Circuit board structure with positioning assembly component

Abstract

The utility model relates to the technical field of electronic parts, in particular to a circuit board structure with a positioning assembly component, which comprises a circuit board body, the circuit board body is provided with at least two flat welding spots arranged at intervals, each flat welding spot can be correspondingly connected with a lead component, and the circuit board body is provided with a limiting component on one side of the flat welding spots. When the wire assembly is placed on the flat welding spot of the circuit board body to be subjected to a flat welding process, the limiting assembly is arranged on one side, located on the flat welding spot, of the circuit board body to prevent the wire assembly on the outer side from moving towards the two sides, so that the end part of the wire assembly can be always aligned with the flat welding spot, and the insertion operation of a wire and an insertion hole does not need to be carried out; the problems of poor welding, unstable electrical performance and the like caused by damage of the end of the wire are greatly reduced, the limiting assembly can prevent the wire assembly from moving towards the two sides, it is guaranteed that the end of the wire assembly is accurately aligned with a flat welding spot, the welding quality can be guaranteed through the accurate welding position, and the yield of products is further improved.

Description

Technical Field

[0001] This utility model relates to the technical field of electronic components, specifically to a circuit board structure with positioning and assembly components. Background Technology

[0002] In the manufacturing and development of modern electronic devices, circuit boards, as one of the core components, play an important role in connecting various electronic components and realizing the transmission of electrical signals. The design and manufacturing process of circuit board structure have a crucial impact on the performance, stability and production efficiency of electronic devices.

[0003] Currently, the circuit board structure used for water level detection (usually a reed switch circuit board or Hall switch circuit board, etc.) mostly uses soldering technology to connect the circuit board and the wires. In traditional circuit board structures, when soldering to the wires, special insertion holes are usually set on the circuit board. The specific operation process is to first insert the end of the wire into the corresponding insertion hole on the circuit board, and then solder the two together to ensure a stable and reliable electrical connection between the circuit board and the wires.

[0004] However, this connection method has obvious drawbacks. In actual production, due to the precise dimensions of the wire end and the connector hole, and the limited operating space, it is difficult for operators to ensure that the wire end is accurately inserted into the connector hole every time. If the wire end is not properly aligned with the connector hole, the circuit board can easily bend the wire end during insertion. Bending the wire end not only affects the subsequent soldering quality, leading to problems such as weak soldering and cold solder joints, but may also alter the electrical properties of the wire, thus affecting the normal operation of the entire electronic device. More seriously, these problems caused by bending the wire end can result in a large number of defective products, increasing production costs, reducing production efficiency, and adversely affecting the company's economic benefits and market competitiveness.

[0005] This utility model was proposed in response to the shortcomings of the existing technology. Utility Model Content

[0006] When soldering existing circuit board structures and wires as mentioned above, the usual method is to set up insertion holes on the circuit board, insert the circuit board structure and the ends of the wires, and then perform the soldering action. However, if the ends of the wires are not properly aligned with the insertion holes, the ends of the wires can easily be bent by the circuit board, leading to technical problems such as defective products.

[0007] The technical solution adopted by this utility model to solve its technical problem is:

[0008] A circuit board structure with positioning assembly components includes a circuit board body, on which at least two spaced flat solder joints are provided, each of which can be connected to a wire assembly. The circuit board body is provided with a limiting component on one side of the flat solder joint to prevent the two wire assemblies from moving to the sides.

[0009] As described above, in the circuit board structure with positioning assembly components, the limiting component includes two spaced-apart limiting protrusions, with a limiting space between the two limiting protrusions for two wire assemblies to enter.

[0010] In the circuit board structure with positioning assembly components as described above, the thickness of each of the limiting bumps is the same as the thickness of the circuit board body.

[0011] As described above, the circuit board structure with positioning assembly components has a flat soldering part on the circuit board body that corresponds one-to-one with the flat soldering point. The flat soldering part has a flat soldering surface, and the flat soldering point is located at the soldering surface.

[0012] As described above, in the circuit board structure with positioning assembly components, the flat solder joint is provided with a through hole that penetrates the circuit board body and the flat solder joint.

