beneficial effects of the heat dissipation device provided by the present invention are as follows: The heat dissipation device of the present invention is divided into a main body area and a protruding area, wherein the protruding area is connected to one side of the main body area and protrudes relative to the main body area. In use, the main body area is attached to the middle area of ​​the back of the electronic device, while the protruding area can be attached to the heat-generating area on the top side of the back of the electronic device. Furthermore, a heat dissipation device is provided in the protruding area, which can perform targeted heat dissipation on the heat-generating area on the top side of the back of the electronic device, resulting in better heat dissipation effect. Attached Figure Description

[0019] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0020] Figure 1 This is a schematic diagram of the heat dissipation device according to an embodiment of the present invention;

[0021] Figure 2 This is an exploded view of the heat dissipation device according to an embodiment of the present invention;

[0022] Figure 3 This is another exploded view of the heat dissipation device according to an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the first side of the inner support in an embodiment of this utility model;

[0024] Figure 5 This is another schematic diagram of the first side of the inner support in an embodiment of this utility model;

[0025] Figure 6 This is a schematic diagram of the second side of the inner support in an embodiment of this utility model;

[0026] Figure 7 This is a schematic cross-sectional view of the inner tube in an embodiment of this utility model.

[0027] The labels for the attached figures are as follows:

[0028] 1. Main body area; 2. Protruding area; 3. Heat dissipation device; 31. Second wire; 4. Inner bracket; 41. First side; 42. Second side; 43. Liquid inlet; 44. Liquid outlet; 45. First mounting groove; 46. Second mounting groove; 461. First wire passage opening; 462. Second wire passage opening; 463. Second wire groove; 47. First wire groove; 5. Base; 6. Liquid cooling channel; 7. Wireless charging module; 8. Circuit board; 9. Sealed cavity; 10. Conduit; 101. Liquid inlet channel; 102. Liquid outlet channel; 103. Wire channel; 20. First wire; 30. Panel; 40. Pressure block. Detailed Implementation

[0029] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0030] This utility model embodiment provides a heat dissipation device, such as... Figure 1 As shown, the heat dissipation device is used for heat dissipation of electronic devices, including a main body area 1 and a protruding area 2. The protruding area 2 is connected to one side of the main body area 1 and protrudes from the main body area 1. The main body area 1 is used to attach to the middle area of ​​the back of the electronic device, and the protruding area 2 is used to attach to the heat-generating area on the top side of the back of the electronic device. A heat dissipation device 3 is provided in the protruding area 2.

[0031] The heat dissipation device of this utility model is divided into a main body area 1 and a protruding area 2. The protruding area 2 is connected to one side of the main body area 1 and protrudes from the main body area 1. In use, the main body area 1 is attached to the middle area of ​​the back of the electronic device, while the protruding area 2 can be attached to the heat-generating area on the top side of the back of the electronic device. Furthermore, a heat dissipation device 3 is provided in the protruding area 2, which can provide targeted heat dissipation to the heat-generating area on the top side of the back of the electronic device, resulting in better heat dissipation effect.

[0032] Specifically, in electronic devices such as mobile phones, heat-generating components like chips are often located on the inner side of the top back panel, for example, on the right side. In this case, the protruding area 2 design allows the heat dissipation device to be directly attached to the heat-generating area, such as the chip, on the top back panel of the electronic device. This design allows for targeted heat dissipation of the heat-generating area, resulting in better heat dissipation. Taking mobile phones as an example, heat-generating components like chips are typically located on the right side of the top back panel. The protruding area 2, positioned on the right side of the top back panel of the mobile phone, can directly dissipate heat from the heat-generating area, resulting in better and more direct heat dissipation.

[0033] Furthermore, such as Figure 2 , Figure 3 and Figure 6 As shown, the heat dissipation device includes an inner support 4 and a base 5. A heat dissipation device 3 is installed at the protruding area 2 on the first side 41 of the inner support 4, and the base 5 is installed on the second side 42 of the inner support 4 in conjunction with it. A liquid cooling channel 6 is provided between the inner support 4 and the base 5, and the liquid cooling channel 6 flows through the protruding area 2 of the inner support 4 on the second side 42. The liquid cooling channel 6, located between the inner support 4 and the base 5 and flowing through the protruding area 2, further enhances the heat dissipation effect. Liquid cooling technology efficiently conducts heat through the evaporation and condensation of coolant, forming an internal circulation to continuously disperse heat. The combined use of the liquid cooling channel 6 and the heat dissipation device 3 enables efficient heat dissipation within a limited space, meeting the needs of equipment miniaturization and high performance. Specifically, the liquid cooling channel 6 can be used to introduce liquid cooling liquids such as water, ethylene glycol aqueous solution, propylene glycol aqueous solution, and mineral oil. The overall sealing performance of the liquid cooling channel 6 can be improved by setting a sealing ring around its perimeter. The first side 41 and the second side 42 are two opposite sides of the inner bracket 4. When in use, the first side 41 is close to the back of the electronic device, and the second side 42 is away from the back of the electronic device.

