Refrigerator

Abstract

The refrigerator comprises a freezing inner container, a low-temperature box and a low-temperature refrigerating system, a freezing chamber is defined by the freezing inner container, the freezing inner container is provided with an air outlet, an air return opening, a first air return channel and a second air return channel, and the first air return channel communicates with the freezing chamber through the air outlet and the air return opening; the second air return duct communicates with the freezing chamber and the first air return duct. The low-temperature box is contained in the freezing chamber, a low-temperature chamber is defined by the low-temperature box, and the low-temperature chamber is independent of the freezing chamber; the low-temperature refrigeration system comprises a semiconductor refrigeration sheet, the semiconductor refrigeration sheet is contained in the second air return duct, and the cold end of the semiconductor refrigeration sheet is in hot connection with the low-temperature box and used for providing cold energy for the low-temperature chamber. According to the refrigerator, the stability of the temperature of the freezing chamber can be ensured on the basis that the requirement for ultralow-temperature storage is met, so that the requirements of users are met.

Description

refrigerator Technical Field

[0001] This utility model belongs to the technical field of ultra-low temperature refrigeration for refrigerators, and in particular relates to a refrigerator. Background Technology

[0002] Currently, the temperature in the freezer compartment of a regular refrigerator is typically -18°C, which is insufficient for storing special foods such as ultra-low temperature tuna. To address this, some refrigerators use thermoelectric coolers to provide cooling for the ultra-low temperature zone and utilize the cooling capacity of the freezer compartment to dissipate heat from the hot end of the thermoelectric cooler. However, this heat dissipation process from the hot end of the thermoelectric cooler can disrupt the temperature in the freezer compartment, causing the actual temperature to deviate from the set value and affecting the stability of the freezer's cooling performance. This systemic temperature deviation not only reduces the temperature control accuracy of the freezer compartment but may also affect the storage performance of other foods within the freezer. Therefore, designing a refrigerator that balances ultra-low temperature requirements with freezer compartment temperature stability is crucial. Summary of the Invention

[0003] In view of this, it is necessary to provide a refrigerator for solving the above-mentioned technical problems.

[0004] A refrigerator, comprising:

[0005] The freezer inner liner is enclosed to form a freezer compartment. The freezer inner liner has an air outlet, an air return outlet, a first air return duct, and a second air return duct. The first air return duct is connected to the freezer compartment through the air outlet and the air return outlet. The second air return duct is connected to both the freezer compartment and the first air return duct.

[0006] A low-temperature chamber is housed within the freezer room, the low-temperature chamber enclosing and forming a low-temperature chamber, the low-temperature chamber being independent of the freezer room;

[0007] The cryogenic refrigeration system includes a thermoelectric cooler housing within a second return air duct. The cold end of the thermoelectric cooler is thermally connected to the cryogenic chamber to provide cooling to the cryogenic compartment.

[0008] It is understandable that the ultra-low temperature of the low-temperature compartment of the refrigerator is achieved by using the cold end of the thermoelectric cooler. During this process, the heat dissipation of the hot end of the thermoelectric cooler is separated from the freezer compartment by a second return air duct. This allows the refrigerator to ensure the temperature stability of the freezer compartment while meeting the ultra-low temperature storage requirements, thus satisfying the user's needs.

[0009] In one embodiment, the first return air duct and the second return air duct are separated by a partition.

[0010] Understandably, the first and second return air ducts are separated by the same partition, which simplifies the structure required for the formation of the first and second return air ducts in the freezer liner and reduces costs.

[0011] In one embodiment, the low-temperature chamber includes a low-temperature chamber body, which encloses the low-temperature compartment.

[0012] The cryogenic refrigeration system also includes a heat-conducting plate, which is attached to the cold end and thermally connected to the cryogenic chamber and the cold end respectively.

[0013] It is understandable that a heat-conducting plate is used to achieve the thermal connection between the cold end of the thermoelectric cooler and the cryogenic chamber. This ensures that the cold energy of the cold end of the thermoelectric cooler can be efficiently and quickly transferred to the cryogenic chamber, thereby maintaining a stable cryogenic storage environment in the cryogenic chamber.