[0013] As described above, the circuit board structure with positioning assembly components further includes a protective layer on the circuit board body, the protective layer including a connection protection portion capable of covering the connection points of all wire components and flat solder joints.

[0014] As described above, in the circuit board structure with positioning assembly components, the protective layer further includes a connection reinforcement portion capable of covering the limiting component and part of the wire assembly.

[0015] In the circuit board structure with positioning assembly components as described above, the protective layer is a UV-curable adhesive, hot melt adhesive, yellow glue, or 704 curable adhesive.

[0016] As described above, the circuit board structure with positioning assembly components includes a functional part and a soldering part. Functional components are assembled on the functional part, and the flat solder joints are located on the soldering part.

[0017] As described above, in the circuit board structure with positioning assembly components, the functional components include reed switches or Hall switches.

[0018] The beneficial effects of this utility model are as follows:

[0019] 1. This utility model relates to the technical field of electronic components and includes a circuit board body with at least two spaced flat solder joints. Each flat solder joint can be connected to a wire assembly. A limiting component is provided on one side of the circuit board body at the flat solder joint. When the wire assembly is placed on the flat solder joint of the circuit board body for the flat soldering process, the limiting component is located on the side of the circuit board body at the flat solder joint to prevent the outer wire assembly from moving to both sides. This ensures that the end of the wire assembly is always aligned with the flat solder joint, eliminating the need for wire insertion into the connector. This greatly reduces problems such as poor soldering and unstable electrical performance caused by damage to the wire end. Furthermore, the limiting component prevents the wire assembly from moving to both sides, ensuring that the end of the wire assembly is accurately aligned with the flat solder joint. Accurate soldering position ensures soldering quality and further improves the product yield.

[0020] 2. The limiting component can prevent the wire assembly from moving to both sides, ensuring that the end of the wire assembly is accurately aligned with the flat solder point. The flat soldering method saves the process of connecting the wire to the circuit board body, reduces the number of operation steps in the production process, and operators do not need to spend a lot of time aligning the wire end and the plug hole, thereby improving the production speed.

[0021] 3. The protective layer can cover all the connections between the conductor components and the solder joints, effectively isolating the connection between the conductor components and the solder joints from the influence of external physical stress, preventing damage to the connection between the solder joints and the conductor components due to external pressure or bending, and also preventing damage or short circuits at the connection between the conductor components and the solder joints (i.e., solder joints) due to oxidation, aging, moisture, etc., thereby improving the overall reliability of the circuit board.

[0022] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0023] Figure 1 This is one of the schematic diagrams of the circuit board structure of this utility model;

[0024] Figure 2 This is the second schematic diagram of the circuit board structure of this utility model (after assembly with the wire assembly).

[0025] Figure 3 This is the third schematic diagram of the circuit board structure of this utility model (with a transparent protective layer).

[0026] Figure 4 The fourth schematic diagram of the circuit board structure of this utility model (with an opaque protective layer). Detailed Implementation

[0027] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0028] like Figures 1 to 4 As shown, the circuit board structure with positioning assembly components in this embodiment includes a circuit board body 1. The circuit board body 1 is provided with at least two spaced flat solder joints 11. Each of the flat solder joints 11 can be connected to a wire assembly 2. The circuit board body 1 is provided with a limiting component 3 on one side of the flat solder joint 11 to prevent the two wire assemblies 2 from moving to both sides.

[0029] Specifically, this embodiment adopts a flat soldering method. During flat soldering, the wire assembly 2 does not need to be inserted into a specific plug hole, but is placed directly on the flat soldering point 11 of the circuit board body 1. Heat is provided by the soldering equipment to melt the solder and firmly connect the wire assembly 2 to the flat soldering point 11 to achieve electrical conduction. This method avoids the process of inserting the end of the wire into the plug hole, thus eliminating the risk of the end of the wire being bent by the circuit board due to difficulty in positioning during the insertion process.

