Column planting jig

Abstract

A column planting jig comprises a tray, a supporting plate, a net plate, a base plate and a protective partition plate, the upper surface of the tray is provided with a groove where the supporting plate is horizontally embedded, the groove bottom of the groove and the supporting plate are provided with a first solder column positioning area and a second solder column positioning area respectively, the first solder column positioning area is composed of a plurality of first positioning holes arranged in an array mode, and the second solder column positioning area is composed of a plurality of second positioning holes arranged in an array mode. The second solder column positioning area is composed of a plurality of second positioning holes arranged in an array mode, the first positioning holes are blind holes, the second positioning holes are through holes, and the second positioning holes and the first positioning holes are in one-to-one correspondence in an up-and-down mode; the mesh body is provided with a discharging area used for discharging solder columns on the mesh body to the first solder column positioning area through the second solder column positioning area, the discharging area is composed of a plurality of mesh holes arranged in an array mode, the number and the distance of the mesh holes are consistent with the number and the distance of the second positioning holes, and the protective partition plate is fixed to the base plate. The window vertically corresponds to a column planting area on the upper surface of a product. The auxiliary column planting device can assist in realizing stable column planting.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, and in particular relates to a planting column fixture. Background Technology

[0002] In the electronics manufacturing industry, surface mount technology (SMT) widely uses solder balls (such as solder balls) as the soldering medium to achieve electrical connections between electronic components and circuit boards. However, in applications such as high-density packaging, high-power devices, or 3D stacking, a specific vertical height difference needs to be maintained between the soldered product (such as a chip, a heat sink, etc.) and the circuit board. In traditional processes, increasing the solder ball diameter to meet the height difference requirement forces a reduction in the spacing between adjacent solder balls. Limited by the physical space of the pad layout, excessively small spacing can cause the following problems:

[0003] 1. Deterioration of conductivity: Dense solder ball layout can easily lead to uneven current distribution, resulting in electromagnetic interference and parasitic capacitance effect under high frequency or high current conditions.

[0004] 2. Reduced heat dissipation efficiency: The heat conduction paths between solder balls overlap, resulting in significant local heat accumulation and affecting device reliability;

[0005] 3. Increased process risk: During reflow soldering, adjacent molten solder balls may bridge and short-circuit, reducing yield.

[0006] To address these issues, the industry has attempted to replace solder balls with high aspect ratio solder pillars (such as tin pillars). Solder pillars, at the same height, significantly reduce the horizontal footprint, thereby increasing the spacing between adjacent solder joints. Their columnar structure also provides a larger cross-sectional area to optimize current carrying capacity and heat dissipation efficiency. However, existing solder ball placement equipment, limited by its feeding mechanism, positioning accuracy, and fixing method, can only achieve precise placement of spherical solder and cannot meet the process requirements of columnar solder. Therefore, the industry urgently needs to develop a dedicated device and supporting process capable of stable solder ball placement to overcome the bottlenecks in electronic interconnection technology under varying elevations.

[0007] Therefore, in order to realize specialized equipment and supporting processes that can stabilize column implantation, it is necessary to provide a column implantation fixture for assisting column implantation. Utility Model Content

[0008] Based on this, a column implantation fixture is provided to address the aforementioned technical problems.

[0009] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0010] A solder column mounting fixture, characterized in that it comprises a tray, a support plate, a mesh plate for mounting on the tray, a base for horizontally fixing the product, and a protective partition for separating the welding points on the product on the base from the support plate vertically. The upper surface of the tray has a groove horizontally embedded by the support plate. The bottom of the groove and the support plate respectively have a first solder column positioning area and a second solder column positioning area. The first solder column positioning area is composed of a plurality of first positioning holes arranged in an array, and the second solder column positioning area is composed of a plurality of second positioning holes arranged in an array. The first positioning holes are blind holes, and the second positioning holes are through holes. The second positioning holes are coaxially aligned with the first positioning holes vertically. The mesh plate has a mesh body with a feeding area for feeding solder columns from the second solder column positioning area to the first solder column positioning area. The feeding area is composed of a plurality of mesh holes arranged in an array. The number and spacing of the mesh holes are consistent with the number and spacing of the second positioning holes. The protective partition is fixed on the base and has windows that correspond vertically to the solder column mounting area on the upper surface of the product.

[0011] This utility model of column planting fixture can help achieve stable column planting and meets the application needs of the industry. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of an implantation column device used in an embodiment of the present utility model;

[0013] Figure 2 This is a front view structural diagram of an implantation column device used in an embodiment of this utility model;

[0014] Figure 3 This is a schematic diagram of the implantation fixture according to an embodiment of the present invention;

[0015] Figure 4 This is a top view of the tray structure of the implantation fixture according to an embodiment of the present utility model;

[0016] Figure 5 This is a top view of the support plate of the implantation fixture according to an embodiment of the present utility model.

