Refrigeration sheet structure of refrigeration equipment

Abstract

The utility model provides a refrigeration sheet structure of refrigeration equipment, which comprises a base plate, a group of radiating fins arranged on the base plate, a heat conducting plate arranged above the base plate, a group of semiconductor refrigeration sheets arranged above the heat conducting plate, quick mounting components arranged on the left side and the right side above the base plate, and a protection component arranged above the base plate, the quick mounting assembly comprises two groups of clamping blocks arranged above the base plate, U-shaped frames arranged outside the clamping blocks and connected with the upper surface of the base plate, and pushing structures arranged on the left side and the right side of the base plate and used for enabling the clamping blocks to be stably clamped into the U-shaped frames, and the protection assembly is used for protecting the semiconductor chilling plate. Through the arrangement of the quick mounting assembly, the trapezoidal block can conveniently drive the clamping block to enter the U-shaped frame or be separated from the U-shaped frame, so that quick mounting and dismounting of the heat conducting plate and the semiconductor chilling plate are realized, the operation time of workers is further shortened, and the mounting and dismounting efficiency of the heat conducting plate and the semiconductor chilling plate is improved.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration equipment technology, and in particular to a refrigeration plate structure for refrigeration equipment. Background Technology

[0002] In the field of refrigeration equipment, the cooling chip is the core component for realizing the refrigeration function. The cooling chip is a semiconductor device that works based on the Peltier effect. By applying a DC voltage across its two ends, one end can absorb heat and become the cold end, while the other end can release heat and become the hot end, thereby realizing the directional transfer of heat. This unique working principle makes it widely used in small refrigeration equipment, heat dissipation of electronic devices and other fields.

[0003] Application No. 202323376385.5 discloses a cooling chip structure for a refrigeration device, including a substrate and a mounting assembly. Fins are embedded inside the substrate, and a heat-conducting plate is provided at the upper end of the fins. Multiple semiconductor cooling chips are mounted on the upper end of the heat-conducting plate. Slots are provided on both sides of the upper end of the heat-conducting plate. The mounting assembly includes an L-shaped plate vertically fixed to both sides of the upper end of the substrate, a rod vertically inserted into the L-shaped plate, and a fastening plate fixed to the outer wall of the rod. A through hole is provided on the L-shaped plate, and a slot is provided on the inner wall of the through hole. The rod is disposed in the through hole and inserted into the slot at its bottom. The fastening plate is adapted to the size of the slot. In this cooling chip structure, the rod passes through the L-shaped plate and is inserted into the slot of the heat-conducting plate. The fastening plate on the outer wall of the L-shaped plate fixes the rod, thereby fixing the heat-conducting plate to the top of the fins, replacing the existing method of fixing with springs and ensuring stable installation of the heat-conducting plate.

[0004] The above solution has shortcomings in use. When installing the heat-conducting plate and the thermoelectric cooler, multiple rods need to be rotated in sequence to fix the heat-conducting plate and the thermoelectric cooler. This process takes a lot of time and further affects the efficiency of installation and disassembly. Therefore, we provide a cooling element junction for a refrigeration device. Utility Model Content

[0005] This utility model provides a cooling chip structure for a refrigeration device, which can more conveniently complete the installation and disassembly of the semiconductor cooling chip, further shorten the operation time of the staff, and thus improve the efficiency of its installation and disassembly.

[0006] The purpose and effect of the cooling chip structure of this utility model for a refrigeration device are achieved by the following specific technical means: A cooling chip structure for a refrigeration device includes a substrate, a set of heat dissipation fins disposed on the substrate, a heat-conducting plate disposed above the substrate, and a set of semiconductor cooling chips mounted above the heat-conducting plate, and further includes:

[0007] The quick-installation components are located on the left and right sides above the substrate, including two sets of locking blocks located on the top of the substrate, a U-shaped frame located outside each locking block and connected to the upper surface of the substrate, and a pushing structure located on the left and right sides of the substrate to stably lock the locking blocks into the U-shaped frame.

[0008] A protective component, disposed above the substrate, is used to protect the semiconductor cooling chip.