[0030] Furthermore, when the wire assembly 2 is placed on the flat solder joint 11 of the circuit board body 1 in preparation for the flat soldering process, due to the elasticity of the wire assembly 2 itself, the two wire assemblies 2 on the outside will tend to move to the sides during placement or when subjected to slight external disturbances. The limiting component 3 is set on the side of the circuit board body 1 located at the flat solder joint 11. It acts like a "barrier" to prevent the outer wire assembly 2 from moving to the sides, so that the ends of the wire assembly 2 can always be aligned with the flat solder joint 11, creating favorable conditions for the subsequent smooth soldering process.

[0031] By adopting a flat soldering method, there is no need to insert the wires into the sockets. This effectively solves the problem of the circuit board being bent due to misalignment between the wire ends and the sockets in the existing technology. As long as the wire ends are not bent, the electrical performance of the wires can be guaranteed to remain unaffected. This greatly reduces problems such as poor soldering and unstable electrical performance caused by damage to the wire ends, thereby improving the product yield.

[0032] Furthermore, the limiting component 3 can prevent the wire assembly 2 from moving to both sides, ensuring that the end of the wire assembly 2 is accurately aligned with the flat solder joint 11. The accurate welding position can guarantee the welding quality, reduce the occurrence of welding defects such as false soldering and spurious soldering, and further improve the product yield.

[0033] Furthermore, the flat soldering method saves the step of connecting the wires to the circuit board body 1, reduces the number of operation steps in the production process, and eliminates the need for operators to spend a lot of time aligning the wire ends and the insertion holes, thereby increasing the production speed.

[0034] As the product yield rate increases, the number of defective products generated during the production process decreases. Consequently, the time and cost of inspecting, reworking, or scrapping defective products are reduced, making the entire production process smoother and improving production efficiency.

[0035] This reduces defective products caused by bending the ends of the wires, reduces waste of raw materials, and thus lowers material costs.

[0036] Saving steps and increasing production efficiency means that more products can be produced in the same amount of time, or that fewer labor hours are required to produce the same quantity of products, thereby reducing labor costs.

[0037] Accurate soldering positions and good soldering quality ensure a stable and reliable electrical connection between the conductor assembly 2 and the circuit board body 1. A stable electrical connection reduces the occurrence of electrical faults, improves product stability and reliability, and enhances overall product performance and market competitiveness.

[0038] like Figures 1 to 4 As shown, the limiting component 3 in this embodiment includes two spaced limiting protrusions 31, and there is a limiting space 32 between the two limiting protrusions 31 for the two wire assemblies 2 to enter.

[0039] When the operator places the wire assembly 2 onto the circuit board body 1 in preparation for the flat soldering process, part of the wire assembly 2 is placed into the limiting space 32 formed by two spaced-apart limiting protrusions 31. Because the wire assembly 2 is elastic, during placement or when subjected to minor external forces, the two outer wire assemblies 2 may tend to move laterally. At this time, the inner walls of the two limiting protrusions 31 block this lateral movement, confining the wire assembly 2 within the limiting space 32. This ensures that the ends of the wire assemblies 2 are always aligned with the flat solder points 11 on the circuit board body 1, providing a stable positional basis for subsequent soldering operations.

[0040] Preferably, the limiting component 3 consists of only two spaced-apart limiting protrusions 31. This structural design is very simple and does not require complex mechanical structures or electronic components. During manufacturing, it is relatively easy to implement using common processes such as mold injection and machining, greatly reducing manufacturing difficulty and production costs. At the same time, the simple structure also reduces the number of parts, lowering maintenance and replacement costs.

[0041] Furthermore, the limiting space 32 formed by the two limiting protrusions 31 can directly and effectively limit the conductor assembly 2. The inner wall of the limiting protrusion 31 is in direct contact with the conductor assembly 2. When the conductor assembly 2 tends to move to both sides, the inner wall will immediately generate a blocking force to prevent its displacement. This direct contact limiting method can quickly and accurately restrict the movement of the conductor assembly 2, ensuring that the end of the conductor assembly 2 and the flat solder joint 11 are accurately aligned, thus improving the precision and quality of the soldering.

[0042] During the process of placing the wire assembly 2 onto the circuit board body 1, only a portion of the wire assembly 2 needs to be placed within the limiting space 32; no complex adjustments or alignment operations are required. This simple operation method reduces operation time and improves production efficiency.

