Capacitor heat dissipation device

Abstract

The utility model discloses a capacitor heat dissipation device. An insulating surface of a capacitor is connected with the top surface of an insulating heat dissipation block; the upper microstrip polar plates of the first microstrip polar plate and the second microstrip polar plate are respectively welded with two conductive polar plates of the capacitor, the connecting microstrip polar plates are respectively welded with two parts, which are not contacted with the insulating surface of the capacitor, of the top surface of the insulating heat dissipation block, and the lower microstrip polar plates are respectively welded with two side surfaces of the insulating heat dissipation block; the upper micro-strip polar plate, the connecting part micro-strip polar plate and the lower micro-strip polar plate are integrally formed; the left side bottom surface and the right side bottom surface of the insulating heat dissipation block are respectively welded on the first bonding pad and the second bonding pad; and the lower microstrip polar plates of the first microstrip polar plate and the second microstrip polar plate are respectively welded on the first bonding pad and the second bonding pad. By means of the device, part of heat can be conducted away through the heat bridge when the capacitor works, meanwhile, the heat bridge and the capacitor are fixed through the micro-strip polar plate, the micro-strip polar plate can further effectively enable the heat to flow away from the capacitor, and mechanical stress can also be eliminated.

Description

Technical Field

[0001] This application relates to the field of cooling and heat dissipation technology, and in particular to a capacitor heat dissipation device. Background Technology

[0002] In the RF / microwave circuit industry, the demand for capacitors with high Q values ​​is constantly growing. High Q-value capacitors can store energy more efficiently and reduce energy loss during operation, which is very important for RF and microwave applications.

[0003] Capacitors generate heat during operation, and the generation and accumulation of this heat cause the capacitor's temperature to rise, known as temperature rise. Temperature rise is an important indicator for evaluating the performance of high-Q capacitors, as excessively high temperatures can affect capacitor performance and even cause damage. Therefore, the need to reduce capacitor temperature rise is increasing.

[0004] like Figure 1 As shown, existing high-Q capacitors are typically soldered directly onto pads, and they use industry-standard materials and internal structures, resulting in minimal temperature variations during operation. Therefore, the temperature rise issue of capacitors may be difficult to significantly improve.

[0005] Chinese patent CN206864315 U, titled "A Space-Saving Heat Dissipation System for Surface Mount Electrolytic Capacitors," describes a method of heat dissipation achieved by placing a heat sink sleeve over the surface mount electrolytic capacitor's casing and soldering the sleeve to pads on an aluminum substrate. However, this method alone is insufficient for effective heat dissipation because the heat sink sleeve is only connected to the bottom surface of the capacitor casing. Summary of the Invention

[0006] Based on this, and in response to the aforementioned technical problems, a capacitor heat dissipation device is provided to solve the problem of poor heat dissipation performance of existing capacitor heat dissipation devices.

[0007] A capacitor heat dissipation device, the device comprising: a capacitor (1), a microstrip plate (4), an insulating heat dissipation block (2), and a solder pad (3);

[0008] An insulating surface of the capacitor (1) is connected to the top surface of the insulating heat sink (2);

[0009] An insulating surface of the capacitor (1) is connected to the top surface of the insulating heat sink (2);

[0010] The microstrip plate (4) includes a first microstrip plate (41) and a second microstrip plate (42). The first microstrip plate (41) and the second microstrip plate (42) include an upper microstrip plate (401), a connecting microstrip plate (402), and a lower microstrip plate (403). The upper microstrip plate (401) of the first microstrip plate (41) and the second microstrip plate (42) are respectively welded to the two conductive plates of the capacitor (1). The connecting microstrip plate (402) is respectively welded to the two parts of the top surface of the insulating heat sink (2) that do not contact the insulating surface of the capacitor (1). The lower microstrip plate (403) is respectively welded to the two sides of the insulating heat sink (2). The upper microstrip plate (401), the connecting microstrip plate (402), and the lower microstrip plate (302) are integrally formed.

[0011] The pad (3) includes a first pad (31) and a second pad (32), which are separate and do not contact each other; the bottom surface of the insulating heat sink (2) includes a left bottom surface (201), a middle bottom surface (203) and a right bottom surface (202), which are respectively soldered to the first pad (31) and the second pad (32), and the middle bottom surface (203) does not contact the first pad (31) and the second pad (32); the lower microstrip plate (403) of the first microstrip plate (41) and the second microstrip plate (42) are respectively soldered to the first pad (31) and the second pad (32).

