Semi-solid injection molding mold with cooling mechanism

Abstract

The utility model discloses a semi-solid injection molding mold with a cooling mechanism, and belongs to the technical field of semi-solid injection molding molds. The mold mainly comprises an upper mold body and a lower mold body, the lower mold body comprises a bottom plate and a bottom mold body, the bottom mold body is fixedly installed on the bottom plate, a liquid inlet pipe and a liquid outlet pipe are installed on the two sides of the bottom mold body in a threaded mode respectively, a cooling cavity is formed in the bottom mold body, and a lower forming cavity for finished product forming is formed in the top face of the bottom mold body; a cooling cavity is formed in the enclosure frame, a cooling groove is formed in the enclosure frame and communicates with the cooling cavity, a first heat conduction assembly is arranged in the cooling cavity, a second heat conduction assembly is arranged in the cooling groove, and by arranging the double heat conduction assemblies and the layered cooling structure, the cooling effect is greatly improved; the defects that the cooling speed of semi-solid metal is inconsistent due to too high mold temperature or non-uniform cooling are effectively avoided, shrinkage cavities, deformation and the like are reduced, the product size precision and the forming quality are improved, meanwhile, the forming period is shortened, and the production efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of semi-solid injection molding technology, specifically a semi-solid injection molding mold with a cooling mechanism. Background Technology

[0002] Semi-solid injection molding dies are mainly used to inject semi-solid metal materials into the mold cavity, and then cool and solidify them into parts of the required shape. They are widely used in manufacturing industries such as automobiles and aerospace. Compared with traditional casting and forging processes, they can improve the precision, mechanical properties and production efficiency of parts.

[0003] However, in existing molds, on the one hand, the cooling system design is unreasonable. During the molding process, a large amount of heat is generated due to the solidification of the semi-solid metal. If heat cannot be dissipated effectively in time, the mold temperature will become too high. Excessive temperature will cause uneven cooling of the semi-solid metal, resulting in defects such as shrinkage cavities and deformation, reducing product quality and dimensional accuracy. At the same time, high temperature will also prolong the molding cycle and reduce production efficiency.

[0004] On the other hand, uneven cooling is a prominent problem. Traditional mold cooling channels have a single layout and cannot effectively cool different parts of the mold to meet their heat dissipation needs. In particular, the edges and thick-walled parts of the mold are prone to excessively high local temperatures due to insufficient heat dissipation, which affects the product molding quality. Furthermore, the finished product is prone to damage during demolding because the molded product is not hard enough.

[0005] Therefore, it is necessary to provide a semi-solid injection mold with a cooling mechanism to solve the above problems.

[0006] It should be noted that the information disclosed in this background section is only for understanding the background technology of this application concept, and therefore may include information that does not constitute prior art. Utility Model Content

[0007] The purpose of this invention is to provide a semi-solid injection molding die with a cooling mechanism to solve the problems mentioned in the background art.

[0008] The technical solution adopted by this application to solve its technical problem is:

[0009] A semi-solid injection molding die with a cooling mechanism includes an upper die and a lower die, which can be closed and moved. The lower die includes a base plate and a bottom mold, which is fixedly installed on the base plate. An inlet pipe and an outlet pipe are threadedly installed on both sides of the bottom mold, and a cooling cavity is opened inside the bottom mold. Both the inlet pipe and the outlet pipe are connected to a cooling wall.

[0010] The top surface of the bottom mold is provided with a lower forming cavity for forming the finished product. A frame is integrally formed on the top surface of the bottom mold around the lower forming cavity. A cooling groove is provided inside the frame and the cooling groove is connected to the cooling cavity.

[0011] The cooling cavity is provided with a first heat-conducting component, the cooling tank is provided with a second heat-conducting component, and the lower molding cavity absorbs the heat generated during the molding process through the second heat-conducting component in the surrounding frame and the first heat-conducting component in the bottom mold.

