Glass substrate protection structure

By setting anti-crack extension areas in the center and edge protection regions of the glass substrate, and utilizing protective blocks and misalignment design, the problem of inward extension of cracks at the edge of the glass substrate is solved, thereby improving the reliability and durability of the glass substrate.

CN224178367UActive Publication Date: 2026-04-28GUANGZHOU FASTPRINT CIRCUIT TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGZHOU FASTPRINT CIRCUIT TECH CO LTD
Filing Date
2025-05-16
Publication Date
2026-04-28

AI Technical Summary

Technical Problem

Existing glass substrate protection structures cannot effectively prevent edge cracks from extending into the substrate, making glass substrates prone to failure during production and transportation.

Method used

A crack-prevention zone is set between the central protection zone and the edge protection zone of the glass substrate. Multiple protective blocks and a staggered design are used to prevent crack propagation by setting preset block gaps and copper sheet/block structures.

Benefits of technology

This effectively reduces the possibility of crack formation in the glass substrate during transportation and prevents cracks from extending to the circuit design, thereby improving the reliability and durability of the glass substrate.

✦ Generated by Eureka AI based on patent content.

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Abstract

A glass substrate protection structure relates to the technical field of circuit board packaging, and comprises a central protection area used for arranging a first protection layer on a circuit design part of a glass substrate; wherein the circuit design part is an area, for providing mechanical support for electronic elements, of the glass substrate, and the glass substrate further comprises a redundancy design part; the edge protection area is used for arranging a second protection layer on the redundant design part of the glass substrate; and the crack extension prevention area is used for arranging a plurality of protection blocks at the redundant design part, and the crack extension prevention area is arranged between the central protection area and the edge protection area.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board packaging technology, and in particular to a glass substrate protection structure. Background Technology

[0002] In related technologies, glass substrates are a basic material used in the manufacture of circuit boards. They mainly provide a platform for the mechanical support and electrical interconnection of electronic components, ensuring the normal operation of the circuit.

[0003] During the production and transportation of glass substrates, related equipment and carriers may come into contact with the edges of the glass substrates. Since glass substrates are fragile, they are very prone to cracks on the edges, and these cracks can extend into the substrate, causing the entire glass substrate to be scrapped.

[0004] Existing glass substrate protection structures can only improve the impact resistance of the glass substrate, but cannot prevent crack propagation. Therefore, how to design a glass substrate protection structure to prevent edge cracks from extending into the substrate has become an urgent technical problem to be solved. Utility Model Content

[0005] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a constant pressure control module that can prevent edge cracks from extending into the plate.

[0006] The glass substrate protection structure according to an embodiment of the present invention includes:

[0007] A central protection area is used to set a first protective layer on the circuit design portion of the glass substrate; wherein, the circuit design portion is the area of ​​the glass substrate that provides mechanical support for electronic components, and the glass substrate also includes a redundancy design portion;

[0008] An edge protection area is provided for providing a second protective layer in the redundant design portion of the glass substrate;

[0009] A crack-prevention zone is provided for setting multiple protective blocks in the redundant design section, wherein the crack-prevention zone is located between the central protection zone and the edge protection zone.

[0010] According to some embodiments of the present invention, each of the protective blocks is spaced apart by a preset block gap.

[0011] According to some embodiments of the present invention, the glass substrate includes a first substrate surface and a second substrate surface, and the crack prevention region is provided with a plurality of protective blocks on both the first substrate surface and the second substrate surface, wherein the protective blocks on the first substrate surface and the protective blocks on the second substrate surface at mirror positions on the glass substrate are offset from each other.

[0012] According to some embodiments of this utility model, the length and width of the protective block are preset block widths.

[0013] According to some embodiments of the present invention, the misalignment distance between the protective block on the first substrate surface and the protective block on the second substrate surface is a target misalignment value, which is half the sum of the block width and the block gap.