[0012] Optionally, in the above scheme, the insulating heat sink (2) is a thermal bridge.

[0013] Optionally, the insulating heat sink (2) can be a cuboid or a cube.

[0014] Optionally, in the above scheme, the top surface area of ​​the insulating heat sink (2) is greater than or equal to the insulating surface area of ​​the capacitor (1) welded to the top surface of the insulating heat sink (2).

[0015] Optionally, the microstrip plate (4) in the above scheme is made of silver.

[0016] Optionally, in the above scheme, the insulating heat sink (2) includes: an end electrode (21) and a middle part (22); the end electrode (21) is used to weld with the lower microstrip plate (403) and the pad (3).

[0017] This application has at least the following beneficial effects:

[0018] This application connects the top surface of the insulating heat sink (2) to the capacitor (1), allowing some of the heat generated by the capacitor during operation to be conducted away through the thermal bridge (ALN), thereby reducing the temperature rise of the capacitor and improving the reliability of the application. Simultaneously, a microstrip plate (4) is used to fix the insulating heat sink (2) and the capacitor (1), and is welded to the thermal bridge (2) and the side surface of the capacitor (1). This allows the microstrip plate (4) to further and more effectively dissipate heat from the capacitor, and also eliminates mechanical stress, especially when the thermal expansion coefficients of the capacitor and the circuit board materials differ significantly. Attached Figure Description

[0019] Figure 1 This is a capacitor mounting structure based on existing technology.

[0020] Figure 2 This application provides a structural diagram of a capacitor heat dissipation device according to one embodiment. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0022] Heat can be transferred to or away from the capacitor casing in several ways, namely conduction, convection, and radiation. The main heat dissipation method for capacitors is conduction. Heat energy is transferred by conduction mainly in the terminal area of ​​ceramic capacitors, and is conducted to the terminal and circuit board surface through the internal electrodes and terminal electrodes. However, the heat dissipation methods and capabilities of existing products are limited.

[0023] In one embodiment, such as Figure 2 As shown, a capacitor heat dissipation device is provided, the device comprising: a capacitor, a microstrip plate, a thermal bridge, and a pad;

[0024] An insulating surface of the capacitor (1) is connected to the top surface of the insulating heat sink (2);

[0025] The microstrip plate (4) includes a first microstrip plate (41) and a second microstrip plate (42). The first microstrip plate (41) and the second microstrip plate (42) include an upper microstrip plate (401), a connecting microstrip plate (402), and a lower microstrip plate (403). The upper microstrip plate (401) of the first microstrip plate (41) and the second microstrip plate (42) are respectively welded to the two conductive plates of the capacitor (1). The connecting microstrip plate (402) is respectively welded to the two parts of the top surface of the insulating heat sink (2) that do not contact the insulating surface of the capacitor (1). The lower microstrip plate (403) is respectively welded to the two sides of the insulating heat sink (2). The upper microstrip plate (401), the connecting microstrip plate (402), and the lower microstrip plate (302) are integrally formed.

[0026] The pad (3) includes a first pad (31) and a second pad (32), which are separate and do not contact each other; the bottom surface of the insulating heat sink (2) includes a left bottom surface (201), a middle bottom surface (203) and a right bottom surface (202), which are respectively soldered to the first pad (31) and the second pad (32), and the middle bottom surface (203) does not contact the first pad (31) and the second pad (32); the lower microstrip plate (403) of the first microstrip plate (41) and the second microstrip plate (42) are respectively soldered to the first pad (31) and the second pad (32).

[0027] In the above-mentioned capacitor heat dissipation device, by connecting the top surface of the insulating heat sink (2) to the capacitor (1), a portion of the heat generated by the capacitor during operation can be conducted away through the thermal bridge (ALN), reducing the temperature rise of the capacitor and improving the reliability of the application. At the same time, the insulating heat sink (2) and the capacitor (1) are fixed by a microstrip plate (4), and welded to the thermal bridge (2) and the side surface of the capacitor (1), so that the microstrip plate (4) can further effectively dissipate heat from the capacitor and also eliminate mechanical stress, especially when the thermal expansion coefficients of the capacitor and the circuit board materials differ greatly.

[0028] In one embodiment, the insulating heat sink (2) is a thermal bridge.

