Resonant vibration sensor

Abstract

The utility model relates to a resonance type vibration sensor. The resonance type vibration sensor comprises a base, a resonance fork and a piezoelectric vibrator, the resonance fork and the piezoelectric vibrator are fixedly connected with the base respectively, the piezoelectric vibrator is arranged on the inner side of the resonance fork, and a U-shaped gap is formed between the resonance fork and the piezoelectric vibrator; a piezoelectric vibrator is arranged on the base, a piezoelectric ceramic sensing chip is attached to one side, close to the base, of the piezoelectric vibrator, a groove is formed in the base, a circuit board is arranged in the groove, a signal amplifier is arranged on the circuit board, and the piezoelectric ceramic sensing chip is electrically connected with the signal amplifier; the signal amplifier is connected with an external lead which is used for being connected with an external circuit. The resonant vibration sensor is simple in structure, and can effectively improve the precision and reliability of vibration signal detection.

Description

Technical Field

[0001] This utility model relates to the field of vibration sensor technology, and in particular to a resonant vibration sensor. Background Technology

[0002] A vibration sensor is a device that converts mechanical vibration energy or motion state into electrical signals. It is widely used in equipment monitoring, structural safety assessment, and earthquake detection. The core function of a vibration sensor is to achieve electromechanical conversion through principles such as piezoelectricity and magnetoelectricity, thereby quantifying vibration parameters.

[0003] Existing vibration sensors have several limitations in application. First, piezoelectric ceramic sensors in existing vibration sensors mainly use metal sheets as substrates. Due to the considerable thickness of the metal substrate, the overall size of the vibration sensor is difficult to further reduce, making them unsuitable for installation in space-constrained applications. Second, the structural characteristics of the metal substrate result in low vibration sensitivity, making it ineffective at detecting weak vibration signals and unable to accurately and promptly capture vibration information, thus affecting the accuracy and reliability of vibration monitoring. Third, the signal output of existing vibration sensors often suffers from small signal amplitude and impedance mismatch, requiring additional complex signal processing circuits for optimization, increasing cost and equipment complexity. Utility Model Content

[0004] Therefore, it is necessary to provide a resonant vibration sensor to address the numerous limitations of existing vibration sensors in application.

[0005] A resonant vibration sensor includes a base, a resonant fork, and a piezoelectric vibrator. The resonant fork and the piezoelectric vibrator are respectively fixedly connected to the base. The piezoelectric vibrator is disposed on the inner side of the resonant fork, and a U-shaped gap is formed between the resonant fork and the piezoelectric vibrator.

[0006] A piezoelectric ceramic sensing chip is attached to the side of the piezoelectric vibrator near the base. The base has a groove, and a circuit board is provided in the groove. A signal amplifier is provided on the circuit board, and the piezoelectric ceramic sensing chip is electrically connected to the signal amplifier.

[0007] The signal amplifier is connected to an external lead, which is used to connect to an external circuit.

[0008] The aforementioned resonant vibration sensor includes a base, a resonant fork, and a piezoelectric vibrator. The resonant fork and the piezoelectric vibrator are fixedly connected to the base. The piezoelectric vibrator is located inside the resonant fork, forming a U-shaped gap between them. A piezoelectric ceramic sensing chip is attached to the side of the piezoelectric vibrator closest to the base. The base has a groove containing a circuit board with a signal amplifier mounted on it. The piezoelectric ceramic sensing chip is electrically connected to the signal amplifier. The signal amplifier is connected to an external lead for connecting to an external circuit. When the resonant vibration sensor is working, if external vibration occurs and its frequency is close to or equal to the natural frequency of the resonant fork, the resonant fork will generate a resonant vibration with enhanced amplitude, transmitting the vibration energy to the piezoelectric vibrator. The piezoelectric ceramic sensing chip attached to the piezoelectric vibrator converts the vibration signal into an electrical signal and transmits it to the signal amplifier for amplification, allowing the external circuit to further process the amplified signal. It can be seen that the combination of the resonant fork and the piezoelectric vibrator can amplify external vibrations, thereby improving the sensitivity of vibration detection. Furthermore, the signal amplifier can amplify the signal and perform impedance transformation. By amplifying the signal, the output signal can meet the processing needs of the external circuit. By transforming the impedance, the output impedance of the resonant vibration sensor can be matched with the input impedance of the external circuit, reducing loss and interference during signal transmission and improving the working efficiency and stability of the resonant vibration sensor.