[0014] According to some embodiments of this utility model, the second protective layer is a copper sheet, and the protective block is a copper block.

[0015] According to some embodiments of the present invention, the thickness of the protective block is greater than 18 μm, and the width of the second protective layer in the edge protection area is 5 mm-10 mm.

[0016] According to some embodiments of this utility model, the crack-prevention area is provided with positioning points.

[0017] According to some embodiments of the present invention, the plurality of protective blocks in the anti-crack extension region are arranged in a grid pattern.

[0018] According to some embodiments of the present invention, the second protective layer of the edge protection area includes a thickness portion covering the glass substrate.

[0019] The glass substrate protection structure according to the embodiments of this utility model has at least the following beneficial effects: By setting a second protective layer in the redundant design portion of the glass substrate to form an edge protection area, the impact force on the edge of the glass substrate during transportation is reduced, thereby reducing the possibility of crack formation. Through the crack propagation prevention area, multiple protective blocks are set in the redundant design portion, which can, to a certain extent, prevent the propagation of cracks, thus solving the problem of edge cracks extending into the substrate. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a plan view of a glass substrate protection structure according to an embodiment of the present invention;

[0022] Figure 2 This is an example diagram from the perspective of observing the thickness of the glass substrate protection structure according to an embodiment of this utility model;

[0023] Figure 3 This is another example diagram from the perspective of observing the thickness of the glass substrate protection structure according to an embodiment of this utility model;

[0024] Reference numerals: central protection area 10, first protective layer 101, glass substrate 20, circuit design part 201, redundancy design part 202, edge protection area 30, second protective layer 301, crack propagation prevention area 40, protective block 401, first substrate surface 211, second substrate surface 212. Detailed Implementation

[0025] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0026] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0028] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0029] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0030] In related technologies, glass substrates are a basic material used in the manufacture of circuit boards. They mainly provide a platform for the mechanical support and electrical interconnection of electronic components, ensuring the normal operation of the circuit.

[0031] During the production and transportation of glass substrates, related equipment and carriers may come into contact with the edges of the glass substrates. Since glass substrates are fragile, they are very prone to cracks on the edges, and these cracks can extend into the substrate, causing the entire glass substrate to be scrapped.

[0032] Existing glass substrate protection structures can only improve the impact resistance of the glass substrate, but cannot prevent crack propagation. Therefore, how to design a glass substrate protection structure to prevent edge cracks from extending into the substrate has become an urgent technical problem to be solved.

[0033] This utility model aims to solve at least one of the technical problems existing in the prior art.

[0034] See Figure 1 The glass substrate protection structure according to an embodiment of the present invention includes:

[0035] The central protection area 10 is used to provide a first protective layer 101 on the circuit design portion 201 of the glass substrate 20. The circuit design portion 201 is the area on the glass substrate 20 that provides mechanical support for electronic components. The glass substrate also includes a redundant design portion 202. The circuit design portion 201 is the core part of the glass substrate, while the redundant design portion 202 is generally located on the outer periphery of the circuit design portion. The redundant design portion 202 is a non-critical area on the glass substrate, mainly used for assembling protective structures and does not affect the main circuit functions. The first protective layer can be an insulating material such as polyimide or epoxy resin, covering the surface of the circuit design area to prevent mechanical damage and electrical interference, ensuring the normal operation of electronic components. This protective layer prevents component damage and short circuits in high-performance circuit boards, ensuring stable circuit operation.

[0036] The edge protection area 30 is used to provide a second protective layer 301 in the redundant design portion 202 of the glass substrate 20. The second protective layer 301 is mainly used to protect the edge of the glass substrate 20 to reduce the impact force on the edge of the glass substrate 20 during transportation, thereby reducing the possibility of crack formation.

