Glue pouring mold of PCBA (Printed Circuit Board Assembly)
By designing a detachable potting mold, the problem of high shape and precision requirements for PCBA board potting molds was solved, which reduced the production cycle and demolding difficulty, and improved the convenience of potting and the safety of electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN BASEUS TECH CO LTD
- Filing Date
- 2025-05-19
- Publication Date
- 2026-05-01
AI Technical Summary
Existing PCBA board potting molds have high requirements for shape and precision, requiring multiple debugging and trial molding, which increases the manufacturing cycle and cost. Furthermore, demolding is difficult and can easily damage electronic components.
A detachable dispensing mold was designed, comprising a first shell and a second shell, which can be assembled to form a cavity before dispensing and separated for demolding after dispensing. This reduces the difficulty of demolding and the structural requirements for the demolding mechanism. The accuracy and convenience of dispensing are improved by setting detachable connections and limiting structures.
It reduces the difficulty of producing and demolding the potting mold, reduces the adhesion between the mold and the PCBA board, reduces the risk of damage to electronic components, and improves the convenience and accuracy of potting.
Smart Images
Figure CN224183524U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of potting mold technology, and more particularly to a potting mold for PCBA boards. Background Technology
[0002] In related technologies, the shape and precision requirements of the potting mold are high when potting adhesive into PCBA boards. Multiple adjustments and trial runs are necessary to fine-tune the mold's parameters and achieve optimal performance. This process requires experienced technicians and may involve repeated modifications and adjustments to the potting mold, increasing the manufacturing cycle and cost. Utility Model Content
[0003] In view of this, the present application aims to provide a potting mold for a PCBA board, which can reduce the manufacturing difficulty of the potting mold and the demolding difficulty of the PCBA board. The potting mold includes a first shell and a second shell; the first shell and the second shell are joined to form an interconnected cavity and an open end, the cavity being used to accommodate the PCBA board;
[0004] The first shell and the second shell are detachably connected.
[0005] In some embodiments, the first shell has a first cavity, the second shell has a second cavity, and the first cavity and the second cavity can communicate to form the cavity.
[0006] In some embodiments, the horizontal projection of the potting mold has four corners; two of the corners are located in the first shell, and the other two corners are located in the second shell.
[0007] In some embodiments, the projection of the potting mold along the horizontal direction has four corners; two of the corners are located in the first shell and the second shell respectively, and the other two corners are formed by splicing the first shell and the second shell.
[0008] In some embodiments, the first shell includes a first side plate and two first end plates connected to both ends of the first side plate, and the second shell includes a second side plate and two second end plates connected to both ends of the second side plate; the first side plate and the second side plate are located on both sides of the PCBA board along a first direction;
[0009] Wherein, the dimension of the glue-pouring mold along the first direction is greater than the dimension along the second direction; the first direction, the second direction, and the up-down direction are perpendicular to each other.
[0010] In some embodiments, the first end plate and / or the second end plate have grooves for separation and demolding from the PCBA board; the PCBA board includes a printed circuit board, the end of which abuts against the groove.
[0011] In some embodiments, one of the first end plates has a length along the second direction that is less than the length along the second direction of the second end plate to which it is connected, and the other of the first end plates has a length along the second direction that is greater than the length along the second direction of the second end plate to which it is connected.
[0012] In some embodiments, the first end plate and the second end plate can respectively abut against both ends of the PCBA board along a first direction; and / or,
[0013] The first side plate and the second side plate can respectively abut against the two ends of the PCBA board along the second direction.
[0014] In some embodiments, the potting mold further includes:
[0015] A filling section is disposed within the cavity to prevent the colloid from flowing to the position of the filling section on the PCBA board.
[0016] In some embodiments, the first shell includes a first side plate and two first end plates connected to both ends of the first side plate, and the second shell includes a second side plate and two second end plates connected to both ends of the second side plate;
[0017] The first shell further includes a bottom plate, and the filling portion is disposed on the bottom plate; the first shell further includes a filling plate disposed relative to the second side plate along a second direction, and the filling portion is located between the filling plate and the second side plate;
[0018] The second side plate has a notch, and the filler plate is located in the notch.