[0009] In one embodiment, the piezoelectric ceramic sensing chip includes a substrate and a piezoelectric ceramic layer;

[0010] The substrate is wrapped inside the piezoelectric ceramic layer, and the substrate is made of a flexible circuit board.

[0011] In one embodiment, the signal amplifier is a field-effect transistor amplifier.

[0012] In one embodiment, both the resonant fork and the piezoelectric vibrator are brass sheets.

[0013] In one embodiment, the base is provided with a through hole for engaging the external lead.

[0014] In one embodiment, the signal amplifier is model RF2324.

[0015] In one embodiment, the circuit board is further provided with a filter, and the signal amplifier is connected to the external lead through the filter.

[0016] In one embodiment, the resonant vibration sensor further includes a silicone sleeve disposed on the outside of the resonant vibration sensor. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the resonant vibration sensor of this utility model;

[0018] Figure 2 This is a schematic diagram of the base structure in the resonant vibration sensor of this utility model;

[0019] Figure 3 This is a circuit diagram of the resonant vibration sensor of this utility model;

[0020] Among them, 10 is the base, 20 is the resonant fork, 30 is the piezoelectric vibrator, 40 is the gap, 50 is the piezoelectric ceramic sensor chip, 60 is the circuit board, 11 is the groove, 12 is the through hole, 61 is the signal amplifier, 62 is the external lead wire, and 63 is the filter. Detailed Implementation

[0021] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0022] It should be noted that when an element is said to be "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly on" another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0024] This utility model discloses a resonant vibration sensor.

[0025] like Figures 1 to 3As shown, the resonant vibration sensor includes a base 10, a resonant fork 20, and a piezoelectric vibrator 30. The resonant fork 20 and the piezoelectric vibrator 30 are fixedly connected to the base 10. The piezoelectric vibrator 30 is located inside the resonant fork 20, and a U-shaped gap 40 is formed between the resonant fork 20 and the piezoelectric vibrator 30. A piezoelectric ceramic sensing chip 50 is attached to the side of the piezoelectric vibrator 30 near the base 10. The base 10 has a groove 11, and a circuit board 60 is located in the groove 11. A signal amplifier 61 is located on the circuit board 60. The piezoelectric ceramic sensing chip 50 is electrically connected to the signal amplifier 61. The signal amplifier 61 is connected to an external lead 62, which is used to connect to an external circuit.

[0026] The aforementioned resonant vibration sensor includes a base, a resonant fork, and a piezoelectric vibrator. The resonant fork and the piezoelectric vibrator are fixedly connected to the base. The piezoelectric vibrator is located inside the resonant fork, forming a U-shaped gap between them. A piezoelectric ceramic sensing chip is attached to the side of the piezoelectric vibrator closest to the base. The base has a groove containing a circuit board with a signal amplifier mounted on it. The piezoelectric ceramic sensing chip is electrically connected to the signal amplifier. The signal amplifier is connected to an external lead for connecting to an external circuit. When the resonant vibration sensor is working, if external vibration occurs and its frequency is close to or equal to the natural frequency of the resonant fork, the resonant fork will generate a resonant vibration with enhanced amplitude, transmitting the vibration energy to the piezoelectric vibrator. The piezoelectric ceramic sensing chip attached to the piezoelectric vibrator converts the vibration signal into an electrical signal and transmits it to the signal amplifier for amplification, allowing the external circuit to further process the amplified signal. It can be seen that the combination of the resonant fork and the piezoelectric vibrator can amplify external vibrations, thereby improving the sensitivity of vibration detection. Furthermore, the signal amplifier can amplify the signal and perform impedance transformation. By amplifying the signal, the output signal can meet the processing needs of the external circuit. By transforming the impedance, the output impedance of the resonant vibration sensor can be matched with the input impedance of the external circuit, reducing loss and interference during signal transmission and improving the working efficiency and stability of the resonant vibration sensor.