[0014] In one embodiment, the low-temperature chamber includes a first liner that encloses the low-temperature compartment; and the heat-conducting plate abuts against the first liner at one end away from the cold end.

[0015] The cryogenic refrigeration system further includes a cover plate, which is partially housed within the cryogenic chamber, and the heat-conducting plate is connected and fixed to the first liner through the cover plate.

[0016] It is understandable that using a cover plate to connect and fix the first inner liner and the heat-conducting plate ensures that the heat-conducting plate is in close contact with the first inner liner, thereby facilitating the sequential transfer of cold energy at the cold end of the thermoelectric cooler.

[0017] In one embodiment, the low-temperature chamber includes a first inner liner, a first outer shell, and a front frame. The first outer shell is disposed on the periphery of the first inner liner and connected to the first inner liner through the front frame. A first insulation layer is filled between the first outer shell and the first inner liner.

[0018] The first inner liner is made of thermally conductive metal, and the front frame is made of plastic.

[0019] It is understandable that the above-mentioned structural design enables the first liner to quickly transfer cold energy and prevents the cold energy from leaking out of the low-temperature chamber.

[0020] In one embodiment, the cryogenic refrigeration system further includes a radiator and a cooling fan, both of which are housed within the second return air duct.

[0021] Furthermore, the heat sink is attached to the hot end of the semiconductor cooling chip and thermally connected to the hot end, and the cooling fan is mounted on the heat sink to drive the air in the second return air duct to flow into the first return air duct.

[0022] It is understandable that by using a cooling fan to draw air from the heat sink, the hot end of the thermoelectric cooler can be quickly cooled to meet the cooling requirements of the cold end of the thermoelectric cooler and achieve the ultra-low temperature operation of the low-temperature chamber in the cryogenic chamber.

[0023] In one embodiment, the cryogenic refrigeration system further includes a temperature sensor disposed in the cryogenic chamber for detecting the ambient temperature of the cryogenic chamber and generating a feedback signal;

[0024] The feedback signal is used to control the operation of the semiconductor cooling chip and the cooling fan, respectively.

[0025] It is understandable that using a temperature sensor to measure the temperature of the low-temperature chamber to control the operation of the thermoelectric cooler and cooling fan allows the thermoelectric cooler and cooling fan to operate at different power levels under different ambient temperatures in the low-temperature chamber, thus extending the service life of the thermoelectric cooler and cooling fan.

[0026] In one embodiment, the low-temperature chamber forms a first predetermined gap between itself and the inner peripheral wall of the freezing liner in the height direction of the refrigerator; and the low-temperature chamber forms a second predetermined gap between itself and the inner peripheral wall of the freezing liner in the width direction of the refrigerator.

[0027] Understandably, the above structural design allows for air circulation from the freezing chamber around the perimeter of the low-temperature chamber, resulting in a more uniform temperature around the chamber.

[0028] In one embodiment, the cryogenic chamber includes a cryogenic chamber body and a cryogenic chamber door, the cryogenic chamber door being hinged to the cryogenic chamber body and used to control the opening / closing of the cryogenic compartment;

[0029] The low-temperature chamber door includes a second inner liner, a second outer shell, a connecting door frame, and a sealing strip. The second inner liner is installed inside the second outer shell and connected to the second outer shell through the connecting door frame. A second insulation layer is filled between the second inner liner and the second outer shell. The sealing strip is installed on the connecting door frame for sealing against the low-temperature chamber.

[0030] The second lining is made of thermally conductive metal, and the connecting door frame is made of plastic.

[0031] It is understandable that the above-mentioned structural design allows the cold air inside the low-temperature chamber to leak out through the opening of the low-temperature chamber.

[0032] In one embodiment, the refrigerator further includes a freezer evaporator housed within the first return air duct;

[0033] Furthermore, the air in the second return air duct can flow towards the refrigeration evaporator.

