Connection structure of high-conductivity aluminum alloy bus duct

Abstract

The utility model discloses a connecting structure of a high-conductivity aluminum alloy bus duct, and relates to the technical field of busbars. The high-conductivity aluminum busbar comprises a high-conductivity aluminum busbar body, the high-conductivity aluminum busbar body comprises an aluminum alloy base body layer A, copper connecting layers A are electroplated on the end portions of the upper side face and the lower side face of the aluminum alloy base body layer A, the high-conductivity aluminum busbar body further comprises a connector, the connector comprises a plurality of copper-aluminum eutectic connecting pieces, and the high-conductivity aluminum busbar body is clamped by the connector and tightly abuts against the copper-aluminum eutectic connecting pieces. The beneficial effects of the utility model lie in that the alloying design and the heat treatment process are optimized, the conductivity of the aluminum alloy busbar is improved, the density of aluminum alloy is lower than that of copper, the lightweight design is realized, and the cost is reduced; the process of firstly plating copper and then plating tin on the surface of the high-conductivity aluminum effectively prevents the surface of the aluminum alloy from being oxidized; the copper-aluminum eutectic connector tightly abuts against the high-conductivity aluminum conducting bar, reliable connection is achieved, the copper-aluminum eutectic layer reduces the resistance of a connecting interface and improves the conductivity, and the copper connecting layer enhances the conductivity and mechanical strength of the connecting interface.

Description

Technical Field

[0001] This utility model relates to the field of busbar technology, and in particular to a connection structure for a high conductivity aluminum alloy busbar trunking. Background Technology

[0002] Busbar trunking is a new type of conductor that uses copper or aluminum as the conductor, is supported by non-alkaline insulation, and is then installed in a metal trough. It has advantages such as large current transmission capacity, convenient installation and disassembly, safety and reliability, and long service life, and is widely used in high-rise buildings, large shopping malls, factories, data centers and other places.

[0003] Traditional busbar trunking typically uses copper or aluminum busbars as its conductors. While copper busbars offer superior conductivity, their high cost and weight hinder energy conservation, emission reduction, and lightweight design. Aluminum busbars, on the other hand, are widely used in busbar trunking production due to their significant cost advantage. Weighing only about one-third of copper busbars, aluminum busbars are easier to handle and install, placing less stress on the building structure and reducing support and reinforcement costs. This makes them particularly advantageous in power supply systems for weight-sensitive or mobile equipment. Furthermore, aluminum is abundant in the Earth's crust, making it a sustainable resource.

[0004] However, the conductivity of aluminum busbars produced by modern manufacturing processes is less than 60% of that of copper busbars. Therefore, when aluminum busbars are used as conductors in busbar trunking, their lower conductivity results in more heat generation during current transmission, leading to increased energy loss as heat. When this heat accumulates on the aluminum busbars and cannot be effectively dissipated, the busbars themselves will heat up, and excessively high temperatures will further reduce their conductivity.

[0005] To balance cost and performance, a high-conductivity aluminum alloy busbar can be designed. The aluminum alloy can be optimized through alloying design and heat treatment process to improve its conductivity. However, considering that its surface may be oxidized, the Al3O2 generated after oxidation is non-conductive. To prevent surface oxidation, it can be solved by tin plating. However, it is difficult to directly tin plating the surface of high-conductivity aluminum. Therefore, it is necessary to design a high-conductivity aluminum busbar that meets the requirements.

[0006] Based on this, the applicant proposed a connection structure for a high-conductivity aluminum alloy busbar trunking to solve the above technical problems. Utility Model Content

[0007] This utility model addresses the shortcomings of existing technologies by providing a connection structure for a high-conductivity aluminum alloy busbar trunking, thereby solving the aforementioned technical problems.

[0008] This utility model is solved by the following technical solution:

[0009] A connection structure for a high conductivity aluminum alloy busbar includes a high conductivity aluminum busbar, the high conductivity aluminum busbar including an aluminum alloy substrate layer A, copper connecting layers A electroplated on the ends of the upper and lower sides of the aluminum alloy substrate layer A, and a connector including a plurality of copper-aluminum eutectic connecting pieces, the high conductivity aluminum busbar being clamped by the connector and tightly abutting against the copper-aluminum eutectic connecting pieces.

