Catenary insulator surface discharge detecting and positioning system
By employing a random uniform array of 128 MEMS microphones and an OV5695 camera in the contact wire insulator surface discharge detection device, the problems of inaccurate detection and inability to monitor in real time were solved, achieving accurate insulator surface discharge detection and positioning.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 四川铁道职业学院
- Filing Date
- 2025-04-14
- Publication Date
- 2026-05-05
AI Technical Summary
Existing contact wire insulator surface discharge detection devices are inaccurate and cannot monitor in real time, posing significant safety hazards. They are particularly prone to errors in complex electromagnetic environments, and existing sensors are not suitable for bare conductors and outdoor environments.
A random and uniform array of 128 MEMS microphones is distributed on the substrate. Combined with an OV5695 camera, high-frequency sound waves and image data are collected through the microphones to achieve accurate detection and positioning of surface discharge of insulators. The peripheral module is used for data storage and display.
It enables accurate detection and real-time monitoring of surface discharge in insulators, improving detection accuracy and reducing errors, and is suitable for exposed conductors and outdoor environments.
Smart Images

Figure CN224203347U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of acoustic imaging detection technology, specifically relating to a contact wire insulator surface discharge detection and positioning system. Background Technology
[0002] The overhead contact line is an overhead transmission line that provides power to electric locomotives through friction current extraction. It uses rod insulators with skirted structures to connect the supports and the supporting devices, which serve as mechanical support and electrical insulation. The insulators are in an open-air, unprotected environment, and industrial pollutants and airborne particulates in the air can easily accumulate on the surface of the insulators, forming a pollution layer. If it encounters rain, snow or other humid weather, the pollution layer will gradually become wetted, and under the action of a strong electric field, it will form a surface discharge, which will cause flashover and even cause a large-scale power outage.
[0003] Currently, railway management departments conduct annual surveys of all pollution sources within a 2-kilometer radius, using methods such as the equivalent salt density method to estimate the pollution level of insulators in electrified sections, thereby determining the insulator cleaning cycle under different pollution conditions. However, this method fails to achieve real-time monitoring, posing significant safety hazards during the monitoring cycle. Existing real-time monitoring is conducted from both electrical and non-electrical parameter perspectives. However, electrical parameters are easily affected by the complex surrounding electromagnetic environment, resulting in large errors. The sensors used for non-electrical parameter perspectives are generally contact-type installations, suitable for the enclosures of sealed and opaque power equipment, but not for exposed conductors or open outdoor environments.
[0004] To address the problems with existing devices, it is necessary to research a more accurate insulator surface discharge detection and positioning system that can monitor in real time. Utility Model Content
[0005] This invention provides a contact wire insulator surface discharge detection and positioning system, which aims to solve the technical problem of inaccurate detection in existing devices.
[0006] To solve the aforementioned technical problems, the present invention adopts the following technical solution:
[0007] A surface discharge detection and location system for overhead contact line insulators includes a sampling module, a core board, a power supply module, and peripheral modules.
[0008] The sampling module includes a microphone sampling module and an image acquisition module. The microphone sampling module includes multiple microphones, which are randomly arrayed on the same plane. Each microphone and the image acquisition module are connected to the core board.
[0009] The peripheral module and power module are respectively connected to the core board.
[0010] In this invention, the microphone can collect the high-frequency sound waves generated by the surface discharge of the insulator, thereby detecting the insulator. In this invention, the microphone is 2m away from the insulator, so the sound waves generated by the surface discharge of the insulator are approximately plane waves. The microphone is a far-field pickup microphone. In addition, all microphones are MEMS microphones. The microphones are all set on a planar substrate and are randomly distributed in an array. This random distribution can improve the spatial resolution and make the detection more accurate.
[0011] In this utility model, the core board is RK3588.
[0012] Preferably, the microphone sampling module includes 128 microphones, which are divided into 16 groups. The 16 groups of microphones are evenly distributed on the substrate, with 8 microphones in each group randomly arranged among each other.
[0013] In this invention, it should be noted that the microphones are randomly and uniformly distributed on the substrate. Uniform distribution means that the 16 groups of microphones are evenly distributed on the substrate, avoiding the concentration of microphones in a certain area of the substrate, which would reduce the detection accuracy. Random distribution means that the microphones in each group are randomly distributed, thus forming a uniform random distribution, which makes the detection accuracy higher.
[0014] Preferably, the spacing between two adjacent microphones is 15±1mm.