[0009] Preferably, the pushing structure of the quick-installation assembly includes an L-shaped plate fixedly connected to the left and right sides of the base plate. Each L-shaped plate is slidably connected to a set of sliding rods. The ends of the two sets of sliding rods that are close to each other are respectively fixedly connected to a trapezoidal block. The bottom surface of each trapezoidal block is connected to the upper surface of the locking block. A spring is sleeved on the outer surface of each sliding rod.

[0010] Preferably, the other end of each set of slide rods is fixedly connected to a pull plate.

[0011] Preferably, each of the two pull plates has an insertion hole on its side that is close to each other, and each of the two L-shaped plates has a top rod hinged to its side that is far from each other.

[0012] Preferably, a set of buffer pads is fixedly connected to one side of each of the two pull plates that are close to each other, and each set of buffer pads is symmetrically arranged.

[0013] Preferably, each of the two trapezoidal blocks has a U-shaped frame slidably connected to one of their opposite sides, and the bottom end of each U-shaped frame is connected to the outer surface of the substrate.

[0014] Preferably, the protective component includes a protective plate disposed above the substrate, and both the front and rear ends of the protective plate are arc-shaped.

[0015] Preferably, the bottom surface of the protective plate is fixedly connected to two sets of elastic plates, and the outer surface of the bottom end of each elastic plate is fitted with a connecting frame. The side of each set of connecting frames that are close to each other is connected to the outer surface of the substrate.

[0016] Preferably, each set of elastic plates has a reinforcing plate fixedly connected to one side of each other.

[0017] Preferably, a set of brackets is fixedly connected to the bottom surface of the protective plate, and the bottom surface of each bracket is in contact with the upper surface of the substrate.

[0018] Beneficial effects:

[0019] 1. The quick-installation components allow the trapezoidal block to easily move the locking block into or out of the U-shaped frame, enabling rapid installation and disassembly of the heat-conducting plate and the thermoelectric cooler, further reducing the operator's time and improving installation and disassembly efficiency. The protective components can stabilize the protective plate above the thermoelectric cooler, thus protecting it.

[0020] 2. The U-shaped frame can support the trapezoidal block, ensuring that the trapezoidal block can move smoothly. Through the cooperation of the set socket and the top rod, the top rod can be inserted into the socket to support the pull plate, so that the trapezoidal block is stable in the installation area away from the heat conduction plate and the semiconductor cooling chip, thus providing sufficient operating space for subsequent installation work. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model.

[0022] Figure 2 This is a three-dimensional structural diagram of the substrate of this utility model.

[0023] Figure 3 This is a three-dimensional structural diagram of the trapezoidal block of this utility model.

[0024] Figure 4 This is a three-dimensional structural diagram of the card block of this utility model from a bottom view.

[0025] Figure 5 This is a three-dimensional structural diagram of the L-shaped plate of this utility model.

[0026] Figure 6 This is a three-dimensional structural diagram of the protective plate of this utility model.

[0027] Figure 1-6 In the diagram, the correspondence between component names and drawing numbers is as follows:

[0028] 1. Substrate; 2. Heat sink fins; 3. Heat conduction plate; 4. Semiconductor cooling chip; 5. Quick-install assembly; 501. Clip; 502. U-shaped frame; 503. L-shaped plate; 504. Slide bar; 505. Trapezoidal block; 506. Spring; 507. Pull plate; 508. Insertion hole; 509. Top rod; 510. Buffer pad; 511. U-shaped frame; 6. Protective assembly; 601. Protective plate; 602. Elastic plate; 603. Connecting frame; 604. Reinforcing plate; 605. Bracket. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0030] First Embodiment

[0031] As attached Figure 1 With appendix Figure 2 The diagram shows a cooling chip structure for a refrigeration device, comprising a substrate 1, a set of heat dissipation fins 2 disposed on the substrate 1, a heat-conducting plate 3 disposed above the substrate 1, and a set of semiconductor cooling chips 4 mounted above the heat-conducting plate 3. When direct current passes through the semiconductor cooling chips 4, the upper surface of the semiconductor cooling chips 4 absorbs heat and becomes the cold end, directly contacting the object to be cooled to absorb heat; the lower surface releases heat and becomes the hot end. The heat is quickly conducted to the heat dissipation fins 2 through the heat-conducting plate 3. When the outside air flows through the gaps between the heat dissipation fins 2, it continuously carries away the heat from the surface of the heat dissipation fins 2, ensuring that the heat is quickly dissipated into the surrounding environment, thereby maintaining the low temperature state of the hot end of the semiconductor cooling chips 4.