[0010] Preferably, the composition of the aluminum alloy substrate layer A, by weight percentage, includes 0.015%~0.05% Ce, 0.015%~0.05% La, 0.05%~0.25% Si, 0.015%~0.05% Zn, 0.025%~0.10% Cu, 0.10%~0.50% Fe, 0.015%~0.035% Ti, 0.015%~0.035% B, with the remainder being Al and unavoidable impurities.

[0011] Preferably, after the high-conductivity aluminum busbar is connected to the connector, the outer boundary of the copper connection layer A is equal to or exceeds the boundary of the copper-aluminum eutectic connection sheet.

[0012] Preferably, the length of the copper connecting layer A at the end of the aluminum alloy substrate layer A accounts for 2% to 15% of the total length.

[0013] Preferably, the thickness of the aluminum alloy substrate layer A is 2mm to 9mm.

[0014] Preferably, the high-conductivity aluminum busbar further includes a P1 busbar, the thickness of which is 1mm to 4.5mm.

[0015] Preferably, the copper-aluminum eutectic connector includes an aluminum alloy substrate layer B, and a copper connector layer B is coated on the aluminum alloy substrate layer B corresponding to the connector surface of the high-conductivity aluminum busbar. The copper-aluminum eutectic layer B is located between the aluminum alloy substrate layer B and the copper connector layer B.

[0016] Preferably, the thickness of the copper connecting layer B is 5% to 35% of the thickness of the copper-aluminum eutectic connecting sheet.

[0017] Preferably, the thickness of the copper-aluminum eutectic connecting sheet is 1mm to 5mm.

[0018] Preferably, the thickness of the copper interconnect layer B is 0.1mm to 0.5mm.

[0019] Preferably, a tin-plated connection layer A is deposited on the outer side of the copper connection layer A, and a tin-plated connection layer B is deposited on the outer side of the copper connection layer B.

[0020] Preferably, a silver connecting layer A is electroplated on the outer side of the copper connecting layer A, and a silver connecting layer B is electroplated on the outer side of the copper connecting layer B.

[0021] The beneficial effects of this utility model are as follows:

[0022] 1. Improved conductivity and lightweight design: Through alloying design and optimized heat treatment process, the conductivity of aluminum alloy busbars is improved. At the same time, the density of aluminum alloy is much lower than that of copper, realizing a lightweight design, which is conducive to energy saving, consumption reduction and material cost reduction.

[0023] 2. Improved oxidation resistance: Aluminum alloy surfaces are prone to oxidation, forming a non-conductive Al3O2 layer that affects conductivity. By first plating copper and then tin on the high-conductivity aluminum surface, oxidation of the aluminum alloy surface is effectively prevented. The copper layer, as an intermediate layer, not only enhances the bonding force between the tin layer and the aluminum alloy substrate, but also acts as an oxygen barrier, further improving the oxidation resistance and long-term stability of the busbar.

[0024] 3. Reliable connection and low resistance: By designing a connector that includes a copper-aluminum eutectic connector, the high-conductivity aluminum busbar is clamped and tightly abuts against the copper-aluminum eutectic connector, achieving a reliable connection. The copper-aluminum eutectic layer reduces the resistance of the connection interface and improves conductivity. At the same time, the presence of the copper connector layer also enhances the conductivity and mechanical strength of the connection interface.

[0025] 4. Process optimization and cost-effectiveness: Although the copper-plating followed by tin plating process adds steps, it is more stable and controllable than the difficulty and unreliability of direct tin plating. At the same time, by rationally designing the thickness and distribution of the plating layer, cost-effectiveness can be further optimized while ensuring conductivity and connection reliability. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be discussed below. Obviously, the technical solutions described in conjunction with the accompanying drawings are only some embodiments of this utility model. For those skilled in the art, other embodiments and their accompanying drawings can be obtained from the embodiments shown in these drawings without creative effort.

[0027] Figure 1 This is a three-dimensional structural diagram of the connection state of this utility model.

[0028] Figure 2 This is a three-dimensional structural diagram of the connection state of this utility model.

[0029] Figure 3 This is a three-dimensional structural cross-sectional view of the connection state of this utility model.

[0030] Figure 4 This is a schematic diagram of the high-conductivity aluminum conductive busbar layer structure of this utility model.

[0031] Figure 5 This is a schematic diagram of the high-conductivity aluminum conductive busbar layer structure of this utility model.

[0032] Figure 6 This is a cross-sectional view of the layered structure of the copper-aluminum eutectic connecting sheet of this utility model.

[0033] Figure 7 This is a cross-sectional view of the layered structure of the copper-aluminum eutectic connecting sheet of this utility model.