[0015] Preferably, the 128 microphones are evenly and randomly distributed within a circle with a diameter of 150 mm on the substrate.
[0016] Preferably, the spacing between two adjacent microphones is 15mm. It should be noted that when the distance between the receiving point and the transmitting point is greater than twice the far-field boundary, it can be considered to be in the far-field distance. That is, in this invention, if the wavelength is λ, the microphone spacing is d, and the sound velocity is c, then the distance s from the discharge position to the array coordinate center can be roughly estimated using the following formula. It should be noted that this formula is an existing formula:
[0017]
[0018] In this invention, to ensure that the 128 microphones are located within a circle with a diameter of 150mm on the substrate and at a far-field distance, a spacing of 15mm is chosen between adjacent microphones. Through extensive field experiments and analysis of the ultrasonic characteristics of surface discharge in railway insulators, it is found that the ultrasonic signal of surface discharge in insulators is mainly distributed in the range of 25kHz±3kHz. Therefore, taking the sound velocity c as 340m / s and d as 15mm, we obtain s = 3.7×10 4It is much larger than the microphone distance from the insulator of 2000mm, thus ensuring that the microphone distribution area is within a circle with a diameter of 150mm and located at the far field distance.
[0019] Preferably, the sampling module further includes an FPGA, the 128 microphones are respectively connected to the FPGA, the FPGA is connected to the core board, and the microphones output PDM digital signals and clock signals from port 1 and port 4 respectively, and port 1 and port 4 are respectively connected to the corresponding PDM_DAT and PDM_CLK pins on the FPGA.
[0020] Preferably, the image acquisition module includes a camera, which is connected to the core board via MIPI. The camera is positioned at the center of the substrate, and microphones are distributed around the camera. The camera is an OV5695 camera, and it is used to acquire image signals.
[0021] Preferably, the peripheral module includes a TF card, an RJ45 port, and a USB port. The TF card, RJ45 port, and USB port are respectively connected to the core board. The TF card is used for local data storage, the RJ45 port is used for remote monitoring, and the USB port is used to connect to external devices to export data. The TF card is connected to the corresponding SDMMC pin of the RK3588 core board. The RK3588 core board is connected to an external PHY chip through the GMAC pin. The RJ45 port is connected to the PHY chip. There are two USB ports.
[0022] Preferably, the power module includes an input power supply and four step-down circuits, namely a 5V step-down circuit, a 4V step-down circuit, a 3.3V step-down circuit, and a 1.8V step-down circuit. The input terminals of the four step-down circuits are respectively connected to the input power supply, and the output terminals are connected to components to meet the needs of each component.
[0023] Preferably, the core board is connected to a display module via a MIPI transmission interface. The display module is an LCD high-definition touch screen, which enables function settings and display of test data.
[0024] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:
[0025] This utility model provides a contact wire insulator surface discharge detection and positioning system. By setting up 128 microphones and randomly arranging them on a substrate, it achieves sampling of multiple characteristic audio signals and improves the sampling accuracy of the microphones. This helps to realize the positioning and real-time monitoring of insulator pollution flashover. Image data is collected by an external OV5695 camera, and data storage and transmission are realized through an external peripheral module. Function settings and monitoring data display are realized through an external display module. Attached Figure Description
[0026] This utility model will be described by way of example and with reference to the accompanying drawings, wherein:
[0027] Figure 1 This is a system framework diagram of the present invention;
[0028] Figure 2 This is a circuit diagram of the FPGA portion of this utility model;
[0029] Figure 3 This is another part of the FPGA circuit diagram of this utility model;
[0030] Figure 4 This is a diagram showing the distribution of the microphone and camera on the substrate of this utility model;
[0031] Figure 5 This is the circuit diagram of the camera of this utility model;
[0032] Figure 6 This is the circuit diagram of the first part of the core board of this utility model;
[0033] Figure 7 This is the circuit diagram of the second part of the core board of this utility model;
[0034] Figure 8 This is the circuit diagram of the third part of the core board of this utility model;
[0035] Figure 9 This is the circuit diagram of the fourth part of the core board of this utility model.
[0036] Figure label:
[0037] 1-Microphone sound wave collection hole, 2-Camera acquisition hole, 3-Substrate. Detailed Implementation
[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments and accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and marked in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0039] In the description of the embodiments of this application, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility product is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0040] like Figures 1-9 As shown, it includes a sampling module, a core board, a power supply module, and peripheral modules.