[0032] Second Embodiment

[0033] As attached Figure 1 Appendix Figure 3 Appendix Figure 4 With appendix Figure 5As shown: Quick-installation component 5, located on the left and right sides above the substrate 1, includes two sets of locking blocks 501 on the substrate 1, a U-shaped frame 502 located outside each locking block 501 and connected to the upper surface of the substrate 1, and a pushing structure located on the left and right sides of the substrate 1 to stably engage the locking blocks 501 with the U-shaped frame 502. The pushing structure of quick-installation component 5 includes L-shaped plates 503 fixedly connected to the left and right sides of the substrate 1. Each L-shaped plate 503 has a set of sliding rods 504 slidably connected to it. The ends of the two sets of sliding rods 504 that are close to each other are respectively fixedly connected to trapezoidal blocks 505. The bottom surface of each trapezoidal block 505 is connected to the upper surface of the locking block 501. Springs 506 are fitted on the outer surface of rod 504. When disassembling, simply pull the sliding rod 504, and the trapezoidal block 505 will drive the locking block 501 to disengage from the U-shaped frame 502, thereby releasing the fixation of the heat-conducting plate 3 and the semiconductor cooling chip 4. When installing, simply release the pull on the sliding rod 504, and the spring 506 will push the trapezoidal block 505, and the locking block 501 will enter the U-shaped frame 502 to fix the heat-conducting plate 3 and the semiconductor cooling chip 4. U-shaped frames 511 are slidably connected to the opposite sides of the two trapezoidal blocks 505. The bottom end of each U-shaped frame 511 is connected to the outer surface of the substrate 1. The U-shaped frames 511 can support the trapezoidal blocks 505, thereby ensuring their smooth movement.

[0034] The other end of each set of sliding rods 504 is fixedly connected to a pull plate 507. The pull plate 507 allows the operator to pull both sliding rods 504 simultaneously. The sides of the two pull plates 507 that are close to each other are provided with insertion holes 508. The sides of the two L-shaped plates 503 that are far from each other are hinged with top rods 509. When the pull plate 507 moves a certain distance, the top rods 509 can be deflected to insert into the insertion holes 508, thereby stabilizing the trapezoidal block 505 in the installation area away from the heat-conducting plate 3 and the semiconductor cooling chip 4, thus providing sufficient operating space for subsequent installation work. The sides of the two pull plates 507 that are close to each other are fixedly connected to a set of buffer pads 510. Each set of buffer pads 510 is symmetrically arranged. When the spring 506 extends and pushes the pull plate 507 to move, the buffer pads 510 will buffer the movement of the pull plate 507, thereby allowing the trapezoidal block 505 to drive the locking block 501 to slide smoothly into the U-shaped frame 502.

[0035] Third Embodiment

[0036] As attached Figure 1 With appendix Figure 6As shown: Protective component 6, disposed above substrate 1, is used to protect the thermoelectric cooler 4. Protective component 6 includes a protective plate 601 disposed above substrate 1, and both the front and rear ends of the protective plate 601 are arc-shaped. The protective plate 601 can shield and protect the thermoelectric cooler 4. Two sets of elastic plates 602 are fixedly connected to the bottom surface of the protective plate 601. A connecting frame 603 is fitted on the outer surface of the bottom end of each elastic plate 602. The side of each set of connecting frames 603 that are close to each other is connected to the outer surface of substrate 1. By inserting the elastic plate 602 into the connecting frame 603, a stable support can be formed for the protective plate 601. At the same time, the protective plate 601 can be quickly removed when it is not needed.

[0037] Each set of elastic plates 602 has a reinforcing plate 604 fixedly connected to one side of each other. The reinforcing plate 604 can be used to connect the elastic plates 602, further enhancing the firmness between the elastic plates 602. A set of brackets 605 is fixedly connected to the bottom surface of the protective plate 601. The bottom surface of each bracket 605 is in contact with the upper surface of the base plate 1. The brackets 605 can support the left and right sides of the protective plate 601 onto the base plate 1, further improving the stability of the protective plate 601.

