Semiconductor material deformation monitoring device

Abstract

The utility model provides a semiconductor material deformation monitoring device, which relates to the technical field of semiconductor production, and comprises a tank body and a sound wave detection head, the inside of the tank body is fixedly connected with an overturning detection assembly, the top end of the overturning detection assembly is fixedly connected with a pressure assembly, and the top end of the tank body is fixedly connected with a feeding assembly. The overturning detection assembly comprises a motor and a connecting plate, the outer side of the motor is fixedly connected to the tank body, the driving end of the motor is fixedly connected with a top cover, the bottom end of the top cover is fixedly connected with a guide plate, and one end of the connecting plate is fixedly connected with a guide sliding column; the innovative design concept enables detection and analysis of the semiconductor material to be more flexible and comprehensive, careful observation can be performed from multiple angles, and researchers can accurately monitor the deformation process of the material, so that behaviors and characteristics of the material under different conditions can be better known, and the detection accuracy of the semiconductor material is improved. Therefore, the rupture of the thin film caused by uneven stress generated in the temperature change process is effectively avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor material deformation monitoring device. Background Technology

[0002] Semiconductors are materials whose conductivity lies between that of conductors and insulators. They can conduct electricity under certain conditions, while behaving as insulators under other conditions. Common semiconductor materials include silicon and germanium.

[0003] However, in actual use, the following shortcomings still exist. For example, during the thin film deposition process, due to the difference in the coefficients of thermal expansion between the thin film and the substrate material, when the temperature changes, the two will produce mismatched deformations during thermal expansion or contraction. This deformation will cause stress to be generated inside the thin film, thereby causing cracking, peeling or warping of the thin film, thus affecting the performance and service life of the thin film.

[0004] Therefore, this utility model provides a semiconductor material deformation monitoring device. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies and provide a semiconductor material deformation monitoring device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor material deformation monitoring device, comprising a tank and an acoustic detection head, wherein a flip detection component is fixedly connected inside the tank, a pressure component is fixedly connected to the top of the flip detection component, and a feeding component is fixedly connected to the top of the tank.

[0007] The flip detection assembly includes a motor and a connecting plate. The outer side of the motor is fixedly connected to the tank body. The drive end of the motor is fixedly connected to a top cover. The bottom end of the top cover is fixedly connected to a guide plate. One end of the connecting plate is fixedly connected to a guide sliding column. The other end of the connecting plate is fixedly connected to a placement frame. The outer side of the placement frame is fixedly connected to a stabilizing column.

[0008] In a preferred embodiment, the pressure assembly includes a top column, the bottom end of which is fixedly connected to a top cover. A connecting rod is fixedly connected to the outer side of the top column, and a sliding rod is slidably connected to the outer side of the connecting rod. A spring is slidably connected to the outer side of the connecting rod and the sliding rod, and a rotating shaft is fixedly connected to the inside of the sliding rod.

[0009] The technical effects of adopting the above technical solution are: it can realize real-time monitoring of the deformation behavior of semiconductor thin films under different temperature and stress conditions; the flip detection component in the device can accurately control the flip angle of the sample; and with the acoustic detection head, it can perform high-precision detection of minute deformations inside the material.

[0010] In a preferred embodiment, the feeding assembly includes a telescopic rod, the outer side of which is mounted on the tank body. A positioning plate is fixedly connected to the top of the tank body, and a pneumatic suction cup is fixedly connected to the driving end of the telescopic rod. The pneumatic suction cup is slidably connected to the positioning plate.

[0011] The technical effect of adopting the above technical solution is that it can effectively monitor the automatic double-sided flipping of semiconductor materials for detection, thereby providing important data support for thin film deposition processes.

[0012] In a preferred embodiment, the outer side of the guide sliding column is slidably connected to a groove formed in the top cover and the guide plate.

[0013] The technical effect of adopting the above technical solution is that it can ensure that the flip detection component remains stable during the flipping process, and avoid misoperation or damage caused by mechanical vibration or external impact.

[0014] In a preferred embodiment, the outer side of the stabilizing column is slidably connected to the tank body.

[0015] The technical effect of adopting the above technical solution is that it can provide additional support and stability, ensuring that the entire device remains accurate during the monitoring process.

[0016] In a preferred embodiment, one end of the rotating shaft is rotatably connected to the placement frame.

[0017] The technical effect of adopting the above technical solution is that it enables the pressure component to flexibly adjust its position during the monitoring process.

[0018] In a preferred embodiment, one end of the spring is fixedly connected to the connecting rod, and the other end of the spring is fixedly connected to the sliding rod.

[0019] The technical effect of adopting the above technical solution is that it can provide stable elasticity and ensure that the slide rod returns to its original position after sliding.