[0012] Preferably, the first heat-conducting component includes a heat-conducting copper plate and a plurality of first heat-dissipating fins. The plurality of first heat-dissipating fins are arranged at equal intervals on the bottom surface of the heat-conducting copper plate. The heat-conducting copper plate and the plurality of first heat-dissipating fins are integrally formed. The heat-conducting copper plate is snapped onto the top surface of the cooling cavity and is in contact with the top surface of the cooling cavity.

[0013] Preferably, the second heat-conducting component includes an annular copper plate and second heat dissipation fins, with at least three second heat dissipation fins respectively fixed around the bottom surface of the annular copper plate, and the annular copper plate is fitted into a cooling groove opened within the frame.

[0014] Preferably, the upper mold includes an injection cylinder, a top mold, and an upper molding cavity. The injection cylinder is inserted and installed at the center of the top surface of the top mold. The upper molding cavity is formed on the bottom surface of the top mold. An injection hole is formed at the center of the upper molding cavity, and the injection hole is connected to the injection cylinder.

[0015] Preferably, guide posts are fixedly installed at the bottom corners of the top mold, and guide holes are provided at the top corners of the bottom mold.

[0016] When the top mold and the bottom mold are closed, the guide post slides into the guide hole.

[0017] Preferably, a demolding assembly is installed inside the top mold. The demolding assembly includes a cylinder, a fixed seat, a movable plate, a sliding column, and demolding rods. The cylinders are fixedly installed on both sides of the top mold, and the fixed seats are fixedly installed on both sides of the movable plate. The telescopic rod ends of the cylinders are fixedly installed in the fixed seats. A sliding hole is provided on the movable plate. A sliding column is fixedly installed on the top surface of the top mold and slides in the sliding hole. Multiple demolding rods are fixedly connected to the bottom surface of the movable plate. A demolding hole is provided on the top surface of the top mold and extends through to the lower molding cavity. The demolding rods slide in the demolding hole.

[0018] The beneficial effects of this application are:

[0019] This technical solution significantly improves the cooling effect by setting up dual heat-conducting components and a layered cooling structure. The first heat-conducting component in the bottom mold cooling cavity uses a heat-conducting copper plate and a first heat dissipation fin to quickly conduct heat from the lower molding cavity and increase the contact area with the coolant. The second heat-conducting component in the frame cooling tank, with an annular copper plate and a second heat dissipation fin, can precisely cool the edge of the lower molding cavity.

[0020] The coolant circulates in the cooling chamber and cooling tank, achieving efficient and uniform cooling of the entire mold. This effectively avoids inconsistent cooling rates of the semi-solid metal caused by excessively high mold temperature or uneven cooling, reduces defects such as shrinkage cavities and deformation, improves product dimensional accuracy and molding quality, and shortens the molding cycle, thereby increasing production efficiency.

[0021] In addition to the purposes, features, and advantages described above, this application has other purposes, features, and advantages. A further detailed description of this application will be provided below with reference to the figures. Attached Figure Description

[0022] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0023] Figure 1 This is an overall schematic diagram of a semi-solid injection molding die with a cooling mechanism according to the present invention.

[0024] Figure 2 This is a schematic diagram of the lower mold structure of this utility model;

[0025] Figure 3 This is a cross-sectional view of the bottom mold of this utility model;

[0026] Figure 4 This is a schematic diagram of the second heat-conducting component of this utility model;

[0027] Figure 5 This is a schematic diagram of the upper mold structure of this utility model;

[0028] Figure 6 This is a schematic diagram of the demolding component structure of this utility model.