[0038] Working principle: When disassembling the heat-conducting plate 3 and the thermoelectric cooler 4, simply pull the pull plate 507. The slide rod 504 will then move the trapezoidal block 505, and the locking block 501 will separate from the U-shaped frame 502. Then, the top rod 509 will be deflected to insert into the socket 508. At this time, the trapezoidal block 505 will compress the spring 506. Then, the heat-conducting plate 3 and the thermoelectric cooler 4 can be removed and replaced. After the new heat-conducting plate 3 and thermoelectric cooler 4 are installed, pull the pull plate 507 to disengage the top rod 509 from the socket 508. Then release the pull plate 507. The spring 506 will extend and push the trapezoidal block 505. The trapezoidal block 505 will then drive the locking block 501 into the U-shaped frame 502, thereby quickly forming the installation of the heat-conducting plate 3 and the thermoelectric cooler 4.

Claims

1. A cooling chip structure for a refrigeration device, comprising a substrate (1), a set of heat dissipation fins (2) disposed on the substrate (1), a heat-conducting plate (3) disposed above the substrate (1), and a set of semiconductor cooling chips (4) mounted above the heat-conducting plate (3), characterized in that, Also includes: The quick-installation assembly (5) is set on the left and right sides above the substrate (1), including two sets of locking blocks (501) set on the top of the substrate (1), a U-shaped frame (502) set outside each locking block (501) and connected to the upper surface of the substrate (1), and a push structure set on the left and right sides of the substrate (1) for stably locking the locking block (501) into the U-shaped frame (502). A protective component (6) is disposed above the substrate (1) for protecting the semiconductor cooling chip (4).

2. The cooling plate structure of the refrigeration equipment according to claim 1, characterized in that: The pushing structure of the quick-installation assembly (5) includes an L-shaped plate (503) fixedly connected to the left and right sides of the base plate (1). Each L-shaped plate (503) is slidably connected to a set of slide rods (504). The ends of the two sets of slide rods (504) that are close to each other are respectively fixedly connected to trapezoidal blocks (505). The bottom surface of each trapezoidal block (505) is connected to the upper surface of the locking block (501). A spring (506) is sleeved on the outer surface of each slide rod (504).

3. The cooling plate structure of the refrigeration equipment according to claim 2, characterized in that: The other end of each set of slide rods (504) is fixedly connected to a pull plate (507).

4. The cooling plate structure of the refrigeration equipment according to claim 3, characterized in that: Both of the two pull plates (507) have insertion holes (508) on their sides that are close to each other, and both of the two L-shaped plates (503) have top rods (509) hinged to their sides that are far from each other.

5. The cooling plate structure of the refrigeration equipment according to claim 3, characterized in that: Each of the two pull plates (507) has a set of buffer pads (510) fixedly connected to one side of each other, and each set of buffer pads (510) is symmetrically arranged.

6. The cooling plate structure of the refrigeration equipment according to claim 2, characterized in that: Each of the two trapezoidal blocks (505) has a U-shaped frame (511) slidably connected to one side away from the other, and the bottom end of each U-shaped frame (511) is connected to the outer surface of the substrate (1).

7. The cooling plate structure of the refrigeration equipment according to claim 1, characterized in that: The protective component (6) includes a protective plate (601) disposed above the substrate (1), and both the front and rear ends of the protective plate (601) are arc-shaped.

8. The refrigeration plate structure of the refrigeration equipment according to claim 7, characterized in that: The bottom surface of the protective plate (601) is fixedly connected to two sets of elastic plates (602). Each elastic plate (602) has a connecting frame (603) fitted on the outer surface of its bottom end. The side of each set of connecting frames (603) that are close to each other is connected to the outer surface of the substrate (1).

9. The cooling plate structure of the refrigeration equipment according to claim 8, characterized in that: Each set of elastic plates (602) has a reinforcing plate (604) fixedly connected to one side of each other.

10. The cooling plate structure of the refrigeration device according to claim 7, characterized in that: A set of brackets (605) are fixedly connected to the bottom surface of the protective plate (601), and the bottom surface of each bracket (605) is in contact with the upper surface of the substrate (1).

Images