Electron detection device and electron beam imaging apparatus

Abstract

The utility model discloses an electron detection device and electron beam imaging equipment. The electronic detection device comprises a supporting mechanism and a plurality of detection units. The detection units are used for receiving and processing electronic signals, the electronic signals are generated by irradiating a to-be-detected sample by electron beams, the multiple detection units are arranged at intervals in the direction perpendicular to the propagation direction of the electronic signals, and gaps are formed between the adjacent detection units and used for allowing the electronic signals to directly pass through. The support mechanism is used for supporting the plurality of detection units, the support mechanism is configured to be movably arranged, and one of the detection units or one of the gaps is arranged in a propagation path of the electronic signal. According to the electronic detection device, the detection unit can be quickly and conveniently replaced, the maintenance period of the electronic detection device can be prolonged, the durability of the electronic detection device can be improved, the imaging effect can be quickly changed, different imaging requirements can be met, and the application range can be expanded.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and in particular to an electron detection device and an electron beam imaging device. Background Technology

[0002] Electron beam microscopy, such as scanning electron microscopy, is a commonly used method for microscopic characterization. In electron beam microscopy imaging equipment, the electron beam imaging detector (or simply electron detector) is used to receive electronic signals carrying information about the sample being measured and to convert these electronic signals into image signals.

[0003] Existing detector devices are typically placed below the objective lens using either an insert or fixed method. Each detector corresponds to a specific receiving position, area, angular range, and detector gain, limiting its application. Furthermore, when a detector becomes contaminated or damaged, the entire device needs to be replaced, shortening the maintenance cycle of the scanning electron microscope or other imaging equipment and affecting its durability. Utility Model Content

[0004] This application provides an electronic detection device and an electron beam imaging device, which can quickly and conveniently replace the detection unit to meet different imaging needs, thereby expanding the scope of application, extending the maintenance cycle of the electronic detection device, and improving its durability.

[0005] According to a first aspect of this application, this application provides an electronic detection device, comprising: a plurality of detection units for receiving and processing electronic signals, the electronic signals being generated by an electron beam irradiating a sample to be tested, the plurality of detection units being spaced apart along a direction perpendicular to the propagation direction of the electronic signals, and gaps being formed between adjacent detection units for direct passage of the electronic signals; and a support mechanism for supporting the plurality of detection units, the support mechanism being configured to be movable, and placing one of the detection units or one of the gaps in the propagation path of the electronic signals.

[0006] In some embodiments, the support mechanism includes a rotating shaft extending along the direction of electronic signal propagation and configured to be rotatable about its own central axis; a plurality of detection units are spaced apart along the outer periphery of the rotating shaft, each detection unit being directly or indirectly connected to the rotating shaft and rotating synchronously with the rotating shaft; the gap is located between circumferentially adjacent detection units along the rotating shaft.

[0007] In some embodiments, the support mechanism includes a plurality of support parts, which are spaced apart circumferentially along the rotating shaft. The support parts are connected to the rotating shaft and rotate synchronously under the drive of the rotating shaft. A plurality of detection units are respectively disposed on the plurality of support parts.

[0008] In some embodiments, the detection unit includes a probe for receiving electronic signals. The probe is disposed outside the support and has a first through hole that penetrates the probe along the propagation direction of the electronic signal. The support has a second through hole that penetrates the support along the propagation direction of the electronic signal. Along the propagation direction of the electronic signal, the first through hole and the second through hole at least partially overlap to allow an electron beam to pass through.

[0009] In some embodiments, both the support and the probe are conductive components.

[0010] In some embodiments, the detection unit includes a probe and a signal transmission and processing device. The probe is used to receive electronic signals and convert the electronic signals into optical signals, and the signal transmission and processing device is used to transmit and process the optical signals. The probe is located outside the support, and the support defines a receiving cavity inside, in which the signal transmission and processing device is housed.