[0043] like Figures 1 to 4 As shown, the thickness of each limiting bump 31 in this embodiment is the same as the thickness of the circuit board body 1. During the circuit board assembly process, the wire assembly 2 needs to be accurately placed on the circuit board body 1 and soldered to the flat solder joint 11 on the circuit board body 1. When the thickness of the limiting bump 31 is the same as the thickness of the circuit board body 1, the limiting bump 31 and the circuit board body 1 are at the same plane height. When placing the wire assembly 2, the wire assembly 2 can be stably placed on both the circuit board body 1 and the limiting bump 31 at the same time, without tilting or lifting due to the height difference. The limiting bump 31 provides a stable and flat support and limiting platform for the wire assembly 2, ensuring that the wire assembly 2 can contact the circuit board body 1 in the correct posture, thereby ensuring that the end of the wire assembly 2 is accurately aligned with the flat solder joint 11, creating good conditions for subsequent soldering operations.

[0044] In modern circuit board manufacturing, automated equipment is increasingly used for the placement and soldering of conductor assemblies 2. When the limiting bump 31 is the same thickness as the circuit board body 1, the automated equipment can more easily perform operations such as gripping, placing, and soldering the conductor assembly 2. The movement trajectory and parameter settings of the equipment can be simpler and more uniform, eliminating the need for complex adjustments for components of different heights, thus improving the efficiency and accuracy of automated production and reducing the programming difficulty and debugging costs of the equipment.

[0045] From an overall structural perspective, the limiting protrusion 31 has the same thickness as the circuit board body 1, making the entire circuit board assembly more flat and stable after assembly. During subsequent use, it can better resist the effects of external vibrations, impacts, and other physical factors, reducing the loosening or damage of the wire assembly 2 due to shaking, and extending the service life of the circuit board.

[0046] like Figures 1 to 4As shown, the circuit board body 1 of this embodiment is provided with a flat soldering part 12 corresponding to the flat soldering point 11. The flat soldering part 12 has a flat soldering surface, and the flat soldering point 11 is located on the soldering surface.

[0047] During the soldering process of a circuit board, components such as lead assemblies need to be connected to solder joints on the circuit board body. The flat soldering section 12 has a flat soldering surface, and the flat solder joint 11 is located on this surface. During soldering operations, such as wave soldering, reflow soldering, or manual soldering, solder (such as solder paste) is placed on the flat solder joint 11 and the soldering surface. Because the soldering surface is flat, the solder can spread evenly on it. During heating, the solder melts fully and makes good contact with the leads of the lead assemblies and the flat solder joint 11. The flat soldering surface provides a stable foundation for the flow and wetting of the solder, allowing it to flow along the gap between the lead assemblies and the soldering surface, filling the voids and ultimately forming a strong solder joint, achieving electrical conductivity.

[0048] A smooth welding surface allows the solder to be evenly distributed around the weld point 11, avoiding solder accumulation or uneven distribution caused by an uneven welding surface. This ensures the consistency and reliability of the weld, reduces welding defects such as incomplete welds and cold welds, and improves the mechanical strength and electrical performance of the weld.

[0049] Solder wets and spreads more easily on smooth surfaces, allowing for better bonding with the pins of lead-in components and the metal layers of the circuit board body. Good wetting properties contribute to the formation of a continuous, dense solder layer, improving the conductivity and stability of the solder joint, reducing contact resistance, and minimizing signal loss and interference during transmission.

[0050] On automated welding production lines, a flat welding surface facilitates accurate positioning of the flat welding points 11 by robots or automated welding equipment. The equipment can apply solder to the welding surface more precisely, improving welding accuracy and repeatability. Simultaneously, the wire assembly can be placed more stably on the welding surface, reducing welding defects caused by inaccurate positioning.

[0051] A smooth welding surface offers better compatibility with various automated welding processes and equipment. Whether it's wave soldering, reflow soldering, or selective welding, processes can be performed more effectively on a smooth surface, improving production efficiency and product quality.

[0052] Because the solder can be evenly distributed on a flat welding surface, unnecessary solder buildup is avoided, thus reducing solder waste. This not only reduces raw material costs but also reduces the extra workload and costs associated with cleaning up excess solder.

