Waste chip suction device for flip wafer frame

Abstract

The utility model relates to a waste chip suction device for a flip wafer frame. The waste chip suction device comprises a supporting frame, a mounting plate, a fixing plate, a bearing plate, a bearing table, a suction assembly, a collecting assembly and a detection camera. And the mounting plate is adjustably arranged on the support frame. The fixing plate is arranged on the mounting plate and can controllably move in a reciprocating mode in the vertical direction, a cam plate is arranged on one side of the top of the fixing plate, and a first hanging rod is arranged on the other side of the fixing plate. The bearing plate is arranged on the fixing plate and rotationally connected with the fixing plate. The bearing table is arranged on the bearing plate and can be controlled to reciprocate in the axis direction of the bearing plate, a rolling cam matched with the cam plate and a second hanging rod are arranged on the bearing table, and a limiting spring is hung between the first hanging rod and the second hanging rod. The suction removal assembly is arranged at the top of the bearing table and used for suction removal of the waste chips. The collecting assembly is arranged at the top of the fixing plate and used for being matched with the suction removal assembly to collect the waste chips. The detection camera is arranged at the bottom of the mounting plate.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically to a waste chip removal device for flip-chip wafer frames. Background Technology

[0002] Existing wafer frame scrap chip removal methods mostly employ "front-side rejection," where chips are ejected from the bottom up using ejector pins or directly picked up from the top down using a suction nozzle. However, because it is difficult for the suction nozzle to avoid obstructing the field of view of the inspection camera above the frame before and after removal, the nozzle positioning is inaccurate, rejection efficiency is low, and yield is reduced, making it difficult to meet the requirements of high precision and high reliability automation. Utility Model Content

[0003] The purpose of this invention is to provide a waste chip removal device for flip-chip wafer frames. Through the cooperation of a rolling cam, a cam plate, and a limiting spring, the support platform moves obliquely upward during the lifting process. This allows the removal component on the support platform to avoid the optical axis of the detection camera in the initial position, and also guides the removal component to the suction position directly below the waste chip of the flip-chip wafer frame for removal, thereby improving the positioning accuracy and reliability of waste chip removal.

[0004] To achieve the above objectives, this utility model provides a waste chip removal device for flip-chip wafer frames, comprising:

[0005] Support frame;

[0006] Mounting plate, adjustablely mounted on the support frame;

[0007] A fixed plate is mounted on the mounting plate and can be moved vertically in a controlled manner. A cam plate is provided on one side of the top of the fixed plate. The side edge of the cam plate is divided into an oblique section and a vertical section. A first hanging rod is provided on the other side of the fixed plate.

[0008] A support plate is disposed on the fixed plate and rotatably connected to the fixed plate;

[0009] A support platform is mounted on the support plate and can be reciprocated in a controllable manner along the axis of the support plate. The support platform is provided with a rolling cam that cooperates with the cam plate and a second hanging rod. A limit spring is hung between the first hanging rod and the second hanging rod.

[0010] A suction component, located on top of the support stage, is used to suction out waste chips from the flip-chip frame;

[0011] A collection component is disposed on the top of the fixed plate and is used to cooperate with the suction component to collect waste chips;

[0012] The detection camera is located at the bottom of the mounting plate.

[0013] Optionally, the waste chip removal device for the flip-chip wafer frame further includes a primary drive assembly for driving the fixing plate to reciprocate vertically, the primary drive assembly comprising:

[0014] A rotary motor is mounted at one end of the mounting plate;

[0015] A timing pulley is located at the other end of the mounting plate, and a timing belt is fitted between the timing pulley and the rotary motor.

[0016] The first slide rail is vertically mounted on the mounting plate;

[0017] The first slide is slidably mounted on the first slide rail, the first slide is locked onto the timing belt, and the fixing plate is mounted on the first slide.

[0018] Optionally, the waste chip removal device for flip-chip wafer frames further includes a secondary drive assembly for reciprocating the carrier stage along the axis of the carrier plate, the secondary drive assembly comprising:

[0019] A drive cylinder and a second slide rail are mounted on the support plate, and the movable end of the drive cylinder abuts against the support platform located above it.

