Device for detecting surface flatness of semiconductor by using laser

Abstract

The utility model relates to the technical field of surface flatness detection, in particular to a device for detecting the surface flatness of a semiconductor by using laser, which comprises a main body, and the top of the main body is fixedly connected with a laser emitting assembly, a rotary lifting assembly and a control assembly; by utilizing a high-precision laser detection technology, the device has extremely high resolution and precision and can detect tiny surface defects and unevenness, non-contact measurement avoids possible damage to the surface of a sample caused by contact measurement, the integrity of the sample is ensured, the laser scanning speed is high, and the detection precision is high. The surface of a large-area sample can be detected in a short time, the equipment can automatically scan, collect and analyze data, errors caused by manual operation are reduced, and the detection efficiency and reliability are improved.

Description

Technical Field

[0001] This utility model relates to the field of surface flatness detection technology, specifically a device for detecting the surface flatness of semiconductors using laser. Background Technology

[0002] The inspection equipment for the CMP polishing unit flattener is specifically designed to inspect the surface flatness and related parameters of wafers during the CMP process. It utilizes various inspection technologies to monitor the wafer surface condition in real time during polishing, ensuring that the wafer achieves the required nanometer-level flatness and surface quality.

[0003] Traditional detection methods include contact probe methods and optical microscopy. However, contact probe methods require the probe to directly contact the sample surface during detection. For soft or fragile samples, the probe may cause scratches or damage to the sample surface, and the measurement speed is relatively slow, making it difficult to quickly complete the detection of large areas. The resolution of optical microscopy is limited by the size and focal length of the optical lens, and can usually only reach about 0.2 micrometers, making it impossible to observe finer surface structures. For large objects that require high-resolution observation, the visible area of ​​optical microscopes is small. Therefore, a device that uses lasers to detect the flatness of semiconductor surfaces is needed to improve the above problems. Utility Model Content

[0004] Traditional detection methods include contact probe methods and optical microscopy. However, contact probe methods require the probe to directly contact the sample surface, which can scratch or damage soft or fragile samples. Furthermore, the measurement speed is slow, making it difficult to quickly complete large-area inspections. Optical microscopy, on the other hand, has resolution limited by the size and focal length of the optical lens, typically reaching only about 0.2 micrometers, making it impossible to observe finer surface structures. For large objects requiring high-resolution observation, the visible area of ​​an optical microscope is small. The purpose of this invention is to provide a device for detecting the flatness of semiconductor surfaces using laser technology, thereby solving the problems mentioned in the background.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A device for detecting the flatness of a semiconductor surface using laser includes a main body, on the top of which a laser emitting component, a rotation and lifting component, and a control component are fixedly connected.

[0007] The main body includes a support frame, a top plate is fixedly connected to the top of the support frame, and a focusing lens and a reflecting mirror are fixedly connected to the top of the top plate;

[0008] The laser emitting assembly includes a slide groove, a first telescopic rod is mounted on the side of the slide groove, the output end of the first telescopic rod is fixedly connected to a mounting base, and a laser emitting assembly is installed inside the mounting base;

[0009] The rotating lifting assembly includes a protective box, inside which a motor is installed. The output end of the motor is fixedly connected to a second telescopic rod, and the output end of the second telescopic rod is fixedly connected to a detection placement plate.

[0010] The control component includes a control box, inside which a circuit board is fixedly connected, and on the side of the circuit board are a signal processing module, an amplification module, a filtering module, and an analog-to-digital conversion module.

[0011] In a preferred embodiment of this utility model, the mounting base is disposed inside the slide groove, and the mounting base slides inside the slide groove.

[0012] In a preferred embodiment of this invention, the signal processing module, amplification module, filtering module, and analog-to-digital conversion module are all electrically connected.

[0013] As a preferred embodiment of this utility model, a working indicator light is fixedly connected to the side of the control box, and a switch is provided on the side of the control box.

[0014] As a preferred embodiment of this utility model, a display screen is fixedly connected to the side of the control box, and physical buttons are provided on the side of the control box, with a plurality of physical buttons provided.

[0015] As a preferred embodiment of this utility model, the laser emission integration includes a laser emitter and a photodetector, wherein the laser emitter emits an ammonia-neon laser.