[0034] It is understandable that the above-mentioned structural design allows the heat dissipated by the semiconductor cooling chip to be used for defrosting of the evaporator, thereby reducing temperature fluctuations in the freezing compartment and low-temperature compartment caused by the electro-defrosting of the evaporator.

[0035] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0036] The refrigerator claimed in this application uses the cooling capacity provided by the cold end of a thermoelectric cooler to achieve ultra-low temperatures in the low-temperature compartment of the low-temperature chamber. During this process, a second return air duct separates the heat dissipation from the hot end of the thermoelectric cooler from the freezer compartment, so that the refrigerator can ensure the temperature stability of the freezer compartment while meeting the ultra-low temperature storage requirements, thus satisfying the user's needs. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 is a partial cross-sectional view of the refrigerator provided in this application.

[0039] Figure 2 is an enlarged view of part A in Figure 1.

[0040] Figure 3 is an enlarged view of part B in Figure 1.

[0041] Figure reference numerals: 100, refrigerator; 10, freezer liner; 101, freezer compartment; 11, air outlet; 12, return air inlet; 13, first return air duct; 14, second return air duct; 141, baffle plate; 110, partition; 111, vent; 120, inner peripheral wall; 130, air guide hood; 20, low-temperature chamber; 201, low-temperature compartment; 21, low-temperature chamber body; 211, first liner; 212, first... 213. Outer shell; 22. Front frame; 22. Low-temperature chamber door; 221. Second inner liner; 222. Second outer shell; 223. Connecting door frame; 224. Sealing strip; 225. Second insulation layer; 30. Low-temperature refrigeration system; 31. Semiconductor refrigeration chip; 311. Cold end; 312. Hot end; 32. Heat conduction plate; 33. Cover plate; 331. Hook; 34. Radiator; 35. Cooling fan; 40. Freezing evaporator. Detailed Implementation

[0042] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] It should be noted that when a component is said to be "located on" another component, it can be directly located on the other component or may have an intervening component. When a component is considered to be "located on" another component, it can be directly located on the other component or may have an intervening component. When a component is considered to be "fixed to" another component, it can be directly fixed to the other component or may have an intervening component.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0045] As shown in Figures 1 to 3, the refrigerator 100 provided in this application includes a freezer inner liner 10, a low-temperature chamber 20, and a low-temperature refrigeration system 30. The freezer inner liner 10 encloses a freezer compartment 101 and has an air outlet 11, a return air outlet 12, a first return air duct 13, and a second return air duct 14. The first return air duct 13 is connected to the freezer compartment 101 through the air outlet 11 and the return air outlet 12. The second return air duct 14 is connected to both the freezer compartment 101 and the first return air duct 13. The low-temperature chamber 20 is housed within the freezer compartment 101 and encloses a low-temperature compartment 201, which is independent of the freezer compartment 101. The low-temperature refrigeration system 30 includes a semiconductor cooling chip 31, which is housed within the second return air duct 14. The cold end 311 of the semiconductor cooling chip 31 is thermally connected to the low-temperature chamber 20 to provide cooling to the low-temperature compartment 201. Here, the temperature of the low-temperature chamber 201 is an ultra-low temperature, lower than that of the freezing chamber 101. It should be noted that the specific structure of the aforementioned semiconductor cooling chip 31 and how the semiconductor cooling chip 31 works to provide cooling to the cold end 311 can be achieved using existing conventional methods, and will not be elaborated here.

[0046] As can be seen from the above, the refrigerator 100 of this application uses the cooling capacity provided by the cold end 311 of the semiconductor cooling chip 31 to achieve the ultra-low temperature of the low temperature compartment 201 of the low temperature box 20. During this process, the heat dissipation to the hot end 312 of the semiconductor cooling chip 31 is separated from the freezer compartment 101 by the second return air duct 14, so that the refrigerator 100 can ensure the temperature stability of the freezer compartment 101 while meeting the ultra-low temperature storage requirements, so as to meet the user's needs.

