Heat dissipation assembly, signal transmission device and electronic equipment

Abstract

The embodiment of the utility model discloses a heat dissipation assembly, a signal transmission device and electronic equipment, and a liquid outlet and a liquid inlet which are communicated with a heat exchange chamber are arranged on a shell part, so that heat exchange liquid can be recycled. Therefore, on one hand, when the heat source device is in contact with the contact area, stable heat conduction between the contact area and the heat source device can be ensured by utilizing elastic deformation generated by the deformation area. When the heat source device is separated from the contact area, the contact area can reset in time under the driving of the deformation area. On the other hand, the height of the shell part is increased through the two supporting columns, assembling of the heat dissipation assembly and the connecting equipment is facilitated, and the heat source device and the contact area can abut against each other conveniently. In addition, the heat exchange chamber is arranged on the shell part, the structure of the heat dissipation assembly can be simplified, and the manufacturing cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation component, a signal transmission device, and an electronic device. Background Technology

[0002] Electronic components in electronic devices generate heat during prolonged use. If this heat cannot be dissipated in time, it will directly affect the operation of the electronic device. Take optical modules as an example. Optical modules are used in data centers, the telecommunications industry, and the Internet of Things (IoT) to enable high-speed signal transmission between electronic devices. If the temperature of the optical module is too high, it will degrade signal transmission performance and reduce its lifespan. Therefore, improving the heat dissipation efficiency of electronic components is a problem that needs to be solved. Utility Model Content

[0003] In view of this, the present invention provides a heat dissipation component, a signal transmission device, and an electronic device, which utilizes a heat-conducting part and a shell to form a heat exchange chamber, thereby simplifying the structure of the heat dissipation component and further improving heat dissipation efficiency.

[0004] According to a first aspect of the present invention, a heat dissipation assembly is provided, the heat dissipation assembly comprising:

[0005] The shell and two support columns, the shell having a heat exchange chamber, and an inlet and an outlet communicating with the heat exchange chamber, the heat exchange chamber being filled with heat exchange fluid;

[0006] A contact area and a deformation area are provided on one side of the shell. When the contact area is configured to contact the heat source device, the deformation area undergoes elastic deformation. Two support columns are provided on both sides of the shell and form a receiving portion with the area between the contact area and the deformation area.

[0007] Furthermore, the shell includes a main body and a heat-conducting plate;

[0008] A groove is formed on the main body, and the groove is located at the receiving portion;

[0009] The heat-conducting sheet is disposed at the receiving portion and forms the heat exchange chamber with the groove; the heat-conducting sheet includes the contact area and the deformation area, and the deformation area is connected between the main body and the contact area.

[0010] Furthermore, the deformation zone has a wavy structure and is arranged around the contact area.

[0011] Furthermore, the heat dissipation assembly also includes a heat exchange section, which is located in the heat exchange chamber and disposed at the contact area;

[0012] The heat exchange section has a degree of freedom of movement in the heat exchange chamber, and the heat exchange section has a heat exchange gap, which is filled with heat exchange fluid.

[0013] Furthermore, the heat exchange section includes a base and a plurality of heat exchange elements. The base abuts against the contact area, and the plurality of heat exchange elements are spaced apart and protrude from the side of the base away from the contact area.

[0014] Furthermore, there are multiple contact areas, multiple heat exchange parts, and multiple heat exchange parts are arranged in a one-to-one correspondence with the multiple contact areas. The multiple heat exchange parts are spaced apart in the heat exchange chamber, and the liquid outlet and the liquid inlet are located on both sides of the multiple heat exchange parts.

[0015] Secondly, this utility model embodiment also provides a signal transmission device, the signal transmission device comprising:

[0016] First connecting part;

[0017] The second connection part includes a heat source device;

[0018] The mounting portion has a receiving cavity, the receiving cavity having a window; and

[0019] A heat dissipation assembly includes a shell and two support columns. The shell has a heat exchange chamber, an inlet and an outlet communicating with the heat exchange chamber. The heat exchange chamber is filled with heat exchange fluid, and the window faces the shell.

[0020] A contact area and a deformation area are provided on one side of the shell. When the contact area is configured to contact a heat source device, the deformation area undergoes elastic deformation. Two support columns are provided on both sides of the shell and form a receiving portion with the area between the contact area and the deformation area.

[0021] The support column and the mounting part are fixedly connected to the first connecting part, and at least part of the mounting part is located in the receiving part; the second connecting part is communicatively connected to the first connecting part.

[0022] The contact area moves away from the receiving cavity, the deformation area undergoes elastic deformation, and the contact area is exposed to the receiving cavity through the window.