[0019] The PCBA board potting mold provided in this application embodiment allows the first and second shells to separate and demold from the potted PCBA board after potting. This reduces the likelihood of the potting mold sticking to the PCBA board during demolding, thus reducing demolding difficulties and lowering the structural requirements for the demolding mechanism. It also reduces the risk of damaging electronic components during demolding. Furthermore, the detachable design of the first and second shells facilitates potting at the desired locations, simplifying the potting operation and reducing the difficulty of potting. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the structure of the potting mold and PCBA board in one embodiment of this application, wherein the first shell and the second shell have not yet been spliced together;
[0021] Figure 2 This is a schematic diagram of the structure of the potting mold and PCBA board in one embodiment of this application, wherein the first shell and the second shell are spliced together;
[0022] Figure 3This is a schematic diagram of the structure of the potting mold and PCBA board in one embodiment of this application, wherein the second shell is demolded from the PCBA board;
[0023] Figure 4 This is a schematic diagram of the structure of the potting mold and PCBA board in one embodiment of this application, wherein both the first shell and the second shell are demolded from the PCBA board.
[0024] Explanation of reference numerals in the attached figures
[0025] 100. Potting mold; 10. First shell; 11. First side plate; 12. First end plate; 13. Base plate; 14. Filler plate; 20. Second shell; 21. Second side plate; 21a. Notch; 22. Second end plate; 30. Filler part; 101. Parting surface; 100a. Open end; 100c. Groove; X. First direction; Y. Second direction; Z. Up and down direction; 200. PCBA board; 200a. Receiving cavity; 200b. Clearance space; 210. Heat sink; 220. Heat-generating component; 230. Printed circuit board. Detailed Implementation
[0026] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but should not be used to limit the scope of this application.
[0027] It should be noted that in the embodiments of this application, the orientations or positional relationships such as "upper," "lower," and "bottom" are based on the orientations or positional relationships shown in the accompanying drawings. It should be understood that these orientational terms are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this application. The application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0028] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.
[0029] In the embodiments of this application, unless otherwise expressly specified and limited, the first feature "on" the second feature may be in direct contact with the first feature and the second feature, or indirect contact between the first feature and the second feature through an intermediate medium.
[0030] In the description of this specification, references to terms such as "some embodiments," "exemplary," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine the different embodiments or examples described in this application, as well as the features of those different embodiments or examples.
[0031] In related technologies, the shape and precision requirements of the potting mold are high when potting adhesive into PCBA boards. Multiple adjustments and trial runs are necessary to fine-tune the mold's parameters and achieve optimal performance. This process requires experienced technicians and may involve repeated modifications and adjustments to the potting mold, increasing the manufacturing cycle and cost.
[0032] In view of this, the present application provides a potting mold for PCBA boards, which can reduce the production difficulty of the potting mold and the demolding difficulty of the PCBA board.
[0033] Please see Figures 1-4 The potting mold 100 includes a first shell 10 and a second shell 20, which are joined together to form an interconnected cavity and an opening end 100a. The cavity is used to accommodate the PCBA board 200. The first shell 10 and the second shell 20 are detachably connected. This allows the first shell 10 and the second shell 20 to be joined before potting to form the cavity and opening end 100a, and to be separated after potting to demold the PCBA board 200. The PCBA board 200 refers to a printed circuit board assembly, which can be used in charging devices, such as power banks (also called portable power banks), which can be portable, wireless, or wired power banks. Exemplarily, the PCBA board 200 includes a printed circuit board (PCB) and electronic components. Potting effectively prevents air, moisture, and dust from entering the PCBA board 200, reducing the possibility of moisture, corrosion, short circuits, or leakage of the PCB and electronic components, improving heat dissipation performance, and thus extending the service life, durability, and reliability of the PCBA board 200. For example, a dispensing machine can be used to dispense adhesive onto a PCBA board. The PCBA board 200 is placed under the dispensing head of the dispensing machine, and the machine is started. The dispensing adhesive can be selected according to requirements, such as polyurethane potting compound, epoxy resin potting compound, or silicone potting compound.
[0034] For example, after the PCBA board 200 is placed and fixed in the cavity, the adhesive flows into the cavity from the opening end 100a to fill it. After the adhesive is poured and cured by heating, one of the first shell 10 and the second shell 20 is demolded and removed from the PCBA board 200, and the PCBA board 200 after being filled with adhesive is demolded and separated from the other of the first shell 10 and the second shell 20.
