Heating device and new energy automobile

Abstract

The utility model relates to a heating device and a new energy automobile. The heating device comprises a shell and a heating device, wherein a containing cavity is defined by the shell; the shell is provided with a containing cavity, the heating unit is arranged in the containing cavity, the heating unit comprises a ceramic substrate and a heating piece, the ceramic substrate and the shell define a circulation cavity and an installation cavity which are independently arranged, and the heating piece is arranged on the ceramic substrate and located in the installation cavity; and the heating piece is used for heating the liquid passing through the circulating cavity. The ceramic substrate is an insulator, so that the heating element can be directly arranged on the ceramic substrate, and an insulating layer is omitted. In this way, heat generated by the heating piece is directly conducted to the liquid in the circulation cavity through the ceramic substrate, the heat loss is small due to the fact that the transmission path of the heat is short, the heat absorption effect of the insulating layer can be eliminated, the heat loss is further reduced, and finally the heating efficiency of the heating device is improved.

Description

Technical Field

[0001] This application relates to the field of new energy technology, and in particular to a heating device and a new energy vehicle. Background Technology

[0002] With the rapid development of new energy vehicles, vehicle thermal management systems face new challenges. Unlike traditional gasoline vehicles, pure electric and hybrid vehicles lack the waste heat from internal combustion engines. Especially in low-temperature environments, excessively low temperatures not only affect the driving range of the power battery but also the comfort of the passenger cabin. Therefore, new energy vehicles need to rely on electric power to drive independent heating devices to meet the needs of cabin heating and battery insulation. However, traditional heating devices typically suffer from low heating efficiency. Utility Model Content

[0003] One of the technical problems addressed by this application is how to improve the heating efficiency of a heating device.

[0004] A heating device, comprising:

[0005] A housing, the housing forming a receiving cavity; and

[0006] A heating unit is disposed within the receiving cavity. The heating unit includes a ceramic substrate and a heating element. The ceramic substrate and the housing form an independently disposed flow cavity and a mounting cavity. The heating element is disposed on the ceramic substrate and located in the mounting cavity, and the heating element is used to heat the liquid passing through the flow cavity.

[0007] In one embodiment, the ceramic substrate is a silicon nitride ceramic substrate.

[0008] In one embodiment, the thermal conductivity of the ceramic substrate is greater than 60 W / (m·K).

[0009] In one embodiment, the circuit pattern of the heating element is formed by screen printing, and the circuit pattern of the heating element is connected to the ceramic substrate by thick film sintering.

[0010] In one embodiment, the heating unit further includes a circuit layer disposed within the mounting cavity and electrically connected to the heating element.

[0011] In one embodiment, the circuit layer is spaced apart from the housing.

[0012] In one embodiment, the ceramic substrate is manufactured using a casting process and a sintering process.

[0013] In one embodiment, the housing is made of a metallic material.

[0014] In one embodiment, the housing includes a bottom plate, a top plate, and a side plate, with the side plate connected between the bottom plate and the top plate; the top plate, the ceramic substrate, and the bottom plate are spaced apart, with the mounting cavity formed between the top plate and the ceramic substrate, and the flow cavity formed between the ceramic substrate and the bottom plate; the side plate is provided with an inlet and an outlet communicating with the flow cavity.

[0015] A new energy vehicle includes the heating device described in any one of the above descriptions.

[0016] One technical advantage of one embodiment of this application is that, since the ceramic substrate itself is an insulator, the heating element can be directly disposed on the ceramic substrate, thereby eliminating the need for an insulating layer. This allows the heat generated by the heating element to be directly conducted to the liquid in the flow cavity through the ceramic substrate. Due to the shorter heat transfer path, there is less heat loss, and the absorption of heat by the insulating layer is eliminated, further reducing heat loss and ultimately improving the heating efficiency of the heating device. Furthermore, the relatively high thermal conductivity of the ceramic substrate increases the speed of heat conduction, thus reducing heat loss during conduction and further improving the heating efficiency of the heating device. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural schematic diagram of a heating device provided in one embodiment.