[0017] Figure 6 This is a three-dimensional structural diagram of the chassis of the implantation fixture according to an embodiment of the present utility model;

[0018] Figure 7 This is a top view of the chip holder of the chassis according to an embodiment of the present utility model;

[0019] Figure 8 A schematic diagram of the structure of a transfer platform of a planting column device used in this embodiment of the utility model, without a tray placed on it;

[0020] Figure 9 This is a structural diagram of the transfer platform with the tray in place according to an embodiment of the present invention;

[0021] Figure 10 A schematic diagram of the structure of a vibrating table tray placement state of an implantation column device used in an embodiment of this utility model;

[0022] Figure 11 This is a structural schematic diagram of the vibration table with the tray and mesh plate placed in an embodiment of the present invention;

[0023] Figure 12 This is a schematic diagram of the vibration table in an embodiment of the present invention without a tray.

[0024] Figure 13 This is a schematic diagram of the planting platform of a planting column device used in an embodiment of the present utility model;

[0025] Figure 14 This is a schematic diagram of the structure of the first transport mechanism and the planting mechanism of a planting column device used in an embodiment of the present utility model;

[0026] Figure 15 This is a schematic diagram of the transport gripper of the first transport mechanism according to an embodiment of the present utility model;

[0027] Figure 16 This is a three-dimensional structural diagram of the column planting mechanism according to an embodiment of the present utility model;

[0028] Figure 17 This is a schematic diagram of the implantation head of an implantation column device used in an embodiment of this utility model. Detailed Implementation

[0029] The embodiments of this utility model will be described below with reference to the accompanying drawings. It should be noted that the embodiments described in this specification are not exhaustive and do not represent the only embodiments of this utility model. The following corresponding embodiments are only for clearly illustrating the utility model content of this patent and are not intended to limit its implementation. For those skilled in the art, different variations and modifications can be made based on the described embodiments. Any obvious variations or modifications that fall within the technical concept and utility model content of this utility model are also within the protection scope of this utility model.

[0030] like Figure 1 , Figure 3 and Figure 10As shown, this embodiment is applied to a column implantation device, including a column implantation fixture 1100, a transfer table 1200, a vibration table 1300, a column implantation table 1400, a first handling mechanism 1500, a second handling mechanism 1600, a column implantation mechanism 1700, a solder column defect rate detection head 1800, and a waste collection table 1900.

[0031] In this embodiment, solder pillars refer to tin pillars.

[0032] like Figure 1 and Figure 2 As shown, the transfer table 1200, vibration table 1300, column planting table 1400, solder column defect rate detection head 1800, and waste collection table 1900 are all installed on the machine base 1999. The transfer table 1200 is located in the middle of the upper surface of the machine base 1999. The vibration table 1300 and column planting table 1400 are located on the left and right sides of the transfer table 1200, respectively. The transfer table 1200, vibration table 1300, and column planting table 1400 are separated from the machine frame and installed separately on the ground. The solder column defect rate detection head 1800 is located between the transfer table 1200 and the column planting table 1400.

[0033] like Figure 3 As shown, the implantation fixture 1100 is a set of components, including a tray 1110, a support plate 1120, a mesh plate 1130, a base 1140, a protective partition 1150, and a pressure plate 1160.

[0034] Among them, tray 1110, support plate 1120, and mesh plate 1130 are used for unloading and transferring welding columns, while support plate 1120, chassis 1140, protective partition 1150, and pressure plate 1160 are used for inserting columns into the product.

[0035] like Figure 3 As shown, the upper surface of the tray 1110 has a rectangular groove 1111 for fitting the support plate 1120. The bottom of the groove 1111 has a first solder pillar positioning area 1111a. The number of first solder pillar positioning areas 1111a can be one or more. The first solder pillar positioning area 1111a is composed of a plurality of first positioning holes arranged in an array. The lower end of each first positioning hole extends downward to form a blow-suction through hole. The diameter of the blow-suction through hole is smaller than the outer diameter of the solder pillar. Therefore, the first positioning hole is equivalent to a blind hole.

[0036] Among them, it is better to have the outer diameter of the first positioning hole be 105%-110% of the outer diameter of the solder column, and the diameter of the blow-suction through hole be 42%-50% of the outer diameter of the solder column.

[0037] The groove 1111 has a ring of steps 1111b for supporting the support plate 1120, and the steps have four grooves 1112 for vacuum suction of the support plate 1120.

[0038] like Figure 4 As shown, the tray 1110 has four first vacuum channels 1113 and four second vacuum channels 1114 that correspond one-to-one with four grooves 1112. The upstream opening of the first vacuum channel 1113 is located on the lower surface of the tray 1110, and the downstream opening 1113a is located in the corresponding groove 1112. The upstream opening of the second vacuum channel 1114 is located on the lower surface of the tray 1110, and the downstream opening 1114a is located outside the groove of the step 1111b. The four downstream openings 1114a of the four second vacuum channels 1114 are evenly distributed along the center of the tray 1110 on the step 1111b.