[0053] High-quality welding and ease of automation streamline the production process, reducing rework and scrap rates caused by poor welding. This improves production efficiency and lowers production costs.

[0054] A smooth solder surface makes solder joints more clearly visible, facilitating visual inspection and electrical performance testing during production. If soldering defects are found, repair and rework are also easier. During the circuit board's use, maintenance personnel can more easily inspect and repair solder joints, improving the circuit board's maintainability and lifespan.

[0055] like Figures 1 to 4 As shown, the flat soldering part 12 of this embodiment is provided with a through hole 121 that penetrates the circuit board body 1 and the flat solder joint 11, so that the solder can flow into the through hole 121 and enhance the connection stability between the solder and the end of the wire assembly 2 on the flat solder joint 11.

[0056] During circuit board soldering, when soldering operations (such as wave soldering, manual soldering, etc.) are performed, the solder becomes liquid under heating. The through hole 121 provided on the flat solder section 12 provides an additional channel for the flow of solder.

[0057] When the solder comes into contact with the flat solder joint 11 and the surrounding area, due to capillary action, the liquid solder will flow into the hole along the inner wall of the through hole 121. Capillary action refers to the phenomenon that a liquid rises or falls in the inner wall of a thin tubular object due to surface tension. In a tiny channel like the through hole 121, the liquid solder will be adsorbed and fill the entire through hole 121.

[0058] The end of the wire assembly 2 contacts the flat solder joint 11. As the solder flows into the through hole 121, after cooling and solidification, the solder forms a strong connection structure with the through hole 121, providing an additional tension point for the solder joint, and tightly bonding the wire assembly 2 with the flat solder joint 11, thus achieving electrical connection and mechanical fixation.

[0059] like Figures 1 to 4 As shown, the circuit board body 1 of this embodiment is also provided with a protective layer 4. The protective layer 4 includes a connection protection part 41 that can cover all the connection points between the conductor assembly 2 and the flat solder joint 11. It can effectively isolate the influence of external physical stress on the connection points between the conductor assembly 2 and the flat solder joint 11, prevent damage to the solder joint and the connection points between the conductor assembly 2 and the flat solder joint 11 due to external pressure or bending, and also prevent damage or short circuits caused by oxidation, aging, moisture and other reasons at the connection points (i.e., solder joints) between the conductor assembly 2 and the flat solder joint 11, thereby improving the overall reliability of the circuit board.

[0060] The protective layer 41 covers the connection between the conductor assembly 2 and the solder joint 11. When the circuit board is subjected to external physical stress (such as pressure, bending force, etc.), the protective layer 4 bears these external forces first. It can disperse the external forces over a larger area, avoiding stress concentration at the connection between the conductor assembly 2 and the solder joint 11. Because the protective layer 4 has a certain strength and toughness, it can absorb and buffer some of the external forces, thereby reducing the amount of stress transmitted to the connection and reducing the risk of damage to the connection due to external forces.

[0061] From a chemical perspective, the connection between the lead wire assembly 2 and the solder joint 11 (solder joint) typically contains metallic components, which are prone to oxidation reactions with oxygen in the air, leading to a decline in solder joint performance. Simultaneously, a humid environment accelerates the corrosion process of the metal, and aging also gradually deteriorates the physical and chemical properties of the solder joint.

[0062] Protective layer 4 acts as a barrier, preventing oxygen, moisture, and other substances from directly contacting the joint. Protective layer 4 generally possesses good sealing properties and chemical stability, forming a relatively closed environment that reduces the erosion of the joint by external substances, thereby delaying the destructive processes of oxidation, aging, and moisture on the solder joint.

[0063] In practical use, circuit boards may be subjected to various external forces, such as compression during installation and vibration during transportation. The presence of the connection protection part 41 enables the connection between the wire assembly 2 and the flat solder joint 11 to withstand greater external forces without damage, thereby improving the reliability of the circuit board in complex mechanical environments.

