Wafer cleaning equipment

Abstract

The utility model discloses wafer cleaning equipment which is characterized in that a wafer is cleaned through an equipment body, and a clamping plug used for bearing the wafer is arranged in the equipment body, so that the wafer can be cleaned in the equipment body; a fixing assembly is arranged in the equipment body and located below the clamping plug, an auxiliary cleaning assembly is rotationally connected into the fixing assembly and used for making contact with the edge of the wafer, and the auxiliary cleaning assembly is driven to rotate through a driving assembly, so that in the wafer cleaning process, the wafer is cleaned through rotation of the auxiliary cleaning assembly, and the wafer is cleaned more conveniently. The wafer is driven to rotate synchronously in the clamping plug, so that a cleaning blind area generated by contact between the wafer and the clamping plug is reduced, the cleaning process of the wafer is more comprehensive, the cleanliness of the wafer is improved, and the performance and reliability of the wafer are improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor substrate processing technology, and more specifically, to a wafer cleaning apparatus. Background Technology

[0002] During the wafer processing, the wafers need to be cleaned to ensure their performance and reliability. However, the current wafer cleaning process often results in poor cleaning at the wafer edges, leaving cleaning agent residue and thus affecting the wafer's performance.

[0003] In conclusion, improving the cleanliness of wafers is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a wafer cleaning device to improve the cleanliness of wafers.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A wafer cleaning apparatus includes: an apparatus body for cleaning wafers; a retainer disposed inside the apparatus body for supporting the wafers; a fixing component disposed inside the apparatus body and located below the retainer; an auxiliary cleaning component rotatably connected to the fixing component and for contacting the edge of the wafers; and a driving component drivingly connected to the auxiliary cleaning component for driving the auxiliary cleaning component to rotate.

[0007] In some embodiments, the plug is configured with an opening at both the top and bottom. The top opening of the plug is used to allow the wafer to be placed into the interior of the plug from the top opening. The bottom opening of the plug allows a portion of the wafer to extend beyond the plug, and the width of the bottom opening of the plug is smaller than the diameter of the wafer. The plug has a slot inside for placing the wafer, and the wafer engages with the slot.

[0008] In some embodiments, the fixing assembly includes a fixedly connected base plate and two side plates; the two side plates are fixedly connected to the top surface of the base plate, and the two side plates are sequentially distributed at both ends of the base plate along the axial direction of the auxiliary cleaning assembly; the side plates are fitted and fixed to the inner wall of the device body.

[0009] In some embodiments, the auxiliary cleaning assembly includes: a roller for contacting the edge of the wafer; and a connecting shaft fixedly connected to the roller, the axis of the connecting shaft being aligned with the axis of the roller, and both ends of the connecting shaft being rotatably connected to the side plate.

[0010] In some embodiments, the roller is made of polyfluoroalkoxyethylene;

[0011] And / or, the connecting shaft is made of polyfluoroalkoxyethylene.

[0012] In some embodiments, the drive assembly includes: a drive motor placed outside the device body; a transmission member drivingly connecting the drive motor and the connecting shaft, and the transmission member being located outside the device body; the device body having a connecting hole on the side near the transmission member for the connecting shaft to pass through, the connecting shaft extending out of the device body and rotatably connected to the connecting hole.

[0013] In some embodiments, the transmission component is connected to the connecting shaft via a gear transmission.

[0014] In some embodiments, a pressure sensor is also included; the pressure sensor is a flexible sensor and has a strip-shaped structure; the pressure sensor is adhered to the circumferential surface of the roller.

[0015] In some embodiments, there is one pressure sensor, and the pressure sensor is capable of covering one circumference of the roller;

[0016] Alternatively, there may be at least two pressure sensors, which are staggered around the circumference of the roller and sequentially distributed along the axial direction of the roller, and the pressure sensors can cover the circumference of the roller.

[0017] In some embodiments, a controller is also included; both the pressure sensor and the drive assembly are electrically connected to the controller.

[0018] The wafer cleaning equipment provided in this application cleans wafers through the equipment body. Inside the equipment body, a chuck is installed to hold the wafer, allowing it to be cleaned within the equipment body. A fixing component is also installed inside the equipment body, located below the chuck. An auxiliary cleaning component is rotatably connected inside the fixing component. This auxiliary cleaning component contacts the edge of the wafer and is driven to rotate by a driving component. Thus, during the wafer cleaning process, the rotation of the auxiliary cleaning component causes the wafer to rotate synchronously within the chuck, reducing blind spots caused by contact between the wafer and the chuck. This results in a more comprehensive cleaning process, improving wafer cleanliness and ultimately enhancing wafer performance and reliability. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the cleaning equipment provided in the embodiments of this application;