[0039] like Figure 3 As shown, the lower surface of the pallet 1110 is evenly distributed with four lifting slots 1115, and the front and rear sides of the pallet 1110 are respectively provided with two claw slots 1116, which facilitates the handling by the first handling mechanism 1500.

[0040] The 1110 pallet is made of carbon material (such as graphite), which has good stability and high processing precision.

[0041] During the solder column unloading stage, the support plate 1120 serves to support the solder column and prevent it from tipping over. It is embedded in the groove 1111 and supported by the step 1111b. Figure 5 As shown, the support plate 1120 has a second solder pillar positioning area 1121 in the middle. The second solder pillar positioning area 1121 is composed of a plurality of second positioning holes arranged in an array. The second positioning holes are through holes and are coaxially aligned with the first positioning holes in the upper and lower parts.

[0042] The support plate aperture parameter is more than 110% of the welding column aperture for better results.

[0043] The support plate 1120 has two waist-shaped openings 1122 on each of its front and rear edges in the left and right directions. The four openings 1122 correspond vertically to the downstream openings 1114a of the four second vacuum channels 1114 of the tray 1110, and are used to vacuum hold the mesh of the stencil 1130 during the solder column unloading process.

[0044] like Figure 3 As shown, the mesh panel 1130 is composed of a frame 1131 and a mesh body 1132 fixed on the frame 1131.

[0045] The frame 1131 is a rectangle that is narrower at the front and back and wider at the left and right. Four vertically oriented first pins 1131a and two vertically oriented first pin holes 1131b are evenly distributed along its center. The four first pins 1131a are located in pairs on the lower surfaces of the left and right sides of the frame 1131. The main body of each first pin 1131a is made of a magnetically shielding material to reduce the magnetization effect of the magnetic field on the solder. A metal sheet (such as an iron sheet) is fixed to the lower end face of the first pin 1131a. The two first pin holes 1131b are located on the left and right sides of the frame 1131, respectively.

[0046] The mesh 1132 has a feeding area 1132a at its center, which consists of an array of mesh openings. The number and spacing of the mesh openings are consistent with the number and spacing of the second positioning holes in the support plate 1120. The diameter of the mesh openings is set between 108% and 115% of the solder pillar diameter, with the specific parameters related to the lead-tin ratio of the solder pillar. During the solder pillar feeding stage, the mesh plate 1130 is placed above the tray 1110, and a number of solder pillars greater than the number of pillars to be fed at one time are pre-placed on its mesh 1132, specifically between 2.2 and 2.7 times the amount of solder consumed in one feeding. The solder pillars can be fed from the second solder pillar positioning area to the first solder pillar positioning area.

[0047] Chassis 1140 is used for horizontally fixing products, where "product" refers to chips, such as... Figure 6 As shown, the upper surface of the chassis 1140 has a rectangular boss 1141 and a rectangular product slot 1142. The boss 1141 is concentric with the chassis 1140. The number of product slots 1142 can be one or more, and they are located in the middle of the boss 1141 for horizontally placing chips. Since the spacing between the solder points of the chip mounting area and the chip edge is not consistent in different batches of chips, a chip holder 1143 that can be adjusted forward, backward, left, and right to calibrate the chip position is provided in the product slot 1142. The upper surface of the chip holder 1143 has a chip groove with the same size as the chip. Figure 7 As shown, the chip slot has a notch at the right rear corner, which extends to the right to form a pressing slot 1146 for accommodating the pressing plate 1144. The right end of the pressing plate 1144 forms a fixing section 1144a that extends in the front-back direction to the chip holder 1143. The fixing section 1144a is bolted to the chip holder 1143. The left end of the pressing plate 1144 forms a top section 1144b that abuts against the right rear corner of the chip, thereby locking the position of the chip 2 in the chip slot 1143a.

[0048] like Figure 6 As shown, a plurality of pins 1147 are evenly distributed along the edge of the upper surface of the chassis 1140. The edges of the protective partition 1150, support plate 1120, and pressure plate 1160 are each evenly distributed with pin holes corresponding to the plurality of pins 1147, thereby allowing the protective partition 1150, support plate 1120, and pressure plate 1160 to be concentrically fixed to the chassis 1140. (See also...) Figure 3 .

[0049] When calibrating the chip position, the support plate 1120 can be fixed on the chassis 1140 first. The soldering points on the upper surface of the chip can be observed through the second positioning hole of the support plate 1120 by the positioning system to determine whether the soldering points are aligned with the second positioning hole. If they are not aligned, the position of the chip holder 1143 can be adjusted back, forth, left, and right until it is aligned. At this time, the position is locked by the locking hole 1148 on the chip holder 1143 and the bolt.