[0020] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0021] This invention utilizes a flip-over detection component and a pressure component structure. The extension of a telescopic rod drives a pneumatic suction cup to grasp and transport materials to a designated detection position under negative pressure. Subsequently, a motor starts, causing the top cover to rotate, which in turn drives the guide plate and guide sliding column to move synchronously. During detection, the top column transmits pressure to the connecting rod, whose sliding structure adjusts the pressure magnitude and application position. Combined with the elastic deformation of the spring, this ensures uniform pressure distribution. Finally, the guide sliding column causes the connecting plate and placement frame to flip, enabling multi-angle detection and analysis of semiconductor materials in conjunction with an acoustic detection head. This innovative design concept makes the detection and analysis of semiconductor materials more flexible and comprehensive, allowing for detailed observation from multiple angles. Researchers can accurately monitor the material deformation process, thereby better understanding the material's behavior and properties under different conditions, effectively preventing rupture caused by uneven stress during temperature changes in the thin film. Attached Figure Description

[0022] Figure 1 A perspective view of a semiconductor material deformation monitoring device provided by this utility model;

[0023] Figure 2 A schematic cross-sectional view of the tank structure of a semiconductor material deformation monitoring device provided by this utility model;

[0024] Figure 3 A schematic diagram of the flip detection component structure of a semiconductor material deformation monitoring device provided by this utility model;

[0025] Figure 4 A schematic diagram of the pressure component structure of a semiconductor material deformation monitoring device provided by this utility model.

[0026] Legend:

[0027] 1. Tank body;

[0028] 2. Tilting detection assembly; 21. Motor; 22. Top cover; 23. Guide plate; 24. Connecting plate; 25. Guide sliding column; 26. Placement frame; 27. Stabilizing column;

[0029] 3. Pressure assembly; 31. Top column; 32. Connecting rod; 33. Slide rod; 34. Spring; 35. Rotating shaft;

[0030] 4. Feeding assembly; 41. Telescopic rod; 42. Positioning plate; 43. Pneumatic suction cup;

[0031] 5. Acoustic wave detection head. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] like Figure 1 - Figure 4 As shown, this embodiment provides a technical solution: a semiconductor material deformation monitoring device, including a tank 1 and an acoustic detection head 5. A flip detection component 2 is fixedly connected inside the tank 1, a pressure component 3 is fixedly connected to the top of the flip detection component 2, and a feeding component 4 is fixedly connected to the top of the tank 1.

[0034] The overturning detection assembly 2 includes a motor 21 and a connecting plate 24. The outer side of the motor 21 is fixedly connected to the tank body 1. The drive end of the motor 21 is fixedly connected to a top cover 22. The bottom end of the top cover 22 is fixedly connected to a guide plate 23. One end of the connecting plate 24 is fixedly connected to a guide sliding post 25. The outer side of the guide sliding post 25 is slidably connected to a groove opened in the top cover 22 and the guide plate 23. The other end of the connecting plate 24 is fixedly connected to a placement frame 26. The outer side of the placement frame 26 is fixedly connected to a stabilizing post 27. The outer side of the stabilizing post 27 is slidably connected to the tank body 1. The overturning detection assembly 2 is... The core detection component of the device consists of a motor 21 and a connecting plate 24. The motor 21 is fixed to the outside of the tank 1 and drives the rotation of the top cover 22. A stable and rotatable chute is formed between the top cover 22 and the guide plate 23, which can guide the sliding column 25 to rotate smoothly in the chute. When the motor 21 starts, it drives the top cover 22 to rotate up and down, which drives the guide sliding column 25 and the connecting plate 24 to move together, and finally pushes the placement frame 26. This rotation movement can allow for multi-angle observation and analysis of the semiconductor material to be tested from different angles, ensuring the comprehensiveness of deformation detection.

[0035] Furthermore, such as Figure 4As shown: In this design, the pressure assembly 3 includes a top column 31, the bottom end of which is fixedly connected to the top cover 22. A connecting rod 32 is fixedly connected to the outer side of the top column 31, and a sliding rod 33 is slidably connected to the outer side of the connecting rod 32. A spring 34 is slidably connected to the outer sides of the connecting rod 32 and the sliding rod 33. One end of the spring 34 is fixedly connected to the connecting rod 32, and the other end is fixedly connected to the sliding rod 33. A rotating shaft 35 is fixedly connected inside the sliding rod 33, and one end of the rotating shaft 35 is rotatably connected to the placement frame 26. Firstly, the top column 31 serves as a supporting structure for the pressure assembly 3, providing a stable connection point. The design of the connecting rod 32 allows pressure to be transmitted from the top column 31 to the lower placement frame 26. The frame 26 is placed on the slide, and an appropriate force is applied during the testing process. The connecting rod 32 not only serves as a connector, but also, due to its sliding structure design, it can move freely within a certain range to flexibly adjust the pressure. The slide rod 33 can adjust its height through its sliding connection, thereby changing the position and angle of the pressure application. This flexibility makes the pressure application more uniform and avoids excessive or insufficient local pressure. The spring 34 adjusts the applied pressure through elastic deformation. When the slide rod 33 is subjected to pressure, the spring 34 will compress or release appropriately according to the material properties. The rotating shaft 35 is designed to provide stable support for the frame 26, so that the frame 26 can remain stable when rotating.

