Ceramic circuit board convenient for multilayer stacking

Abstract

The utility model relates to the technical field of ceramic circuit boards, and discloses a ceramic circuit board convenient for multilayer stacking, which comprises a board body, four corners in the board body are provided with fixing holes, two sides in the board body are provided with limiting clamping holes, two sides of the bottom end of the board body are provided with hidden grooves, and the bottom end of the board body is provided with a through hole. Stacking rod bodies are installed on one sides of the interiors of the hidden grooves in a hinged mode through rotating shafts, and limiting clamping rings are installed on the outer side walls of the stacking rod bodies. When the produced ceramic circuit board is not used, the ceramic circuit board needs to be placed in a dry environment for storage, and the board bodies can be quickly and stably spliced and stacked together by arranging the limiting clamping holes, the hidden grooves, the limiting clamping rings, the stacking rod bodies and other assemblies in the board bodies, so that the board bodies can be better stored, and the service life of the ceramic circuit board is prolonged. The storage space is saved, and the ceramic circuit board is convenient to stack together.

Description

Technical Field

[0001] This utility model relates to the field of ceramic circuit board technology, specifically to a ceramic circuit board that is easy to stack in multiple layers. Background Technology

[0002] A circuit board is an assembly primarily used to fix and connect electronic components. A ceramic circuit board is a type of circuit board produced using thermally conductive ceramic powder and organic adhesives through appropriate processes. Ceramic circuit boards have excellent insulation, high stability, and corrosion resistance, and are commonly used in fields such as semiconductors and LED lighting.

[0003] Traditional ceramic circuit boards are inconvenient to stack for storage, taking up considerable space. Therefore, we propose a ceramic circuit board that facilitates multi-layer stacking to address these issues. Utility Model Content

[0004] The purpose of this invention is to provide a ceramic circuit board that is easy to stack in multiple layers, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a ceramic circuit board that is easy to stack in multiple layers, comprising a board body, fixing holes provided at the four corners of the board body, limit locking holes provided on both sides of the board body, hidden grooves provided on both sides of the bottom end of the board body, and stacking rods hinged to one side of the hidden grooves via a pivot shaft, with limit locking rings installed on the outer side walls of the stacking rods.

[0006] Preferably, the limiting holes and stacking rods are provided in four sets, and they are all symmetrically distributed about the central axis of the plate.

[0007] Preferably, the length of the stacked rod is less than the length of the hidden groove, and the stacked rod and the hidden groove form an engaging structure.

[0008] Preferably, the stacking rod and the limiting ring are matched with the limiting hole, and the stacking rod forms an engaging structure through the limiting ring and the limiting hole.

[0009] Preferably, a heat-conducting groove is provided at the bottom of the interior of the plate body, a heat-conducting silicone is installed at the top of the interior of the heat-conducting groove, and a heat dissipation fin is installed at the bottom of the heat-conducting silicone.

[0010] Preferably, a heat-conducting groove is provided at the bottom of the interior of the plate body, a heat-conducting silicone is installed at the top of the interior of the heat-conducting groove, and a heat dissipation fin is installed at the bottom of the heat-conducting silicone.

[0011] Preferably, a rubber connecting strip is installed on the top of each side plate of the fixing hole via an installation shaft, and a sealing plate is installed on one end of each rubber connecting strip, and a sealing ring is installed on the outer side wall of each sealing plate.

[0012] Preferably, the cross-section of the fixing hole is larger than the cross-section of the sealing plate, and the sealing plate forms an engaging structure with the fixing hole through the sealing ring.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the ceramic circuit board that is easy to stack in multiple layers not only makes it easy to stack in multiple layers and achieves better heat dissipation, but also allows for sealing and protection of the fixing holes;

[0014] (1) When the ceramic circuit board is produced but not used, it needs to be stored in a dry environment. By setting components such as limit card holes, hidden grooves, limit card rings and stacking rods inside the board, the boards can be quickly and stably spliced ​​and stacked together, so as to better store the boards, save storage space, and make the ceramic circuit board easy to stack together.

[0015] (2) When ceramic circuit boards are used, certain electronic components will be installed on top of them. These electronic components will generate a certain amount of heat during use. By setting heat conduction grooves, heat conduction silicone and heat dissipation fins at the bottom of the board body, the heat conduction performance of the board body is increased, so that the board body can better dissipate heat, avoid high temperature damage to the board body, and greatly increase the protection of the board body.