[0021] Figure 2 This is a partial structural disassembly diagram of the cleaning equipment provided in the embodiments of this application;

[0022] Figure 3 This is a schematic diagram of a cleaning device for cleaning wafers provided in an embodiment of this application;

[0023] Figure 4 A comparison diagram showing the wafer cleaning effects of the cleaning equipment provided in this application embodiment and existing cleaning equipment.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1-Equipment body, 2-Fixing component, 21-Base plate, 22-Side plate, 3-Auxiliary cleaning component, 31-Roller, 32-Connecting shaft, 4-Drive component, 41-Drive motor, 42-Transmission component, 5-Pressure sensor, 6-Clubbing plug, 7-Chip. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to be a limitation of this application. As used in the specification and appended claims of this application, the singular expressions "a," "an," "the," "the," "the," and "this" are intended to also include expressions such as "one or more," unless the context clearly indicates otherwise. It should also be understood that in the embodiments of this application, "one or more" refers to one, two, or more; "and / or" describes the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0028] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0029] like Figure 1 As shown in the embodiment of this application, the wafer cleaning equipment includes: a device body 1, which is used to clean wafers 7; a retainer 6, which is installed inside the device body 1 and is used to support the wafers 7 so that the wafers 7 can be cleaned inside the device body 1; a fixing component 2, which is disposed inside the device body 1 and is located below the retainer 6; an auxiliary cleaning component 3, which is rotatably connected to the inside of the fixing component 2 and can contact the edge of the wafers 7; and a driving component 4, which is drively connected to the auxiliary cleaning component 3 and can drive the auxiliary cleaning component 3 to rotate. In this way, by rotating the auxiliary cleaning component 3, the wafers 7 are driven to rotate synchronously inside the retainer 6, reducing the cleaning blind spots caused by the contact between the wafers 7 and the retainer 6, making the cleaning process of the wafers 7 more comprehensive, improving the cleanliness of the wafers 7, and improving the performance and reliability of the wafers 7.

[0030] It should be noted that the equipment body 1 is a conventional cleaning equipment used for cleaning wafers, such as an ultrasonic cleaner, a semiconductor wet cleaner, a semiconductor wafer cleaner, etc., and this application embodiment does not limit it.

[0031] In the wafer cleaning equipment provided in the embodiments of this application, such as Figure 3 As shown, the cartridge 6 is configured with an opening at both the top and bottom. The top opening of the cartridge 6 is used to allow the wafer 7 to be placed into the interior of the cartridge 6 from the top opening, and the bottom opening of the cartridge 6 allows a portion of the wafer 7 to extend beyond the cartridge 6 from the bottom opening, so that the auxiliary cleaning component 3 can contact the edge of the wafer 7. The width of the bottom opening of the cartridge 6 is smaller than the diameter of the wafer 7, so that the cartridge 6 can support the wafer 7.

[0032] Inside the cartridge 6 is a slot for placing the chip 7. The slot can separate adjacent chips 7 to reduce contact between adjacent chips 7, and the slot can engage with the chip 7 so that the chip 7 can be stably cleaned in the slot.

[0033] It is understandable that there is a tiny gap between the card slot and the chip 7, which allows the chip 7 to rotate relative to the card slot, so that the auxiliary cleaning component 3 can drive the chip 7 to rotate.

[0034] like Figures 1-2 As shown, the fixing component 2 includes a fixedly connected base plate 21 and two side plates 22; wherein, the two side plates 22 are fixedly connected to the top surface of the base plate 21, and the two side plates 22 are distributed sequentially at both ends of the base plate 21 along the axial direction of the auxiliary cleaning component 3, and both side plates 22 are attached and fixed to the inner wall of the equipment body 1, so as to support the auxiliary cleaning component 3 to rotate within the two side plates 22, thereby improving the stability of the auxiliary cleaning component 3 during operation.

[0035] like Figures 1-2 As shown, the auxiliary cleaning assembly 3 includes a roller 31 and a connecting shaft 32; wherein, the roller 31 is used to contact the edge of the wafer 7; the connecting shaft 32 is fixedly connected to the roller 31, and the axis of the connecting shaft 32 is consistent with the axis of the roller 31. The two ends of the connecting shaft 32 are rotatably connected to the side plate 22 so that the connecting shaft 32 can drive the roller 31 to rotate synchronously, thereby driving the wafer 7 to rotate.

[0036] For example, such as Figure 2 As shown, a rotating hole is provided on the side plate 22 for rotating with the connecting shaft 32. The connecting shaft 32 can be connected to the rotating hole through a bearing so that the connecting shaft 32 can rotate with the side plate 22.