[0029] The following are the labeling elements in the figure:

[0030] 1. Upper mold; 11. Injection cylinder; 12. Ejector mold; 13. Injection hole; 14. Upper molding cavity; 15. Guide pillar;

[0031] 2. Lower mold; 21. Bottom mold; 211. Cooling cavity; 22. Base plate; 23. Guide hole; 24. Frame; 241. Cooling groove; 25. Lower forming cavity;

[0032] 3. Liquid inlet pipe;

[0033] 4. Discharge pipe;

[0034] 5. First heat-conducting component; 51. Heat-conducting copper plate; 52. First heat dissipation fins;

[0035] 6. Second heat-conducting component; 61. Annular copper plate; 62. Second heat dissipation fins;

[0036] 7. Demolding assembly; 71. Cylinder; 72. Fixed base; 73. Moving plate; 74. Sliding column; 75. Demolding rod. Detailed Implementation

[0037] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0038] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present application.

[0039] Please see Figures 1-6 The embodiments provided by this utility model are as follows:

[0040] like Figure 1 As shown, a semi-solid injection molding die with a cooling mechanism includes an upper mold 1 and a lower mold 2. The upper mold 1 and the lower mold 2 have a closing motion. The upper mold 1 and the lower mold 2 achieve relative movement through a mechanical drive device, such as a hydraulic or electric push rod, to complete the mold closing and opening actions. When the mold is closed, the upper mold 1 and the lower mold 2 dock to form a closed molding space, providing a molding cavity for semi-solid metal injection molding. The mold is opened to remove the molded finished product.

[0041] like Figure 2 and Figure 3As shown, the lower mold 2 includes a base plate 22 and a bottom mold 21. The bottom mold 21 is fixedly installed on the base plate 22. The bottom mold 21 has an inlet pipe 3 and an outlet pipe 4 threadedly installed on both sides. The bottom mold 21 has a cooling cavity 211 inside. The inlet pipe 3 and the outlet pipe 4 are both connected to the cooling wall. The top surface of the bottom mold 21 has a lower forming cavity 25 for forming the finished product. The bottom mold 21 has an integrally formed frame 24 on the top surface of the bottom mold 21 around the lower forming cavity 25. The frame 24 has a cooling groove 241 inside. The cooling groove 241 is connected to the cooling cavity 211. The coolant is introduced into the cooling wall cavity through the inlet pipe 3, absorbs the heat generated in the lower forming cavity 25 during the forming process, and then is discharged from the bottom mold 21 through the outlet pipe 4.

[0042] During the semi-solid metal injection molding process, the lower molding cavity 25 will generate a large amount of heat due to metal solidification and other processes. The inlet pipe 3 introduces low-temperature coolant into the cooling cavity 211. The coolant flows in the cooling cavity 211 and the cooling tank 241 connected to it. Through heat exchange, it absorbs the heat near the lower molding cavity 25 and the surrounding frame 24, thereby reducing the mold temperature. After absorbing heat, the coolant temperature rises and is discharged from the mold through the outlet pipe 4. After entering the cooling circulation system to cool down, it flows back into the mold through the inlet pipe 3, forming a circulating flow of coolant that continuously carries away the heat from the mold.

[0043] Among them, such as Figure 3 As shown, a first heat-conducting component 5 is provided in the cooling cavity 211. The first heat-conducting component 5 includes a heat-conducting copper plate 51 and a plurality of first heat dissipation fins 52. The plurality of first heat dissipation fins 52 are arranged at equal intervals on the bottom surface of the heat-conducting copper plate 51. The heat-conducting copper plate 51 and the plurality of first heat dissipation fins 52 are integrally formed. The heat-conducting copper plate 51 is snapped onto the top surface of the cooling cavity 211 and is in contact with the top surface of the cooling cavity 211.

[0044] The heat-conducting copper plate 51 has excellent thermal conductivity and is snap-fitted onto the top surface of the cooling cavity 211, allowing it to quickly absorb heat transferred from the lower molding cavity 25 to the top surface of the mold. The first heat dissipation fins 52 are evenly distributed on the bottom surface of the heat-conducting copper plate 51, increasing the contact area with the coolant. When the coolant flows in the cooling cavity 211, heat is transferred from the heat-conducting copper plate 51 and the first heat dissipation fins 52 into the coolant, accelerating the heat transfer speed and further enhancing the cooling cavity 211's ability to absorb and transfer heat from the lower molding cavity 25. The heat-conducting copper plate 51 rapidly conducts heat, and the first heat dissipation fins 52 increase the heat dissipation area, enabling the coolant to absorb heat more efficiently, improving cooling efficiency, ensuring the lower molding cavity 25 maintains a suitable temperature during the molding process, and improving product quality and production efficiency.