[0023] Furthermore, in the free state, the contact area is recessed into the accommodating cavity through the window.

[0024] Furthermore, the accommodating cavity has a insertion interface facing the side of the window;

[0025] The shell includes a main body and a heat-conducting plate. A groove is formed on the main body and the groove is located at the receiving portion. The heat-conducting plate is disposed at the receiving portion and forms the heat exchange chamber with the groove.

[0026] The heat-conducting sheet has a guide area disposed opposite to the insertion interface, and the guide area is connected between the contact area and the deformation area;

[0027] In its free state, the side of the heat-conducting sheet where the guide area connects to the contact area tilts away from the insertion interface.

[0028] Furthermore, the shell includes a main body and a heat-conducting plate. A groove is formed on the main body and the groove is located at the receiving portion. The heat-conducting plate is disposed at the receiving portion and forms the heat exchange chamber with the groove.

[0029] The heat dissipation assembly also includes a thermal pad, one side of which is attached to the thermal pad and the other side is exposed to the accommodating cavity through the window to form the contact area.

[0030] Furthermore, the accommodating cavity has a insertion interface facing the side of the window;

[0031] The edge of the thermal pad has a guide slope, and the guide slope corresponds to the insertion interface and is inclined away from the shell in a direction away from the insertion interface.

[0032] Furthermore, the first connecting portion includes a socket, which is disposed in the receiving cavity;

[0033] The accommodating cavity has an insertion interface and a window, the contact area is correspondingly provided with the window, and the insertion interface is laterally facing the window;

[0034] The heat source device is a plug, which is inserted into the receiving cavity through the plug interface and engaged with the socket, with the side of the plug abutting against the contact area.

[0035] Thirdly, this utility model embodiment also provides an electronic device, the electronic device comprising:

[0036] The signal transmission device described in the second aspect above.

[0037] The heat dissipation assembly, signal transmission device, and electronic device of this utility model embodiment have a liquid outlet and a liquid inlet on the housing that communicate with the heat exchange chamber, facilitating the circulation of the heat exchange fluid. Therefore, on the one hand, when the heat source device comes into contact with the contact area, the elastic deformation generated by the deformation zone ensures stable heat conduction between the contact area and the heat source device. When the heat source device separates from the contact area, the contact area can also promptly reset under the action of the deformation zone. On the other hand, raising the height of the housing using two support columns facilitates the assembly of the heat dissipation assembly with the connecting equipment, making it easier to bring the heat source device and the contact area into contact. Furthermore, placing the heat exchange chamber in the housing simplifies the structure of the heat dissipation assembly and reduces manufacturing costs. Attached Figure Description

[0038] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:

[0039] Figure 1 This is a structural schematic diagram of one side of the signal transmission device according to an embodiment of the present invention;

[0040] Figure 2 This is a schematic diagram of the other side of the signal transmission device according to an embodiment of the present invention;

[0041] Figure 3 This is an exploded view of one side of the signal transmission device according to an embodiment of the present invention;

[0042] Figure 4 This is an exploded view of the other side of the signal transmission device according to an embodiment of the present invention;

[0043] Figure 5 This is an exploded view of another side of the signal transmission device according to an embodiment of the present invention;

[0044] Figure 6 This is a cross-sectional schematic diagram of the heat dissipation device according to an embodiment of the present utility model;

[0045] Figure 7 This is a cross-sectional schematic diagram of the signal transmission device according to some embodiments of the present utility model;

[0046] Figure 8 yes Figure 7 A magnified view of a portion of point B in the middle;

[0047] Figure 9 This is a cross-sectional schematic diagram of the signal transmission device according to an embodiment of the present invention in some other embodiments;

[0048] Figure 10 yes Figure 9 A magnified view of a portion of point C.

[0049] Explanation of reference numerals in the attached figures:

[0050] 1-Heat dissipation components;

[0051] 11-Heat-conducting part; 111-Heat-conducting plate; 1111-Guiding area; 112-Heat-conducting pad; 1121-Guiding slope;

[0052] 12-Shell portion; 121-Groove; 122-Partition plate; 123-Main body; 124-Support column;

[0053] 13-Heat exchange fluid; 14-Contact area; 15-Deformation zone; 16-Heat exchange chamber;

[0054] 17-Heat exchange section; 171-Heat exchange gap; 172-Seat; 173-Heat exchanger; 18-Housing section;

[0055] 2-Installation section;

[0056] 21-Accommodation cavity; 211-Window; 212-Installation interface; 213-Clearing opening;

[0057] 31-liquid outlet; 32-liquid inlet;

[0058] 4-First connecting part;

[0059] 41-Socket; 42-Circuit board;

[0060] 5-Second connecting part;

[0061] 51-Heat source device. Detailed Implementation

[0062] The present invention will now be described based on embodiments, but it is not limited to these embodiments. In the following detailed description of the present invention, certain specific details are described in detail. Those skilled in the art will fully understand the present invention even without these details. To avoid obscuring the essence of the present invention, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0063] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0064] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".

