High-precision electrical measurement probe clamping device and scanning probe microscope

Abstract

The utility model relates to the technical field of scanning probe microscopes, and discloses a high-precision electrical measurement probe clamping device which is at least applied to a scanning probe microscope. The device comprises a base; the clamping structure is arranged on the base, and an accommodating space is defined by the clamping structure and the surface of the base; the clamping structure at least partially forms electric shielding between the containing space and the external environment. As the clamping structure forms electric shielding between the accommodating space and the external environment, broadband radio frequency interference in the space can be prevented from invading a signal link through radiation coupling, and high-frequency weak capacitance signal transmission distortion is avoided. Moreover, the clamping structure can clamp the probe assembly, so that the position of the probe assembly is fixed in the measurement process, and the measurement error caused by the shaking of the probe assembly is reduced. Through the synergistic effect of electric shielding and mechanical clamping, the influence of electromagnetic interference and mechanical disturbance on signals is reduced, and then the accuracy and reliability of the electrical property measurement result of the material are improved. The utility model also discloses a scanning probe microscope.

Description

Technical Field

[0001] This application relates to the field of scanning probe microscopy technology, for example to a high-precision electrical measurement probe clamping device and a scanning probe microscope. Background Technology

[0002] Currently, scanning probe microscopy (SMT) has become an important tool for material characterization by measuring the local interaction between the probe tip and the sample surface, enabling nanoscale surface morphology analysis. However, the detection principle of traditional SMT is mainly based on mechanical effects or quantum tunneling phenomena, making it difficult to directly obtain key electrical parameters of materials, such as dielectric constant distribution and semiconductor carrier concentration. This limits the application expansion of SMT in fields such as microelectronic device analysis and the study of the electrical properties of functional materials.

[0003] To overcome the aforementioned limitations, related technologies introduce high-frequency capacitive sensing mechanisms into scanning probe microscopy. By applying a high-frequency bias voltage to a conductive probe, a highly sensitive sensor captures minute changes in the nanoscale capacitance formed between the probe and the sample surface in real time. Based on advanced signal processing algorithms, the capacitance or differential capacitance signal is analyzed in depth, thereby achieving a quantitative mapping of the dielectric properties and carrier concentration distribution of the material surface, providing a novel approach for characterizing the intrinsic electrical properties of materials.

[0004] In the process of implementing the embodiments of this disclosure, at least the following problems were found in the related art:

[0005] While related technologies can characterize the intrinsic electrical properties of materials, in practical applications, the widespread broadband radio frequency interference in space can easily intrude into the signal transmission link through radiation coupling, causing the high-frequency weak capacitance signal carrying the electrical information of the material to be distorted during transmission, thereby reducing the accuracy and reliability of the measurement results.

[0006] The information disclosed in the background section is only intended to enhance the understanding of the background of this utility model, and therefore may contain information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0007] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.

[0008] This disclosure provides a high-precision electrical measurement probe clamping device and a scanning probe microscope to reduce the impact of radio frequency interference on weak high-frequency capacitance signals and improve the accuracy and reliability of measurement results.

[0009] In some embodiments, the high-precision electrical measurement probe clamping device is at least applied to a scanning probe microscope; the device includes: a base; a clamping structure disposed on the base and enclosing a receiving space with the base surface; wherein the clamping structure at least partially forms an electrical shield between the receiving space and the external environment.

[0010] Optionally, the clamping structure includes: an elastic part; and a clamping part connected to the elastic part, wherein the clamping part can apply a clamping force to the base surface side under the elastic force provided by the elastic part, so that at least a portion of the probe assembly is fixed between the base surface and the clamping part; wherein the elastic part, the clamping part and the base surface enclose a receiving space.

[0011] Optionally, the clamping part includes: a first part connected to the elastic part and raised in a direction away from the base; and a second part connected to the first part and lowered in a direction closer to the base; wherein the first part and the second part form an arc-shaped arm connected to the elastic part, and the elastic part, the arc-shaped arm and the base surface enclose a receiving space.

[0012] Optionally, the second part includes: a first window, which communicates with the accommodating space.