[0020] The second slide is slidably mounted on the second slide rail, and the support platform is mounted on the second slide.

[0021] The secondary drive assembly is configured to move the support platform upward via the drive cylinder so that the rolling cam passes through the inclined section and the vertical section of the cam plate respectively.

[0022] Optionally, the suction component includes:

[0023] Fixture;

[0024] A vacuum chamber is mounted on the fixed frame and can reciprocate horizontally.

[0025] A vacuum nozzle is disposed at the top of the vacuum chamber and is used to remove waste chips. A buffer spring is provided between the vacuum nozzle and the vacuum chamber for cushioning.

[0026] Optionally, the collection component includes:

[0027] A collection chamber is provided on the top of the fixed plate, and an air intake is provided on the top side of the collection chamber;

[0028] A connecting plate is disposed at the top of the collection chamber and has an inverted L-shaped structure. The connecting plate and the air inlet form a receiving cavity for accommodating the vacuum nozzle.

[0029] An air-blowing connector, located on the connecting plate, is used to cooperate with the air intake to collect waste chips adsorbed on the vacuum nozzle.

[0030] Optionally, the waste chip removal device for the flip-chip wafer frame further includes a fine-tuning component for adjusting the position of the mounting plate, the fine-tuning component comprising:

[0031] The first movable plate is mounted on the support frame and can move along the first horizontal direction;

[0032] A connecting piece is disposed between the support frame and the first movable plate, for fixing the first movable plate with screws;

[0033] A support boss is provided at the end of the first movable plate, and a support groove is provided on the side of the mounting plate, with the support boss located in the support groove;

[0034] The second movable plate is disposed on the first movable plate and can move along a second horizontal direction perpendicular to the first horizontal direction. The second movable plate is fixed to the first movable plate by screws, and the mounting plate is connected to the end of the second movable plate.

[0035] Optionally, a light source is provided next to the detection camera.

[0036] The beneficial effects of this utility model are as follows: through the cooperation of the rolling cam, cam plate and limiting spring, the support platform moves obliquely upward during the lifting process. This not only allows the suction component on the support platform to avoid the optical axis of the detection camera in the initial position, but also guides the suction component to the suction position directly below the waste chip of the flip wafer frame for the suction of the waste chip, thereby improving the positioning accuracy and reliability of waste chip suction.

[0037] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0038] Figure 1 This is a schematic structural plan view of a waste chip removal device for flip-chip wafer frames according to an embodiment of the present invention;

[0039] Figure 2 This is a first schematic three-dimensional structural diagram of a waste chip removal device for flip-chip wafer frames according to an embodiment of the present invention;

[0040] Figure 3This is a schematic structural diagram of the support platform of a waste chip removal device for a flip-chip wafer frame according to an embodiment of the present invention;

[0041] Figure 4 This is a second schematic three-dimensional structural diagram of a waste chip removal device for a flip-chip wafer frame according to an embodiment of the present invention;

[0042] Figure 5 This is a schematic structural diagram of the suction component and collection component of a waste chip suction device for a flip-chip wafer frame according to an embodiment of the present invention;

[0043] In the diagram: 1. Support frame; 2. Mounting plate; 3. Fixing plate; 31. Cam plate; 311. Inclined section; 312. Vertical section; 32. First hanging rod; 33. Rotating shaft; 4. Bearing plate; 5. Bearing platform; 51. Rolling cam; 52. Second hanging rod; 6. Suction assembly; 61. Fixing frame; 62. Vacuum chamber; 63. Vacuum nozzle; 64. Third slide table; 65. Third slide rail; 7. Collection assembly; 71. Collection chamber; 72. Connecting plate; 73. Air blowing connector; 74. 75. Intake port; 8. Receptacle cavity; 9. Detection camera; 9. Primary drive assembly; 91. Rotary motor; 92. Synchronous pulley; 93. First slide rail; 94. First slide table; 95. Synchronous belt; 10. Secondary drive assembly; 101. Drive cylinder; 102. Second slide rail; 103. Second slide table; 11. Fine-tuning assembly; 111. First moving plate; 112. Connecting piece; 113. Support boss; 114. Second moving plate; 115. Support groove; 12. Light source. Detailed Implementation