[0050] Since each soldering point in the product's mounting area is pre-set with solder paste, in order to prevent the support plate 1120 from touching and damaging the solder paste during the mounting stage, the protective partition 1150 is fixed on the chassis 1140 after the product is fixed to the chassis 1140, thereby separating the soldering points on the product on the chassis 1140 from the support plate 1120 vertically. The protective partition 1150 has windows corresponding to the vertical position of the product's mounting area and operation holes for tools to pass through to adjust the position of the chip holder 1143.

[0051] The pressure plate 1160 is used to press the upper end of the solder column above the support plate 1120 after the solder column is released and embedded on the product, thereby further ensuring that the lower end of the solder column is in full contact with the solder joint. Of course, the pressure plate 1160 can also be omitted.

[0052] The transfer table 1200 is used to horizontally place the tray 1110 with the support plate 1120 embedded in it, such as Figure 2 , Figure 8 and Figure 9 As shown, it includes a turntable body 1210, a rotary drive motor (not shown in the figure), a linear drive module 1220 in the forward and backward direction, and a residual column suction unit 1230.

[0053] like Figure 8 As shown, the horizontal top surface of the transfer station body 1210 has a first pallet placement area 1211 and a positioning structure 1212 for positioning the pallet 1110 to the placement area 1211. The first pallet placement area 1211 is a rectangle that is narrow at the front and back and wide at the left and right, and is concentric with the horizontal top surface. The positioning structure 1212 is composed of multiple positioning blocks 1212a.

[0054] The transfer station body 1210 has a locking structure 1213 for locking the tray 1110 in the first placement area 1211. In this embodiment, the locking structure 1213 is composed of four pressure claws 1213a driven by cylinders. This structure is a conventional structure, and its specific structure is not limited here.

[0055] The first tray placement area 1211 has a vacuum groove 1211a that corresponds to the blow-suction through hole of the tray 1110. The transfer table body 1210 forms a first vacuum chamber inside, which is connected to the vacuum groove 1211a.

[0056] A rotary drive motor is used to drive the turntable body 1210 to rotate horizontally, and a linear drive module 1220 in the forward and backward direction is used to drive the turntable body 1210 to move horizontally forward and backward, thereby adjusting the position of the tray 1110. The turntable body 1210 is connected to the rotary drive motor, which is fixed on the linear drive module 1220. The linear drive module 1220 can be an electric cylinder or a pneumatic cylinder, and it is fixed on the machine base 1999.

[0057] The residual solder column extraction unit 1230 is used to extract residual solder columns on the upper surface of the tray 1110, such as... Figure 8 As shown, it consists of a vacuum suction head 1231 and a linear module 1232 that drives the suction head 1231 to move horizontally back and forth. The linear module 1232 is an electric cylinder or a pneumatic cylinder, which is fixed on the left and right crossbeam 1999a above the machine base 1999. During operation, the linear module 1232 drives the vacuum suction head 1231 to move forward from its original position at the rear, passing over the tray 1110 of the transfer table 1200 from above. At this time, the vacuum suction head 1231 is activated and can suck away the residual solder column.

[0058] The vibration table 1300 is used to vibrate the tray 1110 with the support plate 1120 embedded and the mesh plate 1130 located above the tray 1110, so that the solder column on the mesh plate 1130 is fed into the tray 1110.

[0059] like Figure 10-12 As shown, the top of the vibration table 1300 is provided with a fixed seat 1310. The fixed seat 1310 has a first fixing structure and a second fixing structure for releasably and horizontally fixing the tray 1110 and the mesh plate 1130, respectively, and for making the mesh holes of the mesh plate 1130 coaxially aligned with the second positioning hole.

[0060] like Figure 12 As shown, the top plate of the fixing base 1310 has a second tray placement area 1311, which is a rectangle that is narrow at the front and back and wide at the left and right, and is concentric with the top plate.

[0061] like Figure 12 As shown, the first fixing structure includes a positioning unit 1321, a vacuum port 1322, a vacuum groove 1323, a second vacuum chamber, a third vacuum channel 1324, and a fourth vacuum channel 1325.

[0062] The positioning unit 1321 is used to position the pallet 1110 to the second pallet placement area 1311, and it is composed of multiple positioning blocks 1321a.

[0063] Vacuum port 1322 is used to suck up solder columns through the blow-suction through-hole of tray 1110, and it is located in the middle of the second tray placement area 1311.

[0064] The vacuum grooves 1323 are used to vacuum hold the tray 1110, thereby fixing or releasing the tray 1110. There are two vacuum grooves 1323, which are located on the front and rear edges of the second tray placement area 1311, respectively.

[0065] The second vacuum chamber is formed inside the fixed base 1310 and is connected to the vacuum port 1322 and the vacuum groove 1323.