[0065] In the description of this utility model, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0066] Unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0067] For ease of explanation, spatially related terms such as “inside,” “outside,” “below,” “below,” “lower,” “above,” “upper,” etc., are used herein to describe the relationship between one element or feature illustrated in the figure and another. It will be understood that spatially related terms may be intended to encompass different orientations of the device in use or operation besides those depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “below” another element or feature would then be positioned “above” that other element or feature. Thus, the exemplified term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein should be interpreted accordingly.

[0068] Figure 1 and Figure 2 This is a schematic diagram of the signal transmission device in this embodiment.

[0069] In some implementations, such as Figures 1-2 As shown, the signal transmission device in this embodiment includes a heat dissipation device and a first connecting part 4 and a second connecting part 5 disposed on the heat dissipation device. The heat dissipation device includes a heat dissipation assembly 1 and a mounting part 2. The heat dissipation assembly 1 and the mounting part 2 are fixedly connected to the first connecting part 4, and the second connecting part 5 is communicatively connected to the first connecting part 4. The heat dissipation assembly 1 includes a heat-conducting part 11.

[0070] Figure 3 , Figure 4 and Figure 5 This is an exploded schematic diagram of the signal transmission device in this embodiment. Figure 6 This is a cross-sectional schematic diagram of the heat dissipation device in this embodiment.

[0071] In some implementations, such as Figures 3-5As shown, in this embodiment, the mounting portion 2 has a receiving cavity 21. The second connecting portion 5 includes a heat source device 51, and the receiving cavity 21 is used to receive the heat source device 51.

[0072] Optionally, the mounting part 2 is a sheet metal part, which is made by bending or cutting the sheet metal part to make the mounting part 2 easier to process.

[0073] In some implementations, such as Figures 1-6 As shown, the heat dissipation assembly 1 includes a housing 12 and two support pillars 124. The housing 12 has a heat exchange chamber 16, and an inlet 32 ​​and an outlet 31 communicating with the heat exchange chamber 16. The heat exchange chamber 16 is filled with heat exchange fluid 13. A contact area 14 and a deformation area 15 are provided on one side of the housing 12. When the contact area 14 is configured to contact the heat source device 51, the deformation area 15 undergoes elastic deformation. The two support pillars 124 are provided on both sides of the housing 12, and the area between the two support pillars 124 and the contact area 14 and the deformation area 15 forms a receiving portion 18.

[0074] Specifically, the housing 12 also includes a main body 123. Two support pillars 124 are located on both sides of the main body 123 and extend toward the circuit board 42. The receiving portion 18 is located in the area between the two support pillars 124 and the main body 123.

[0075] In this embodiment, the deformation zone 15 enables the shell portion 12 to elastically deform. When the contact area 14 is pushed, the deformation zone 15 deforms itself, causing the contact area 14 to displace. The heat exchange fluid 13 fills the heat exchange chamber 16. The side of the contact area 14 facing away from the heat exchange chamber 16 is exposed to the receiving cavity 21. When the contact area 14 moves away from the receiving cavity 21, the deformation zone 15 elastically deforms, thereby ensuring that the contact area 14 abuts against the heat source device 51. The two support columns 124 can be used to fix the first connecting portion 4, and the receiving portion 18 can be used to receive the mounting portion 2 and the second connecting portion 5.

[0076] In summary, the heat dissipation assembly 1 in this embodiment has an outlet 31 and an inlet 32 ​​on the shell 12 that communicate with the heat exchange chamber 16, so as to facilitate the circulation of the heat exchange fluid 13. Therefore, on the one hand, when the heat source device 51 contacts the contact area 14, the elastic deformation generated by the deformation area 15 ensures stable heat conduction between the contact area 14 and the heat source device 51. When the heat source device 51 separates from the contact area 14, the contact area 14 can also be promptly reset under the action of the deformation area 15. On the other hand, raising the height of the shell 12 using the two support columns 124 facilitates the assembly of the heat dissipation assembly 1 with the connecting equipment, making it easier to bring the heat source device 51 and the contact area 14 into contact. Furthermore, placing the heat exchange chamber 16 in the shell 12 simplifies the structure of the heat dissipation assembly 1 and reduces manufacturing costs.