[0044] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0045] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0046] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0047] Please see Figures 1 to 5 A preferred embodiment of this application shows a waste chip removal device for flip-chip wafer frames, comprising a support frame 1, a mounting plate 2, a fixing plate 3, a carrier plate 4, a carrier stage 5, a removal assembly 6, a collection assembly 7, and a detection camera 8. The mounting plate 2 is adjustablely mounted on the support frame 1. The fixing plate 3 is mounted on the mounting plate 2 and can be controllably moved vertically back and forth. A cam plate 31 is provided on one side of the top of the fixing plate 3, and the side edge of the cam plate 31 is divided into an inclined section 311 and a vertical section 312. A first hanging rod 32 is provided on the other side of the fixing plate 3. The carrier plate 4 is mounted on the fixing plate 3 and is rotatably connected to the fixing plate 3 via a rotating shaft 33. The carrier stage 5 is mounted on the carrier plate 4 and can be controllably moved back and forth along the axis of the carrier plate 4. The carrier stage 5 is provided with a rolling cam 51 that cooperates with the cam plate 31 and a second hanging rod 52. A limit spring is suspended between the first hanging rod 32 and the second hanging rod 52. The suction assembly 6 is located on top of the carrier stage 5 and is used to suction out waste chips from the flip-chip frame. The collection assembly 7 is located on top of the mounting plate 3 and is used in conjunction with the suction assembly 6 to collect the waste chips. The inspection camera 8 is located at the bottom of the mounting plate 2.

[0048] According to the solution of this utility model embodiment, through the cooperation of the rolling cam 51, the cam plate 31 and the limiting spring, the support platform 5 moves obliquely upward during the rising process. This allows the suction component 6 on the support platform 5 to avoid the optical axis of the detection camera 8 in the initial position, and also guides the suction component 6 to the suction position directly below the waste chip of the flip wafer frame for the suction of the waste chip, thereby improving the positioning accuracy and reliability of the waste chip suction.

[0049] The following detailed description uses specific examples:

[0050] Specifically, please see Figures 1 to 4The waste chip removal device also includes a primary drive assembly 9 for driving the fixed plate 3 to reciprocate vertically and a secondary drive assembly 10 for driving the support platform 5 to reciprocate along the axis of the support plate 4. The primary drive assembly 9 includes a rotary motor 91, a synchronous belt 95 pulley 92, a first slide rail 93, and a first slide table 94. The rotary motor 91 is located at one end of the mounting plate 2. The synchronous belt 95 pulley 92 is located at the other end of the mounting plate 2, and a synchronous belt 95 is fitted between the synchronous belt 95 pulley 92 and the rotary motor 91. The first slide rail 93 is vertically mounted on the mounting plate 2. The first slide table 94 is slidably mounted on the first slide rail 93 and is engaged with the synchronous belt 95. The fixed plate 3 is mounted on the first slide table 94. The secondary drive assembly 10 includes a drive cylinder 101, a second slide rail 102, and a second slide table 103. The drive cylinder 101 and the second slide rail 102 are mounted on the support plate 4, and the movable end of the drive cylinder 101 abuts against the support platform 5 located above it. The second slide 103 is slidably mounted on the second slide rail 102, and the support platform 5 is mounted on the second slide 103. The secondary drive assembly 10 is configured to drive the support platform 5 upward via the drive cylinder 101 so that the rolling cam 51 passes through the inclined section 311 and the vertical section 312 of the cam plate 31 respectively.

[0051] It should be noted that because the limiting spring applies a limiting force to the support platform 5 toward the other side of the fixed plate 3, the support platform 5 will always move in close contact with the cam plate 31. When the rolling cam 51 passes through the inclined section 311 of the cam plate 31, the suction component 6 on the support platform 5 moves obliquely upwards in sync. At the same time, the support plate 4, which is connected to the support platform 5 through the second slide table 103 and the second slide rail 102, will rotate synchronously to prevent motion interference. When the rolling cam 51 passes through the vertical section 312 of the cam plate 31, the suction component 6 moves upwards in sync to reach directly below the waste chip.