[0066] The third vacuum channel 1324 is used to hold the support plate 1120 through the first vacuum channel 1113, and the fourth vacuum channel 1325 is used to hold the mesh 1132 through the second vacuum channel 1114. In this embodiment, there are four pairs of third vacuum channels 1324 and fourth vacuum channels 1325, which are evenly distributed on the front and rear edges of the top plate of the fixed base 1310. The downstream openings 1324a and 1325a of the third vacuum channel 1324 and the fourth vacuum channel 1325 are located on the upper surface of the top plate, and can correspond vertically to the upstream openings of the first vacuum channel 1113 and the second vacuum channel 1114 of the tray 1110 located in the second tray placement area 1311.

[0067] Based on the first fixed structure, the vibration table 1300 can hold the tray 1110, support plate 1120 and mesh 1132 during vibration, ensuring the accuracy of material feeding and preventing the three from being scratched by friction during vibration. In addition, the material feeding efficiency is improved by intermittently sucking the welding material column through the vacuum port 1322 during vibration.

[0068] like Figure 12 As shown, the top of the vibration table 1300 is also equipped with four lifting cylinders 1340. The front and rear sides of the top plate of the fixed base 1310 have two notches 1311a, which correspond one-to-one with the four lifting cylinders 1340. The notches 1311a extend inward to the edge of the second tray placement area 1311. The lifting cylinders 1340 can lift the tray 1110 from the lifting groove 1115 through the corresponding notches 1311a.

[0069] like Figure 12 As shown, the second fixing structure includes four second pin holes 1331 and two second pins 1332.

[0070] The four second pin holes 1331 correspond one-to-one with the four first pins 1131a. The four second pin holes 1331 are located in pairs on the left and right edges of the top plate of the fixing base 1310, so as to achieve uniform distribution along the center of the second tray placement area 1311. In order to facilitate the coaxiality alignment of the mesh plate 1130 and the support plate 1120, the diameter of the second pin holes 1331 is slightly larger (about 1 mm) than the outer diameter of the first pins 1131a.

[0071] Two second pins 1332 correspond one-to-one with two first pin holes 1131b. The two second pins 1332 are located on the left and right edges of the top plate of the fixing base 1310, respectively, so as to achieve uniform distribution along the center of the second tray placement area 1311. Each second pin 1332 is arranged between two second pin holes 1331 on the same side.

[0072] Among them, such as Figure 12 As shown, an electromagnet block 1333 is provided below each second pin hole 1331 to attract the iron sheet at the lower end of the corresponding first pin 1131a and to place the mesh plate 1130 above the tray 1110 of the second tray placement area 1311. Each electromagnet block 1333 is fixed by a corresponding bracket 1334 below the top plate. The bracket 1334 is connected to the top plate, thereby enabling the mesh plate 1130 to be fixed or released.

[0073] like Figure 12 As shown, each second pin 1332 is horizontally adjustable on the mounting block 1335. The mounting block 1335 is detachably fixed to the top plate via pin holes 1335a and bolts. Before each mesh plate 1130 is used, the mesh plate 1130 and the tray 1110 on the fixing seat 1310 below need to be aligned for coaxiality: First, fix the mesh plate 1130 on the fixing seat 1310. At this time, the mesh plate 1130 and the fixing seat 1310 are connected only by two second pins 1332 and two first pin holes 1131b. Then, observe the mesh and the positioning hole of the support plate 1120 on the tray 1110 through a microscope. At the same time, adjust the horizontal position of the mesh plate 1130. During the adjustment, the second pins 1332 move horizontally until the mesh and the positioning hole are coaxial. At this time, lock the position of the second pins 1332 on the mounting block 1335. After the above registration, the two mounting blocks 1335 are paired with the above-mentioned screen plate 1130. All three need to be used at the same time to ensure the coaxiality of the screen plate 1130 and the support plate 1120. Similarly, before using other screen plates for the first time, the above registration process also needs to be performed to pair them with the corresponding two mounting blocks 1335.

[0074] When using the same product specifications again, only the complete set of fixtures (forming two matching mounting blocks 1335 and mesh plate 1130) is needed, without the need for re-alignment and debugging.

[0075] Specifically, the mounting block 1335 has a locking hole, and the second pin 1332 has a bolt hole 1332a. The locking bolt can lock the second pin 1332 on the mounting block 1335 in a horizontal position through the locking hole and the bolt hole 1332a. The diameter of the locking hole is slightly larger than the outer diameter of the locking bolt, which allows the locking bolt to be eccentric with the locking hole, thereby enabling the second pin 1332 to be adjusted in a horizontal position on the mounting block 1335.

[0076] Based on the second fixing structure described above, the mesh plate 1130 can be fixed above the tray 1110 located in the second tray placement area 1311, so that the mesh holes of the mesh plate 1130 are coaxially aligned with the second positioning holes. In this embodiment, the mesh plate 1130 can also be supported by the positioning blocks 1321a on the left and right sides.