[0037] In some embodiments, the roller 31 is made of polyfluoroalkoxy (PFA), which has excellent chemical resistance and high temperature resistance to improve the stability of the roller 31 during operation.

[0038] In some other embodiments, the connecting shaft 32 is also made of PFA, which further improves the stability of the auxiliary cleaning assembly 3 during rotation.

[0039] like Figures 1-3 As shown, the drive assembly 4 includes a drive motor 41 and a transmission component 42; wherein, the drive motor 41 is placed outside the device body 1, the transmission component 42 is located outside the device body 1, and the transmission component 42 drives the drive motor 41 and the connecting shaft 32, so that the drive motor 41 can drive the connecting shaft 32 to rotate through the transmission component 42.

[0040] In order to enable the transmission component 42 to be connected to the connecting shaft 32, such as Figure 3 As shown, a connecting hole is provided on the side of the device body 1 near the transmission component 42 for the connecting shaft 32 to pass through. The connecting shaft 32 can extend out of the device body 1 through the connecting hole and be rotatably connected to the connecting hole, so that the transmission component 42 can drive the connecting shaft 32 to rotate.

[0041] In some embodiments, the connecting shaft 32 can be connected to the connecting hole of the device body 1 through a bearing, so that the connecting shaft 32 and the device body 1 can rotate together.

[0042] In some embodiments, the transmission component 42 and the connecting shaft 32 can be connected by gear transmission (not shown in the figure), such as bevel gears, worm gears, etc.

[0043] In some embodiments, the opening and closing of the drive motor 41 can be manually controlled to drive the roller 31 to rotate, thereby driving the wafer 7 to rotate, thus improving the stability of the rotation of the auxiliary cleaning component 3.

[0044] In some other embodiments, the pressure sensor 5 can sense whether the chip 7 is in contact with the roller 31. The pressure sensor 5 is a flexible sensor and has a strip structure so that the pressure sensor 5 is adhered to the circumferential surface of the roller 31. After the chip 7 is placed inside the stopper 6, the pressure sensor 5 senses that the chip 7 has been placed inside the stopper 6 by contacting the chip 7. This allows the pressure sensor 5 to transmit data to the drive motor 41 so that the drive motor 41 drives the roller 31 to rotate.

[0045] It should be noted that the wafer cleaning equipment provided in this application embodiment also includes a controller. The pressure sensor 5 and the drive motor 41 in the drive assembly 4 are both electrically connected to the controller, so that the controller can receive the signal transmitted by the pressure sensor 5 and control the drive motor 41 to start.

[0046] It should be noted that, since the pressure sensor 5 is a thin-walled strip structure with a small thickness, and since there is a certain amount of movement space between the chip 7 and the slot of the plug 6, the chip 7 has a certain amount of movement space relative to the plug 6 in its radial direction, so that the pressure sensor 5 will not affect the contact between the surface of the roller 31 and the edge of the chip 7, and the roller 31 can drive the chip 7 to rotate synchronously.

[0047] It should be noted that the pressure sensor 5 is wirelessly connected to the controller, using wireless transmission methods such as Bluetooth or WIFI; and it is powered wirelessly so that the pressure sensor 5 can rotate synchronously with the roller 31.

[0048] For example, the pressure sensor 5 can be a SAW sensor, which is excited by a radio frequency signal, requires no battery, and relies on reflected signals to transmit pressure data.

[0049] In order to ensure that the pressure sensor 5 can sense the chip 7, in some embodiments, the pressure sensor 5 is a single sensor that can cover the circumference of the roller 31 so that the pressure sensor 5 can sense the chip 7.

[0050] In some other embodiments, there are at least two pressure sensors 5, and the at least two pressure sensors 5 are staggered along the circumference of the roller 31 and sequentially distributed along the axial direction of the roller 31, so that the at least two pressure sensors 5 can cover the circumference of the roller 31, so that the pressure sensors 5 can sense the wafer 7.

[0051] In the wafer cleaning equipment provided in this application embodiment, the wafer 7 is placed in the cassette 6 so that the wafer 7 contacts the pressure sensor 5. After the pressure sensor 5 senses the wafer 7, it controls the drive motor 41 to start through the controller. The drive motor 41 drives the roller 31 to rotate, so that the roller 31 can drive the wafer 7 to rotate synchronously in the cassette 6. In this way, during the wafer 7 cleaning process, the cleaning blind area caused by the contact between the wafer 7 and the cassette 6 is reduced, making the wafer 7 cleaning process more comprehensive, improving the cleanliness of the wafer 7, and improving the performance and reliability of the wafer 7.

[0052] As shown in Table 1, comparing the cleaning effects of existing equipment with the wafer cleaning equipment provided in this application embodiment, it can be seen that after the wafer cleaning equipment provided in this application embodiment cleans the wafer 7, the surface of the wafer 7 is free of wax stains, polishing fluid residue, and white lines, thereby improving the cleanliness of the wafer 7 and enhancing its performance and reliability.