[0052] Specifically, please see Figure 5 The suction assembly 6 includes a mounting frame 61, a vacuum chamber 62, and a vacuum nozzle 63. The vacuum chamber 62 is mounted on the mounting frame 61 and can reciprocate horizontally. Specifically, in this embodiment, the vacuum chamber 62 reciprocates horizontally via a third slide table 64 and a third slide rail 65. This arrangement provides buffer protection for the vacuum chamber 62 under external force in the first horizontal direction. The vacuum nozzle 63 is located at the top of the vacuum chamber 62 and is used to remove waste chips. A buffer spring is provided between the vacuum nozzle 63 and the vacuum chamber 62 for cushioning. By providing the buffer spring, when the vacuum nozzle 63 exceeds a preset lifting stroke and collides with the waste chips on the flip-chip wafer frame, the vacuum nozzle 63 is buffered, preventing damage to the vacuum nozzle 63 or the waste chips.

[0053] Specifically, please see Figure 5The collection assembly 7 includes a collection chamber 71, a connecting plate 72, and an air blowing connector 73. The collection chamber 71 is located on top of the fixed plate 3, and an air intake 74 is provided on the top side of the collection chamber 71. The connecting plate 72 is located on top of the collection chamber 71 and has an inverted L-shaped structure. The connecting plate 72 and the air intake 74 form a receiving cavity 75 for accommodating the vacuum nozzle 63. The air blowing connector 73 is located on the connecting plate 72 and is used to cooperate with the air intake 74 to collect the waste chips adsorbed on the vacuum nozzle 63. After the vacuum nozzle 63 adsorbs the waste chips and returns to the initial discharge position (i.e., back to the receiving cavity 75), the air blowing connector 73 blows air to separate the waste chips, and the air intake 74 sucks them into the collection chamber 71, where they fall into the collection box connected to the collection chamber 71 to complete the collection.

[0054] Further, please see Figure 2 and Figure 4 The waste chip removal device also includes a fine-tuning component 11 for adjusting the position of the mounting plate 2. The fine-tuning component 11 includes a first movable plate 111, a connecting piece 112, a support boss 113, and a second movable plate 114. The first movable plate 111 is mounted on the support frame 1 and can move along a first horizontal direction. The connecting piece 112 is located between the support frame 1 and the first movable plate 111 and is used to fix the first movable plate 111 with screws. The support boss 113 is located at the end of the first movable plate 111, and a support groove 115 is provided on the side of the mounting plate 2, with the support boss 113 located within the support groove 115. The second movable plate 114 is mounted on the first movable plate 111 and can move along a second horizontal direction perpendicular to the first horizontal direction. The second movable plate 114 is fixed to the first movable plate 111 with screws, and the mounting plate 2 is connected to the end of the second movable plate 114.

[0055] It should be noted that after the flip-chip wafer frame moves to the target suction position, the inspection camera 8 first captures and identifies the position of the ejector pins above the frame and provides the corresponding coordinates. Based on this, the mounting plate 2 is finely corrected and locked along the X and Y axes by manually adjusting the screws of the fine-tuning component 11 to ensure that the vacuum nozzle 63 is aligned with the center line of the ejector pins after reaching the suction position. Then, the rotary motor 91 is started, which drives the first slide table 94 to move vertically upward along the first slide rail 93 via the synchronous belt 95, driving the fixed plate 3 and the carrier plate 4 to rise synchronously to the predetermined stroke and stop. Immediately afterwards, the drive cylinder 101 is started to push the carrier stage 5 along the axis of the carrier plate 4. As the device moves upward, under the action of the limiting spring, the rolling cam 51 on the support platform 5 rolls close to the cam plate 31, guiding the vacuum nozzle 63 to move precisely along the oblique trajectory to directly below the waste chip. With the help of the ejector pin pushing the chip downward, negative pressure is applied to the vacuum nozzle 63 to adsorb the chip. When the drive cylinder 101 returns, the limiting spring pulls the support platform 5 and the vacuum nozzle 63 back to the initial discharge position. Through the coordinated action of the air blowing connector 73 and the air suction port 74, the chip is blown off and sucked into the collection box. Finally, the detection camera 8 takes another picture to confirm whether the waste chip has been successfully removed. If it is not successful, the system alarms and prompts manual intervention.