[0013] Optionally, the high-precision electrical measurement probe clamping device further includes: a circuit board disposed within the receiving space, with an electrical shield at least partially covering the circuit board.

[0014] Alternatively, the circuit board and the probe may be electrically connected without wires; or the circuit board and the probe may be electrically connected via wires.

[0015] Optionally, the electrical shielding at least partially covers the area where the circuit board connects to the probe.

[0016] Optionally, the base includes: a first groove disposed on the surface of the base, and the clamping structure is at least partially disposed within the first groove.

[0017] Optionally, the base includes a second groove disposed on the side of the base away from the clamping structure.

[0018] In some embodiments, the scanning probe microscope includes the high-precision electrical measurement probe clamping device described above.

[0019] The high-precision electrical measurement probe clamping device and scanning probe microscope provided in this disclosure can achieve the following technical effects:

[0020] A high-precision electrical measurement probe clamping device is used in scanning probe microscopes. It includes a base and a clamping structure mounted on the base, which together form a receiving space. The clamping structure at least partially forms an electrical shield between the receiving space and the external environment. Because the clamping structure forms an electrical shield between the receiving space and the external environment, it effectively blocks broadband radio frequency interference in the space from entering the signal link through radiative coupling, avoiding distortion in the transmission of high-frequency weak capacitive signals. Furthermore, the clamping structure can stably clamp the probe assembly, ensuring that the probe assembly's position is largely fixed during measurement, reducing measurement errors caused by probe assembly movement. Through the synergistic effect of electrical shielding and mechanical clamping, the influence of electromagnetic interference and mechanical disturbances on the signal is reduced, thereby improving the accuracy and reliability of the material's electrical property measurement results.

[0021] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description

[0022] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein:

[0023] Figure 1 This is a schematic diagram of the test structure of a high-precision electrical measurement probe clamping device provided in an embodiment of this disclosure;

[0024] Figure 2 This is a top view schematic diagram of a high-precision electrical measurement probe clamping device provided in an embodiment of this disclosure;

[0025] Figure 3 This is a front view schematic diagram of a high-precision electrical measurement probe clamping device provided in an embodiment of this disclosure.

[0026] Figure label:

[0027] 10: Base; 11: Elastic part; 12: Pressing part; 121: First part; 122: Second part; 13: First window; 14: Circuit board; 15: Probe assembly; 16: First groove; 17: Second groove. Detailed Implementation

[0028] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0029] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0030] In this disclosure, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for better describing the embodiments of this disclosure and their implementations, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to require them to be constructed and operated in a specific orientation. Furthermore, some of the aforementioned terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this disclosure according to the specific circumstances.

[0031] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0032] Unless otherwise stated, the term "multiple" means two or more.

[0033] In this embodiment of the disclosure, the character " / " indicates that the objects before and after it are in an "or" relationship. For example, A / B means: A or B.

[0034] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0035] It should be noted that, unless otherwise specified, the embodiments and features described in the present disclosure can be combined with each other.

[0036] Combination Figure 1-3 As shown, this disclosure provides a high-precision electrical measurement probe clamping device, which is at least applied to scanning probe microscopes. The high-precision electrical measurement probe clamping device includes a base 10 and a clamping structure. The clamping structure is disposed on the base 10 and encloses the surface of the base 10 to form a receiving space. The clamping structure at least partially forms an electrical shield between the receiving space and the external environment.