[0018] Figure 2 for Figure 1 A partial planar cross-sectional view of the heating device shown.

[0019] Figure 3 for Figure 1 A partial side view of the heating unit in the heating device shown.

[0020] Reference numerals: heating device 10, housing 100, receiving cavity 110, flow cavity 111, mounting cavity 112, top plate 120, bottom plate 130, side plate 140, liquid inlet 151, liquid outlet 152, heating unit 200, ceramic substrate 210, heating element 220, circuit layer 230. Detailed Implementation

[0021] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0022] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0023] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0026] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0027] See Figure 1 , Figure 2 and Figure 3 This application provides a heating device 10 for use in new energy vehicles. The heating device 10 includes a housing 100 and a heating unit 200. The housing 100 forms a receiving cavity 110, and the heating unit 200 is disposed within the receiving cavity 110. The heating unit 200 includes a ceramic substrate 210 and a heating element 220. The ceramic substrate 210 and the housing 100 form a flow cavity 111 and a mounting cavity 112. The flow cavity 111 and the mounting cavity 112 are independently arranged and not connected to each other. It can be understood that the receiving cavity 110 includes the flow cavity 111 and the mounting cavity 112. The heating element 220 is disposed on the ceramic substrate 210 and located in the mounting cavity 112. The heating element 220 has a certain resistance, and when energized, it converts electrical energy into heat energy. Liquid is introduced into the flow cavity 111. When the heating element 220 generates heat, the heat is conducted to the flow cavity 111 through the ceramic substrate 210, causing the liquid in the flow cavity 111 to absorb the heat, thus heating the liquid in the flow cavity 111. After the temperature of the liquid in the flow cavity 111 rises due to heating, the heated liquid can be used to provide energy to the cabin of the new energy vehicle, thereby improving the driving comfort of the new energy vehicle. Of course, the heated liquid can also be used to keep the battery warm, thereby reasonably improving the battery's range in low-temperature environments.

[0028] If the heating unit 200 of the heating device 10 adopts a configuration where the heating element 220 is mounted on a stainless steel substrate, since the stainless steel substrate is a conductor, an insulating layer needs to be first placed on the stainless steel substrate for insulation, and then the heating element 220 is placed on the insulating layer. In this way, due to the presence of the insulating layer, the heat generated by the heating element 220 will be conducted sequentially through the insulating layer and the stainless steel substrate to the liquid in the flow cavity 111, resulting in a longer heat transfer path and greater heat loss. Furthermore, the insulating layer also absorbs heat, further increasing heat loss and ultimately reducing the heating efficiency of the heating device 10. Simultaneously, the thermal conductivity of the stainless steel substrate is typically 15 W / (m·K)-30 W / (m·K), while the thermal conductivity of the insulating layer is less than 1 W / (m·K). This reduces the heat conduction speed, further exacerbating heat loss during conduction and thus further reducing the heating efficiency of the heating device 10. On the other hand, stainless steel has a high density, resulting in a significant weight. Combined with the addition of an insulation layer, this makes the overall heating device 10 relatively heavy and bulky, and also more structurally complex, hindering its miniaturization, lightweight design, and simplification. Furthermore, the insulation layer increases the material cost of the heating device 10, and its installation on the stainless steel substrate requires complex processes, increasing processing costs and ultimately raising the overall manufacturing cost. Simultaneously, thermal stress can easily cause the insulation layer to detach from the stainless steel substrate, affecting the connection strength and ultimately impacting the reliability of the heating device 10.