[0027] The piezoelectric ceramic sensor chip 50 includes a substrate and a piezoelectric ceramic layer. The substrate is wrapped inside the piezoelectric ceramic layer and is made of a flexible circuit board. The flexible circuit board is thin and flexible, which significantly reduces the thickness of the piezoelectric ceramic sensor chip 50 compared to traditional metal substrates, making this resonant vibration sensor thinner and lighter. At the same time, the unique physical properties of the flexible circuit board allow the piezoelectric ceramic sensor chip 50 to deform more freely during vibration, thereby significantly improving vibration sensitivity and enabling more accurate detection of weak vibration signals.

[0028] Furthermore, the signal amplifier 61 employs a field-effect transistor (FET) amplifier. FET amplifiers offer advantages such as high input impedance, low noise, low power consumption, wide dynamic range, and ease of integration. The use of a FET amplifier in the signal amplifier 61 significantly improves the quality and reliability of signal amplification.

[0029] Both the resonant fork 20 and the piezoelectric vibrator 30 are made of brass sheets. Brass sheets have the advantages of good elasticity and thinness, and can generate appropriate elastic deformation during vibration, effectively transmitting and amplifying vibration energy. The racetrack-shaped structure of the resonant fork and piezoelectric vibrator has unique mechanical properties, which can make the vibration energy evenly distributed on the resonant fork and piezoelectric vibrator, further enhancing the vibration effect and improving the response capability of this resonant vibration sensor to vibrations of different directions and frequencies.

[0030] The base 10 is provided with a through hole 12 for connecting the external lead 62. The through hole 12 makes it easier to bring out the external lead 62.

[0031] Furthermore, the signal amplifier 61 is model number RF2324. The RF2324 amplifier features low noise, high intercept point, power control, single-supply operation, wide operating frequency range, and extremely small package size.

[0032] The circuit board 60 also includes a filter 63, through which the signal amplifier 61 is connected to an external lead 62. The filter 63 is preferably a π-type filter and includes a resistor R, a first capacitor C1, and a second capacitor C2. The main features of the filter 63 include high-efficiency filtering, ease of implementation, good stability, and a wide frequency range.

[0033] Furthermore, the resonant vibration sensor also includes a silicone sleeve, which is located on the outside of the sensor. This silicone sleeve effectively protects the resonant vibration sensor.

[0034] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0035] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A resonant vibration sensor, characterized in that, The device includes a base, a resonant fork, and a piezoelectric vibrator. The resonant fork and the piezoelectric vibrator are respectively fixedly connected to the base. The piezoelectric vibrator is disposed on the inner side of the resonant fork, and a U-shaped gap is formed between the resonant fork and the piezoelectric vibrator. A piezoelectric ceramic sensing chip is attached to the side of the piezoelectric vibrator near the base. The base has a groove, and a circuit board is provided in the groove. A signal amplifier is provided on the circuit board, and the piezoelectric ceramic sensing chip is electrically connected to the signal amplifier. The signal amplifier is connected to an external lead, which is used to connect to an external circuit.

2. The resonant vibration sensor according to claim 1, characterized in that, The piezoelectric ceramic sensing chip includes a substrate and a piezoelectric ceramic layer; The substrate is wrapped inside the piezoelectric ceramic layer, and the substrate is made of a flexible circuit board.

3. The resonant vibration sensor according to claim 2, characterized in that, The signal amplifier is a field-effect transistor amplifier.

4. The resonant vibration sensor according to claim 3, characterized in that, Both the resonant fork and the piezoelectric vibrator are made of brass sheets.

5. The resonant vibration sensor according to claim 4, characterized in that, The base is provided with a through hole for accommodating the external lead wire.

6. The resonant vibration sensor according to claim 5, characterized in that, The signal amplifier is model RF2324.

7. The resonant vibration sensor according to claim 6, characterized in that, The circuit board is also equipped with a filter, and the signal amplifier is connected to the external lead through the filter.

8. The resonant vibration sensor according to claim 7, characterized in that, Includes a silicone sheath, which is disposed on the outside of the resonant vibration sensor.

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