[0045] like Figure 4As shown, a second heat-conducting component 6 is provided in the cooling tank 241. The second heat-conducting component 6 includes an annular copper plate 61 and a second heat dissipation fin 62. At least three second heat dissipation fins 62 are respectively fixed around the bottom surface of the annular copper plate 61. The annular copper plate 61 is snapped into the cooling tank 241 opened in the frame 24. The lower molding cavity 25 absorbs the heat generated during the molding process through the second heat-conducting component 6 in the frame 24 and the first heat-conducting component 5 in the bottom mold 21.

[0046] The annular copper plate 61 is snapped into the cooling tank 241 inside the frame 24 and is in close contact with the cooling tank 241. It can quickly absorb the heat from the edge of the lower molding cavity 25 and the frame 24. The second heat dissipation fins 62 surrounding the bottom surface of the annular copper plate 61 increase the contact area with the coolant. When the coolant flows in the cooling tank 241, heat is transferred from the annular copper plate 61 and the second heat dissipation fins 62 to the coolant, thus achieving effective cooling of the edge area of ​​the lower molding cavity 25.

[0047] like Figure 5 As shown, the upper mold 1 includes an injection cylinder 11, a top mold 12, and an upper molding cavity 14. The injection cylinder 11 is inserted and installed at the center of the top surface of the top mold 12. The upper molding cavity 14 is opened on the bottom surface of the top mold 12. An injection hole 13 is opened at the center of the upper molding cavity 14. The injection hole 13 is connected to the injection cylinder 11. Guide pillars 15 are fixedly installed at the corners of the bottom surface of the top mold 12. Guide holes 23 are provided at the corners of the top surface of the bottom mold 21. When the top mold 12 and the bottom mold 21 are closed, the guide pillars 15 slide and insert into the guide holes 23.

[0048] The injection cylinder 11 is used to transport semi-solid metal. The semi-solid metal is injected into the closed space formed by the upper molding cavity 14 and the lower molding cavity 25 through the injection hole 13 by the injection machine. During the mold closing process, the guide post 15 on the top mold 12 slides into the guide hole 23 on the bottom mold 21 to guide and position, ensuring that the upper molding cavity 14 and the lower molding cavity 25 are accurately connected to form a complete molding space, ensuring that the semi-solid metal can accurately fill the cavity.

[0049] like Figure 6 As shown, a demolding assembly 7 is installed inside the top mold 12. The demolding assembly 7 includes a cylinder 71, a fixed seat 72, a movable plate 73, a sliding column 74, and demolding rods 75. The cylinder 71 is fixedly installed on both sides of the top mold 12, and the fixed seat 72 is fixedly installed on both sides of the movable plate 73. The end of the telescopic rod of the cylinder 71 is fixedly installed in the fixed seat 72. A sliding hole is opened on the movable plate 73. A sliding column 74 is fixedly installed on the top surface of the top mold 12. The sliding column 74 is slidably installed in the sliding hole. A plurality of demolding rods 75 are fixedly connected to the bottom surface of the movable plate 73. A demolding hole is opened on the top surface of the top mold 12, and the demolding hole extends through to the lower molding cavity 25. The demolding rods 75 are slidably installed in the demolding hole.

[0050] After molding is completed, the mold opening action separates the upper mold 1 from the lower mold 2. At this time, the cylinder 71 is activated, and its telescopic rod pushes the fixed seat 72, which in turn drives the moving plate 73 to slide on the slide column 74. Since the demolding rod 75 is fixed to the bottom surface of the moving plate 73, the movement of the moving plate 73 drives the demolding rod 75 to move downward along the demolding hole, pushing the molded finished product out of the upper molding cavity 14, thus completing the demolding process.