[0034] Figure 8 This is a schematic diagram of the layered structure of the copper-aluminum eutectic connecting sheet of this utility model.

[0035] Figure 9 This is a connection diagram of this utility model.

[0036] Figure 10 This is a schematic diagram of the busbar trunking of this utility model.

[0037] In the diagram: 1. High-conductivity aluminum busbar, 11. P1 busbar, 101. Aluminum alloy substrate layer A, 102. Copper connector layer A, 104. Tin connector layer A, 2. Connector, 21. Copper-aluminum eutectic connector, 211. Aluminum alloy substrate layer B, 212. Copper connector layer B, 213. Copper-aluminum eutectic layer B, 214. Tin connector layer B. Detailed Implementation

[0038] The technical solutions of various embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments described in this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Example 1:

[0039] like Figures 1 to 4 , Figures 6 to 7 , Figures 9 to 10As shown, the present invention discloses a connection structure for a high conductivity aluminum alloy busbar, comprising a high conductivity aluminum busbar 1, wherein the high conductivity aluminum busbar 1 includes an aluminum alloy substrate layer A101, and copper connecting layers A102 are electroplated on the upper and lower ends of the aluminum alloy substrate layer A101. The thickness of the aluminum alloy substrate layer A101 is 5mm. The high conductivity aluminum busbar 1 also includes a P1 bar 11, the thickness of which is 2.5mm. It further includes a connector 2, which includes several copper-aluminum eutectic connecting pieces 21. The high conductivity aluminum busbar 1 is clamped by the connector 2 and tightly abuts against the copper-aluminum eutectic connecting pieces 21. The copper connecting layers are provided at the ends of the aluminum alloy substrate layer A101. The length of A102 accounts for 2% to 15% of the total length. After the high-conductivity aluminum busbar 1 is connected to the connector 2, the outer boundary of the copper connection layer A102 is equal to or exceeds the boundary of the copper-aluminum eutectic connection piece 21. The copper-aluminum eutectic connection piece 21 includes an aluminum alloy substrate layer B211. A copper connection layer B212 is covered on the aluminum alloy substrate layer B211 corresponding to the connection surface of the high-conductivity aluminum busbar 1. Between the aluminum alloy substrate layer B211 and the copper connection layer B212 is a copper-aluminum eutectic layer B213. The thickness of the copper-aluminum eutectic connection piece 21 is 3 mm, the thickness of the copper connection layer B212 is 0.3 mm, and the thickness of the copper-aluminum eutectic layer B213 is several micrometers to tens of micrometers.

[0040] By designing a connector that includes a copper-aluminum eutectic connector, a high-conductivity aluminum busbar is clamped and tightly abuts against the copper-aluminum eutectic connector, achieving a reliable connection. The copper-aluminum eutectic layer reduces the resistance of the connection interface and improves conductivity. At the same time, the presence of the copper connector layer also enhances the conductivity and mechanical strength of the connection interface.

[0041] The conductive bus of this utility model adopts a high aluminum conductivity conductive bus 1. The composition of the high aluminum conductivity material is provided, which, by weight percentage, includes 0.015%~0.05% Ce, 0.015%~0.05% La, 0.05%~0.25% Si, 0.015%~0.05% Zn, 0.025%~0.10% Cu, 0.10%~0.50% Fe, 0.015%~0.035% Ti, 0.015%~0.035% B, with the remainder being Al and unavoidable impurities.

[0042] Based on the above-mentioned high-conductivity aluminum material, a preparation process for the high-conductivity aluminum material is provided, including the following steps:

[0043] Step a: Add pure aluminum ingots to a smelting furnace for smelting. When the temperature of the molten aluminum solution reaches 720°C, add elemental cerium, elemental lanthanum, aluminum-iron alloy ingots, aluminum-silicon alloy ingots, aluminum-copper alloy ingots, and aluminum-zinc alloy ingots. Then, stir thoroughly in the molten aluminum state to obtain an aluminum alloy molten solution.

[0044] Step b: Pour the molten aluminum alloy solution into the holding furnace, raise the holding temperature to 760℃, and then hold it at that temperature for 20 minutes.

[0045] Step c: The molten aluminum alloy solution is degassed and filtered by online processing equipment such as a degassing box and a filter box. At the same time, aluminum-titanium-boron wire is fed into the molten aluminum at the inlet of the degassing box at a feeding speed of 120~130mm / min.