[0016] (3) When the ceramic circuit board is used, the fastener will be installed on the board body through the fixing hole. By setting the rubber connecting strip, sealing ring and sealing plate on the upper part of the board body on the side of the fixing hole, the fixing hole on which the fastener is installed can be sealed and protected, thereby preventing external dust and water from falling on the top of the fastener and ensuring the normal disassembly and use of the fastener. Attached Figure Description

[0017] Figure 1 This is a top view of the structure of this utility model;

[0018] Figure 2 For the present utility model Figure 1 Enlarged cross-sectional view of point A in the middle;

[0019] Figure 3 This is a frontal cross-sectional view of the plate structure of this utility model;

[0020] Figure 4 This is a frontal cross-sectional view of the hidden groove structure of this utility model.

[0021] In the diagram: 1. Plate; 2. Rubber connecting strip; 3. Limiting hole; 4. Mounting shaft; 5. Sealing ring; 6. Sealing plate; 7. Fixing hole; 8. Heat conduction groove; 9. Thermal conductive silicone; 10. Heat dissipation fins; 11. Rotating shaft; 12. Hidden groove; 13. Limiting ring; 14. Stacking rod. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 This utility model provides an embodiment: a ceramic circuit board that is easy to stack in multiple layers, including a board body 1. Fixing holes 7 are provided at the four corners inside the board body 1. Limiting holes 3 are provided on both sides inside the board body 1. Hidden grooves 12 are provided on both sides of the bottom end of the board body 1. A stacking rod 14 is hinged to one side inside the hidden groove 12 via a pivot 11. Limiting rings 13 are installed on the outer side walls of the stacking rod 14. The limiting holes 3 and the stacking rod 14 are each provided with four... The stacked rods 14 and the limiting rings 13 are symmetrically distributed about the central axis of the plate 1. The stacked rods 14 and the limiting rings 13 are matched with the limiting holes 3. The stacked rods 14 form a locking structure with the limiting rings 13 and the limiting holes 3, so that multiple sets of plates 1 can be stacked together stably. The length of the stacked rods 14 is less than the length of the hidden groove 12. The stacked rods 14 and the hidden groove 12 form a locking structure, so that the stacked rods 14 can be hidden inside the hidden groove 12 when stacking is not required.

[0024] Specifically, such as Figure 1 , Figure 3 and Figure 4 As shown, when stacking the plate 1, the first set of plate 1 is taken out and the stacking rods 14 on both sides of its bottom end are rotated out of the hidden groove 12 and distributed perpendicularly between the plate 1. Then the second set of plate 1 is taken out and the stacking rods 14 at the bottom end of the first set of plate 1 are engaged into the limiting hole 3 inside the second set of plate 1, so that the first set of plate 1 and the second set of plate 1 are stacked together. Subsequently, multiple plates 1 can be stacked together in accordance with the above operation.

[0025] A heat-conducting groove 8 is provided at the bottom of the interior of the plate 1. A thermally conductive silicone 9 is installed at the top of the interior of the heat-conducting groove 8, and a heat dissipation fin 10 is installed at the bottom of the thermally conductive silicone 9. Several heat dissipation fins 10 are provided, and the several heat dissipation fins 10 are distributed at equal intervals inside the heat-conducting groove 8. The heat dissipation fins 10 distributed at equal intervals can better and more evenly dissipate the heat of the plate 1.

[0026] Specifically, such as Figure 2 As shown, when the board 1 is in use, heat is dissipated to the outside through the thermally conductive silicone 9, and the heat dissipated to the thermally conductive silicone 9 is then quickly discharged through the heat dissipation fins 10, which improves the heat dissipation performance of the board 1.

[0027] Rubber connecting strips 2 are installed on the top of the plate 1 on one side of the fixing hole 7 via the mounting shaft 4. A sealing plate 6 is installed on one end of the rubber connecting strip 2, and a sealing ring 5 is installed on the outer side wall of the sealing plate 6. The cross-section of the fixing hole 7 is larger than the cross-section of the sealing plate 6. The sealing plate 6 and the fixing hole 7 form a locking structure through the sealing ring 5, which provides better sealing and protection for the fasteners installed inside the fixing hole 7.