[0037] In this embodiment, the clamping structure may be partially or entirely composed of shielding material, and the clamping structure is grounded to form a shielding circuit. The shielding material may be a metal material, a conductive polymer material, a surface-metallized plastic material, or other shielding materials. Specifically, the clamping part 12 of the clamping structure may be integrally molded from polycarbonate material mixed with a set proportion of short-cut carbon fibers through precision injection molding. The conductive polymer material itself has electromagnetic shielding performance, and the elastic part 11 of the clamping structure may be a metal spring sheet to ensure elasticity. During assembly, the end of the metal elastic part 11 may be firmly connected and conductive to the grounding terminal on the base 10 by adhesive bonding or metal screws. At the same time, the inner surface (facing the receiving space) of the sinking section (second part 122) of the arc-shaped arm of the conductive polymer clamping part 12 is reliably electrically connected to the metal part of the elastic part 11 through an embedded metal foil or a coated conductive silver paste layer, ensuring that the entire surface of the clamping part 12 has a grounding potential. Thus, the main body of the clamping part 12, made of conductive polymer, works together with its surface conductive layer to form an effective electrical shielding layer above and on the sides of the receiving space, blocking external radio frequency interference from intruding into the circuit board 14 and probe connection positions within the receiving space. Furthermore, the elastic part 11 of the clamping structure can also be made of metal (such as a stainless steel spring) to provide stable elasticity. The bow-shaped arm body of the clamping part 12 is injection molded from a lightweight and easily moldable engineering plastic (such as PEEK or glass fiber reinforced nylon). To impart shielding functionality, the entire surface of the bow-shaped arm, especially the inner and outer surfaces of its recessed section (second part 122) and the bottom surface opposite the base 10, is chemically nickel-plated. The metal elastic part 11 is connected to the grounding metal layer of the base 10 during installation via crimping or welding. Meanwhile, the metal plating on the surface of the plastic bow-shaped arm is connected to the elastic part 11 at its root region (i.e., the first part 121 of the bow-shaped arm near the elastic part 11) via a precisely designed metal clip or conductive adhesive, achieving a low-impedance electrical connection. This reliably grounds the entire metal plating on the surface of the bow-shaped arm. In this way, the plastic bow-shaped arm wrapped in metal plating, together with the metal elastic part 11 and the grounding base 10, constitutes a continuous conductive shielding shell, effectively isolating the interior of the containing space (including the circuit board 14) from the external electromagnetic environment. Even if the main structure is non-metallic plastic, it can provide excellent electromagnetic shielding performance.

[0038] The high-precision electrical measurement probe clamping device provided in this embodiment is applied to a scanning probe microscope. It includes a base 10 and a clamping structure disposed on the base 10, which together form a receiving space. The clamping structure at least partially forms an electrical shield between the receiving space and the external environment. Because the clamping structure forms an electrical shield between the receiving space and the external environment, it can effectively block broadband radio frequency interference in the space from entering the signal link through radiative coupling, avoiding distortion in the transmission of high-frequency weak capacitive signals. Furthermore, the clamping structure can stably clamp the probe assembly 15, ensuring that the position of the probe assembly 15 is substantially fixed during measurement, reducing measurement errors caused by the shaking of the probe assembly 15. Through the synergistic effect of electrical shielding and mechanical clamping, the influence of electromagnetic interference and mechanical disturbances on the signal is reduced, thereby improving the accuracy and reliability of the material's electrical property measurement results.

[0039] Optionally, the clamping structure includes an elastic portion 11 and a clamping portion 12. The clamping portion 12 is connected to the elastic portion 11, and the clamping portion 12 can apply a clamping force to the surface side of the base 10 under the elastic force provided by the elastic portion 11, so that at least a portion of the probe assembly 15 is fixed between the surface of the base 10 and the clamping portion 12. The elastic portion 11, the clamping portion 12, and the surface of the base 10 together form a receiving space.

[0040] In this embodiment, the clamping structure can be an integrated spring structure, a lever-type elastic structure, or other structures. Specifically, the elastic part 11 in the clamping structure is a U-shaped metal spring with a preset curvature, vertically fixed to both sides of the base 10. The pressing part 12 is a metal plate integrally connected to the top of the elastic part 11, and its end is bent towards the surface of the base 10 to form a wedge-shaped pressing block. During assembly, pressing the pressing part 12 causes the elastic part 11 to deform. When the probe assembly 15 is placed in the preset positioning area of ​​the base 10, the pressure is released, and the elastic part 11 rebounds, driving the wedge-shaped pressing block to slide along the upper surface of the probe bracket and lock, so that the probe is stably pressed against the surface of the base 10. The side wall of the elastic part 11, the bottom surface of the pressing part 12, and the conductive surface of the base 10 naturally form a receiving space, and the three form a continuous conductive circuit through metal contact. In addition, the elastic part 11 can be a pre-compressed helical spring, vertically fixed to the column of the base 10. The clamping part 12 is a metal lever, one end of which is hinged to the top of the spring, and the other end extends towards the surface of the base 10 to form an arc-shaped pressing surface. The preload of the spring drives the end of the lever to continuously press against the probe assembly 15, so that the probe assembly 15 is clamped between the lever pressing surface and the base 10. The arched part in the middle of the lever, together with the side wall of the elastic part 11 and the surface of the base 10, forms a dome-shaped receiving space, and the metal surface of the lever is in direct contact with the spring and the conductive layer of the base 10 to form a complete electromagnetic shield.