[0077] Figure 7 and Figure 9 yes Figure 1 Schematic diagram of cross-section at point AA. Figure 8 yes Figure 7 A magnified view of a portion of point B in the middle. Figure 10 yes Figure 9 A magnified view of a portion of point C.

[0078] In some implementations, such as Figures 3-4 and Figures 7-10 As shown, the shell portion 12 includes a main body 123 and a heat-conducting portion 11. The heat-conducting portion 11 includes a heat-conducting plate 111. A groove 121 is formed on the main body 123, and the groove 121 is located at the receiving portion 18. The heat-conducting plate 111 is disposed at the receiving portion 18 and forms a heat exchange chamber 16 with the groove 121. The heat-conducting plate 111 includes a contact area 14 and a deformation area 15, and the deformation area 15 is connected between the main body 123 and the contact area 14.

[0079] Specifically, one side of the heat-conducting plate 111 is covered with a groove 121 to form a heat exchange chamber 16. The receiving cavity 21 has a window 211 facing the shell portion 12, and the contact area 14 is provided corresponding to the window 211.

[0080] Preferably, the shell portion 12 has a connecting surface, and a groove 121 is formed on the connecting surface. The edge of the heat-conducting plate 111 is welded to the connecting surface to ensure the airtightness of the heat exchange chamber 16. In this embodiment, the heat-conducting portion 11 can simultaneously contact the heat source device 51 and the heat exchange fluid 13, thereby optimizing the heat conduction efficiency and improving the heat dissipation effect of the heat dissipation assembly 1.

[0081] In some implementations, such as Figures 3-6 As shown, the heat dissipation assembly 1 also includes a heat exchange section 17, which is located within the heat exchange chamber 16 and disposed at the contact area 14. The heat exchange section 17 has a degree of freedom of movement within the heat exchange chamber 16 and has a heat exchange gap 171, which is filled with heat exchange fluid 13. Specifically, the heat exchange section 17 is located within the heat exchange chamber 16 and disposed on the heat-conducting plate 111.

[0082] In this embodiment, the heat exchange gap 171 increases the heat exchange area between the heat exchange section 17 and the heat exchange liquid 13, allowing the heat on the heat-conducting section 11 to be transferred to the heat exchange liquid 13 more quickly. Furthermore, the volume of the heat exchange section 17 is configured such that when the heat-conducting plate 111 moves the heat exchange section 17 through deformation, collisions between the heat exchange section 17 and the inner wall of the heat exchange chamber 16 are avoided, ensuring that the contact area 14 has sufficient range of motion.

[0083] Optionally, the heat-conducting part 11 and the heat exchange part 17 can be made of materials such as aluminum alloy, copper, or stainless steel. The heat exchange fluid 13 can be a water-based coolant (e.g., ethylene glycol or propylene glycol) or an oil-based coolant (e.g., mineral oil or synthetic oil). This improves the thermal conductivity of the heat dissipation component 1.

[0084] In some implementations, such as Figure 4 As shown, the heat exchange section 17 includes a base 172 and a plurality of heat exchange elements 173. The base 172 abuts against the contact area 14, and the plurality of heat exchange elements 173 are spaced apart and protrude from the side of the base 172 away from the contact area 14. Specifically, the base 172 abuts against the heat-conducting plate 111, and the plurality of heat exchange elements 173 are spaced apart and protrude from the side of the base 172 away from the heat-conducting plate 111.

[0085] In this embodiment, the base 172 is used to connect to the heat-conducting plate 111 and conduct the heat on the heat-conducting plate 111 to the heat exchanger 173. This increases the contact area between the heat exchanger 17 and the heat-conducting plate 111.

[0086] Optionally, the heat exchanger 173 can be a plate-like structure, with multiple heat exchangers 173 arranged at intervals to form fins. The heat exchanger 173 can also be a rod-like structure, with multiple rod-like structures arranged in parallel. The ends of the rod-like structures or fins away from the heat exchanger 173 maintain a predetermined distance from the inner wall of the receiving cavity 21 to prevent the heat exchanger 173 from colliding with the inner wall of the receiving cavity 21.

[0087] In some implementations, such as Figures 5-6 As shown, there are multiple contact areas 14 and multiple heat exchange sections 17, which are arranged one-to-one with the multiple contact areas 14. The multiple heat exchange sections 17 are spaced apart in the heat exchange chamber 16, and the liquid outlet 31 and the liquid inlet 32 ​​are located on both sides of the multiple heat exchange sections 17.

[0088] Specifically, the shell 12 has a liquid outlet 31 and a liquid inlet 32, which are connected to the heat exchange chamber 16. Thus, the heat exchange fluid 13 can flow through each heat exchange section 17, ensuring the consistency of the heat dissipation rate in each contact area 14.