[0034] The heat dissipation device also includes a panel 30, which is mounted on the first side 41 of the inner bracket 4 and covers the first side 41 of the inner bracket 4. The base 5 and the inner bracket 4 can be fixed together by screws, and the panel 30 can be attached to the first side 41 of the inner bracket 4 by glue or the like.

[0035] Furthermore, such as Figure 4As shown, the heat dissipation device includes a wireless charging module 7, which is installed in the main body area 1 on the second side 42 of the inner bracket 4; the liquid cooling channel 6 flows through the main body area 1 of the inner bracket 4 on the second side 42. This solution combines the heat dissipation device with the wireless charging module 7, realizing the integration of heat dissipation and wireless charging functions. During the use of electronic devices, it can not only effectively dissipate heat from the device, but also perform wireless charging at the same time, improving the convenience of using the device. For example, when using a mobile phone, the user does not need to connect an additional charging cable; simply place the phone on the heat dissipation device to dissipate heat while charging, reducing the constraints of cables and improving the user experience. The liquid cooling channel 6 flows through the main body area 1 of the inner bracket 4, which can dissipate heat from the wireless charging module 7 and the heat-generating areas near the main body area 1. A certain amount of heat is generated during wireless charging, and the liquid cooling channel 6 can conduct and disperse this heat in a timely manner, preventing heat accumulation and overheating of the device. At the same time, the liquid cooling channel 6 can also play a good role in dissipating heat from the heat-generating components in the middle area of ​​the back of the electronic device attached to the main body area 1, further improving the heat dissipation efficiency and effect of the entire heat dissipation device and ensuring the stable operation of the electronic device during wireless charging.

[0036] Combination Figure 3 and Figure 6 As shown, the heat dissipation device also includes a circuit board 8, which is connected to the wireless charging module 7. A sealed cavity 9, which is sealed and isolated from the liquid cooling channel 6, is provided in the main body area 1 between the base 5 and the inner support 4. The circuit board 8 is installed in the sealed cavity 9. The circuit board 8, connected to the wireless charging module 7, is a key component for realizing the wireless charging function. Installing it in the sealed cavity 9 in the main body area 1 between the base 5 and the inner support 4 effectively prevents the liquid cooling liquid in the liquid cooling channel 6 from contacting the circuit board 8. The liquid cooling liquid may be conductive or corrode the electronic components on the circuit board 8. The design of the sealed cavity 9 provides a sealed and dry environment for the circuit board 8, ensuring the stable operation of the circuit board 8 during the operation of the heat dissipation device. A sealing ring can be provided at the edge of the sealed cavity 9 to improve the sealing performance of the sealed cavity 9 and ensure the sealed isolation between the liquid cooling channel 6 and the sealed cavity 9.

[0037] The heat dissipation device is equipped with a liquid inlet 43 and a liquid outlet 44. The liquid cooling channel 6 connects to the liquid inlet 43 and then extends to the protruding area 2. From there, it extends to the main body area 1, and then around the side of the sealed cavity 9 to the side of the main body area 1 away from the protruding area 2 before connecting to the liquid outlet 44. The liquid cooling channel 6, connecting from the liquid inlet 43 to the protruding area 2, can immediately dissipate heat from heat-generating components within the protruding area 2 (such as high-heat-generating chips on the top side of the back of the electronic device). Because the protruding area 2 is designed for specific heat-generating areas of the electronic device, where heat is often most concentrated, the coolant flows through this area first, quickly absorbing a large amount of heat and effectively reducing the temperature of that area. Subsequently, the liquid cooling channel 6 extends from the protruding area 2 to the main body area 1, continuing to dissipate heat from the middle area of ​​the back of the electronic device attached to the main body area 1. This achieves comprehensive coverage of the key heat-generating areas on the back of the electronic device, making heat dissipation more uniform and efficient.