[0051] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A semi-solid injection molding die with a cooling mechanism, comprising an upper die (1) and a lower die (2), wherein the upper die (1) and the lower die (2) have a closing motion, characterized in that: The lower mold (2) includes a base plate (22) and a bottom mold (21). The bottom mold (21) is fixedly installed on the base plate (22). An inlet pipe (3) and an outlet pipe (4) are threadedly installed on both sides of the bottom mold (21). A cooling cavity (211) is opened inside the bottom mold (21). The inlet pipe (3) and the outlet pipe (4) are both connected to the cooling wall. The bottom mold (21) has a lower forming cavity (25) for forming finished products on its top surface. The bottom mold (21) located around the lower forming cavity (25) has an integrally formed frame (24) on its top surface. The frame (24) has a cooling groove (241) inside it. The cooling groove (241) is connected to the cooling cavity (211). The cooling cavity (211) is provided with a first heat-conducting component (5), the cooling tank (241) is provided with a second heat-conducting component (6), and the lower molding cavity (25) absorbs the heat generated during the molding process through the second heat-conducting component (6) in the frame (24) and the first heat-conducting component (5) in the bottom mold (21).

2. The semi-solid injection mold with a cooling mechanism according to claim 1, characterized in that: The first heat-conducting component (5) includes a heat-conducting copper plate (51) and a plurality of first heat-dissipating fins (52). The plurality of first heat-dissipating fins (52) are arranged at equal intervals on the bottom surface of the heat-conducting copper plate (51). The heat-conducting copper plate (51) and the plurality of first heat-dissipating fins (52) are integrally formed. The heat-conducting copper plate (51) is snapped onto the top surface of the cooling cavity (211) and is in contact with the top surface of the cooling cavity (211).

3. A semi-solid injection mold with a cooling mechanism according to claim 1, characterized in that: The second heat-conducting component (6) includes an annular copper plate (61) and a second heat dissipation fin (62). At least three of the second heat dissipation fins (62) are respectively fixed around the bottom surface of the annular copper plate (61). The annular copper plate (61) is engaged in a cooling groove (241) opened in the frame (24).

4. A semi-solid injection mold with a cooling mechanism according to claim 1, characterized in that: The upper mold (1) includes an injection cylinder (11), a top mold (12) and an upper molding cavity (14). The injection cylinder (11) is inserted and installed at the center of the top surface of the top mold (12). The upper molding cavity (14) is opened on the bottom surface of the top mold (12). An injection hole (13) is opened at the center of the upper molding cavity (14). The injection hole (13) is connected to the injection cylinder (11).

5. A semi-solid injection mold with a cooling mechanism according to claim 4, characterized in that: Guide columns (15) are fixedly installed at the bottom corners of the top mold (12), and guide holes (23) are provided at the top corners of the bottom mold (21). When the top mold (12) and the bottom mold (21) are closed, the guide post (15) slides into the guide hole (23).

6. A semi-solid injection mold with a cooling mechanism according to claim 5, characterized in that: The top mold (12) is equipped with a demolding assembly (7). The demolding assembly (7) includes a cylinder (71), a fixed seat (72), a moving plate (73), a sliding column (74), and a demolding rod (75). The cylinder (71) is fixedly installed on both sides of the top mold (12). The fixed seat (72) is fixedly installed on both sides of the moving plate (73). The telescopic rod end of the cylinder (71) is fixedly installed in the fixed seat (72). The moving plate (73) has a sliding hole. The top surface of the top mold (12) is fixedly installed with a sliding column (74). The sliding column (74) is slidably installed in the sliding hole. The bottom surface of the moving plate (73) is fixedly connected with multiple demolding rods (75). The top surface of the top mold (12) has a demolding hole, which extends through to the lower forming cavity (25). The demolding rod (75) is slidably installed in the demolding hole.

Images