[0035] The structure of the first shell 10 and the second shell 20 is not limited and can be designed according to the different potting requirements of the PCBA board 200. The first shell 10 and the second shell 20 are detachably connected. Before potting, the first shell 10 and the second shell 20 can be spliced to form a cavity, surrounding the PCBA board 200 within the cavity. The adhesive is poured into the cavity from the opening end 100a to seal the PCBA board 200. It should be noted that after the first shell 10 and the second shell 20 are spliced, only the opening end 100a on the potting mold 100 can communicate with the outside. That is to say, the spliced part of the first shell 10 and the second shell 20 is a sealed joint to prevent the adhesive from leaking from the splice.
[0036] The potting mold 100 provided in this embodiment allows the first shell 10 and the second shell 20 to separate and demold from the potted PCBA board 200 after potting. This reduces the likelihood of the potting mold 100 sticking to the PCBA board 200 during demolding, thus reducing the structural requirements of the demolding mechanism and lowering the risk of damage to electronic components during demolding. Furthermore, the separability of the first shell 10 and the second shell 20 facilitates potting at the desired location, simplifying the potting operation and reducing the difficulty of potting.
[0037] In some embodiments, the first shell 10 has a first cavity, and the second shell 20 has a second cavity, which can communicate to form a mold cavity. Thus, both the first shell 10 and the second shell 20 can form cavities. Compared to one of them being plate-shaped without a cavity, this reduces the volume of a single cavity, preventing it from becoming too large and causing a large contact area between the cavity-forming part of the first shell 10 and the encapsulated PCBA board 200, which could lead to adhesion. This also facilitates the separation and demolding of the first shell 10 and the second shell 20 from the encapsulated PCBA board 200 after encapsulation, reducing demolding difficulty.
[0038] In other embodiments not shown, the first shell 10 has a first cavity, and the second shell 20 is plate-shaped, with the second shell 20 spliced onto the first shell 10 to form a cavity. Alternatively, the second shell 20 has a second cavity, and the first shell 10 is plate-shaped, with the first shell 10 spliced onto the second shell 20 to form a cavity.
[0039] For example, please refer to Figure 1The overall outline of the glue-pouring mold 100 is close to a cuboid. After the first shell 10 and the second shell 20 are spliced together, the horizontal projection of the glue-pouring mold 100 has four corners. The splicing position of the first shell 10 and the second shell 20 can be located at a corner or at other positions.
[0040] For example, the horizontal projection of the dispensing mold 100 has four corners; two of these corners are located in the first shell 10, and the other two corners are located in the second shell 20. A corner refers to an angle formed by the dispensing mold 100 in the horizontal direction, which can be a right angle, an acute angle, or an obtuse angle. This facilitates the setting of the mating surfaces at the joint position of the first shell 10 and the second shell 20, reducing the processing difficulty in meeting the sealing requirements at the joint position of the first shell 10 and the second shell 20. In another embodiment (not shown), the horizontal projection of the dispensing mold 100 has four corners; two of these corners are located in the first shell 10 and the second shell 20 respectively, and the other two corners are formed by the joint of the first shell 10 and the second shell 20.
[0041] In some embodiments, please refer to Figure 1 The first shell 10 includes a first side plate 11 and two first end plates 12 connected to both ends of the first side plate 11. The second shell 20 includes a second side plate 21 and two second end plates 22 connected to both ends of the second side plate 21. The first side plate 11 and the second side plate 21 are located on both sides of the PCBA board 200 along the first direction X. The size of the potting mold 100 along the first direction X is larger than the size along the second direction Y. The first direction X and the second direction Y are perpendicular. For example, the first direction X, the second direction Y, and the vertical direction Z are all perpendicular to each other. In this way, the two sets of first end plates 12 and second end plates 22 can be sealed together to prevent glue leakage.