[0041] In this way, the elastic deformation of the elastic part 11 can continuously provide stable pressure, driving the clamping part 12 to tightly press the probe assembly 15 onto the surface of the base 10, eliminating the assembly gap between the probe assembly 15 and the base 10, thereby preventing the probe from shifting due to mechanical vibration or external force interference during scanning. At the same time, the elastic part 11, the clamping part 12, and the base 10 together form an accommodating space, which can enclose the core circuit area of ​​the probe assembly 15, such as the resonant circuit, in a shielded cavity, which is equivalent to forming a Faraday cage structure. This can effectively block external radio frequency signal radiation from coupling into the internal circuit of the probe clip, improving the sensitivity of capacitance detection.

[0042] Optionally, the clamping part 12 includes a first part 121 and a second part 122. The first part 121 is connected to the elastic part 11 and is lifted away from the base 10. The second part 122 is connected to the first part 121 and is lowered towards the base 10. The first part 121 and the second part 122 form an arc-shaped arm connected to the elastic part 11, and the elastic part 11, the arc-shaped arm, and the surface of the base 10 enclose a receiving space.

[0043] In this embodiment, the clamping part 12 can adopt a continuous arc-shaped structure or a bend-angle structure. Specifically, the clamping part 12 can be integrally bent from a metal sheet. Its first part 121 starts from the top of the elastic part 11 and extends in a smooth arc towards the direction away from the base 10, forming an arched clearance space. The second part 122 turns from the top of the arch and extends in a reverse arc towards the direction closer to the base 10, naturally narrowing at the end to a line contact pressing edge. In addition, the clamping part 12 can also be made of spring steel plate welded in sections. The first part 121 is a straight arm extending obliquely upward, connected to the elastic part 11 at an obtuse angle, forming a lifting clearance channel. The second part 122 is a straight arm extending obliquely downward, transitioning to the first part 121 through an arc-shaped corner, with a flat pressing block processed at the end. In the natural state, the straight arm of the settling section is pulled by the elastic part 11, pressing the probe against the positioning surface of the base 10. A triangular operating window is formed at the angle between the straight arm of the lifting section and the settling section.

[0044] In this way, the first part 121 of the bow-shaped arm structure rises away from the base 10, providing operational clearance space for the installation of the probe assembly 15 and facilitating the non-interference placement of the resonant circuit board 14 into the surface of the base 10. The second part 122 sinks towards the base 10, concentrating the pressure of the elastic part 11 to the clamping position of the probe assembly 15, enhancing the stability of the probe assembly 15 and suppressing probe displacement during scanning. The bow-shaped arm, the elastic part 11, and the surface of the base 10 together form an electrical shielding layer, which can enclose the functional circuits integrated on the circuit board 14 within the accommodating space by the conductive cavity, shielding external radio frequency interference and ensuring the purity of high-frequency weak capacitive signal transmission.

[0045] Optionally, the second part 122 includes a first window 13. The first window 13 is in communication with the receiving space.