[0077] like Figure 13 As shown, the mounting platform 1400 is used to horizontally place the chassis 1140 on which the product is pre-fixed. The upper surface of the product is pre-set with multiple welding points arranged in an array. The number and spacing of the welding points are consistent with the number and spacing of the second positioning holes.

[0078] The structure of the planting platform 1400 is similar to that of the transfer platform 1200. It can also rotate horizontally and move back and forth. The structure of the transfer platform 1200 can be referred to. The difference is that the chassis 1140 is fixed by vacuum. The structure of the vacuum method can be referred to that of the vibration table 1300. It will not be described in detail here.

[0079] like Figure 14 As shown, the first conveying mechanism 1500 is used to convey the pallet 1110 between the transfer table 1200 and the vibration table 1300. It includes a conveying gripper 1510, a lifting module 1520 for driving the conveying gripper 1510 to rise and fall, and a linear module 1530 for driving the conveying gripper 1510 to move horizontally and linearly.

[0080] The transport gripper 1510 is fixed to the lifting module 1520. In this embodiment, as shown... Figure 15As shown, the transport gripper 1510 has a pair of left-right arranging positioning grippers 1511 and a pair of front-back arranging clamping grippers 1512. The positioning grippers 1511 are used to center and position the pallet 1110, and the clamping grippers 1512 are used to engage with the hook grooves 1116 on the front and rear sides of the pallet 1110 to clamp the pallet 1110. Both the positioning grippers 1511 and the clamping grippers 1512 are driven by cylinders. The cylinder for the positioning grippers 1511 is located on the upper plate 1513, and the cylinder for the clamping grippers 1512 is located on the lower plate 1512. Four springs 1515 are evenly distributed between the upper plate 1513 and the lower plate 1514 on the plate 1514 to accommodate the clamping height. An elastic nylon plate 1514a is provided on the lower surface of the lower plate 1514 to separate the support plate 1120 and prevent it from sticking to the transport gripper 1510. In addition, the transport gripper 1510 is also equipped with a sensor for detecting whether the support plate 1120 is missing from the pallet 1110, and a sensor for detecting whether the transport gripper 1510 has clamped the pallet 1110.

[0081] The lifting module 1520 is fixed on the linear module 1530, and the linear module 1530 is fixed on the crossbeam 1999a. The lifting module 1520 and the linear module 1530 can be electric cylinders or pneumatic cylinders.

[0082] The second conveying mechanism 1600 is used to convey the mesh plate 1130 to or from the vibration table 1300, such as... Figure 10 and Figure 11 As shown, it includes two support frames 1610, two linear modules 1620 in the front-to-back direction, two lifting modules 1630, a mounting plate 1640, two cylinders 1650 in the left-to-right direction, and two grippers 1660.

[0083] Two support frames 1610 are set on the left and right sides of the vibration table 1300 and fixed to the machine base 1999. Two linear modules 1620 are fixed on the two support frames 1610 respectively, and two lifting modules 1630 are fixed on the two linear modules 1620 respectively. The linear modules 1620 and the lifting modules 1630 can be electric cylinders or pneumatic cylinders.

[0084] The left and right ends of the mounting plate 1640 are fixed to the two lifting modules 1630 respectively, the two cylinders 1650 are fixed to the lower surfaces of the left and right ends of the mounting plate 1640, and the two grippers 1660 are connected to the two cylinders 1650 respectively.

[0085] Based on the structure of the second conveying mechanism 1600, the two grippers 1660 can move back and forth and lift up and down, as well as grip or release the mesh plate 1130.

[0086] The column planting mechanism 1700 is used to simultaneously pick up the support plate 1120 and the solder column from the tray 1110 of the transfer table 1200, move them above the column planting platform 1400, release the support plate 1120 onto the protective partition 1150, and simultaneously align the solder column with the solder joint and release it onto the product.

[0087] like Figure 14 As shown, the column planting mechanism 1700 includes a horizontal fixed plate 1710, a moving unit 1720, and a column planting head 1730.

[0088] like Figure 16 As shown, two hooks 1711 are provided on the front and rear sides of the fixing plate 1710 for installing the column head 1730. The fixing plate 1710 is connected to the moving unit 1720.

[0089] The upper surface of the fixing plate 1710 is provided with multiple striking cylinders 1711, which are used to strike the fixing plate 1710 during the column planting process, thereby ensuring that the solder columns are implanted into the product.

[0090] The moving unit 1720 is used to drive the fixed plate 1710 to move up, down, left, and right. In this embodiment, for example... Figure 14 As shown, the moving unit 1720 includes a lifting module 1721 and a linear module 1722 in the left and right directions. The lifting module 1721 is used to drive the fixed plate 1710 to rise and fall, and it is fixed on the linear module 1722. The linear module 1722 is used to drive the fixed plate 1710 to move horizontally in the left and right directions, and it is fixed on the crossbeam 1999a. The lifting module 1721 and the linear module 1722 can be electric cylinders or pneumatic cylinders.