[0042] For example, one of the first end plates 12 has a length along the second direction Y that is less than the length along the second direction Y of the second end plate 22 to which it is connected, while the other first end plate 12 has a length along the second direction Y that is greater than the length along the second direction Y of the second end plate 22 to which it is connected. Thus, the first end plate 12 and the second end plate 22 are joined near a corner. When the PCBA board 200 is separated from the potting mold 100, the relatively shorter first end plate 12 and the second end plate 22 have a smaller contact area with the potting mold 100, resulting in a relatively lower degree of adhesion. This facilitates the application of force to separate at least one of the relatively shorter first end plate 12 and the second end plate 22 from the PCBA board 200 first, reducing the difficulty of demolding.
[0043] For example, please refer to Figure 1The first end plate 12 has a groove 100c, and the PCBA board 200 includes a printed circuit board 230, the end of which abuts against the groove 100c. This facilitates the separation and demolding of the PCBA board 200 from the potting mold 100. The printed circuit board 230 is arranged along the first direction X along its length.
[0044] For example, the first shell 10 and the second shell 20 have a parting surface 101, which refers to the portion of the first shell 10 and the second shell 20 that can contact the PCBA board 200 after they are joined together. For example, please refer to [link to example]. Figure 1 The first end plate 12 has a parting surface 101. A groove 100c is provided on the parting surface 101. In some other embodiments not shown, the second end plate 22 has a groove 100c, and the PCBA board 200 includes a printed circuit board 230, the end of which abuts against the groove 100c.
[0045] In other embodiments not shown, the first end plate 12 and the second end plate 22 have a groove 100c, and the PCBA board 200 includes a printed circuit board 230, the end of which abuts against the groove 100c.
[0046] In some embodiments, the first end plate 12 and the second end plate 22 can respectively abut against both ends of the PCBA board 200 along the first direction X. In this way, after the first shell 10 and the second shell 20 are spliced, the first end plate 12 and the second end plate 22 can limit the two ends of the PCBA board 200 along the first direction X, which can reduce the possibility of the PCBA board 200 shaking relative to the potting mold 100 during potting and improve the accuracy of the potting position.
[0047] In some embodiments, the first side plate 11 and the second side plate 21 can respectively abut against both ends of the PCBA board 200 along the second direction Y. In this way, after the first shell 10 and the second shell 20 are spliced, the first side plate 11 and the second side plate 21 can limit the two ends of the PCBA board 200 along the first direction X, which can reduce the possibility of the PCBA board 200 shaking relative to the potting mold 100 during potting and improve the accuracy of the potting position.
[0048] For example, please refer to Figure 1 The PCBA board has heat sinks 210 on both sides along the first direction X, and the two heat sinks 210 abut against the first side plate 11 and the second side plate 21 respectively.
[0049] In some embodiments, the first end plate 12 and the second end plate 22 can respectively abut against the two ends of the PCBA board 200 along the first direction X; and the first side plate 11 and the second side plate 21 can respectively abut against the two ends of the PCBA board 200 along the second direction Y. In this way, the potting mold 100 can play a limiting role around the PCBA board 200, further reducing the possibility of the PCBA board 200 shaking relative to the potting mold 100 during potting, and improving the accuracy of the potting position.
[0050] In some embodiments, please refer to Figure 1 The potting mold 100 also includes a filling part 30, disposed within the cavity, to prevent the adhesive from flowing to the position on the PCBA board 200 corresponding to the filling part 30. By providing the filling part 30, areas on the PCBA board 200 that do not require potting can be avoided during potting, ensuring that no adhesive enters the PCBA board 200 at the position corresponding to the filling part 30 after potting. Specifically, the filling part 30 can be specifically positioned at the desired potting locations on the PCBA board 200 according to the specific potting requirements of different PCBA boards 200.
[0051] In some embodiments, please refer to Figure 1 The first shell 10 also includes a bottom plate 13, and a filling portion 30 is disposed on the bottom plate 13; the first shell 10 also includes a filling plate 14 disposed relative to the second side plate 21 along the second direction Y, and the filling portion 30 is located between the filling plate 14 and the second side plate 21; the second side plate 21 has a notch 21a, and the filling plate 14 is located in the notch 21a. The first end plate 12 and the second end plate 22 can be sealed together, and the second side plate 21 and the filling plate 14 can be sealed together to prevent colloid leakage.
[0052] The base plate 13 is located at the other end of the dispensing mold 100 along the vertical direction Z opposite the opening end 100a. When dispensing adhesive from the opening end 100a, the base plate 13 can prevent the adhesive from leaking from the bottom. At the same time, the base plate 13 can also support the filling part 30.