[0047] As shown in Figure 2, in one embodiment, the first return air duct 13 and the second return air duct 14 are separated by a partition 110. Specifically, the partition 110 can be installed and fixed inside the freezer liner 10. That is, in this embodiment, the freezer liner 10 uses the same partition 110 to separate the first return air duct 13 and the second return air duct 14. This simplifies the structure required for forming the first return air duct 13 and the second return air duct 14 in the freezer liner 10, thus reducing costs. Here, the second return air duct 14 can be formed by the partition 110, the low-temperature chamber 20, and the baffle 141 installed on the low-temperature chamber 20.

[0048] As shown in Figure 1, in one embodiment, the freezer inner liner 10 is equipped with an air guide hood 130 inside the freezer compartment 101. The air guide hood 130 is located at the return air inlet 12, and air inside the freezer compartment 101 can be guided into the return air inlet 12 through the air guide hood 130 to achieve air return. Here, the air guide hood 130 is located on the air inlet side of the second return air duct 14.

[0049] As shown in Figures 1 and 2, in one embodiment, the low-temperature chamber 20 forms a first predetermined gap between itself and the inner peripheral wall 120 of the freezing liner 10 in the height direction of the refrigerator 100; and a second predetermined gap between itself and the inner peripheral wall 120 of the freezing liner 10 in the width direction of the refrigerator 100. In other words, the low-temperature chamber 20 has air circulation through the freezing compartment 101 around its periphery, which makes the temperature around the low-temperature chamber 20 more uniform.

[0050] As shown in Figures 1 and 3, in one embodiment, the cryogenic chamber 20 includes a cryogenic chamber body 21 and a cryogenic chamber door 22. The cryogenic chamber body 21 encloses a cryogenic chamber 201, and the cryogenic chamber door 22 is hinged to the cryogenic chamber body 21 to control the opening / closing of the cryogenic chamber 201. Here, the cryogenic chamber door 22 and the cryogenic chamber body 21 can be hinged together by a hinge (not shown).

[0051] As shown in Figure 3, in this embodiment, the cryogenic chamber 21 includes a first inner liner 211, a first outer shell 212, and a front frame 213. The first outer shell 212 is disposed on the periphery of the first inner liner 211 and connected to the first inner liner 211 through the front frame 213. A first insulation layer (not shown) is filled between the first outer shell 212 and the first inner liner 211. The first inner liner 211 is made of thermally conductive metal, and the front frame 213 is made of plastic. This allows the cryogenic chamber 21 of this embodiment to rapidly transfer the cold energy transmitted to the cold end 311 of the semiconductor refrigeration chip 31 using the first inner liner 211, and prevents the cold energy within the cryogenic chamber 201 from becoming skewed using the first insulation layer and the plastic front frame 213. Specifically, the material of the first inner liner 211 can be stainless steel, aluminum plate, or other alloy materials.

[0052] As shown in Figure 3, in this embodiment, the cryogenic chamber door 22 includes a second inner liner 221, a second outer shell 222, a connecting door frame 223, and a sealing strip 224. The second inner liner 221 is installed inside the second outer shell 222 and connected to the second outer shell 222 via the connecting door frame 223. A second insulation layer 225 fills the space between the second inner liner 221 and the second outer shell 222. The sealing strip 224 is installed on the connecting door frame 223 for sealing against the cryogenic chamber 21. The second inner liner 221 is made of thermally conductive metal, and the connecting door frame 223 is made of plastic. This prevents cold air from leaking out of the cryogenic chamber 201 through its opening. Specifically, the material of the second inner liner 221 can be stainless steel, aluminum, or other alloy materials.

[0053] As shown in Figure 2, in one embodiment, the cryogenic refrigeration system 30 further includes a heat-conducting plate 32, which is attached to the cold end 311 and thermally connected to both the cryogenic chamber 21 and the cold end 311. In other words, the cryogenic refrigeration system 30 of this embodiment uses the heat-conducting plate 32 to achieve thermal connection between the cold end 311 of the thermoelectric cooler 31 and the cryogenic chamber 21. This ensures that the cooling energy of the cold end 311 of the thermoelectric cooler 31 can be efficiently and quickly transferred to the cryogenic chamber 201, thereby maintaining a stable cryogenic storage environment in the cryogenic chamber 201. Here, the heat-conducting plate 32 is insulated with thermal insulation material.