[0046] Step d: The molten aluminum alloy solution is continuously cast and rolled into aluminum alloy sheet and strip billets using a twin-roll casting mill. The rolling force of the twin-roll casting mill is greater than 1200 tons, the casting speed is 600 mm / min, the thickness of the cast and rolled aluminum alloy sheet and strip billet is 10 mm, the width is 600 mm, the temperature of the coolant in the rolls is 28℃, and the cooling rate is 300℃ / s.

[0047] Step e: Cold roll the cast and rolled aluminum alloy sheet and strip blanks with a reduction rate of 20%;

[0048] Step f: Place the aluminum alloy sheet and strip billet after the first cold rolling into an annealing furnace at a temperature of 250℃ and hold for 1.5 hours;

[0049] Step g: After cooling the annealed aluminum alloy sheet and strip billet to 30°C, perform a second rolling. Adjust the rolling equipment to perform two finishing rollings with a reduction rate of 8% each time. The thickness of the aluminum alloy sheet and strip after the second cold rolling is 4mm.

[0050] Step h: Cut the wide strip into strips of the required width;

[0051] Step i: Chamfer the strip after slitting and polish the surface to obtain high-conductivity aluminum conductive busbar 1.

[0052] like Figure 5 , Figure 8 As shown, in another embodiment, the copper connection layer A102 is electroplated with a tin connection layer A104 on the outside, and the copper connection layer B212 is electroplated with a tin connection layer B214 on the outside. Tin plating prevents surface oxidation, improves the corrosion resistance of the connection parts, and enhances the overall durability of the busbar. This design effectively resists the erosion of the external environment and extends the service life of the busbar.

[0053] Direct tin plating on high-conductivity aluminum surfaces presents significant challenges. While the copper-plating followed by tin plating method of this invention adds a step, it is more stable and controllable compared to the difficulty and unreliability of direct tin plating. Furthermore, by rationally designing the thickness and distribution of the plating layer, cost-effectiveness can be further optimized while ensuring conductivity and connection reliability.

[0054] The outer side of the copper connecting layer A102 is electroplated with a silver connecting layer A, and the outer side of the copper connecting layer B212 is electroplated with a silver connecting layer B. Silver plating can improve conductivity.

[0055] In the above embodiment, the connector 2 includes a plurality of insulating mounting plates disposed between two end caps, and the copper-aluminum eutectic connecting piece 21 is disposed on the insulating mounting plate.

[0056] Copper-aluminum eutectic refers to a low-melting-point eutectic alloy formed between copper and aluminum under certain temperature and pressure. This eutectic alloy has good wettability and fluidity, which can fill the tiny gaps between copper and aluminum to form a strong bond. At the same time, the copper-aluminum eutectic layer also has good electrical conductivity and corrosion resistance, which can improve the overall performance of the connector.

[0057] The insulating mounting plate includes one single-sided slot insulating mounting plate and four double-sided slot insulating mounting plates. The number of single-sided slot insulating mounting plates and double-sided slot insulating mounting plates is set according to actual needs and adapted to the busbar trunking. The single-sided slot insulating mounting plate is arranged adjacent to the end cover. The double-sided slot insulating mounting plate is arranged between the single-sided slot insulating mounting plate and another end cover. One copper-aluminum eutectic connecting piece 21 is provided on the single-sided slot insulating mounting plate, and two copper-aluminum eutectic connecting pieces 21 are symmetrically arranged on the double-sided slot insulating mounting plates.

[0058] A connecting cavity for clamping the high-conductivity aluminum conductive busbar 1 is formed between adjacent insulating mounting plates, and a connecting cavity for clamping the P1 busbar 11 is formed between the end cap and the adjacent double-side slot insulating mounting plate.

[0059] The end cap has a protrusion in the middle of the side facing the insulating mounting plate, forming a gap with the adjacent single-sided slot insulating mounting plate to fit the auxiliary side plate of the busbar. The end cap has a mounting cavity on the side facing away from the insulating mounting plate, and a gasket is provided in the mounting cavity. The protrusion and mounting cavity design on the end cap enhance the structural strength of the device and facilitate installation and fixation.

[0060] An insulating sleeve passes through the end cap, the insulating mounting plate, and the copper-aluminum eutectic connecting piece 21. After the busbar torque bolt passes through the insulating sleeve, the high-conductivity aluminum busbar 1 is clamped by tightening the nut at the end, ensuring the stability and safety of the connection.