[0038] The liquid cooling channel 6, bypassing the sealed cavity 9, extends to the side of the main body area 1 away from the protruding area 2 and then connects to the liquid outlet 44. This path design ensures that the coolant flows fully throughout the entire main body area 1 of the heat dissipation device, leaving no dead zones for heat dissipation. Even the side of the main body area 1 away from the protruding area 2 can receive effective heat dissipation, avoiding overheating caused by poor local heat dissipation. This further improves the heat dissipation efficiency and effect of the entire heat dissipation device, ensuring the stability and reliability of electronic equipment under various operating conditions.

[0039] Specifically, the liquid inlet 43 and the liquid outlet 44 are located on the side of the main body area 1 on the second side 42 of the inner support 4.

[0040] Furthermore, the liquid cooling channel 6 on the side of the main body area 1 away from the protruding area 2 is arranged in a multi-segment reciprocating bend. This multi-segment reciprocating bend design significantly extends the flow path of the coolant on the side of the main body area 1 away from the protruding area 2. This tortuous path increases the contact area between the coolant and the inner support 4 and the base 5, thereby improving heat exchange efficiency. In the same amount of time, the coolant can absorb more heat, more effectively conducting and dispersing the heat in the middle area of ​​the back of the electronic device, further enhancing the heat dissipation effect of the heat dissipation device in this area, making the heat dissipation of the entire back of the electronic device more uniform. Although the side away from the protruding area 2 is not the main heat-generating area, it still generates some heat during device operation. The multi-segment reciprocating bend liquid cooling channel 6 can provide more intensive heat dissipation treatment in this area, enhancing the local heat dissipation effect.

[0041] Further integration Figure 7As shown, the heat dissipation device also includes a conduit 10, which has an inlet channel 101 and an outlet channel 102 arranged axially. The conduit 10 is mounted on the inner support 4. The inlet channel 101 communicates with the inlet port 43, and the outlet channel 102 communicates with the outlet port 44. The inlet channel 101 can accurately guide the coolant to the starting end of the liquid cooling channel 6, i.e., the protruding area 2, ensuring that the flow path of the coolant in the heat dissipation device is rationally planned from the beginning. The outlet channel 102 guides the cooled coolant out of the heat dissipation device in an orderly manner, avoiding disordered flow or local accumulation of coolant inside the heat dissipation device, improving the efficiency and stability of coolant circulation, and ensuring the continuous and efficient operation of the heat dissipation device. The conduit 10 can be mounted on one side of the inner support 4 using a clamping block 40 and screws.

[0042] Furthermore, the conduit 10 has a wire channel 103 arranged axially. The heat dissipation device includes a first wire 20, which is electrically connected to the circuit board 8; the first wire 20 passes through the wire channel 103. Integrating the wire channel 103 into the conduit 10 reduces the need for separate wire conduits. This integrated design makes the structure of the heat dissipation device simpler. The wires passing through the wire channel 103 are also effectively protected. After exiting the conduit 10, the first wire 20 is connected to a power source to supply power to the heat dissipation device.

[0043] Further integration Figure 4 and Figure 5 As shown, a first mounting groove 45 is provided at the protruding area 2 of the first side 41 of the inner bracket 4, and a second mounting groove 46 is provided at the main body area 1 of the first side 41 of the inner bracket 4; the first mounting groove 45 and the second mounting groove 46 are connected by a first wire groove 47. The heat dissipation device 3 is a semiconductor cooling device; the heat dissipation device 3 is installed in the first mounting groove 45, and the second wire 31 of the heat dissipation device 3 is laid from the first wire groove 47 to the second mounting groove 46. The wireless charging module 7 is installed in the second mounting groove 46. The second mounting groove 46 has a first wire passage opening 461 and a second wire passage opening 462 that connects to the sealed cavity 9; the second wire 31 is electrically connected to the circuit board 8 through the first wire passage opening 461, and the third wire of the wireless charging module 7 is electrically connected to the circuit board 8 through the second wire passage opening 462.

[0044] By creating a first mounting slot 45 and a second mounting slot 46 on the inner bracket 4 and connecting them via a first wire channel 47, a reasonable layout of the semiconductor cooling component and the wireless charging module 7 is achieved. This design makes the internal structure of the heat dissipation device more compact, reduces space waste, and improves space utilization. The first wire channel 47 allows the second wire 31 to be laid orderly from the first mounting slot 45 to the second mounting slot 46, avoiding messy wire arrangement. The wire channel can effectively protect the wires, preventing them from being mechanically damaged during installation and use. The first wire passage opening 461 and the second wire passage opening 462 allow the second wire 31 and the third wire to be safely connected to the circuit board 8 through the sealed cavity 9, simplifying wiring. Furthermore, the design of the first mounting slot 45 and the second mounting slot 46 makes the installation of the heat dissipation device 3 and the wireless charging module 7 more convenient. During assembly, simply install the semiconductor cooling component and the wireless charging module 7 in the first mounting slot 45 and the second mounting slot 46 respectively, and then connect the wires to the circuit board 8 through the wire channel and the wire passage opening to complete the assembly. The semiconductor cooling component and the wireless charging module 7 can be fixed in the first mounting slot 45 and the second mounting slot 46 by adhesive or the like.