[0089] Optionally, there are multiple accommodating cavities 21, contact areas 14, and heat exchange sections 17, each corresponding to the other. The multiple accommodating cavities 21 are arranged side-by-side and separated by baffles. The liquid outlet 31 and liquid inlet 32 ​​are located on the same side of the multiple heat exchange sections 17, and the multiple heat exchange sections 17 are located in the area between the liquid outlet 31 and the liquid inlet 32. Thus, the multiple heat exchange sections 17 can share the same heat exchange chamber 16, allowing the heat dissipation assembly 1 to simultaneously provide heat dissipation for multiple heat source devices 51. Furthermore, each contact area 14 can move independently, allowing the size of the accommodating cavity 21 to be adjusted according to the size of the corresponding heat source device 51.

[0090] Preferably, such as Figure 6 As shown, a partition 122 is provided on the inner wall of the accommodating cavity 21, and the partition 122 is located between the two heat exchange sections 17. When the heat exchange fluid 13 flows in the heat exchange chamber 16, it will bypass the partition 122. This allows the heat exchange fluid 13 to fully contact the heat exchange gap 171 of each heat exchange section 17 during its flow.

[0091] In some implementations, such as Figures 3-4 As shown, the deformation zone 15 has a corrugated structure. This corrugated structure is arranged around the contact area 14. This allows the deformation zone 15 to move along the thickness direction of the heat-conducting sheet 111.

[0092] In this embodiment, the contact area 14 can contact the heat source device 51 through the window 211. In addition, the area on the heat-conducting sheet 111 located around the contact area 14 can be placed at the edge of the window 211 to ensure the stability of the shape of the heat-conducting sheet 111.

[0093] Optionally, the pressure of the heat exchange fluid 13 in the heat exchange chamber 16 is configured to be within a predetermined range (e.g., 50 kPa-150 kPa) to ensure sufficient flow velocity of the heat exchange fluid 13 within the heat exchange chamber 16. Simultaneously, the pressure of the heat exchange fluid 13 can also exert downward pressure on the contact area 14, ensuring stable contact between the contact area 14 and the heat source device 51, and guaranteeing that the contact area 14 can be promptly reset after the heat source device 51 is removed from the receiving cavity 21.

[0094] In one alternative implementation, such as Figures 1-10 As shown, the heat dissipation component 1 in the above embodiment can be applied to a signal transmission device. The signal transmission device in this embodiment includes a mounting portion 2, a first connecting portion 4, a second connecting portion 5, and a heat dissipation component 1. The heat dissipation component 1 includes a housing portion 12 and two support columns 124. The housing portion 12 has a heat exchange chamber 16, and an inlet 32 ​​and an outlet 31 communicating with the heat exchange chamber 16. The heat exchange chamber 16 is filled with heat exchange fluid 13, and a window 211 faces the housing portion 12. A contact area 14 and a deformation area 15 are provided on one side of the housing portion 12. When the contact area 14 is configured to contact the heat source device 51, the deformation area 15 undergoes elastic deformation. The two support columns 124 are disposed on both sides of the housing portion 12, forming a receiving portion 18 with the area between the contact area 14 and the deformation area 15. The support columns 124 and the mounting portion 2 are fixedly connected to the first connecting portion 4, and at least a portion of the mounting portion 2 is located in the receiving portion 18. The second connecting portion 5 is communicatively connected to the first connecting portion 4.

[0095] When the heat source device 51 is placed in the accommodating cavity 21, it will come into contact with the contact area 14. In this case, the heat source device 51 pushes the contact area 14 to move away from the accommodating cavity 21, causing the deformation area 15 to undergo elastic deformation, and the contact area 14 is exposed to the accommodating cavity 21 through the window 211.

[0096] In summary, the signal transmission device in this embodiment fixes the mounting part 2 to the first connecting part 4, uses the accommodating cavity 21 of the mounting part 2 to accommodate the heat source device 51, and configures the contact area 14 to be exposed to the accommodating cavity 21 through the window 211. Therefore, on the one hand, when the heat source device 51 is placed in the accommodating cavity 21, the heat source device 51 can directly contact the contact area 14, and the elastic deformation generated by the deformation area 15 can ensure stable contact between the contact area 14 and the heat source device 51. When the heat source device 51 is removed from the accommodating cavity 21, the contact area 14 can also be promptly reset under the action of the deformation area 15. On the other hand, raising the height of the shell part 12 using the two support columns 124 facilitates the assembly of the heat dissipation assembly 1 with the first connecting part 4, making it easier to abut the heat source device 51 against the contact area 14 and communicate with the second connecting part 5. Furthermore, placing the heat exchange chamber 16 in the shell part 12 simplifies the structure of the heat dissipation assembly 1 and reduces manufacturing costs.