[0061] Each high-conductivity aluminum busbar 1 is stacked in the busbar trunking, and an insulating layer is provided on it to prevent short circuits between them. The insulating layer can be a single-layer polyester film. The smooth surface of the polyester film can prevent the film from being damaged by mutual squeezing and friction when the high-conductivity aluminum busbars 1 are stacked. Although the single-layer polyester film is very thin, it still affects heat dissipation. Using high-conductivity aluminum busbars 1 can improve heat dissipation. The wider the busbar, the better the heat dissipation. The base layer of the high-conductivity aluminum busbar 1 is an aluminum alloy base layer A101. Under the same weight or cost, the high-conductivity aluminum busbar 1 will have better heat dissipation than copper busbars.

[0062] The copper-aluminum eutectic connecting piece 21 of this utility model is a copper-aluminum eutectic composite material. A production process for this copper-aluminum eutectic composite material is provided, involving copper plate surface pretreatment, copper plate preheating, solid-liquid composite casting and rolling, composite slab homogenization annealing, cold rolling, secondary annealing, and slitting. This process includes the following steps:

[0063] Step A: Copper plate surface pretreatment: The copper plate is first subjected to high-pressure rinsing to quickly remove solid impurities from the surface of the copper plate, and then degreased by low-pressure rinsing to remove grease from the surface of the copper plate. Then, the oxide layer on the surface of the copper plate is polished off by steel brush equipment, and finally the copper plate is dried for use.

[0064] Step B: Copper plate preheating: The pretreated copper plate is fixedly fed into the feeding equipment and heated to 150℃~220℃ in an oxygen-free environment;

[0065] Step C: Solid-liquid composite casting and rolling: The aluminum ingot is heated to 660℃~710℃ to obtain molten aluminum liquid. Then, inert gas is introduced near the rolls to fill the casting and rolling environment and form an oxygen-free environment. At the same time, the outer surface temperature of the rolls is heated to 85℃~95℃. Cooling liquid is introduced into the rolls, and the casting and rolling equipment is started. In the oxygen-free environment, the molten aluminum liquid and the processed copper plate are brought into contact to achieve solid-liquid composite oxygen-free continuous casting and rolling, and copper-aluminum composite slab is obtained.

[0066] Step D: Homogenization annealing of composite slab: The obtained copper-aluminum composite slab is placed in an annealing furnace for homogenization annealing;

[0067] Step E: Cold rolling: The annealed composite slab is rolled a second time. The rolling equipment is adjusted to obtain the required plate thickness and width. The final plate thickness after the second rolling is 0.2 mm to 16 mm, of which the copper plate thickness is 5% to 35% of the overall composite plate thickness, and the plate width is 600 mm to 1200 mm.

[0068] Step F: Secondary annealing: The cold-rolled copper-aluminum composite plate is subjected to secondary annealing;

[0069] Step G: Cut into strips.

[0070] In step A, the rinsing solution is an alkaline degreasing solution at 50℃~70℃.

[0071] In step A, the steel brush equipment not only removes the oxide layer on the surface of the copper plate, but also increases the surface roughness, increases the copper-aluminum composite area, and thus enhances the adhesion of the composite material.

[0072] In step B, preheating the copper plate can increase the thermal activation energy of atoms, allowing atoms to acquire enough energy to migrate in a short time at high temperatures, forming a thicker eutectic layer, thereby effectively improving the bonding strength of the copper-aluminum composite interface.

[0073] In step C, the inert gas is nitrogen. Introducing nitrogen to create an oxygen-free environment can prevent the copper plate and aluminum liquid from forming an oxide layer due to direct exposure to air during the composite process, which would make it difficult to form an ideal eutectic layer and adversely affect the peel strength of the material.

[0074] In step C, introducing coolant into the rolls can increase the cooling rate of the casting and rolling process, forming smaller grains, thereby increasing the material strength. The rolling speed of the rolls is 600~1300 mm / min, the temperature of the coolant is 20℃~30℃, and the cooling rate is 300~1000℃ / s.

[0075] In step C, the composite rate after solid-liquid composite casting and rolling is 100%.

[0076] In step D, the heating temperature of the homogenization annealing process is 430℃~510℃, and the annealing time is 4h~5h. The homogenization annealing process can reduce intragranular segregation on both sides of the copper-aluminum alloy, remove residual stress, and improve the alloy performance.