[0056] Furthermore, a light source 12 is provided next to the detection camera 8. Adding a light source 12 next to the detection camera 8 can improve the lighting conditions in the top view area of ​​the frame, improve the imaging contrast and detection accuracy of the camera, and ensure accurate and reliable judgment of the state before and after rejection.

[0057] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A waste chip removal device for flip-chip wafer frames, characterized in that, include: Support frame; Mounting plate, adjustablely mounted on the support frame; A fixed plate is mounted on the mounting plate and can be moved vertically in a controlled manner. A cam plate is provided on one side of the top of the fixed plate. The side edge of the cam plate is divided into an oblique section and a vertical section. A first hanging rod is provided on the other side of the fixed plate. A support plate is disposed on the fixed plate and rotatably connected to the fixed plate; A support platform is mounted on the support plate and can be reciprocated in a controllable manner along the axis of the support plate. The support platform is provided with a rolling cam that cooperates with the cam plate and a second hanging rod. A limit spring is hung between the first hanging rod and the second hanging rod. A suction component, located on top of the support stage, is used to suction out waste chips from the flip-chip frame; A collection component is disposed on the top of the fixed plate and is used to cooperate with the suction component to collect waste chips; The detection camera is located at the bottom of the mounting plate.

2. The waste chip removal device for flip-chip wafer frames according to claim 1, characterized in that, It also includes a primary drive assembly for driving the fixed plate to reciprocate vertically, the primary drive assembly comprising: A rotary motor is mounted at one end of the mounting plate; A timing pulley is located at the other end of the mounting plate, and a timing belt is fitted between the timing pulley and the rotary motor. The first slide rail is vertically mounted on the mounting plate; The first slide is slidably mounted on the first slide rail, the first slide is locked onto the timing belt, and the fixing plate is mounted on the first slide.

3. The waste chip removal device for flip-chip wafer frames according to claim 1, characterized in that, It also includes a secondary drive assembly for reciprocating the support platform along the axis of the support plate, the secondary drive assembly comprising: A drive cylinder and a second slide rail are mounted on the support plate, and the movable end of the drive cylinder abuts against the support platform located above it. The second slide is slidably mounted on the second slide rail, and the support platform is mounted on the second slide. The secondary drive assembly is configured to move the support platform upward via the drive cylinder so that the rolling cam passes through the inclined section and the vertical section of the cam plate respectively.

4. The waste chip removal device for flip-chip wafer frames according to claim 1, characterized in that, The suction component includes: Fixture; A vacuum chamber is mounted on the fixed frame and can reciprocate horizontally. A vacuum nozzle is disposed at the top of the vacuum chamber and is used to remove waste chips. A buffer spring is provided between the vacuum nozzle and the vacuum chamber for cushioning.

5. The waste chip removal device for flip-chip wafer frames according to claim 4, characterized in that, The collection component includes: A collection chamber is provided on the top of the fixed plate, and an air intake is provided on the top side of the collection chamber; A connecting plate is disposed at the top of the collection chamber and has an inverted L-shaped structure. The connecting plate and the air inlet form a receiving cavity for accommodating the vacuum nozzle. An air-blowing connector, located on the connecting plate, is used to cooperate with the air intake to collect waste chips adsorbed on the vacuum nozzle.

6. The waste chip removal device for flip-chip wafer frames according to claim 1, characterized in that, It also includes a fine-tuning component for adjusting the position of the mounting plate, the fine-tuning component comprising: The first movable plate is mounted on the support frame and can move along the first horizontal direction; A connecting piece is disposed between the support frame and the first movable plate, for fixing the first movable plate with screws; A support boss is provided at the end of the first movable plate, and a support groove is provided on the side of the mounting plate, with the support boss located in the support groove; The second movable plate is disposed on the first movable plate and can move along a second horizontal direction perpendicular to the first horizontal direction. The second movable plate is fixed to the first movable plate by screws, and the mounting plate is connected to the end of the second movable plate.

7. The waste chip removal device for flip-chip wafer frames according to claim 1, characterized in that, A light source is installed next to the detection camera.

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