[0037] The crack propagation prevention region 40 is used to set multiple protection blocks 401 in the redundant design section 201, wherein the crack propagation prevention region 40 is located between the central protection region 10 and the edge protection region 30. The protection blocks 401 can prevent the propagation of cracks to a certain extent, preventing cracks generated at the redundant design section 202 from extending to the circuit design section 201, thereby solving the problem of cracks at the board edge extending into the board.

[0038] In related technologies, since the redundant design portion is a non-critical area on the glass substrate and unrelated to circuit function, there is a lack of protection measures for the redundant design portion. Furthermore, the redundant design portion will eventually be discarded, leaving only the circuit design portion for product design. Therefore, for cost considerations, related technologies only protect the circuit design portion and do not provide protection measures for the redundant design portion.

[0039] However, during the production and transportation of glass substrates, it is inevitable to transport them through redundant design sections. Due to the fragile nature of glass, cracks can easily appear in these redundant design sections, and these cracks can extend to the circuit design sections, rendering the glass substrate unusable. This is especially true for glass substrates with a thickness of less than 0.5 mm.

[0040] In response, this application proposes to set up a crack-prevention area and an edge protection area in the redundant design of the glass substrate. The edge protection area reduces the possibility of cracks in the glass substrate due to impact during transportation, and the crack-prevention area prevents the cracks from extending further to the circuit design when cracks occur in the glass substrate.

[0041] In some embodiments, each protective block is spaced apart by a preset block gap, and a specific width of spacing is left between adjacent protective blocks in the protective structure of the glass substrate 20. This design can control the crack propagation path. When an external force causes a crack to form in the glass substrate 202, the preset block gap can serve as a buffer zone for crack propagation. When a crack encounters a block gap during propagation, its energy is released and dispersed to a certain extent, thereby reducing the possibility of the crack continuing to extend to the next protective block and the circuit design part inside the glass substrate. By reasonably setting the size of the block gap, the direction of the crack can be effectively managed, causing it to stop in the edge protection area or the crack propagation prevention area, avoiding endangering the core circuit part of the glass substrate, thereby improving the reliability and durability of the glass substrate during production, transportation, and use.

[0042] In some embodiments, the length and width of the protective block are preset, i.e., the protective block is square. The specific block width can be accurately calculated and simulated based on various factors such as the thickness of the glass substrate, the stress conditions in the application scenario, and the expected crack characteristics.

[0043] Reference Figure 2In some embodiments, the glass substrate 20 includes a first substrate surface 211 and a second substrate surface 212. The crack-prevention region 40 has multiple protective blocks 401 on both the first substrate surface 211 and the second substrate surface 212. The protective blocks on the first substrate surface and the protective blocks on the second substrate surface at a mirror position on the glass substrate are misaligned. This misalignment means that when viewed from the first substrate surface, the positions of the protective blocks there are not aligned with the corresponding positions when viewed from the second substrate surface. The advantage of this design is that if a crack forms at the gap between the protective blocks on one substrate surface, the crack is unlikely to penetrate to the other substrate surface because the protective blocks at that position on the other substrate surface are not aligned, thus effectively blocking the direct propagation path of the crack. This design increases the resistance to crack propagation, making it more likely that the crack will terminate or change direction around the protective blocks, rather than easily penetrating the entire glass substrate. Simultaneously, this misaligned layout also helps to improve the overall stability and impact resistance of the glass substrate.

[0044] Reference Figure 3 In some embodiments, the misalignment distance between the protective block on the first substrate surface and the protective block on the second substrate surface is a target misalignment value, which is half the sum of the block width and the block gap.

[0045] The misalignment distance between the protective blocks on the first substrate surface and the protective blocks on the second substrate surface is set as the target misalignment value. This target misalignment value is determined by calculating half the sum of the block width and the block gap. This design cleverly balances the misalignment spacing between the protective blocks, ensuring optimal performance in preventing crack propagation. This misalignment arrangement effectively increases the path length and complexity of crack propagation, reducing the likelihood of cracks directly penetrating the entire glass substrate, thereby significantly improving the glass substrate's resistance to crack propagation.