[0011] In some embodiments, the support portion is provided with a wire outlet hole communicating with the receiving cavity. The support portion includes a first end and a second end disposed opposite to each other. The first end is connected to a rotating shaft and is closer to the wire outlet hole than the second end. The electronic detection device includes multiple cables, which are disposed one-to-one with multiple detection units. Each cable extends into the receiving cavity of the support portion through the wire outlet hole of a corresponding support portion and is connected to a signal transmission and processing device inside the receiving cavity.

[0012] In some embodiments, the electronic detection device further includes a drive mechanism connected to the rotating shaft for driving the rotating shaft to rotate.

[0013] In some embodiments, the drive mechanism is also used to drive the rotating shaft to translate in the first direction, the second direction and the direction of electronic signal propagation, wherein the first direction, the second direction and the direction of electronic signal propagation intersect each other.

[0014] According to a second aspect of this application, an electron beam imaging device is provided, comprising: an electron beam source for emitting an electron beam toward a sample; and an electron detection device according to any embodiment of the first aspect, wherein the electron detection device is used to receive an electronic signal generated by the electron beam irradiating the sample under test, and convert the electronic signal into an image signal.

[0015] The electronic detection device provided in this application selectively places one of the detection units or one of the gaps in the propagation path of the electronic signal through a support mechanism. When at least some of the detection units have the same specifications, they can be easily replaced with other detection units after one unit is contaminated or damaged, which helps extend the maintenance cycle of the electronic detection device and improve its durability. When at least some of the detection units have different specifications, suitable detection units can be quickly switched according to different needs or application scenarios to quickly change the imaging effect and meet different imaging requirements, thus expanding the scope of application. When other components (such as axial detectors, deflection devices, etc.) are needed to receive and process the electronic signal, the gap can be placed in the propagation path of the electronic signal to further expand the application range of the electronic detection device. Attached Figure Description

[0016] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0017] Figure 1 This is a schematic diagram of the structure of an electronic detection device provided in some embodiments of this application.

[0018] Figure 2 and Figure 3 They are Figure 1 The diagram shows a partial structure of the electronic detection device in different orientations.

[0019] Figure 4 yes Figure 1 A cross-sectional view of the electronic detection device shown.

[0020] Figure 5 yes Figure 4 A magnified structural diagram of region A in the middle.

[0021] Figure 6 This is a schematic diagram of the structure of an electron beam imaging device provided in some embodiments of this application.

[0022] The reference numerals in the accompanying drawings for the specific embodiments are as follows:

[0023] Electronic detection device 1, support mechanism 10, rotating shaft 11, support part 12, first end 121, second end 122, second through hole 123, wire outlet hole 124, receiving cavity 125, connector 13;

[0024] Detection unit 20, probe 21, first through hole 211, signal transmission and processing device 22, gap 30, cable 40, drive mechanism 50;

[0025] 2. Sample to be tested, 3. Electron beam imaging device, 4. Electron beam source, 6. First feed device, 7. Second feed device, 5. Vacuum system, 501. Vacuum chamber, 502.

[0026] The propagation direction is X, the first direction is Y, and the second direction is Z. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0028] The terms "first," "second," "third," etc., used in the specification, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy. In the embodiments of this application, the same reference numerals denote the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0029] In this application, the reference to "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments.

[0030] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0031] In the embodiments of this application, "parallel" includes not only the case of absolute parallelism, but also the case of approximate parallelism as commonly understood in engineering; similarly, "perpendicular" also includes not only the case of absolute perpendicularity, but also the case of approximate perpendicularity as commonly understood in engineering. For example, if the angle between two directions is 85°-95°, the two directions can be considered perpendicular; if the angle between two directions is 0°-10°, the two directions can be considered parallel.