[0077] In step F, the heating temperature of the secondary annealing process is 300℃~350℃, and it is cooled to below 80℃ in the annealing furnace. The secondary annealing process can refine the grains, adjust the microstructure, and eliminate microstructural defects. Since there is a certain internal stress during the rolling process, it will lead to a decrease in the strength of the composite material. The annealing process can reduce residual stress, stabilize dimensions, reduce deformation and cracking tendency, and ensure that the product has good comprehensive mechanical properties and good metallurgical bonding.

[0078] The skin effect of copper-aluminum eutectic composite material is not affected in current transmission, and its current carrying capacity is about 85% of that of pure copper conductor. Compared with copper busbar, it reduces the consumption of copper material and saves production costs.

[0079] The copper-aluminum eutectic composite material produced by this process has high shear strength and peel strength, and can achieve metallurgical bonding between composite metals to form a eutectic layer, which can meet the bonding strength requirements of the material. At the same time, compared with existing composite material production methods, the preparation method of this process is simpler, more economical and more efficient.

[0080] In this embodiment, in order to obtain the copper-aluminum eutectic connecting piece 21 that meets the requirements, the relevant parameters in the above-mentioned copper-aluminum eutectic composite material production process can be appropriately adjusted so that the processed composite material meets the requirements.

[0081] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and not restrictive in all respects. The scope of this invention is defined by the appended claims, not by the foregoing description, and is therefore intended to encompass all variations falling within the meaning and scope of equivalents of the claims. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0082] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A connection structure for a high conductivity aluminum alloy busbar trunking, characterized in that: The device includes a high-conductivity aluminum busbar (1), which includes an aluminum alloy substrate layer A (101). The ends of the upper and lower sides of the aluminum alloy substrate layer A (101) are plated with copper connecting layers A (102). The device also includes a connector (2), which includes a plurality of copper-aluminum eutectic connecting pieces (21). The high-conductivity aluminum busbar (1) is clamped by the connector (2) and closely abuts against the copper-aluminum eutectic connecting pieces (21). The copper-aluminum eutectic connecting pieces (21) include an aluminum alloy substrate layer B (211). The aluminum alloy substrate layer B (211) is covered with a copper connecting layer B (212) on the connecting surface of the high-conductivity aluminum busbar (1). The copper-aluminum eutectic layer B (213) is located between the aluminum alloy substrate layer B (211) and the copper connecting layer B (212).

2. The connection structure of a high conductivity aluminum alloy busbar trunking according to claim 1, characterized in that: The composition of the aluminum alloy substrate layer A (101), by weight percentage, includes 0.015%~0.05% Ce, 0.015%~0.05% La, 0.05%~0.25% Si, 0.015%~0.05% Zn, 0.025%~0.10% Cu, 0.10%~0.50% Fe, 0.015%~0.035% Ti, 0.015%~0.035% B, with the remainder being Al and unavoidable impurities.

3. The connection structure of a high conductivity aluminum alloy busbar trunking according to claim 1, characterized in that: After the high-conductivity aluminum busbar (1) is connected to the connector (2), the outer boundary of the copper connection layer A (102) is equal to or exceeds the boundary of the copper-aluminum eutectic connection piece (21).

4. The connection structure of a high conductivity aluminum alloy busbar trunking according to claim 1, characterized in that: The copper connecting layer A (102) provided at the end of the aluminum alloy substrate layer A (101) accounts for 2% to 15% of the total length.

5. The connection structure of a high conductivity aluminum alloy busbar trunking according to claim 1, characterized in that: The thickness of the aluminum alloy substrate layer A (101) is 2mm to 9mm.

6. The connection structure of a high conductivity aluminum alloy busbar trunking according to claim 1, characterized in that: The thickness of the copper bonding layer B (212) is 5% to 35% of the thickness of the copper-aluminum eutectic bonding sheet (21).

7. The connection structure of a high conductivity aluminum alloy busbar trunking according to claim 6, characterized in that: The thickness of the copper-aluminum eutectic bonding sheet (21) is 1mm to 5mm, and the thickness of the copper bonding layer B (212) is 0.1mm to 0.5mm.

8. The connection structure of a high conductivity aluminum alloy busbar trunking according to claim 1, characterized in that: The copper connection layer A (102) is electroplated with a tin connection layer A (104) on the outside, and the copper connection layer B (212) is electroplated with a tin connection layer B (214) on the outside.

9. The connection structure of a high conductivity aluminum alloy busbar trunking according to claim 1, characterized in that: The copper connecting layer A (102) is electroplated with a silver connecting layer A on the outside, and the copper connecting layer B (212) is electroplated with a silver connecting layer B on the outside.

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