[0045] Furthermore, a second wire guide groove 463 is provided in the second mounting slot 46, which connects the wire guide channel 103 and the first wire passage opening 461. After the first wire 20 is electrically connected to the circuit board 8, it passes through the first wire passage opening 461 and the second guide groove in sequence before entering the wire guide channel 103. After the first wire 20 is connected to the circuit board 8, it enters the second wire guide groove 463 through the first wire passage opening 461 and then passes through the wire guide channel 103. This design avoids messy wiring inside the heat dissipation device, reduces mutual interference between wires, and improves wire management efficiency. The design of the second wire guide groove 463 makes wire installation more convenient. During assembly, the first wire 20 only needs to pass through the first wire passage opening 461 and the second wire guide groove 463 in sequence, and then pass through the wire guide channel 103 to complete the wire arrangement. This design simplifies the installation steps and improves production efficiency.

[0046] It should be understood that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of this utility model.

Claims

1. A heat dissipation device for heat dissipation in electronic equipment, characterized in that, It includes a main body area and a protruding area, the protruding area being connected to one side of the main body area and protruding relative to the main body area; the main body area is used to attach to the middle area of ​​the back of the electronic device, and the protruding area is used to attach to the heat-generating area on the top side of the back of the electronic device; a heat dissipation device is provided in the protruding area.

2. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device includes an inner support and a base; The heat dissipation device is installed at the protruding area on the first side of the inner bracket, and the base is installed on the second side of the inner bracket in conjunction with the inner bracket; a liquid cooling channel is provided between the inner bracket and the base, and the liquid cooling channel flows through the protruding area of ​​the inner bracket on the second side.

3. The heat dissipation device according to claim 2, characterized in that, The heat dissipation device includes a wireless charging module, which is installed on the main body area on the second side of the inner bracket; the liquid cooling channel flows through the main body area of ​​the inner bracket on the second side.

4. The heat dissipation device according to claim 3, characterized in that, The heat dissipation device also includes a circuit board, which is connected to the wireless charging module; a sealed cavity is provided in the main body area between the base and the inner support, which is sealed and isolated from the liquid cooling channel, and the circuit board is installed in the sealed cavity.

5. The heat dissipation device according to claim 4, characterized in that, The heat dissipation device is provided with a liquid inlet and a liquid outlet; the liquid cooling channel is connected to the liquid inlet and then to the protruding area, and then from the protruding area to the main body area, and then around the side of the sealing cavity to the side of the main body area away from the protruding area and then connected to the liquid outlet.

6. The heat dissipation device according to claim 5, characterized in that, The liquid cooling channel on the side of the main body area away from the protruding area is arranged in a multi-segment reciprocating bend.

7. The heat dissipation device according to claim 5, characterized in that, The heat dissipation device also includes a conduit, which has an inlet channel and an outlet channel along the axial direction. The conduit is mounted on the inner support, and the inlet channel is connected to the inlet port, while the outlet channel is connected to the outlet port.

8. The heat dissipation device according to claim 7, characterized in that, The conduit is provided with a wire channel along the axial direction, and the heat dissipation device includes a first wire, which is electrically connected to the circuit board; the first wire passes through the wire channel.

9. The heat dissipation device according to claim 8, characterized in that, A first mounting groove is provided at the protruding area on the first side of the inner bracket, and a second mounting groove is provided at the main body area on the first side of the inner bracket; the first mounting groove and the second mounting groove are connected by a first wire groove. The heat dissipation device is a semiconductor cooling device; the heat dissipation device is installed in the first mounting slot, the second wire of the heat dissipation device is laid from the first wire slot to the second mounting slot, and the wireless charging module is installed in the second mounting slot; The second mounting groove has a first wire passage opening and a second wire passage opening that communicate with the sealed cavity; The second wire is electrically connected to the circuit board through the first wire opening, and the third wire of the wireless charging module is electrically connected to the circuit board through the second wire opening.

10. The heat dissipation device according to claim 9, characterized in that, The second mounting slot has a second wire groove, which connects the wire channel and the first wire opening. After the first wire is electrically connected to the circuit board, it passes through the first wire opening and the second guide groove in sequence and enters the wire channel.

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