[0046] In this embodiment, the first window 13 can be a metal frame window structure or a composite shielding mesh window structure. Specifically, the settling section (second part 122) of the pressing part 12 is formed by stamping a thin metal sheet, and a rectangular first window 13 can be opened in its middle. The window edge retains a metal frame and forms a flange perpendicular to the plate surface through a continuous flanging process. The height of the flange can form a stepped shielding structure with the thickness of the metal plate. When the pressing part 12 is installed, the flanged flange and the surface of the base 10 maintain a parallel gap, the window area exposes the debugging interface of the circuit board 14 in the accommodating space, and the flanged flange and the metal body of the settling section form a continuous conductive loop to suppress electromagnetic waves from leaking from the window edge. In addition, the settling section body of the pressing part 12 can also adopt a double-layer structure, with the inner layer being an insulating engineering plastic substrate and the outer layer covered with a copper foil shielding layer. A portion of the copper foil is cut off in the middle of the settling section to form the first window 13, and a metal mesh is embedded in the window. The edge of the metal mesh can be seamlessly overlapped with the outer copper foil shielding layer through conductive silver paste, and the mesh hole diameter is smaller than the target shielding frequency wavelength. After installation, the wire mesh area allows for visual observation of the circuit board 14 status within the containment space. At the same time, the wire mesh and the copper foil layer of the sink section form a complete conductive surface, maintaining the continuity of radio frequency shielding.

[0047] In this way, the first window 13 is connected to the receiving space, exposing the connection area between the circuit board 14 and the probe, facilitating direct access or debugging by external devices. However, the window opening inevitably leads to local discontinuities in the electrical shielding layer. To mitigate this, the window is confined within the limited area of ​​the settling section of the clamping part 12 (i.e., the second part 122), ensuring structural continuity between the window edge and the metal clamping part 12. Since the settling section of the clamping part 12 is close to the surface of the base 10, its edge, together with the base 10, forms a closed conductive loop around the window, limiting the radiation leakage path locally. This minimizes the negative impact of the window on the shielding effect, thereby suppressing electromagnetic leakage to the greatest extent. This ensures ease of operation while maintaining the stability of high-frequency signal transmission.

[0048] Optionally, the high-precision electrical measurement probe holder also includes a circuit board 14. The circuit board 14 is disposed within the receiving space, and an electrical shield at least partially covers the circuit board 14.

[0049] In this embodiment, a rectangular circuit board 14 is disposed within the accommodating space enclosed by the elastic part 11 and the pressing part 12. One end of the circuit board 14 can be fixed to the surface of the base 10 by an insulating post, and the other end can extend below the settling section of the pressing part 12. A stripline resonant circuit is printed on the surface of the circuit board 14, and its output terminal is directly exposed on the upper surface corresponding to the settling section. The metal bottom surface of the settling section of the pressing part 12 at least partially covers the resonant circuit area of ​​the circuit board 14, and the two can maintain a parallel gap. The metal bottom surface acts as an electrical shielding layer to isolate external radio frequency interference. The probe assembly 15 can extend into the parallel gap reserved in the settling section of the pressing part 12 and be aligned and pressed with the resonant circuit of the circuit board 14 to achieve a direct connection without wires.

[0050] In this way, by directly placing the circuit board 14 within the receiving space, and using the clamping structure and the surface of the base 10 to form an electrical shielding layer covering the main area of ​​the circuit board 14, the resonant circuit integrated on the circuit board 14 can be encased by the electrical shielding layer, blocking external radio frequency interference radiation coupling. Furthermore, by placing the circuit board 14 within the receiving space, a wireless direct connection between the circuit board 14 and the probe can be achieved, directly eliminating parasitic capacitance and losses introduced by the signal transmission line. This ensures the purity of high-frequency weak capacitive signals transmitted in the direct connection path.

[0051] Optionally, the circuit board 14 is electrically connected to the probe without any wires; or, the circuit board 14 is electrically connected to the probe via wires.