[0064] Reduced risk of solder joint detachment: By dispersing stress and buffering external forces, protective layer 4 reduces the likelihood of solder joints detaching from the circuit board body 1. A secure solder joint connection is crucial for the normal operation of the circuit board; if a solder joint detaches, it may cause a circuit break, rendering the circuit board inoperable.

[0065] Oxidation and aging can increase the contact resistance of solder joints, affecting the normal conduction of the circuit. Protective layer 4 prevents these factors from affecting the solder joints, maintains the stability of the solder joint contact resistance, ensures stable current transmission in the circuit, and reduces electrical faults caused by resistance changes.

[0066] In humid environments, moisture can form conductive paths on the solder joint surface, leading to short circuits. Protective layer 4 isolates moisture, preventing this from happening and improving the electrical safety of the circuit board.

[0067] Factors such as oxidation, aging, and humidity can accelerate the aging process of solder joints and conductor assemblies, shortening their lifespan. The protective layer 4 effectively slows down these aging processes, allowing the connection between the conductor assembly 2 and the flat solder joint 11 to maintain good performance for a longer period of time, thereby extending the lifespan of the entire circuit board.

[0068] Improved circuit board reliability and extended lifespan reduce the number of repairs and replacements required due to solder joint damage, thus lowering maintenance costs.

[0069] like Figures 1 to 4 As shown, the protective layer 4 in this embodiment also includes a connection reinforcement part 42 that can cover the limiting component 3 and part of the wire component 2, which can further improve the protective performance and stability of the protective layer 4. Moreover, it is only necessary to apply glue to the side of the circuit board body 1 with the flat solder joint 11, and it is not necessary to apply glue to both sides of the circuit board body 1.

[0070] The connecting reinforcement part 42 covers the limiting component 3 and part of the wire assembly 2. When the circuit board is subjected to external force, the connecting reinforcement part 42 can better fix the limiting component 3 and the wire assembly 2 together. It is like an adhesive and support structure, making the limiting effect of the limiting component 3 on the wire assembly 2 more stable. For example, in a vibration environment, the connecting reinforcement part 42 can prevent the wire assembly 2 from being released from the constraint of the limiting component 3 due to shaking, thus ensuring the positional stability of the wire assembly 2 on the circuit board.

[0071] The connecting reinforcement part 42 can disperse stress over a larger area. It can disperse the concentrated stress acting at the connection between the limiting component 3 and the wire assembly 2, and avoid component damage caused by stress concentration.

[0072] Both the reinforcing connection 42 and the protective connection 41 are located on the side of the circuit board body 1 with the solder joint 11. Since the protective connection 41 already protects the connection between the conductor assembly 2 and the solder joint 11, and the reinforcing connection 42 further strengthens the connection between the limiting assembly 3 and the conductor assembly 2, the protective layer 4 formed by applying adhesive to this side can meet the overall protection requirements of the circuit board. From the perspective of the circuit board's function and structure, the solder joint 11 and the connection between the limiting assembly 3 and the conductor assembly 2 are relatively fragile parts that require special protection. Concentrating adhesive application on this side can effectively protect these critical parts, and since the structure itself has good stability, no additional adhesive protection is needed.

[0073] The reinforcing connection 42 enhances the connection stability between the limiting component 3 and the wire assembly 2, reducing the risk of circuit failure due to loose connections. In complex operating environments, such as high temperature, high humidity, and vibration, the circuit board can operate more stably, reducing signal transmission instability, short circuits, and other faults caused by connection problems, thus improving the overall reliability of the electronic device.

[0074] Applying adhesive only to one side of the circuit board body 1 reduces the amount of adhesive and other materials used compared to applying adhesive to both sides, thus lowering production costs. It also reduces potential problems caused by excessive adhesive use, such as adhesive overflow affecting other components of the circuit board.

[0075] Single-sided gluing is a relatively simple process, reducing the number of gluing steps and time. In mass production, this can significantly improve production efficiency and shorten the production cycle. Workers only need to operate on one side of the circuit board, reducing the complexity and difficulty of the operation and also reducing the product defect rate due to operational errors.

[0076] like Figures 1 to 4 As shown, the protective layer 3 in this embodiment is an ultraviolet curable adhesive (UV adhesive), hot melt adhesive, yellow glue, or 704 curable adhesive.