[0016] As a preferred embodiment of this utility model, the support frame is composed of high-strength aluminum alloy.

[0017] As a preferred embodiment of this utility model, the bottom of the support frame is fixedly connected with four feet.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] 1. In this utility model, by utilizing high-precision laser detection technology, which has extremely high resolution and accuracy, it can detect minute surface defects and unevenness. Non-contact measurement avoids the damage to the sample surface that may be caused by contact measurement, ensuring the integrity of the sample. The laser scanning speed is fast, and it can complete the detection of a large area of ​​sample surface in a short time. The equipment can automatically perform scanning, data acquisition and analysis, reducing human error and improving detection efficiency and reliability.

[0020] 2. In this utility model, a photodetector is used to receive the laser intensity information reflected from the sample surface and convert it into an electrical signal. An amplification module, a filtering module, and an analog-to-digital conversion module are used to amplify, filter, and convert the electrical signal output by the photodetector to extract the feature parameters related to the surface flatness. Then, based on the feature parameters extracted by the signal processing module, the flatness data of the sample surface is calculated using an algorithm. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the laser emitting component structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the rotating lifting component structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the control component structure of this utility model.

[0025] In the diagram: 1. Main body; 101. Support frame; 102. Foot; 103. Top plate; 104. Focusing lens; 105. Reflector; 2. Laser emitting assembly; 201. Slide rail; 202. First telescopic rod; 203. Mounting base; 204. Laser emitting integration; 3. Rotation and lifting assembly; 301. Protective box; 302. Motor; 303. Second telescopic rod; 304. Detection placement plate; 4. Control assembly; 401. Control box; 402. Circuit board; 403. Signal processing module; 404. Amplification module; 405. Filtering module; 406. Analog-to-digital conversion module; 407. Display screen; 408. Working indicator light; 409. Switch; 410. Physical button. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0027] For examples, please refer to Figures 1-4 This utility model provides a technical solution:

[0028] A device for detecting the flatness of a semiconductor surface using laser includes a main body 1, with a laser emitting component 2, a rotation and lifting component 3, and a control component 4 fixedly connected to the top of the main body 1.

[0029] In this embodiment, as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the main body 1 includes a support frame 101, a top plate 103 fixedly connected to the top of the support frame 101, a focusing lens 104 and a reflector 105 fixedly connected to the top of the top plate 103, a laser emitting assembly 2 includes a slide 201, a first telescopic rod 202 mounted on the side of the slide 201, a mounting base 203 fixedly connected to the output end of the first telescopic rod 202, a laser emitting assembly 204 installed inside the mounting base 203, a rotating lifting assembly 3 includes a protective box 301, a motor 302 installed inside the protective box 301, a second telescopic rod 303 fixedly connected to the output end of the motor 302, a detection placement plate 304 fixedly connected to the output end of the second telescopic rod 303, and a control assembly 4. The system includes a control box 401, inside which a circuit board 402 is fixedly connected. The side of the circuit board 402 is fixedly connected to a signal processing module 403, an amplification module 404, a filtering module 405, and an analog-to-digital conversion module 406. Utilizing high-precision laser detection technology, it boasts extremely high resolution and accuracy, capable of detecting minute surface defects and unevenness. Non-contact measurement avoids potential damage to the sample surface caused by contact measurement, ensuring sample integrity. The laser scanning speed is fast, enabling the detection of large-area sample surfaces in a short time. The equipment can automatically scan, acquire data, and analyze data, reducing human error and improving detection efficiency and reliability.

[0030] In this embodiment, as Figure 1 , Figure 3 and Figure 4As shown, the mounting base 203 is disposed inside the slide groove 201 and slides within the slide groove 201. The signal processing module 403, amplification module 404, filtering module 405, and analog-to-digital conversion module 406 are all electrically connected. A working indicator light 408 is fixedly connected to the side of the control box 401. A switch 409 is provided on the side of the control box 401. A display screen 407 is fixedly connected to the side of the control box 401. Several physical buttons 410 are provided on the side of the control box 401. The laser emission integration 204 includes a laser emitter and a photodetector. The laser emitter emits... The laser emitted is an ammonia-neon laser. The support frame 101 is made of high-strength aluminum alloy. The bottom of the support frame 101 is fixedly connected to four feet 102. A photodetector is used to receive the laser intensity information reflected from the sample surface and convert it into an electrical signal. The amplification module 404, the filtering module 405, and the analog-to-digital conversion module 406 are used to amplify, filter, and convert the electrical signal output by the photodetector to extract the feature parameters related to the surface flatness. Then, based on the feature parameters extracted by the signal processing module 403, the flatness data of the sample surface is calculated using an algorithm.