[0032] Figure 1 This is a schematic diagram of the structure of an electronic detection device provided in some embodiments of this application. Figure 2 and Figure 3 They are Figure 1 The diagram shows a partial structural representation of the electronic detection device from different orientations. Figure 4 yes Figure 1 A cross-sectional view of the electronic detection device shown. Figure 5 yes Figure 4A magnified structural diagram of region A in the middle. (Refer to...) Figures 1 to 5 The electron detection device 1 provided in this application embodiment includes a support mechanism 10 and a plurality of detection units 20. The detection units 20 are used to receive and process electronic signals, which are generated by irradiating the sample 2 under test with an electron beam. The plurality of detection units 20 are arranged at intervals along a direction perpendicular to the propagation direction X of the electronic signals, and a gap 30 is formed between adjacent detection units 20 to allow the electronic signals to pass directly through. The support mechanism 10 is used to support the plurality of detection units 20, and the support mechanism 10 is configured to be movable, placing one of the detection units 20 or one of the gaps 30 in the propagation path of the electronic signals.

[0033] The electron signal generated by irradiating the sample 2 with an electron beam mainly includes secondary electrons and backscattered electrons. Secondary electrons mainly carry information such as the surface morphology of the sample 2, while backscattered electrons have a higher depth and mainly carry information such as the composition and density of the sample 2.

[0034] The detection unit 20 is used to detect the sample feature information carried by the electronic signals it receives.

[0035] In this embodiment, the propagation direction X of the electronic signal refers to the direction in which the main part of the electronic signal is emitted from the sample 2 to the detector unit 20. This direction is usually perpendicular to the surface of the sample 2 and parallel to the optical axis of the electron beam.

[0036] Within the same projection plane perpendicular to the propagation direction X of the electronic signal, the orthographic projections of multiple detection units 20 do not overlap. The reception of the electronic signal by each detection unit 20 is unaffected by the reception by other detection units 20.

[0037] In the direction of electronic signal propagation X, the distance between the multiple detection units 20 and the measured surface of the sample 2 can be the same or different.

[0038] The gap 30 is used to allow electronic signals to pass through directly, meaning that no structure is set in the gap 30, and the electronic signal can pass through the gap 30 without obstruction.

[0039] The support mechanism 10 supports multiple detection units 20 and drives them to move, such that one of the detection units 20 or one of the gaps 30 is positioned within the propagation path of the electronic signal. If the detection unit 20 is within the propagation path, it can receive and process the electronic signal to obtain the sample information carried by the signal. If the gap 30 is within the propagation path, the electronic signal can be transmitted to other components via the gap 30. These other components may be, for example, axial detectors, deflection devices, etc., for receiving and processing the electronic signal.

[0040] The support mechanism 10 can move the multiple detection units 20 in ways including but not limited to translation and / or rotation. The way the support mechanism 10 moves the multiple detection units 20 can be adapted to the arrangement of the multiple detection units 20, so as to place one of the detection units 20 or one of the gaps 30 in the propagation path of the electronic signal.

[0041] For example, multiple detection units 20 are arranged side by side and spaced apart along the first direction Y, and the support mechanism 10 is movable along the first direction Y to drive the multiple detection units 20 to translate along the first direction Y.

[0042] For example, multiple detection units 20 are spaced apart along the outer periphery of a reference axis, and the support mechanism 10 can rotate about the reference axis to drive the multiple detection units 20 to rotate.

[0043] In some examples, the support mechanism 10 may be connected to a drive mechanism to move under the drive of the drive mechanism. In other examples, the support mechanism 10 may also move under manual operation.

[0044] In some examples, at least some of the detection units 20 have different specifications. In other examples, all detection units 20 have the same specifications. The specifications of the detection units 20 include, but are not limited to, gain, response rate, and probe size.

[0045] The electronic detection device 1 provided in this application embodiment selectively places one of the detection units 20 or one of the gaps 30 in the propagation path of the electronic signal through the support mechanism 10. When at least some of the detection units 20 have the same specifications, they can be easily replaced with other detection units 20 after one is contaminated or damaged, which helps extend the maintenance cycle of the electronic detection device 1 and improve its durability. When at least some of the detection units 20 have different specifications, the appropriate specification of the detection unit 20 can be quickly switched according to different needs or application scenarios to quickly change the imaging effect, meet different imaging requirements, and expand the scope of application. For example, when the beam current of the electron beam increases, the beam current of secondary electrons, backscattered electrons, and other electronic signals generated by the sample 2 under test also increases. A detection unit 20 with lower gain can be switched to improve the effectiveness of electronic signal acquisition. When other components (such as axial detectors, deflection devices, etc.) are needed to receive and process the electronic signal, the gap 30 can be placed in the propagation path of the electronic signal to further expand the scope of application of the electronic detection device 1.