[0077] The preferred choice is a UV-curable adhesive. UV adhesives cure very quickly, typically within seconds to minutes, significantly reducing production time and improving efficiency. In large-scale circuit board production, rapid curing allows products to proceed to the next process more quickly, increasing output per unit time.

[0078] Furthermore, the cured UV adhesive possesses high bonding strength, firmly securing connections between limiting components and wire assemblies, as well as between wire assemblies and solder joints, effectively preventing component loosening and displacement. When the circuit board is subjected to external forces such as vibration and impact, the UV adhesive ensures connection stability, reducing the risk of circuit failures due to poor connections.

[0079] UV adhesives typically possess good transparency and a low dielectric constant, and do not significantly affect the optical (if applicable) or electrical properties of the circuit board. They can protect the circuit board while ensuring stable signal transmission, making them suitable for electronic devices with high electrical performance requirements.

[0080] UV adhesives have good chemical resistance, resisting the erosion of some common chemicals such as moisture, solvents, acids, and alkalis. This allows the circuit board to maintain stable performance under different environmental conditions, extending its lifespan.

[0081] like Figures 1 to 4As shown, the circuit board body 1 of this embodiment includes a functional part 13 and a soldering part 14. The functional part 13 is equipped with a functional component 15, and the flat solder joint 11 is located on the soldering part 14. This design ensures that there is a certain distance between the solder joint 11 and the functional part, so as to avoid the situation where the soldering will affect the functional component.

[0082] like Figures 1 to 4 As shown, the functional component 15 in this embodiment includes a reed switch or a Hall switch. Specifically, the functional component 15 on the circuit board includes structures such as a reed switch or a Hall switch, which can be used on two-wire, three-wire, or multi-wire circuit boards. The appropriate design can be selected according to actual needs.

[0083] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A circuit board structure with positioning and assembly components, characterized in that: The circuit board body (1) includes at least two spaced flat solder joints (11) on the circuit board body (1). Each of the flat solder joints (11) can be connected to a wire assembly (2). The circuit board body (1) is provided with a limiting component (3) on one side of the flat solder joint (11) to prevent the two wire assemblies (2) from moving to both sides.

2. The circuit board structure with positioning assembly components according to claim 1, characterized in that: The limiting component (3) includes two spaced limiting protrusions (31) with a limiting space (32) between the two limiting protrusions (31) for the two wire assemblies (2) to enter.

3. The circuit board structure with positioning assembly components according to claim 2, characterized in that: The thickness of each of the limiting bumps (31) is the same as the thickness of the circuit board body (1).

4. The circuit board structure with positioning assembly components according to claim 1, characterized in that: The circuit board body (1) is provided with a flat solder part (12) corresponding to the flat solder point (11) one by one. The flat solder part (12) has a flat solder surface, and the flat solder point (11) is located at the solder surface.

5. The circuit board structure with positioning assembly components according to claim 4, characterized in that: The flat solder joint (12) is provided with a through hole (121) that passes through the circuit board body (1) and the flat solder joint (11).

6. The circuit board structure with positioning assembly components according to any one of claims 1 to 5, characterized in that: The circuit board body (1) is also provided with a protective layer (4), which includes a connection protection part (41) that can cover the connection between all wire assemblies (2) and flat solder joints (11).

7. The circuit board structure with positioning assembly components according to claim 6, characterized in that: The protective layer (4) also includes a connection reinforcement part (42) that can cover the limiting component (3) and part of the wire assembly (2).

8. The circuit board structure with positioning assembly components according to claim 6, characterized in that: The protective layer (4) is a UV-curable adhesive, hot melt adhesive, yellow glue, or 704 curable adhesive.

9. The circuit board structure with positioning assembly components according to claim 1, characterized in that: The circuit board body (1) includes a functional part (13) and a soldering part (14). The functional part (13) is equipped with a functional component (15), and the flat solder joint (11) is located on the soldering part (14).

10. The circuit board structure with positioning assembly components according to claim 9, characterized in that: The functional component (15) includes a reed switch or a Hall switch.

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