[0031] The working process of this utility model is as follows: When the device designed in this scheme for detecting the flatness of semiconductor surfaces using laser is in operation, the laser beam emitted by the laser emitting integrated circuit 204 is focused by the focusing lens 104 and the reflecting mirror 105 and then irradiates the sample surface. When the sample surface is flat, the intensity and distribution of the reflected light are relatively uniform. However, when there are defects or unevenness on the surface, the intensity and distribution of the reflected light will change. The photodetector receives the reflected light and converts it into an electrical signal. The signal processing module 403 processes the electrical signal and extracts the characteristic parameters related to the surface flatness. The data processing and analysis unit calculates the flatness data of the sample surface using an algorithm based on these characteristic parameters and displays it on the display screen 407. At the same time, the data is stored in the memory. The extension and retraction of the first telescopic rod 202 pushes the laser emitting integrated circuit 204 to slide in the slide groove 201, and the motor 302 and the second telescopic rod 303 are used to lift and rotate the sample, thereby realizing the comprehensive detection of the entire surface.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device for detecting the flatness of a semiconductor surface using laser, comprising a main body (1), characterized in that: The top of the main body (1) is fixedly connected to a laser emitting component (2), a rotating lifting component (3), and a control component (4); The main body (1) includes a support frame (101), a top plate (103) is fixedly connected to the top of the support frame (101), and a focusing lens (104) and a reflecting mirror (105) are fixedly connected to the top of the top plate (103). The laser emitting assembly (2) includes a slide (201), a first telescopic rod (202) is installed on the side of the slide (201), the output end of the first telescopic rod (202) is fixedly connected to a mounting base (203), and a laser emitting assembly (204) is installed inside the mounting base (203); The rotating lifting assembly (3) includes a protective box (301), inside which a motor (302) is installed. The output end of the motor (302) is fixedly connected to a second telescopic rod (303), and the output end of the second telescopic rod (303) is fixedly connected to a detection placement plate (304). The control component (4) includes a control box (401), a circuit board (402) is fixedly connected inside the control box (401), and a signal processing module (403), an amplification module (404), a filtering module (405) and an analog-to-digital conversion module (406) are fixedly connected to the side of the circuit board (402).

2. The apparatus for detecting flatness of a semiconductor surface using a laser according to claim 1, wherein: The mounting base (203) is disposed inside the slide groove (201) and slides inside the slide groove (201).

3. The device for detecting the surface flatness of a semiconductor using laser according to claim 1, characterized in that: The signal processing module (403), amplification module (404), filtering module (405) and analog-to-digital conversion module (406) are all electrically connected.

4. The apparatus for detecting flatness of a semiconductor surface using a laser according to claim 1, wherein: A working indicator light (408) is fixedly connected to the side of the control box (401), and a switch (409) is provided on the side of the control box (401).

5. The apparatus for detecting flatness of a semiconductor surface using a laser according to claim 1, wherein: A display screen (407) is fixedly connected to the side of the control box (401), and physical buttons (410) are provided on the side of the control box (401), with several physical buttons (410).

6. The device for detecting the surface flatness of a semiconductor using laser according to claim 1, characterized in that: The laser emission assembly (204) includes a laser emitter and a photodetector, wherein the laser emitter emits an ammonia-neon laser.

7. The apparatus for detecting flatness of a semiconductor surface using a laser according to claim 1, wherein: The support frame (101) is made of high-strength aluminum alloy.

8. The apparatus for detecting flatness of a semiconductor surface using a laser according to claim 1, wherein: The bottom of the support frame (101) is fixedly connected to a foot (102), and four feet (102) are provided.

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