[0029] See Figure 1 , Figure 2 and Figure 3Regarding the heating device 10 in the above embodiments, since the ceramic substrate 210 itself is an insulator, the heating element 220 can be directly disposed on the ceramic substrate 210, thereby eliminating the need for an insulating layer. This allows the heat generated by the heating element 220 to be directly conducted to the liquid in the flow cavity 111 through the ceramic substrate 210, resulting in less heat loss due to the shorter transmission path. It also eliminates the heat absorption effect of the insulating layer, further reducing heat loss and ultimately improving the heating efficiency of the heating device 10. Furthermore, the thermal conductivity of the ceramic substrate 210 is higher than that of the stainless steel substrate, thereby increasing the heat conduction speed and reducing heat loss during conduction, further improving the heating efficiency of the heating device 10. On the other hand, the ceramic substrate 210 has a lower density, resulting in a lighter weight. The elimination of the insulating layer further reduces the weight and volume of the entire heating device 10, simplifying its structure and facilitating miniaturization, weight reduction, and simplified design. Furthermore, by omitting the insulation layer, the material cost of the heating device 10 can be reduced, as can the processing cost of the insulation layer, thereby lowering the manufacturing cost of the heating device 10. At the same time, there is no need to consider the connection strength and detachment issues of the insulation layer, thus improving the reliability of the heating device 10.

[0030] In some embodiments, the thermal conductivity of the ceramic substrate 210 is greater than 60 W / (m·K), thus the ceramic substrate 210 has excellent thermal conductivity, which further increases the heat conduction speed in the ceramic substrate 210 and reduces energy loss, thereby further improving the heating efficiency of the heating device 10. The ceramic substrate 210 can be a silicon nitride ceramic substrate, which gives the silicon nitride ceramic substrate even better thermal conductivity to improve the heating efficiency of the heating device 10, and the silicon nitride ceramic substrate also has excellent insulation properties. The density of the silicon nitride ceramic substrate can be 3.2 g / cm³. 3 This further reduces the weight of the heating device 10. Of course, in other embodiments, the ceramic substrate 210 may also be a glass-ceramic substrate 210, etc.

[0031] In some embodiments, the ceramic substrate 210 can be manufactured using a tape casting process and a sintering process. Specifically, for a silicon nitride ceramic substrate, a slurry can be prepared using silicon nitride powder or silicon powder with sintering aids. This slurry is then formed using a tape casting process to create a green film. Following the removal of the binder from the green film, a sintering process is then performed to create the silicon nitride ceramic substrate product. Furthermore, the silicon nitride ceramic substrate after the sintering process can be subjected to hot isostatic pressing (HIP) sintering, thereby further improving the density, strength, and reliability of the silicon nitride ceramic substrate.

[0032] In some embodiments, the circuit pattern of the heating element 220 is formed by screen printing, and the circuit pattern of the heating element 220 is connected to the ceramic substrate 210 by thick film sintering. Specifically, when the heating element 220 needs to be placed on the ceramic substrate 210, the ceramic substrate 210 can be cleaned first, and then a mixed slurry of conductive paste, glass powder and organic binder can be prepared. The mixed slurry is then screen printed onto the ceramic substrate 210, thus forming the circuit pattern of the heating element 220. Finally, the circuit pattern of the heating element 220 is cured by thick film sintering to form a heating element 220 with a certain resistance. During the curing process, the heating element 220 will form a stable and reliable connection with the ceramic substrate 210. When the ceramic substrate 210 is a silicon nitride ceramic substrate, given the excellent insulation properties of silicon nitride ceramic substrates, the amount of glass powder used in the preparation of the heating element 220 can be reasonably reduced, thereby reducing the manufacturing cost of the heating element 220 and the entire heating device 10.

[0033] See Figure 1 , Figure 2 and Figure 3 In some embodiments, the heating unit 200 further includes a circuit layer 230, which is disposed within the mounting cavity 112 and electrically connected to the heating element 220. The circuit layer 230 can control parameters such as the heating power of the heating element 220, thereby realizing the adjustment and control of the heating power of the heating device 10. The circuit layer 230 can be connected to the heating element 220 and / or the ceramic substrate 210, and is also spaced apart from the housing 100 to avoid electrical conduction between the circuit layer 230 and the housing 100, thereby preventing leakage current from the housing 100.