[0054] As shown in Figure 2, in this embodiment, the end face of the heat-conducting plate 32 away from the cold end 311 is attached to the first inner liner 211. Specifically, the heat-conducting plate 32 passes through the first outer shell 212 of the low-temperature chamber 21 and is attached to the first inner liner 211. The low-temperature refrigeration system 30 also includes a cover plate 33, which is partially housed in the low-temperature chamber 201. The heat-conducting plate 32 and the first inner liner 211 are connected and fixed through the cover plate 33, which ensures that the heat-conducting plate 32 and the first inner liner 211 are in close contact, thereby facilitating the sequential transfer of cold energy from the cold end 311 of the semiconductor refrigeration chip 31. Here, the cover plate 33 is attached to the first inner liner 211 and is connected and fixed to the heat-conducting plate 32 through the hooks 331 on the cover plate 33. Specifically, the cover plate 33 can be configured as a metal plate.

[0055] As shown in Figures 1 and 2, in one embodiment, the cryogenic refrigeration system 30 further includes a heat sink 34 and a cooling fan 35, both housed within a second return air duct 14. The heat sink 34 is attached to and thermally connected to the hot end 312 of the thermoelectric cooler 31. The cooling fan 35 is mounted on the heat sink 34 to drive air within the second return air duct 14 towards the first return air duct 13. In other words, this embodiment utilizes the cooling fan 35 to draw air from the heat sink 34, achieving rapid heat dissipation from the hot end 312 of the thermoelectric cooler 31, thereby meeting the cooling requirements of the cold end 311 of the thermoelectric cooler 31 to achieve the ultra-low temperature operation of the cryogenic chamber 201 in the cryogenic chamber 20.

[0056] In one embodiment, the cryogenic refrigeration system 30 further includes a temperature sensor (not shown), which is disposed within the cryogenic chamber 201 to detect the ambient temperature of the cryogenic chamber 201 and generate a feedback signal. The feedback signal is used to control the operation of the thermoelectric cooler 31 and the cooling fan 35. This allows the thermoelectric cooler 31 and the cooling fan 35 to operate at different power levels under different ambient temperatures in the cryogenic chamber 201, thereby extending the service life of the thermoelectric cooler 31 and the cooling fan 35.

[0057] As shown in Figures 1 and 2, in one embodiment, the refrigerator 100 also includes a freezer evaporator 40, which is housed within a first return air duct 13. Furthermore, air in the second return air duct 14 can flow towards the freezer evaporator 40. Specifically, a vent 111 facing the freezer evaporator 40 can be opened on a partition 110 used to separate the first return air duct 13 and the second return air duct 14. When the low-temperature refrigeration system 30 is working, the cooling fan 35 can guide the air in the second return air duct 14 to blow towards the freezer evaporator 40, so that the heat dissipated by the semiconductor cooling chip 31 can be used for defrosting the freezer evaporator 40. This can reduce temperature fluctuations in the freezer compartment 101 and the low-temperature compartment 201 caused by the electric defrosting of the freezer evaporator 40.

[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present utility model and are not intended to limit the present utility model. Any appropriate changes and variations made to the above embodiments within the scope of the essential spirit of the present utility model shall fall within the scope of protection claimed by the present utility model.

Claims

1. A refrigerator, characterized in that, The refrigerator (100) includes: a freezer liner (10) enclosing a freezer compartment (101), the freezer liner (10) having an air outlet (11), an air return outlet (12), a first air return duct (13), and a second air return duct (14), the first air return duct (13) being connected to the freezer compartment (101) through the air outlet (11) and the air return outlet (12), and the second air return duct (14) being connected to the freezer compartment (101) and the first air return duct (13) respectively; low temperature The low-temperature box (20) is housed in the freezer compartment (101). The low-temperature box (20) encloses a low-temperature compartment (201), which is set independently of the freezer compartment (101). The low-temperature refrigeration system (30) includes a semiconductor refrigeration chip (31), which is housed in the second return air duct (14). The cold end (311) of the semiconductor refrigeration chip (31) is thermally connected to the low-temperature box (20) to provide cooling to the low-temperature compartment (201).