[0028] Specifically, such as Figure 1 and Figure 2 As shown, after the corresponding fasteners are installed in the limiting hole 3 inside the plate 1, the sealing plate 6 is inserted into the fixing hole 7, so that the sealing plate 6 is engaged with the fixing hole 7 through the sealing ring 5, thereby sealing and protecting the fixing hole 7 and preventing external dust and water from falling onto the fasteners inside the limiting hole 3 and causing damage. When it is necessary to open the fixing hole 7 later, the rubber connecting strip 2 is pulled to move the sealing plate 6 out from the inside of the fixing hole 7, and the limiting hole 3 can be opened.

[0029] Working Principle: When using this utility model, after the ceramic circuit board is manufactured and stored, the first set of board 1 is taken out, and the stacking rods 14 on both sides of its bottom end are rotated out from inside the hidden groove 12 and distributed perpendicularly to the board 1. Then, the second set of board 1 is taken out, and the stacking rods 14 at the bottom end of the first set of board 1 are engaged into the limiting holes 3 inside the second set of board 1, so that the first set of board 1 and the second set of board 1 are stacked together. Multiple boards 1 can be stacked together for storage according to the actual situation. When needed... When using board 1, take board 1 out and rotate stacking rod 14 to store it inside the hidden slot 12. Then, pass the fixing piece through the limiting hole 3 to install board 1. After board 1 is installed, insert sealing plate 6 into the fixing hole 7 so that sealing plate 6 is engaged with fixing hole 7 through sealing ring 5 to seal and protect fixing hole 7. When board 1 is used, the heat generated by the electronic components installed on it will be conducted out through thermal conductive silicone 9. The heat conducted to thermal conductive silicone 9 is then quickly discharged through heat dissipation fins 10.

[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A ceramic circuit board that is easy to stack in multiple layers, comprising a board body (1), characterized in that: Fixing holes (7) are provided at the four corners inside the plate (1). Limiting holes (3) are provided on both sides inside the plate (1). Hidden grooves (12) are provided on both sides of the bottom end of the plate (1). Stacking rods (14) are hinged to one side inside the hidden grooves (12) via pivots (11). Limiting rings (13) are installed on the outer side walls of the stacking rods (14).

2. The ceramic circuit board according to claim 1, which is convenient for multi-layer stacking, is characterized in that: The limiting holes (3) and the stacking rods (14) are each provided in four sets, and they are all symmetrically distributed about the central axis of the plate (1).

3. A ceramic circuit board that is easy to stack in multiple layers according to claim 1, characterized in that: The length of the stacked rod (14) is less than the length of the hidden groove (12), and the stacked rod (14) and the hidden groove (12) form an engaging structure.

4. A ceramic circuit board that is easy to stack in multiple layers according to claim 1, characterized in that: The stacking rod (14) and the limiting ring (13) are matched with the limiting hole (3), and the stacking rod (14) forms a locking structure through the limiting ring (13) and the limiting hole (3).

5. A ceramic circuit board that is easy to stack in multiple layers according to claim 1, characterized in that: A heat-conducting groove (8) is provided at the bottom of the plate (1), and a heat-conducting silicone (9) is installed at the top of the heat-conducting groove (8), and a heat dissipation fin (10) is installed at the bottom of the heat-conducting silicone (9).

6. A ceramic circuit board that is easy to stack in multiple layers according to claim 5, characterized in that: The heat dissipation fins (10) are provided in a plurality of manner, and the plurality of heat dissipation fins (10) are distributed at equal intervals inside the heat conduction groove (8).

7. A ceramic circuit board that is easy to stack in multiple layers according to claim 6, characterized in that: The top of the plate (1) on one side of the fixing hole (7) is equipped with a rubber connecting strip (2) through the mounting shaft (4). A sealing plate (6) is installed at one end of the rubber connecting strip (2), and a sealing ring (5) is installed on the outer side wall of the sealing plate (6).

8. A ceramic circuit board that is easy to stack in multiple layers according to claim 6, characterized in that: The cross-section of the fixing hole (7) is larger than the cross-section of the sealing plate (6), and the sealing plate (6) forms an engaging structure with the fixing hole (7) through the sealing ring (5).

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