[0097] In some implementations, such as Figures 7-8 As shown, the contact area 14 is formed on the heat-conducting sheet 111. In the free state, the contact area 14 is recessed into the receiving cavity 21 through the window 211.

[0098] Specifically, in this embodiment, the heat-conducting sheet 111 includes an intermediate sheet for forming the contact area 14. The deformation area 15 has a corrugated structure and is disposed around the intermediate sheet. When the contact area 14 is pushed by the heat source device 51, the corrugated structure contracts and deforms, thereby moving the contact area 14 away from the receiving cavity 21. When the deformation area 15 is in a free state, it is subjected to the downward pressure of the heat exchange fluid 13 and rests on the edge of the window 211.

[0099] In some implementations, such as Figures 5-8 As shown, the accommodating cavity 21 has a insertion interface 212, which faces the window 211 laterally. The orientation of the insertion interface 212 is perpendicular to the orientation of the window 211. The heat-conducting plate 111 has a guide region 1111 opposite to the insertion interface 212, which connects the contact region 14 and the deformation region 15. In its free state, the side of the heat-conducting plate 111 connected to the contact region 14 is inclined away from the insertion interface 212. Preferably, the guide region 1111 is annular, with its inner edge connected to the contact region 14 and its outer edge connected to the deformation region 15.

[0100] In this embodiment, the guide area 1111 serves a guiding function. When the heat source device 51 is inserted into the receiving cavity 21 through the insertion interface 212, the end of the heat source device 51 will contact the guide area 1111, pushing the contact area 14 to gradually rise until the contact area 14 abuts against the side of the heat source device 51. This reduces the friction between the heat source device 51 and the heat-conducting plate 111, preventing the heat source device 51 from being scratched during repeated insertion and removal.

[0101] In some implementations, such as Figures 9-10 As shown, the heat dissipation assembly 1 also includes a thermal pad 112. One side of the thermal pad 112 is attached to the thermal pad 111, and the other side is exposed to the receiving cavity 21 through the window 211 and forms a contact area 14.

[0102] Optionally, in this embodiment, when the deformation zone 15 is in a free state, the middle piece of the heat-conducting sheet 111 and the edge of the heat-conducting sheet 111 are on the same plane. The heat-conducting pad 112 is attached to the middle piece so that the heat-conducting pad 112 can enter the receiving cavity 21 and thus come into contact with the heat source device 51.

[0103] In some implementations, such as Figure 3 and Figures 9-10 As shown, the accommodating cavity 21 has an insertion interface 212, which is lateral to the window 211. The edge of the thermal pad 112 has a guide slope 1121, at least a portion of which corresponds to the insertion interface 212, and the side of the guide slope 1121 away from the shell 12 is inclined in a direction away from the insertion interface 212.

[0104] In this embodiment, the guide ramp 1121 serves a guiding function. When the heat source device 51 is inserted into the receiving cavity 21 through the insertion interface 212, the end of the heat source device 51 will contact the guide ramp 1121, pushing the thermal pad 112 to gradually rise until the side of the heat source device 51 abuts against the thermal pad 112. This reduces the friction between the heat source device 51 and the thermal pad 112, preventing the heat source device 51 from being scratched during repeated insertion and removal.

[0105] In some implementations, such as Figures 1-5 As shown, the first connecting part 4 includes a socket 41, which is disposed in the receiving cavity 21. The receiving cavity 21 has a plug-in interface 212 and a window 211, and the contact area 14 is correspondingly disposed with respect to the window 211. The plug-in interface 212 faces the side of the window 211. The heat source device 51 is a plug, which is inserted into the receiving cavity 21 through the plug-in interface 212 and engages with the socket 41. The side of the plug abuts against the contact area 14. Thus, a detachable connection between the heat source device 51 and the socket 41 is achieved. Furthermore, after each engagement, the heat source device 51 can simultaneously abut against the contact area 14.

[0106] Specifically, the signal transmission device in this embodiment can be used to transmit optical signals or electrical signals. Taking optical signals as an example, the first connecting part 4 and the second connecting part 5 are communicatively connected to form a high-speed connector. This optical transmission module can be applied in data centers, telecommunications, the Internet of Things (IoT), or transportation, among other fields. Figure 3 For example, the signal transmission device includes two OSFP optical modules (Octal Small Form Factor Pluggable).