[0046] In some embodiments, the support mechanism 10 includes a rotating shaft 11 extending along the propagation direction X of the electronic signal and configured to be rotatable about its own central axis. A plurality of detection units 20 are spaced apart along the outer periphery of the rotating shaft 11, each detection unit 20 being directly or indirectly connected to the rotating shaft 11 and rotating synchronously with it. A gap 30 is located between circumferentially adjacent detection units 20 along the rotating shaft 11.

[0047] Optionally, multiple detection units 20 are arranged at equal intervals along the outer periphery of the rotating shaft 11. When replacing a detection unit 20, the rotating shaft 11 can be rotated at a preset angle, which helps to simplify the control logic and improve the positional accuracy of the detection unit 20.

[0048] Alternatively, multiple detection units 20 are arranged at non-equidistant intervals along the outer periphery of the rotating shaft 11.

[0049] In some examples, multiple detection units 20 are evenly distributed on a ring surrounding the rotating shaft 11, which helps to increase the gap 30 between adjacent detection units 20 and reduce the obstruction and influence of the detection units 20 on the electronic signal when the gap 30 is placed in the propagation path of the electronic signal.

[0050] In other examples, multiple detection units 20 are distributed on an arc around the rotating shaft 11, which helps to reduce the gap 30 between adjacent detection units 20, reduce the angle of rotation of the rotating shaft 11 during the switching of detection units 20, and improve the switching efficiency.

[0051] In some examples, the detection unit 20 is directly connected to the rotating shaft 11 and rotates synchronously under the drive of the rotating shaft 11.

[0052] In other examples, the detection unit 20 is indirectly connected to the rotating shaft 11 through other structures and rotates synchronously with the rotating shaft 11 under the drive of the other structures.

[0053] A gap 30 is formed between any two adjacent detection units 20 along the circumference of the rotation axis 11.

[0054] In this embodiment, a rotating shaft 11 drives multiple detection units 20 to rotate, thereby switching the positions of each detection unit 20 and each gap 30. The structure and switching method are relatively simple. The rotation angle of the rotating shaft 11 is easy to control, which is beneficial for accurately positioning each detection unit 20 and each gap 30, thereby improving detection accuracy.

[0055] In some embodiments, the support mechanism 10 includes a plurality of support portions 12, which are spaced apart circumferentially along the rotating shaft 11. The support portions 12 are connected to the rotating shaft 11 and rotate synchronously under the drive of the rotating shaft 11. A plurality of detection units 20 are respectively disposed on the plurality of support portions 12.

[0056] Multiple detection units 20 are arranged in a one-to-one correspondence with multiple support parts 12. Each detection unit 20 is indirectly connected to the rotating shaft 11 through a corresponding support part 12.

[0057] Optionally, the multiple support parts 12 are integrally formed, which simplifies the structure and assembly. Alternatively, the multiple support parts 12 are separate, independent components.

[0058] In the circumferential direction of the rotating shaft 11, the gap 30 between two adjacent detection units 20 is located between two adjacent support parts 12.

[0059] Optionally, the support 12 is a strip structure extending radially along the pivot 11, which helps to reduce the space occupied by the support 12, increase the size of the gap 30, and reduce the obstruction of electronic signals by the support 12.

[0060] The support part 12 includes a first end 121 and a second end 122 arranged radially opposite to each other along the rotating shaft 11. The first end 121 is connected to the rotating shaft 11, and the component in the detection unit 20 used to receive electronic signals can be located at the second end 122, which is beneficial to increase the spacing between adjacent detection units 20 and reduce mutual interference between different detection units 20.

[0061] In this embodiment, multiple support parts 12 support multiple detection units 20, which helps to improve the support stability of each detection unit 20.