[0036] Furthermore, such as Figure 1 As shown: The feeding assembly 4 includes a telescopic rod 41, the outer side of which is mounted on the tank body 1. A positioning plate 42 is fixedly connected to the top of the tank body 1. A pneumatic suction cup 43 is fixedly connected to the drive end of the telescopic rod 41. The pneumatic suction cup 43 is slidably connected to the positioning plate 42. The telescopic rod 41, as the main actuator of the feeding assembly, is responsible for accurately conveying the material to the designated position. The positioning plate 42 provides a fixed reference surface for the entire feeding system, ensuring that the position of each component of the feeding assembly is accurate during operation. The pneumatic suction cup 43 relies on the pneumatic principle to grab the material through the negative pressure generated inside, achieving stable material adsorption. Since it is fixedly connected to the telescopic rod 41, the pneumatic suction cup 43 can simultaneously pick up and place the material when the telescopic rod 41 extends or retracts.

[0037] Working principle:

[0038] like Figure 1 - Figure 4 As shown:

[0039] In use: First, during the material feeding stage, the telescopic rod 41 extends, and the pneumatic suction cup 43 fixed at its drive end grips the material by generating negative pressure. Then, it moves synchronously during the extension and retraction of the telescopic rod 41, ultimately accurately delivering the material to the designated detection position. Subsequently, the motor 21 starts, driving the top cover 22 to rotate, which in turn drives the guide plate 23 connected to the top cover 22 to move synchronously. During the detection process, the top column 31 acts as a support structure, transmitting pressure to the connecting rod 32 connected to it. As the detection progresses, the connecting rod 32 flexibly slides through its sliding structure. Adjusting the pressure causes the sliding rod 33, which is slidably connected to it, to move up and down, thereby changing the position and angle of the applied pressure. At this time, the spring 34 undergoes elastic deformation according to the pressure change, helping to adjust the appropriate pressure. Finally, through the placement frame 26 connected to the rotating shaft 35, the guide sliding column 25, which is fixed in the groove of the guide plate 23, begins to rotate along the groove, causing the connecting plate 24, which is fixedly connected to it, and the placement frame 26 at its end to move together, thereby realizing the rotation of the placement frame 26. This allows for multi-angle detection and analysis of the semiconductor material through the acoustic wave detection head 5.

[0040] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A semiconductor material deformation monitoring device, comprising a tank (1) and an acoustic wave detection head (5), characterized in that, The tank (1) is fixedly connected to a flip detection component (2), the top of the flip detection component (2) is fixedly connected to a pressure component (3), and the top of the tank (1) is fixedly connected to a feeding component (4). The flip detection component (2) includes a motor (21) and a connecting plate (24). The outer side of the motor (21) is fixedly connected to the tank body (1). The driving end of the motor (21) is fixedly connected to a top cover (22). The bottom end of the top cover (22) is fixedly connected to a guide plate (23). One end of the connecting plate (24) is fixedly connected to a guide sliding column (25). The other end of the connecting plate (24) is fixedly connected to a placement frame (26). The outer side of the placement frame (26) is fixedly connected to a stabilizing column (27).

2. The semiconductor material deformation monitoring device according to claim 1, characterized in that: The pressure assembly (3) includes a top post (31), the bottom end of which is fixedly connected to the top cover (22). A connecting rod (32) is fixedly connected to the outside of the top post (31), and a slide rod (33) is slidably connected to the outside of the connecting rod (32). A spring (34) is slidably connected to the outside of the connecting rod (32) and the slide rod (33). A rotating shaft (35) is fixedly connected inside the slide rod (33).

3. The semiconductor material deformation monitoring device according to claim 1, characterized in that: The feeding assembly (4) includes a telescopic rod (41), the outer side of which is mounted on the tank body (1). A positioning plate (42) is fixedly connected to the top of the tank body (1). A pneumatic suction cup (43) is fixedly connected to the driving end of the telescopic rod (41), and the pneumatic suction cup (43) is slidably connected to the positioning plate (42).

4. The semiconductor material deformation monitoring device according to claim 1, characterized in that: The outer side of the guide sliding column (25) is slidably connected to the groove opened in the top cover (22) and the guide plate (23).

5. The semiconductor material deformation monitoring device according to claim 1, characterized in that: The outer side of the stabilizing column (27) is slidably connected to the tank body (1).

6. The semiconductor material deformation monitoring device according to claim 2, characterized in that: One end of the rotating shaft (35) is rotatably connected to the placement frame (26).

7. A semiconductor material deformation monitoring device according to claim 2, characterized in that: One end of the spring (34) is fixedly connected to the connecting rod (32), and the other end of the spring (34) is fixedly connected to the slide rod (33).

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