[0053] By setting corresponding filler plates 14 and notches 21a, the joint position of the first shell 10 and the second shell 20 is at least partially located on the filler plate 14, which can reduce the difficulty of demolding and reduce the possibility of colloid leakage.
[0054] For example, the top surface of the filler plate 14 and the top surface of the filler portion 30 are at the same height along the vertical direction Z.
[0055] For example, PCBA board 200 has an extension, and filler board 14 and filler 30 are spaced apart to avoid the extension, and the extension can be inserted between filler board 14 and filler 30.
[0056] For example, the PCBA board 200 has a receiving cavity 200a, and the electronic component can be a heat-generating element 220. The heat-generating element 220 is located within the receiving cavity 200a, and before potting, there is a clearance space 200b above the heat-generating element 220 within the receiving cavity 200a. It should be noted that the heat-generating element 220 refers to a component that is prone to generating heat during use, rather than a component used to generate heat. For example, an inductor can stabilize the current and improve the current stability of the power bank during charging and discharging. Thus, after potting, a larger amount of potting compound is applied to the area above the heat-generating element 220, which can improve the heat dissipation effect on the heat-generating element 220.
[0057] For example, the PCBA board 200 includes an outer frame with a receiving cavity 200a, in which electronic components are at least partially located.
[0058] For example, the PCBA board 200 includes a connection interface for connecting the printed circuit board 230 to an external device. The connection interface can be a USB interface, a Micro-USB interface, a Type-C interface, etc. For example, the connection interface is located at the open end 100a, and a clearance opening is formed between the connection interface and the frame, through which the adhesive can be poured in.
[0059] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.
Claims
1. A potting mold for PCBA boards, characterized in that, The potting mold includes a first shell and a second shell; the first shell and the second shell are joined together to form an interconnected cavity and an open end, the cavity being used to accommodate the PCBA board; The first shell and the second shell are detachably connected.
2. The dispensing mold according to claim 1, characterized in that, The first shell has a first cavity, and the second shell has a second cavity, and the first cavity and the second cavity can communicate to form the cavity.
3. The mold of claim 2, wherein, The horizontal projection of the potting mold has four corners; two of the corners are located in the first shell, and the other two corners are located in the second shell.
4. The potting mold according to claim 2, wherein The projection of the glue-pouring mold along the horizontal direction has four corners; two of the corners are located in the first shell and the second shell respectively, and the other two corners are formed by splicing the first shell and the second shell.
5. The potting mold of claim 1, wherein, The first shell includes a first side plate and two first end plates connected to both ends of the first side plate; the second shell includes a second side plate and two second end plates connected to both ends of the second side plate; the first side plate and the second side plate are located on both sides of the PCBA board along a first direction; Wherein, the dimension of the dispensing mold along the first direction is greater than the dimension along the second direction; the first direction and the second direction are perpendicular.
6. The mold of claim 5, wherein, The first end plate and / or the second end plate have a groove, and the PCBA board includes a printed circuit board, the end of which abuts against the groove.
7. The mold of claim 5, wherein, One of the first end plates has a length along the second direction that is less than the length along the second direction of the second end plate to which it is connected, and the other of the first end plates has a length along the second direction that is greater than the length along the second direction of the second end plate to which it is connected.
8. The mold of claim 5, wherein, The first end plate and the second end plate can respectively abut against both ends of the PCBA board along a first direction; and / or, The first side plate and the second side plate can respectively abut against the two ends of the PCBA board along the second direction.
9. The potting mold according to claim 1, characterized in that, The dispensing mold also includes: A filling section is disposed within the cavity to prevent the colloid from flowing to the position of the filling section on the PCBA board.
10. The potting mold according to claim 9, wherein The first shell includes a first side plate and two first end plates connected to both ends of the first side plate; the second shell includes a second side plate and two second end plates connected to both ends of the second side plate. The first shell further includes a bottom plate, and the filling portion is disposed on the bottom plate; the first shell further includes a filling plate disposed relative to the second side plate along a second direction, and the filling portion is located between the filling plate and the second side plate; The second side plate has a notch, and the filler plate is located in the notch.