[0091] To balance the weight of the implant head 1730, the lifting module 1721 is also equipped with two springs and cylinders arranged on the left and right sides, making the lifting module 1721 lighter and more precise.

[0092] like Figure 17 As shown, the implant head 1730 is plate-shaped, and its front and rear sides are provided with hanging ears 1731 that correspond one-to-one with the hooks 1711. The hanging ears 1731 are hung on the hooks 1711 to fix the implant head 1730 to the lower surface of the fixing plate 1710.

[0093] The upper surface of the post head 1730 forms a first groove 1731, which together with the fixing plate 1710 forms a third vacuum chamber. The lower surface of the post head 1730 forms a plurality of first suction holes 1732 for holding the support plate 1120 and a plurality of second suction holes 1733 for holding a plurality of solder posts. The first suction holes 1732 and the second suction holes 1733 are both connected to the third vacuum chamber. The plurality of second suction holes 1733 are arranged in an array, and their number and spacing are consistent with the number and spacing of the second positioning holes of the support plate 1120.

[0094] In this design, a second groove 1734 is formed in the middle of the bottom of the first groove 1731, and multiple second suction holes 1733 are arranged in the middle of the corresponding second groove 1734, so as to provide a more stable suction force for the solder column. Multiple first suction holes 1732 are evenly distributed around the second groove 1734.

[0095] The column planting mechanism 1700 is also equipped with a distance measuring sensor to ensure that the position and force of the column planting head 1730 are accurate and to prevent overpressure.

[0096] In addition, such as Figure 16 As shown, the column planting mechanism 1700 is equipped with a left positioning camera 1997 and a right positioning camera 1998. The left positioning camera 1997 is used to visually detect whether the position of the tray 1110 on the transfer platform 1200 deviates from the standard position. If there is a deviation, the transfer platform 1200 will perform rotation and / or forward and backward movement to adjust it. The right positioning camera 1998 is used to visually detect whether the position of the chassis 1140 on the column planting platform 1400 deviates from the standard position. If there is a deviation, the column planting platform 1400 will perform rotation and / or forward and backward movement to adjust it.

[0097] The solder pillar defect rate detection head 1800 is a detection camera. During the process of the solder pillar mechanism moving the support plate 1120 and the solder pillar above the solder pillar platform 1400, the solder pillar defect rate detection head 1800 visually detects the defect rate of the solder pillar from below the support plate 1120. If the defect rate exceeds the threshold, the support plate 1120 and the solder pillar are moved to the waste collection platform 1900. The waste collection platform 1900 is located on the front side of the solder pillar platform 1400 and can be driven by the front and rear drive modules of the solder pillar platform 1400 to achieve horizontal movement in the front and rear directions.

[0098] The column planting process of the column planting equipment in this embodiment is as follows:

[0099] 1. Place the tray 1110, which has the support plate 1120 embedded in it, horizontally on the transfer platform 1200. The locking structure 1213 locks the tray 1110 into the first placement area 1211. (See below) Figure 9 The chassis 1140, on which the product is pre-fixed, is placed horizontally on the column mounting platform, and the chassis 1140 is fixed by vacuum.

[0100] Alternatively, the pallet 1110 can be placed horizontally on the transfer platform 1200 first, and then the support plate 1120 can be embedded into the pallet 1110. The placement of the pallet 1110, the support plate 1120, and the chassis 1140 can be done manually or automatically.

[0101] 2. The first conveying mechanism 1500 transports the pallet 1110 with the embedded support plate to the vibration table 1300, and the pallet is horizontally fixed to the second pallet placement area 1311 of the fixed base 1310 by the first fixing structure. (See below) Figure 10 .

[0102] 3. The second conveying mechanism 1600 transports the mesh plate 1130 to the tray 1110 on the vibration table 1300, and the second fixing structure horizontally fixes the mesh plate 1130 onto the fixing seat 1310 of the vibration table 1300, so that the mesh holes of the mesh plate 1130 are coaxially aligned with the second positioning holes of the support plate 1120. (See [reference]) Figure 11 .

[0103] During the handling process, compressed air can be blown onto the pallet 1110 and support plate 1120 through the air blowing pipe on the second handling mechanism 1600 to remove foreign objects (residual solder pillars, etc.).

[0104] 4. The vibration table 1300 operates, vibrating the tray 1110 with the support plate 1120 embedded and the mesh plate 1130 located above the tray 1110. This causes the solder column, which is pre-placed on the mesh plate 1130, to be fed onto the tray 1110 along the mesh openings, the second positioning hole of the support plate 1120, and the first positioning hole of the tray 1110. During this process, the solder column is drawn downward by intermittent vacuum. After the feeding is completed, the support plate 1120 supports the upper end of the solder column to prevent it from tipping over.