[0052] In this embodiment, a circuit board 14 is fixedly mounted on the surface of a base 10 within the accommodating space, with exposed conductive pads in specific areas of its surface. A probe assembly 15 has a corresponding flat conductive contact surface. When the operator places the probe assembly 15 at a preset position on the surface of the base 10 and releases the clamping structure, the pressing part 12, under the action of the elastic part 11, presses the probe assembly 15 as a whole. At this time, the conductive contact surface at the bottom of the probe assembly 15 is directly pressed onto the conductive pads of the circuit board 14, achieving a stable wireless electrical connection through physical contact pressure. Furthermore, the circuit board 14 is fixedly mounted within the accommodating space, with terminals provided at its edges. A short wire is used, with one end soldered to the terminals of the circuit board 14 and the other end soldered or clamped to a preset electrical connection point on the probe assembly 15. The entire wire is confined within the accommodating space formed by the clamping structure, the elastic part 11, and the surface of the base 10. The electrical shielding layer formed by the clamping structure effectively covers the wires within the accommodating space and the connection points between the circuit board 14 and the wires, blocking external radio frequency interference from radiating and coupling into the signal link through the wires.

[0053] In this way, parasitic capacitance and losses introduced by signal transmission lines can be eliminated by directly contacting the probes on circuit board 14. The electrical connection scheme retains wiring flexibility by confining the wires within the space covered by the electrical shield, thereby using the electrical shield to suppress external radio frequency radiation interference received by the wires and reducing the risk of signal distortion.

[0054] Optionally, the electrical shielding at least partially covers the area where the circuit board 14 is connected to the probe.

[0055] In this embodiment of the disclosure, the electrical shield can either completely cover the area where the circuit board 14 is connected to the probe, or it can partially cover the area where the circuit board 14 is connected to the probe.

[0056] In this way, the connection position between the electrical shielding circuit board 14 and the probe is directly electromagnetically isolated at the key node of signal transmission. The weak signal generated by the state change of the equivalent capacitance structure formed by the probe and the sample is most susceptible to external radio frequency radiation coupling interference at the connection point. The electrical shielding layer formed by the clamping structure and the base 10 can locally strengthen the coverage of this connection area, block broadband radio frequency noise from intruding into the signal transmission path, and avoid high-frequency signal distortion at the electrical connection interface.

[0057] Optionally, the base 10 includes a first groove 16. The first groove 16 is disposed on the surface of the base 10, and the clamping structure is at least partially disposed within the first groove 16.

[0058] In this embodiment, a rectangular first groove 16 may be provided on the surface of the base 10, and the elastic part 11 of the clamping structure adopts a U-shaped metal spring that matches the contour of the groove. During installation, the spring is embedded in the groove, and the sidewall of the groove constrains the lateral displacement of the spring. The pressing part 12 is a metal plate integrally formed with the top of the spring, and its lifting section naturally extends into the space outside the groove, while the sinking section hangs over the surface of the base 10. The groove depth controls the pre-compression amount of the elastic part 11, ensuring that the sinking section of the pressing part 12 applies constant pressure, while the metal sidewall of the groove is tightly fitted with the outer wall of the spring to form a continuous conductive shielding layer. Alternatively, a cylindrical first groove 16 may be provided on the surface of the base 10, and the elastic part 11 of the clamping structure may be a helical spring, with its lower end fitted and fixed to the bottom of the groove. The pressing part 12 is a metal lever hinged to the top of the spring, and the transition between the lifting and sinking sections of the lever is located above the groove opening. The sidewall of the groove restricts the radial displacement of the spring, ensuring that the lever pressure direction is perpendicular to the surface of the base 10. The groove depth determines the spring preload. When the lever is closed, the sinking section presses against the probe assembly 15. The inner metal wall of the groove, together with the spring and the lever, forms a shielded circuit.

[0059] In this way, a first groove 16 is provided on the surface of the base 10. The depth of the groove precisely limits the sinking position of the elastic part 11 of the clamping structure, so that the elastic part 11 is fitted into the first groove 16 and avoids lateral displacement. At the same time, the surface of the base 10 outside the first groove 16 provides unobstructed descent space for the sinking section of the pressing part 12, ensuring that the end of the pressing part 12 can fully approach the surface of the base 10 to form a wedge-shaped pressing area, thereby enhancing the clamping stability of the probe assembly 15. In addition, the sidewall of the first groove 16 fits tightly with the surface of the elastic part 11, and works in conjunction with the contact between the sinking section of the pressing part 12 and the plane of the base 10, strengthening the continuity of the electrical shielding layer between the clamping structure and the base 10, and reducing electromagnetic leakage gaps.