[0107] Specifically, such as Figure 3 , Figure 4 and Figure 5 As shown, the first connecting part 4 includes a circuit board 42 and a socket 41 disposed on the circuit board 42. The receiving cavity 21 has a clearance opening 213, which faces opposite to the window 211, and the socket 41 enters the receiving cavity 21 through the clearance opening 213. The area between the two support pillars 124 and the main body 123 forms a receiving part 18. This receiving part 18 is a receiving groove. The two support pillars 124 are connected to the circuit board 42 by screws, so that the receiving groove is fastened to the circuit board 42, and the mounting part 2 is located in the receiving groove.

[0108] In an alternative implementation, the signal transmission device can be installed as follows: First, the mounting part 2 is fixed to the circuit board 42, and the socket 41 enters the receiving cavity 21 through the clearance opening 213. Second, the heat exchange part 17 is soldered to one side of the intermediate plate. Next, the heat-conducting plate 111 is soldered to the main body 123, so that the heat-conducting plate 111 covers the groove 121, and the heat exchange part 17 is located inside the heat exchange chamber 16. Third, the two support pillars 124 are fixedly connected to the circuit board 42 with screws, and the intermediate plate can enter the corresponding receiving cavity 21 through the window 211 to form a contact area 14. The mounting part 2 in this step can be used to support the heat-conducting plate 111 and prevent the heat-conducting plate 111 from being recessed downward. Finally, the heat source device 51 is inserted into the receiving cavity 21 through the insertion interface 212 and plugged into the socket 41.

[0109] In another alternative implementation, the signal transmission device can be installed as follows: First, the mounting part 2 is fixed to the circuit board 42, and the socket 41 enters the receiving cavity 21 through the clearance opening 213. Second, the heat exchange part 17 is soldered to one side of the intermediate plate, and the thermal pad 112 is soldered to the other side of the intermediate plate. Next, the thermal pad 111 is soldered to the main body 123, and the thermal pad 111 covers the groove 121, with the heat exchange part 17 located inside the heat exchange chamber 16. Third, the two support pillars 124 are fixedly connected to the circuit board 42 with screws, and the thermal pad 112 can enter the corresponding receiving cavity 21 through the window 211 to form a contact area 14. Finally, the heat source device 51 is inserted into the receiving cavity 21 through the insertion interface 212 and plugged into the socket 41.

[0110] In an alternative implementation, the signal transmission device in the above embodiments can be applied to an electronic device. This electronic device includes, but is not limited to, data centers, telecommunications equipment, IoT devices, or security equipment.

[0111] In summary, the electronic device in this embodiment fixes the mounting part 2 to the first connecting part 4, uses the accommodating cavity 21 of the mounting part 2 to accommodate the heat source device 51, and configures the contact area 14 to be exposed to the accommodating cavity 21 through the window 211. Therefore, on the one hand, when the heat source device 51 is placed in the accommodating cavity 21, the heat source device 51 can directly contact the contact area 14, and the elastic deformation generated by the deformation area 15 can ensure stable contact between the contact area 14 and the heat source device 51. When the heat source device 51 is removed from the accommodating cavity 21, the contact area 14 can also be promptly reset under the action of the deformation area 15. On the other hand, raising the height of the shell part 12 using the two support columns 124 facilitates the assembly of the heat dissipation assembly 1 with the first connecting part 4, making it easier to abut the heat source device 51 against the contact area 14 and communicate with the second connecting part 5. Furthermore, placing the heat exchange chamber 16 in the shell part 12 simplifies the structure of the heat dissipation assembly 1 and reduces manufacturing costs.

[0112] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principle of this utility model should be included within the protection scope of this utility model.

Claims

1. A heat dissipation component, characterized in that, The heat dissipation component includes: The shell (12) and two support columns (124) have a heat exchange chamber (16), and an inlet (32) and an outlet (31) communicating with the heat exchange chamber (16), wherein the heat exchange chamber (16) is filled with heat exchange fluid (13). A contact area (14) and a deformation area (15) are provided on one side of the shell (12). When the contact area (14) is configured to contact the heat source device (51), the deformation area (15) undergoes elastic deformation. Two support columns (124) are provided on both sides of the shell (12) and form a receiving portion (18) with the area between the contact area (14) and the deformation area (15).

2. The heat dissipation assembly according to claim 1, characterized in that, The shell (12) includes a main body (123) and a heat-conducting plate (111); A groove (121) is provided on the main body (123), and the groove (121) is located at the receiving part (18); The heat-conducting plate (111) is disposed at the receiving portion (18) and forms the heat exchange chamber (16) with the groove (121); the heat-conducting plate (111) includes the contact area (14) and the deformation area (15), and the deformation area (15) is connected between the main body (123) and the contact area (14).