[0062] In some embodiments, the support mechanism 10 further includes a connector 13, to which the rotating shaft 11 is inserted and fixed relative to the connector 13. The connector 13 may be integrally formed with multiple support portions 12, or may be connected to multiple support portions 12 by bonding, welding or other suitable means.

[0063] In some embodiments, the detection unit 20 includes a probe 21 for receiving electronic signals, the probe 21 being disposed outside the support portion 12. The probe 21 has a first through-hole 211 that penetrates the probe 21 along the propagation direction X of the electronic signal. The support portion 12 has a second through-hole 123 that penetrates the support portion 12 along the propagation direction X of the electronic signal. Along the propagation direction X of the electronic signal, the first through-hole 211 and the second through-hole 123 at least partially overlap to allow the electron beam to pass through.

[0064] The probe 21 is located on the side of the support 12 facing the sample 2 to facilitate the reception of electronic signals.

[0065] Optionally, the cross-sectional area of ​​the first through-hole 211 is less than or equal to the cross-sectional area of ​​the second through-hole 123. When viewed in a direction opposite to the propagation direction X of the electronic signal, the second through-hole 123 covers the first through-hole 211. The smaller cross-sectional area of ​​the first through-hole 211 is beneficial for increasing the signal receiving area of ​​the probe 21 and improving signal receiving efficiency. The larger cross-sectional area of ​​the second through-hole 123 is beneficial for reducing the influence and interference of the support portion 12 on the electron beam.

[0066] Optionally, both the first through hole 211 and the second through hole 123 are circular holes to match the cross-sectional shape of the electron beam and reduce the risk of the support 12 and / or the probe 21 blocking the electron beam.

[0067] When the detection unit 20 and its supporting part 12 are located in the propagation path of the electronic signal, the first through hole 211 and the second through hole 123 can provide a propagation channel for the electron beam, allowing the electron beam to pass through the first through hole 211 and the second through hole 123 to irradiate the sample 2 to be tested. This helps to reduce the obstruction of the electron beam and eliminates the need for a deflection device, which helps to simplify the structure and reduce costs.

[0068] In some embodiments, both the support 12 and the probe 21 are conductive components. In other words, both the support 12 and the probe 21 are made of conductive materials.

[0069] Optionally, the support 12 is made of metal. The probe 21 is made of metal.

[0070] In this embodiment, both the support 12 and the probe 21 are made as conductive components. Both the support 12 and the probe 21 can shield the surrounding electric field, reducing the influence of the electric field on the focusing or deflection of the electron beam, thus reducing interference with the electron beam. No additional shielding is required, which helps to simplify the structure.

[0071] In some embodiments, the detection unit 20 is a semiconductor detector, a photodetector, or a microchannel plate. Such detection units 20 inherently possess the function of shielding the electric field, eliminating the need for additional shielding components and simplifying the structure.

[0072] In some embodiments, refer to Figure 4 and Figure 5 The detection unit 20 includes a probe 21 and a signal transmission and processing device 22. The probe 21 is used to receive electronic signals and convert them into optical signals. The signal transmission and processing device 22 is used to transmit and process the optical signals generated by the probe 21. The probe 21 is located outside the support portion 12, and the support portion 12 defines a receiving cavity 125 inside, in which the signal transmission and processing device 22 is housed.

[0073] Optionally, the signal transmission and processing device 22 includes a light guide and a photomultiplier tube. The light guide is used to transmit the light signal generated by the probe 21 to the photomultiplier tube, and the photomultiplier tube is used to convert the received light signal into an electrical signal for imaging.

[0074] In this embodiment, the signal transmission processing device 22 is disposed in the receiving cavity 125 of the support part 12. The signal transmission processing device 22 is hidden inside the support part 12, which helps to reduce the influence and interference of the external environment on the signal transmission processing device 22, and also helps to simplify the external structure of the electronic detection device 1 and improve the structural integration.