[0029] In this application, aluminum nitride (AlN) is used as a thermal bridge material: AlN has high thermal conductivity and good electrical insulation, and can dissipate heat quickly.

[0030] In one embodiment, the insulating heat sink (2) is a cuboid or a cube.

[0031] In this embodiment, the thermal bridge (2) carries the capacitor (1). Therefore, when the thermal bridge (2) is a cuboid or a cube, it is more useful to use the microstrip plate (4) to fix the combination of the capacitor (1) and the thermal bridge (2).

[0032] In one embodiment, the top surface area of ​​the insulating heat sink (2) is greater than or equal to the insulating surface area of ​​the capacitor (1) welded to the top surface of the insulating heat sink (2).

[0033] In this embodiment, the top surface area of ​​the thermal bridge (2) is greater than the insulating surface area of ​​the capacitor (1), thereby increasing the contact area between the capacitor (1) and the thermal bridge (2) and increasing the heat dissipation effect. Alternatively, the top surface area of ​​the insulating heat sink (2) can be equal to the insulating surface area of ​​the capacitor (1). In this case, the insulating heat sink (2) and the insulating surface of the capacitor (1) are in complete contact, and there is no part where the top surface of the insulating heat sink (2) does not contact the insulating surface of the capacitor (1). Therefore, the microstrip plate (4) does not include the connecting microstrip plate (402), but only has an upper microstrip plate (401) and a lower microstrip plate (403), which are respectively welded to the conductive electrode plate of the capacitor (1) and the side of the insulating heat sink (2).

[0034] In one embodiment, the microstrip plate (4) is made of silver.

[0035] In this embodiment, the silver microstrip plate can increase the heat dissipation effect, enabling faster heat dissipation.

[0036] In one embodiment, the insulating heat sink (2) includes: an end electrode (21) and a middle portion (22); the end electrode (21) is used to weld to the lower microstrip plate (403) and the pad (3).

[0037] In addition, external methods such as introducing cooling and enhancing exhaust ventilation can be used to enhance heat dissipation. For example, exhaust fans can be introduced into the area where capacitors are placed.

[0038] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0039] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A capacitor heat dissipation device, characterized in that, The device includes: a capacitor (1), a microstrip plate (4), an insulating heat sink (2), and a solder pad (3); An insulating surface of the capacitor (1) is connected to the top surface of the insulating heat sink (2); The microstrip plate (4) includes a first microstrip plate (41) and a second microstrip plate (42). The first microstrip plate (41) and the second microstrip plate (42) include an upper microstrip plate (401), a connecting microstrip plate (402), and a lower microstrip plate (403). The upper microstrip plate (401) of the first microstrip plate (41) and the second microstrip plate (42) are respectively welded to the two conductive plates of the capacitor (1). The connecting microstrip plate (402) is respectively welded to the two parts of the top surface of the insulating heat sink (2) that do not contact the insulating surface of the capacitor (1). The lower microstrip plate (403) is respectively welded to the two sides of the insulating heat sink (2). The upper microstrip plate (401), the connecting microstrip plate (402), and the lower microstrip plate (403) are integrally formed. The pad (3) includes a first pad (31) and a second pad (32), which are separate and do not contact each other; the bottom surface of the insulating heat sink (2) includes a left bottom surface (201), a middle bottom surface (203) and a right bottom surface (202), which are respectively soldered to the first pad (31) and the second pad (32), and the middle bottom surface (203) does not contact the first pad (31) and the second pad (32); the lower microstrip plate (403) of the first microstrip plate (41) and the second microstrip plate (42) are respectively soldered to the first pad (31) and the second pad (32).

2. The capacitor heat dissipation device according to claim 1, characterized in that, The insulating heat sink (2) is a thermal bridge.

3. The capacitor heat dissipation device according to claim 1, characterized in that, The insulating heat sink (2) is a cuboid or a cube.

4. The capacitor heat dissipation device according to claim 1, characterized in that, The top surface area of ​​the insulating heat sink (2) is greater than or equal to the insulating surface area of ​​the capacitor (1) welded to the top surface of the insulating heat sink (2).

5. The capacitor heat dissipation device according to claim 1, characterized in that, The microstrip plate (4) is made of silver.

6. The capacitor heat dissipation device according to claim 1, characterized in that, The insulating heat sink (2) includes: an end electrode (21) and a middle part (22); the end electrode (21) is used to weld to the lower microstrip plate (403) and the pad (3).

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