2. The refrigerator according to claim 1, characterized in that, The first return air duct (13) and the second return air duct (14) are separated by a partition (110).

3. The refrigerator according to claim 1, characterized in that, The low-temperature chamber (20) includes a low-temperature chamber body (21), which encloses the low-temperature compartment (201); wherein, the low-temperature refrigeration system (30) further includes a heat-conducting plate (32), which is attached to the cold end (311) and thermally connected to the low-temperature chamber body (21) and the cold end (311) respectively.

4. The refrigerator according to claim 3, characterized in that, The low-temperature chamber (21) includes a first liner (211), which encloses the low-temperature chamber (201); and the end face of the heat-conducting plate (32) away from the cold end (311) is attached to the first liner (211); wherein, the low-temperature refrigeration system (30) also includes a cover plate (33), which is partially housed in the low-temperature chamber (201), and the heat-conducting plate (32) and the first liner (211) are connected and fixed through the cover plate (33).

5. The refrigerator according to claim 3, characterized in that, The low-temperature chamber (21) includes a first inner liner (211), a first outer shell (212), and a front frame (213). The first outer shell (212) is disposed on the periphery of the first inner liner (211) and connected to the first inner liner (211) through the front frame (213). A first insulation layer is filled between the first outer shell (212) and the first inner liner (211). The material of the first inner liner (211) is configured as thermally conductive metal, and the material of the front frame (213) is configured as plastic.

6. The refrigerator according to claim 1, characterized in that, The cryogenic refrigeration system (30) further includes a radiator (34) and a cooling fan (35), both of which are housed within the second return air duct (14). The radiator (34) is attached to the hot end (312) of the semiconductor cooling chip (31) and is thermally connected to the hot end (312). The cooling fan (35) is mounted on the radiator (34) and is used to drive the air in the second return air duct (14) to flow into the first return air duct (13).

7. The refrigerator according to claim 6, characterized in that, The cryogenic refrigeration system (30) also includes a temperature sensor, which is located in the cryogenic chamber (201) and is used to detect the ambient temperature of the cryogenic chamber (201) and generate a feedback signal. The feedback signal is used to control the operation of the semiconductor cooling chip (31) and the cooling fan (35) respectively.

8. The refrigerator according to claim 1, characterized in that, The low-temperature box (20) forms a first preset gap between the refrigerator (100) in the height direction and the inner peripheral wall (120) of the freezing inner liner (10); and the low-temperature box (20) forms a second preset gap between the refrigerator (100) in the width direction and the inner peripheral wall (120) of the freezing inner liner (10).

9. The refrigerator according to claim 1, characterized in that, The low-temperature chamber (20) includes a low-temperature chamber body (21) and a low-temperature chamber door (22). The low-temperature chamber door (22) is hinged to the low-temperature chamber body (21) and is used to control the opening / closing of the low-temperature chamber (201). The low-temperature chamber door (22) includes a second inner liner (221), a second outer shell (222), a connecting door frame (223), and a sealing strip (224). The second inner liner (221) is installed inside the second outer shell (222) and connected to the second outer shell (222) through the connecting door frame (223). A second insulation layer (225) is filled between the second inner liner (221) and the second outer shell (222). The sealing strip (224) is installed on the connecting door frame (223) and is used to abut and seal against the low-temperature chamber body (21). The material of the second inner liner (221) is configured as thermally conductive metal, and the material of the connecting door frame (223) is configured as plastic.

10. The refrigerator according to claim 1, characterized in that, The refrigerator (100) also includes a freeze evaporator (40), which is housed in the first return air duct (13); and air in the second return air duct (14) can flow to the freeze evaporator (40).

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