[0075] In some embodiments, the support portion 12 is provided with a cable outlet 124 communicating with the receiving cavity 125. The support portion 12 includes a first end 121 and a second end 122 disposed opposite to each other. The first end 121 is connected to the rotating shaft 11, and the first end 121 is closer to the cable outlet 124 than the second end 122. The electronic detection device 1 includes a plurality of cables 40, which are disposed one-to-one with a plurality of detection units 20. Each cable 40 extends into the receiving cavity 125 of the support portion 12 through the cable outlet 124 of a corresponding support portion 12 and is connected to the signal transmission processing device 22 within the receiving cavity 125.

[0076] Optionally, the outlet hole 124 is located at the first end 121.

[0077] Cable 40 is used to connect signal transmission processing device 22 and other devices, such as power supply, display device, etc.

[0078] Compared to the second end 122, the cable outlet 124 is closer to the first end 121. The first end 121 is connected to the rotating shaft 11. When the rotating shaft 11 rotates, the cable 40 rotates with a smaller amplitude, which helps to reduce the risk of the cable 40 interfering with or getting tangled with other structures.

[0079] In some embodiments, the electronic detection device 1 further includes a drive mechanism 50, which is connected to the rotating shaft 11 and is used to drive the rotating shaft 11 to rotate.

[0080] The drive mechanism 50 includes a power module for outputting power. Optionally, the power module includes a motor.

[0081] Optionally, the drive mechanism 50 also includes a sensor for detecting the rotation angle of the motor, so as to control the rotation angle of the shaft 11 by the rotation angle of the motor, which helps to improve the position accuracy of the detection unit 20.

[0082] Optionally, the drive mechanism 50 further includes a transmission assembly connected to the power module and the rotating shaft 11, for transmitting the power output from the power module to the rotating shaft 11. Optionally, the transmission assembly includes a reduction gear.

[0083] In this embodiment, the rotating shaft 11 is driven to rotate by the driving mechanism 50, which facilitates control of the rotation angle of the rotating shaft 11 and improves the position accuracy of the detection unit 20.

[0084] In some embodiments, the drive mechanism 50 is also used to drive the rotating shaft 11 to translate in the first direction Y, the second direction Z and the propagation direction X of the electronic signal, wherein the first direction Y, the second direction Z and the propagation direction X of the electronic signal intersect each other.

[0085] The rotation shaft 11 translates along the X direction of electron signal propagation, which can adjust the distance between the detection unit 20 and the sample 2 under test. The translation of the rotation shaft 11 along the first Y direction and the second Z direction allows for fine-tuning of the position of the detection unit 20 relative to the electron beam, which helps ensure the coaxiality of the detection unit 20 and the electron beam optical axis. In this embodiment, the drive mechanism 50 achieves the displacement of the detection unit 20 in three dimensions, which helps improve the accuracy and efficiency of the detection by the detection unit 20.

[0086] According to a second aspect of this application, embodiments of this application also provide an electron beam imaging device for detecting wafer surface defects or critical dimensions.

[0087] Figure 6 This is a schematic diagram of the structure of an electron beam imaging device provided in some embodiments of this application. The electron beam imaging device 3 provided in the embodiments of this application includes an electron beam source 4 and an electron detection device 1 provided in any embodiment of this application. The electron beam source 4 is used to emit an electron beam toward the sample 2 under test (e.g., a wafer). The electron detection device 1 is used to receive the electron signal generated by the electron beam irradiating the sample 2 under test and convert the electron signal into an image signal.

[0088] The electron beam imaging device 3 of this application embodiment can quickly and conveniently replace the detection unit 20, which helps to extend the maintenance cycle of the electron detection device 1, improve its durability, and also quickly change the imaging effect to meet different imaging needs and expand the scope of application. When other components (such as axial detectors, deflection devices, etc.) are required to receive and process electronic signals, the gap 30 can be placed in the propagation path of the electronic signal to further expand the scope of application of the electron detection device 1.

[0089] Electron beam imaging equipment 3 includes, but is not limited to, scanning electron microscopes, transmission electron microscopes, electron beam exposure systems, etc.