[0053] Table 3 Comparison of cleaning effects before and after the invention tool was added

[0054] condition Solution temperature Cleaning time solution concentration Cleaning effect Existing equipment 70℃ 20min 40% Wax residue and polishing fluid residue, resulting in white lines. This application 70℃ 20min 40% No wax residue, no polishing fluid residue, and no white lines.

[0055] It should be noted that the wax stains and polishing fluid residues both come from the cleaning agent inside the equipment body 1 during the wafer 7 cleaning process.

[0056] like Figure 4 Figure a shows the effect of existing equipment on cleaning wafer 7. Figure 4 b shows the effect of the wafer cleaning equipment provided in this application embodiment on the cleaning of wafer 7. It can be seen that the edge particles of wafer 7 are significantly reduced after cleaning by the wafer cleaning equipment provided in this application embodiment, which improves the cleanliness of wafer 7 and improves the performance and reliability of wafer 7.

[0057] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer cleaning device, characterized in that, include: Equipment body (1), the equipment body (1) is used to clean wafers (7); A retainer (6) is disposed inside the device body (1) and is used to carry the wafer (7). Fixing component (2), the fixing component (2) is disposed inside the device body (1), and the fixing component (2) is located below the plug (6); An auxiliary cleaning component (3) is rotatably connected to the interior of the fixing component (2), and the auxiliary cleaning component (3) is used to contact the edge of the wafer (7); The drive component (4) is connected to the auxiliary cleaning component (3) in a transmission manner, and the drive component (4) drives the auxiliary cleaning component (3) to rotate.

2. The wafer cleaning equipment according to claim 1, characterized in that, The plug (6) is configured with an opening at both the top and the bottom. The top opening of the plug (6) is used to allow the wafer (7) to be placed into the interior of the plug (6) from the top opening. The bottom opening of the plug (6) allows a portion of the wafer (7) to extend beyond the plug (6), and the width of the bottom opening of the plug (6) is smaller than the diameter of the wafer (7). The insert (6) has a slot for placing the chip (7) inside, and the chip (7) is engaged with the slot.

3. The wafer cleaning equipment according to claim 2, characterized in that, The fixing component (2) includes a fixedly connected base plate (21) and two side plates (22); The two side plates (22) are fixedly connected to the top surface of the base plate (21), and the two side plates (22) are distributed sequentially at both ends of the base plate (21) along the axial direction of the auxiliary cleaning assembly (3); The side plate (22) is attached and fixed to the inner wall of the equipment body (1).

4. The wafer cleaning equipment according to claim 3, characterized in that, The auxiliary cleaning component (3) includes: A roller (31) is used to contact the edge of the wafer (7); A connecting shaft (32) is fixedly connected to the roller (31). The axis of the connecting shaft (32) is consistent with the axis of the roller (31). Both ends of the connecting shaft (32) are rotatably connected to the side plate (22).

5. The wafer cleaning equipment according to claim 4, characterized in that, The roller (31) is made of polyfluoroalkoxyethylene; And / or, the connecting shaft (32) is made of polyfluoroalkoxyethylene.

6. The wafer cleaning equipment according to claim 4, characterized in that, The driving component (4) includes: A drive motor (41) is placed outside the device body (1); A transmission component (42) is provided, which drives the drive motor (41) and the connecting shaft (32), and the transmission component (42) is located outside the device body (1); The device body (1) has a connecting hole on the side near the transmission component (42) for the connecting shaft (32) to pass through. The connecting shaft (32) extends out of the device body (1) and is rotatably connected to the connecting hole.

7. The wafer cleaning equipment according to claim 6, characterized in that, The transmission component (42) is connected to the connecting shaft (32) via gear transmission.

8. The wafer cleaning equipment according to claim 4, characterized in that, It also includes a pressure sensor (5); The pressure sensor (5) is a flexible sensor and has a strip-shaped structure; The pressure sensor (5) is bonded to the circumferential surface of the roller (31).

9. The wafer cleaning equipment according to claim 8, characterized in that, The pressure sensor (5) is one, and the pressure sensor (5) can cover the circumference of the roller (31); Alternatively, the pressure sensor (5) may be at least two, with at least two pressure sensors (5) distributed circumferentially offset along the roller (31) and sequentially distributed along the axial direction of the roller (31), and at least two pressure sensors (5) may cover the circumference of the roller (31).

10. The wafer cleaning apparatus according to claim 8 or 9, characterized in that, It also includes the controller; The pressure sensor (5) and the drive assembly (4) are both electrically connected to the controller.

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