[0046] In some embodiments, the second protective layer is a copper foil, and the protective block is a copper block. In the protective structure of the glass substrate, the protective layer is a copper foil, and the protective block is a copper block. Copper foil has good electrical conductivity, thermal conductivity, and mechanical strength, providing effective mechanical protection and electrical performance for the glass substrate. As the second protective layer, the copper foil can cover the edge area of ​​the glass substrate, forming a robust barrier to resist external physical impacts and friction. The first protective layer can also be protected by copper foil; the excellent conductivity of copper foil helps to achieve electromagnetic shielding, protecting the internal circuitry from external electromagnetic interference. The copper block is used to construct a protective structure to prevent crack propagation. The strength and toughness of the copper block enable it to effectively block crack propagation when subjected to external forces. In the redundant design areas of the glass substrate, these copper blocks are strategically placed to enhance the mechanical properties of the edge areas. When a crack forms at the edge of the glass substrate, the copper block can absorb and disperse the crack's energy, preventing the crack from extending into the internal circuitry design area.

[0047] In some embodiments, the thickness of the protective block is greater than 18 μm, and the width of the second protective layer in the edge protection area is 5 mm-10 mm.

[0048] In some embodiments, the crack propagation prevention area is provided with positioning points. These positioning points play a crucial role in the production, processing, and assembly of the glass substrate. During production, positioning points ensure the precise positioning of various protective structures (such as copper foil and copper blocks) on the glass substrate, guaranteeing that the first protective layer, second protective layer, and protective blocks are accurately laid out according to design requirements, thereby achieving optimal protection. In subsequent processing steps, such as etching, drilling, or other circuit fabrication processes, positioning points provide precise reference positions for equipment, ensuring that processing operations are performed in the correct locations and avoiding structural damage or functional failure that may be caused by positional deviations. In addition, positioning points also help to provide quick and accurate guidance when assembling the glass substrate with other components, improving production efficiency and ensuring the reliability and consistency of the entire circuit board assembly. These positioning points are typically achieved through small holes, markings, or other identification features made at specific locations on the glass substrate. The presence of positioning points makes the entire glass substrate manufacturing and assembly process more orderly and efficient, and is one of the key elements to ensure product quality and performance.

[0049] In some embodiments, the crack-prevention area is a reserved area for contact with the grippers, preventing the grippers from directly contacting the circuit design portion of the glass substrate. This protects the circuit design portion of the glass substrate and prevents gripping marks from being left by the grippers or other equipment. The protective block designed in the crack-prevention area also becomes the gripping part of the grippers.

[0050] In some embodiments, multiple protective blocks in the crack propagation prevention region are arranged in a grid pattern. This grid arrangement ensures that the protective blocks maintain a regular interval in both the horizontal and vertical directions, forming a mesh structure. This arrangement can evenly distribute stress. When external force is applied to the glass substrate, the grid-like protective blocks can effectively disperse the stress in multiple directions, thereby reducing the risk of localized stress concentration and helping to prevent the formation and propagation of cracks, as cracks are more likely to form and propagate at stress concentration points. Simultaneously, the grid arrangement increases the coverage area of ​​the protective structure, ensuring more comprehensive protection for the edges and surfaces of the glass substrate. This arrangement also facilitates automation and standardization in the production process, as robots or robotic arms can place the protective blocks according to a preset grid arrangement pattern, reducing human error and improving production efficiency.

[0051] On the other hand, the processing of glass substrates also includes resin injection, and the shape and distribution of the protective blocks can provide a clear path for resin flow. For example, if the copper blocks are designed with a specific geometry and arranged according to certain rules, they can guide the resin flow, allowing the resin to fill the corners of the glass substrate more evenly and avoiding dead zones or excessive local resin accumulation.