[0090] In some embodiments, the electron beam imaging device 3 includes a vacuum system 5, which includes a vacuum chamber 501 and a vacuum pumping device 502 for creating a vacuum environment within the vacuum chamber 501. The sample to be tested 2, a plurality of detection units 20, and at least a portion of the support mechanism 10 are all disposed within the vacuum chamber 501.

[0091] In some embodiments, the electron beam imaging device 3 includes a first feed device 6 and a second feed device 7 disposed outside the vacuum chamber 501. A drive mechanism 50 is connected to the first feed device 6, which is used to connect at least a portion of the drive mechanism 50 to the vacuum chamber 501. Each cable 40 is connected to the second feed device 7, which is used to connect the cable 40 to the vacuum chamber 501.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An electronic detection device, characterized in that, include: Multiple detection units are provided for receiving and processing electronic signals generated by electron beam irradiation of the sample under test. The multiple detection units are arranged at intervals along the direction perpendicular to the propagation of the electronic signals, and gaps are formed between adjacent detection units to allow the electronic signals to pass through directly. as well as A support mechanism for supporting the plurality of detection units, the support mechanism being configured to be movable and placing one of the detection units or one of the gaps in the propagation path of the electronic signal.

2. The electronic detection device according to claim 1, characterized in that, The support mechanism includes a rotating shaft that extends along the propagation direction of the electronic signal and is configured to be rotatable about its own central axis. The plurality of detection units are arranged at intervals along the outer periphery of the rotating shaft, and each detection unit is directly or indirectly connected to the rotating shaft and rotates synchronously with the rotating shaft; The gap is located between the circumferentially adjacent detection units along the axis of rotation.

3. The electronic detection device according to claim 2, characterized in that, The support mechanism includes multiple support parts, which are spaced apart circumferentially along the rotating shaft. The support parts are connected to the rotating shaft and rotate synchronously under the drive of the rotating shaft. The plurality of detection units are respectively disposed on the plurality of support parts.

4. The electronic detection device according to claim 3, characterized in that, The detection unit includes a probe for receiving the electronic signal. The probe is located outside the support and has a first through hole that penetrates the probe along the propagation direction of the electronic signal. The support portion is provided with a second through hole, which penetrates the support portion along the propagation direction of the electronic signal; Along the propagation direction of the electronic signal, the first through-hole and the second through-hole at least partially overlap to allow the electron beam to pass through.

5. The electronic detection device according to claim 4, characterized in that, Both the support and the probe are conductive components.

6. The electronic detection device according to claim 3, characterized in that, The detection unit includes a probe and a signal transmission and processing device. The probe is used to receive the electronic signal and convert the electronic signal into an optical signal. The signal transmission and processing device is used to transmit and process the optical signal. The probe is located outside the support portion, and the support portion has an internal cavity for receiving the signal transmission and processing device.

7. The electronic detection device according to claim 6, characterized in that, The support portion is provided with a cable outlet hole communicating with the receiving cavity. The support portion includes a first end and a second end disposed opposite to each other. The first end is connected to the rotating shaft and the first end is closer to the cable outlet hole than the second end. The electronic detection device includes multiple cables, each cable corresponding to one of the multiple detection units. Each cable extends into the receiving cavity of the support part through the outlet hole of a corresponding support part and is connected to the signal transmission and processing device inside the receiving cavity.

8. The electronic detection device according to claim 2, characterized in that, The electronic detection device also includes a drive mechanism connected to the rotating shaft for driving the rotating shaft to rotate.

9. The electronic detection device according to claim 8, characterized in that, The driving mechanism is also used to drive the rotating shaft to translate in the first direction, the second direction and the propagation direction of the electronic signal, wherein the first direction, the second direction and the propagation direction of the electronic signal intersect each other.

10. An electron beam imaging device, characterized in that, include: An electron beam source, used to emit an electron beam toward a sample; as well as According to any one of claims 1-9, the electronic detection device is used to receive the electronic signal generated by the electron beam irradiating the sample to be tested, and convert the electronic signal into an image signal.

Images