[0105] 5. After the material is unloaded, the vibrating table 1300 stops working, the mesh plate 1130 is released through the second fixing structure, and the mesh plate 1130 is removed from the vibrating table 1300 by the second conveying mechanism 1600. The pallet 1110 is released through the first fixing structure, and the pallet 1110 is lifted from the four lifting slots 1115 by the four lifting cylinders 1340 on the vibrating table 1300. The pallet 1110 is then transported back to the transfer station 1200 by the first conveying mechanism 1500. The pallet 1110 is locked again by the locking structure 1213, and the solder column is held in place by vacuum suction. The solder column is kept vertical by gravity and suction. Then the residual solder column suction unit 1230 sweeps over the pallet 1110 to clean it (suck away the residual solder column).

[0106] 6. The solder column is simultaneously picked up from the tray 1110 of the transfer table 1200 by the column planting mechanism 1700. During this process, the solder column can be blown upward through the blow-suction through hole and the first positioning hole of the tray 1110 and the second positioning hole of the support plate 1120. After the pick-up is completed, the support plate 1120 and the solder column are moved above the column planting table 1400 so that the solder column is aligned with the corresponding solder joint on the product. Then, the support plate 1120 and the solder column are moved down and released so that the support plate 1120 is placed on the protective partition 1150 and the solder column is planted on the product.

[0107] 7. Finally, place the pressure plate 1160 on the support plate 1120 to press down the upper end of the solder column. The pressure plate 1160 can be placed manually or automatically.

[0108] After completing the above process, release the chassis 1140, and move the support plate 1120, the product with the implanted column, the protective partition 1150, the support plate 1120, and the pressure plate 1160 together into the reflow oven for reflow soldering. It should be noted that the chassis 1140 must be made of a material with a shrinkage rate close to that of the product.

[0109] As can be seen from the above, the column implantation fixture provided in this application embodiment can help achieve stable column implantation and meet the application needs of the industry.

[0110] Obviously, those skilled in the art should recognize that the above embodiments are only used to illustrate the present utility model and are not intended to limit the present utility model. Any changes or modifications to the above embodiments within the essential spirit of the present utility model will fall within the scope of the claims of the present utility model.

Claims

1. A planting column fixture, characterized in that, The device includes a tray, a support plate, a mesh plate for mounting on the tray, a chassis for horizontally fixing the product, and a protective partition for separating the welding points on the product on the chassis from the support plate. The upper surface of the tray has a groove horizontally embedded by the support plate. The bottom of the groove and the support plate respectively have a first solder column positioning area and a second solder column positioning area. The first solder column positioning area is composed of a plurality of first positioning holes arranged in an array, and the second solder column positioning area is composed of a plurality of second positioning holes arranged in an array. The first positioning holes are blind holes, and the second positioning holes are through holes. The second positioning holes are coaxially aligned with the first positioning holes. The mesh plate has a mesh body with a feeding area for feeding solder columns from the second solder column positioning area to the first solder column positioning area. The feeding area is composed of a plurality of mesh holes arranged in an array. The number and spacing of the mesh holes are the same as the number and spacing of the second positioning holes. The protective partition is fixed on the chassis and has windows that correspond vertically to the solder column areas on the upper surface of the product.

2. The implantation column fixture according to claim 1, characterized in that, Each first positioning hole extends downward to form a blow-suction through hole, the diameter of which is smaller than the outer diameter of the solder pillar. The tray has a step in the groove for supporting the support plate. The step has a groove for vacuum suction of the support plate. The tray has a first vacuum channel and a second vacuum channel. The upstream opening of the first vacuum channel is located on the lower surface of the tray, and the downstream opening is located in the groove. The upstream opening of the second vacuum channel is located on the lower surface of the tray, and the downstream opening is located outside the groove of the step. The support plate has an opening for vacuum suction of the mesh, and the opening corresponds vertically to the downstream opening of the second vacuum channel.

3. The implantation fixture according to claim 2, characterized in that, It also includes a pressure plate for pressing the upper end of the solder column above the support plate after the solder column is released and embedded in the product. The upper surface of the chassis has a plurality of pins evenly distributed along its edge, and the protective partition, support plate and pressure plate are each evenly distributed with pin holes corresponding to the plurality of pins.

4. The implantation fixture according to claim 3, characterized in that, The first solder column positioning area and the second solder column positioning area are located in the middle of the tray and the support plate, respectively.

5. The implantation fixture according to claim 4, characterized in that, The feeding area is located in the middle of the mesh body. Multiple first pins and multiple first pin holes in the vertical direction are evenly distributed along the center of the mesh plate. The first pins are located at the lower edge of the mesh plate, and iron plates are provided on their lower end faces. The first pin holes are located at the edge of the mesh plate.

Images