[0052] In some embodiments, the second protective layer in the edge protection region includes a thickness portion covering the glass substrate. This design significantly enhances the mechanical strength and impact resistance of the glass substrate edges. Specifically, the second protective layer not only covers the first and second substrate surfaces of the glass substrate but also extends to the sides, forming all-around protection for the glass substrate edges. This coverage ensures that all parts of the glass substrate are adequately protected, effectively preventing edge damage caused by external impacts or friction. The second protective layer covering the thickness portion is typically made of durable materials, such as copper or special resins. These materials have high hardness and toughness, effectively resisting physical impacts and environmental corrosion. For example, a copper protective layer not only provides good mechanical protection but also enhances electromagnetic shielding to a certain extent, preventing external electromagnetic interference from affecting internal circuits.

[0053] During production, this second protective layer covering the thick portion can be achieved through various processes, such as electroplating, electroless plating, or physical vapor deposition (PVD). These processes allow for precise control of the thickness and uniformity of the second protective layer, ensuring good adhesion between the second protective layer and the glass substrate, further improving the overall structural stability. By covering the thick portion of the glass substrate, the second protective layer in the edge protection area not only improves the mechanical strength and impact resistance of the glass substrate but also optimizes stress distribution, enhances environmental adaptability and electromagnetic shielding performance, thereby significantly improving the reliability and durability of the glass substrate in various application scenarios.

[0054] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0055] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0056] In the embodiments provided in this application, it should be understood that the disclosed structures can be implemented in other ways. For example, the division of the units described above is merely a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units, components, or regions may be combined or integrated into another system, or some features may be ignored or not executed.

[0057] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The above examples are only for the purpose of helping to understand the core idea of ​​this utility model. The above description is only a preferred embodiment of this utility model. It should be noted that due to the limitations of written expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of this utility model, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the concept and technical solution of the utility model to other occasions without modification, should all be considered within the protection scope of this utility model.

Claims

1. A glass substrate protection structure, characterized in that, include: A central protection area is used to set a first protective layer on the circuit design portion of the glass substrate; wherein, the circuit design portion is the area of ​​the glass substrate that provides mechanical support for electronic components, and the glass substrate also includes a redundancy design portion; An edge protection area is provided for providing a second protective layer in the redundant design portion of the glass substrate; A crack-prevention zone is provided for setting multiple protective blocks in the redundant design section, wherein the crack-prevention zone is located between the central protection zone and the edge protection zone.

2. The glass substrate protection structure according to claim 1, characterized in that, Each of the aforementioned protective blocks is spaced apart by a predetermined block gap.

3. The glass substrate protection structure according to claim 2, characterized in that, The glass substrate includes a first substrate surface and a second substrate surface. The crack prevention region is provided with a plurality of protective blocks on both the first substrate surface and the second substrate surface. The protective blocks on the first substrate surface and the protective blocks on the second substrate surface at mirror positions on the glass substrate are offset from each other.

4. The glass substrate protection structure according to claim 3, characterized in that, The length and width of the protective block are preset block widths.

5. The glass substrate protection structure according to claim 4, characterized in that, The misalignment distance between the protective block on the first substrate surface and the protective block on the second substrate surface is a target misalignment value, which is half the sum of the block width and the block gap.

6. The glass substrate protection structure according to claim 1, characterized in that, The second protective layer is a copper sheet, and the protective block is a copper block.

7. The glass substrate protection structure according to claim 1, characterized in that, The thickness of the protective block is greater than 18 μm, and the width of the second protective layer in the edge protection area is 5 mm-10 mm.

8. The glass substrate protection structure according to claim 1, characterized in that, The crack-prevention area is equipped with positioning points.

9. The glass substrate protection structure according to claim 1, characterized in that, The multiple protective blocks in the crack prevention zone are arranged in a grid pattern.

10. The glass substrate protection structure according to claim 1, characterized in that, The second protective layer of the edge protection area includes a thickness portion covering the glass substrate.