[0034] See Figure 1 , Figure 2 and Figure 3In some embodiments, the housing 100 may be made of a metallic material, such as cast aluminum. The housing 100 may be generally rectangular in shape, for example, it may include a bottom plate 130, a top plate 120, and a side plate 140. The side plate 140 connects the bottom plate 130 and the top plate 120. Along the thickness direction of the ceramic substrate 210, i.e., along the thickness direction of the entire housing 100, the top plate 120, the ceramic substrate 210, and the bottom plate 130 are spaced apart. A mounting cavity 112 is formed between the top plate 120 and the ceramic substrate 210, and a flow cavity 111 is formed between the ceramic substrate 210 and the bottom plate 130. The side plate 140 is provided with an inlet 151 and an outlet 152. The inlet 151 connects to the outside and the flow cavity 111, and the outlet 152 connects to the outside and the flow cavity 111. The inlet 151 and the outlet 152 are spaced apart on the side plate 140 by a certain distance. During the operation of the heater, the lower-temperature cryogenic liquid first enters the flow chamber 111 through the inlet 151. When the heating unit 200 heats the cryogenic liquid in the flow chamber 111, the cryogenic liquid transforms into a higher-temperature liquid. The high-temperature liquid can be output from the flow chamber 111 through the outlet 152, providing heat to the cabin of the new energy vehicle or insulating the battery. After heat exchange at the location of the cabin or battery in the new energy vehicle, the high-temperature liquid transforms into a cryogenic liquid, which returns to the flow chamber 111 through the inlet 151 for reheating, thus achieving liquid circulation.

[0035] This application also provides a new energy vehicle, which includes the aforementioned heating device 10. By installing the heating device 10, energy can be provided to the passenger compartment of the new energy vehicle, thereby improving the driving comfort. It can also insulate the battery of the new energy vehicle, thereby reasonably improving the driving range. Given the improved heating efficiency of the heating device 10, the energy utilization rate of the new energy vehicle can be improved, and the battery's driving range can be further enhanced.

[0036] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0037] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A heating device, characterized in that, include: A housing that encloses a receiving cavity; and A heating unit is disposed within the receiving cavity. The heating unit includes a ceramic substrate and a heating element. The ceramic substrate and the housing form an independently disposed flow cavity and a mounting cavity. The heating element is disposed on the ceramic substrate and located in the mounting cavity, and the heating element is used to heat the liquid passing through the flow cavity.

2. The heating device according to claim 1, characterized in that, The ceramic substrate is a silicon nitride ceramic substrate.

3. The heating device according to claim 1, characterized in that, The thermal conductivity of the ceramic substrate is greater than 60 W / (m·K).

4. The heating device according to claim 1, characterized in that, The circuit pattern of the heating element is formed by screen printing, and the circuit pattern of the heating element is connected to the ceramic substrate by thick film sintering.

5. The heating device according to claim 1, characterized in that, The heating unit further includes a circuit layer, which is disposed within the mounting cavity and electrically connected to the heating element.

6. The heating device according to claim 5, characterized in that, The circuit layer is spaced apart from the housing.

7. The heating device according to claim 1, characterized in that, The ceramic substrate is manufactured using a casting process and a sintering process.

8. The heating device according to claim 1, characterized in that, The shell is made of metal.

9. The heating device according to claim 1, characterized in that, The housing includes a bottom plate, a top plate, and a side plate, with the side plate connected between the bottom plate and the top plate. The top plate, the ceramic substrate, and the bottom plate are spaced apart, forming the mounting cavity between the top plate and the ceramic substrate, and the flow cavity between the ceramic substrate and the bottom plate. The side plate is provided with an inlet and an outlet that communicate with the flow cavity.

10. A new energy vehicle, characterized in that, The heating device includes any one of claims 1 to 9.

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