[0060] Optionally, the base 10 includes a second groove 17. The second groove 17 is located on the side of the base 10 away from the clamping structure.

[0061] In this embodiment, a through-type second groove 17 can be processed on the side of the base 10 away from the clamping structure. The groove extends through the thickness of the base 10, forming a rectangular light-transmitting channel. The inner wall of the groove is plated with a metal shielding layer, which is continuously bonded to the conductive layer of the main body of the base 10. When the scanning probe microscope is working, the laser beam of the position detection system passes vertically through the groove and irradiates the back reflection area of ​​the probe cantilever without obstruction, while the metal layer of the inner wall of the groove maintains the overall shielding integrity, preventing external radio frequency interference from entering the receiving space through the opening. In addition, a stepped second groove 17 can also be provided on the side of the base 10 away from the clamping structure. The bottom surface of the groove is higher than the bottom plane of the base 10, forming a double-step structure. A light-transmitting conductive window is embedded on the surface of the upper step, and the edge of the window is seamlessly connected to the metal layer of the base 10 through conductive adhesive. The laser beam is incident at an inclined angle and is accurately projected onto the back of the probe cantilever after being refracted by the conductive window.

[0062] Thus, a second groove 17 is provided on the side of the base 10 away from the clamping structure. This second groove 17 provides an unobstructed penetration channel for the external detection optical path, allowing the detection beam to accurately illuminate the back of the probe cantilever. The space of the second groove 17 avoids the physical obstruction of the optical path by the base 10 body, ensuring the complete transmission of the position detection signal to the detector. Furthermore, the structure of the second groove 17 also reduces the overall weight of the base 10 and optimizes the center of gravity distribution.

[0063] This disclosure provides a scanning probe microscope, including the high-precision electrical measurement probe clamping device described above.

[0064] The foregoing description and accompanying drawings fully illustrate embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included or substituted for parts and features of other embodiments. Embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from its scope. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A high-precision electrical measurement probe clamping device, characterized in that, At least applicable to scanning probe microscopes; the apparatus includes: Base; A clamping structure is set on the base and encloses the base surface to form an accommodating space; The clamping structure at least partially forms an electrical shield between the containment space and the external environment.

2. The apparatus according to claim 1, characterized in that, The clamping structure includes: Elastic part; The clamping part is connected to the elastic part. Under the elastic force provided by the elastic part, the clamping part can apply a clamping force to the base surface side so that at least a part of the probe assembly is fixed between the base surface and the clamping part. The elastic part, the pressing part, and the base surface enclose and form a receiving space.

3. The apparatus according to claim 2, characterized in that, The clamping part includes: The first part is connected to the elastic part and is lifted away from the base; The second part connects to the first part and settles towards the base; The first part and the second part together form an arc-shaped arm connected to the elastic part, and the elastic part, the arc-shaped arm and the base surface enclose and form a receiving space.

4. The apparatus according to claim 3, characterized in that, Part Two includes: The first window connects to the storage space.

5. The apparatus according to any one of claims 1 to 4, characterized in that, Also includes: A circuit board is disposed within a receiving space, and an electrical shield at least partially covers the circuit board.

6. The apparatus according to claim 5, characterized in that, There is no wired electrical connection between the circuit board and the probe; or, The circuit board and the probe are electrically connected by wires.

7. The apparatus according to claim 6, characterized in that, The electrical shielding at least partially covers the area where the circuit board connects to the probe.

8. The apparatus according to any one of claims 1 to 4, characterized in that, The base includes: A first groove is provided on the surface of the base, and the clamping structure is at least partially provided in the first groove.

9. The apparatus according to any one of claims 1 to 4, characterized in that, The base includes: The second groove is located on the side of the base away from the clamping structure.

10. A scanning probe microscope, characterized in that, The high-precision electrical measurement probe clamping device includes any one of claims 1 to 9.

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