3. The heat dissipation assembly according to claim 1, characterized in that, The deformation zone (15) has a wavy structure and is arranged around the contact zone (14).

4. The heat dissipation component according to any one of claims 1-3, characterized in that, The heat dissipation assembly (1) further includes a heat exchange section (17), which is located inside the heat exchange chamber (16) and disposed at the contact area (14); The heat exchange section (17) has a degree of freedom of movement in the heat exchange chamber (16), and the heat exchange section (17) has a heat exchange gap (171), which is filled by the heat exchange fluid (13).

5. The heat dissipation assembly according to claim 4, characterized in that, The heat exchange section (17) includes a base (172) and a plurality of heat exchange elements (173). The base (172) abuts against the contact area (14), and the plurality of heat exchange elements (173) are spaced apart and protrude from the side of the base (172) away from the contact area (14).

6. The heat dissipation assembly according to claim 4, characterized in that, The number of contact areas (14) is multiple, the number of heat exchange parts (17) is multiple and is arranged corresponding to the multiple contact areas (14), the multiple heat exchange parts (17) are spaced apart in the heat exchange chamber (16), and the liquid outlet (31) and the liquid inlet (32) are located on both sides of the multiple heat exchange parts (17).

7. A signal transmission device, characterized in that, The signal transmission device includes: First connecting part (4); The second connecting part (5) includes a heat source device (51); The mounting part (2) has a receiving cavity (21) having a window (211); and The heat dissipation assembly (1) includes a shell (12) and two support columns (124). The shell (12) has a heat exchange chamber (16) and an inlet (32) and an outlet (31) communicating with the heat exchange chamber (16). The heat exchange chamber (16) is filled with heat exchange fluid (13). The window (211) faces the shell (12). A contact area (14) and a deformation area (15) are provided on one side of the shell (12). When the contact area (14) is configured to contact the heat source device (51), the deformation area (15) undergoes elastic deformation. Two support columns (124) are provided on both sides of the shell (12) and form a receiving portion (18) with the area between the contact area (14) and the deformation area (15). The support column (124) and the mounting part (2) are fixedly connected to the first connecting part (4), and at least part of the mounting part (2) is located in the receiving part (18), and the second connecting part (5) is communicatively connected to the first connecting part (4); The contact area (14) moves away from the receiving cavity (21), the deformation area (15) undergoes elastic deformation, and the contact area (14) is exposed to the receiving cavity (21) through the window (211).

8. The signal transmission device according to claim 7, characterized in that, In the free state, the contact area (14) is recessed into the receiving cavity (21) through the window (211).

9. The signal transmission device according to claim 7, characterized in that, The accommodating cavity (21) has a insertion interface (212) which is lateral to the window (211); The shell portion (12) includes a main body (123) and a heat-conducting plate (111). A groove (121) is formed on the main body (123). The groove (121) is located at the receiving portion (18). The heat-conducting plate (111) is disposed at the receiving portion (18) and forms the heat exchange chamber (16) with the groove (121). The heat-conducting sheet (111) has a guide area (1111) disposed opposite to the insertion interface (212), and the guide area (1111) is connected between the contact area (14) and the deformation area (15); In its free state, the side of the heat-conducting plate (111) connected to the contact area (14) is inclined away from the insertion interface (212).

10. The signal transmission device according to claim 7, characterized in that, The shell portion (12) includes a main body (123) and a heat-conducting plate (111). A groove (121) is formed on the main body (123). The groove (121) is located at the receiving portion (18). The heat-conducting plate (111) is disposed at the receiving portion (18) and forms the heat exchange chamber (16) with the groove (121). The heat dissipation assembly (1) further includes a thermal pad (112), one side of which is attached to the thermal pad (111), and the other side is exposed to the accommodating cavity (21) through the window (211) to form the contact area (14).

11. The signal transmission device according to claim 10, characterized in that, The accommodating cavity (21) has a insertion interface (212) which is lateral to the window (211); The edge of the thermal pad (112) has a guide slope (1121), which corresponds to the insertion interface (212) and is inclined away from the shell (12) in a direction away from the insertion interface (212).

12. The signal transmission device according to claim 10, characterized in that, The first connecting part (4) includes a socket (41) disposed in the receiving cavity (21); The accommodating cavity (21) has an insertion interface (212) and a window (211), the contact area (14) is correspondingly provided with the window (211), and the insertion interface (212) is lateral to the window (211); The heat source device (51) is a plug, which is inserted into the receiving cavity (21) through the plug interface (212) and engaged with the socket (41). The side of the plug abuts against the contact area (14).

13. An electronic device, characterized in that, The electronic device includes: The signal transmission device according to any one of claims 7-11.

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