[0041] The sampling module includes a microphone sampling module and an image acquisition module. The microphone sampling module includes multiple microphones, which are randomly arrayed on the same plane. Each microphone and the image acquisition module are connected to the core board.
[0042] The peripheral module and power module are respectively connected to the core board.
[0043] In this embodiment, the microphone can collect the high-frequency sound waves generated by the surface discharge of the insulator, thereby detecting the insulator. In this invention, the microphone is 2m away from the insulator, so the sound waves generated by the surface discharge of the insulator are approximately plane waves. The microphone is a far-field pickup. In addition, the microphones are all MEMS silicon digital microphones, model SPH0641LU4H. The sampling frequency of this microphone is 20Hz-80KHz ultrasonic signals. The microphones are all set on the planar substrate 3 and are randomly distributed in an array. This random distribution can improve the spatial resolution and make the detection more accurate. In this embodiment, the core board is RK3588.
[0044] In another embodiment, the microphone sampling module includes 128 microphones, which are divided into 16 groups. The 16 groups of microphones are evenly distributed on the substrate 3, with 8 microphones in each group randomly arranged among each other.
[0045] The microphones are randomly and uniformly distributed on the substrate 3. The uniform distribution means that 16 groups of microphones are evenly distributed on the substrate 3. Specifically, 128 microphone sound wave collecting holes 1 are randomly and evenly opened on the substrate 3. Each microphone sound wave collecting hole 1 contains one microphone, which avoids the microphones being concentrated in a certain area of the substrate 3, thereby reducing the detection accuracy. The random distribution means that the microphones in each group are randomly distributed, thus forming a uniform random distribution, which makes the detection accuracy higher.
[0046] In another embodiment, the spacing between two adjacent microphones is 15±1mm, and the 128 microphones are evenly and randomly distributed within a circle with a diameter of 150mm on the substrate 3.
[0047] In another embodiment, the spacing between two adjacent microphones is 15mm. It should be noted that when the distance between the receiving point and the transmitting point is greater than twice the far-field boundary, it can be considered to be in the far-field distance. That is, in this invention, if the wavelength is λ, the microphone spacing is d, and the sound velocity is c, then the distance s from the discharge location to the center of the array coordinates can be roughly estimated using the following formula. It should be noted that this formula is an existing formula:
[0048]
[0049] In this embodiment, to ensure that the 128 microphones are located within a circle with a diameter of 150mm on the substrate and at a far-field distance, the spacing between two adjacent microphones is chosen to be 15mm. Through extensive field experiments and analysis of the ultrasonic characteristics of surface discharge in railway insulators, it was found that the ultrasonic signal of surface discharge in insulators is mainly distributed in the range of 25kHz±3kHz. Therefore, taking the speed of sound c as 340m / s and d as 15mm, we can obtain s = 3.7×10 4 It is much larger than the microphone distance from the insulator of 2000mm, thus ensuring that the microphone distribution area is within a circle with a diameter of 150mm and located at the far field distance.
[0050] In this embodiment, the sampling module further includes an FPGA. The 128 microphones are connected to the FPGA, which is connected to the core board. The DAT and CLK pins of the microphones are connected to the corresponding PDM_DAT and PDM_CLK pins on the FPGA, respectively, and output PDM digital signals and clock signals. A capacitor is connected in parallel between the microphone's VDD and GND for filtering. The L / R pins of two adjacent microphones in the same group are connected to a 3.3V power supply and the negative terminal GND, or the negative terminal GND and the 3.3V power supply, respectively.
[0051] The GMAC1 pin on the RK3588 core board is connected to the corresponding FIO pin on the FPGA. Specifically, the GMAC1_TXD0, GMAC1_TXD1, GMAC1_TXD2, GMAC1_TXD3, GMAC1_TXEN, GMAC1_TXCLK, GMAC1_RXD0, GMAC1_RXD1, GMAC1_RXD2, GMAC1_RXD3, GMAC1_RXDV_CRS, GMAC1_RXCLK, GMAC1_MDC, GMAC1_MDIO, and GMAC1_RSTn_L pins on the RK3588 core board are respectively connected to the FIO_36, FIO_37, FIO_38, FIO_39, FIO_40, FIO_41, FIO_44, FIO_45, FIO_46, FIO_47, FIO_48, and FIO_50 pins on the FPGA. In this embodiment, the FPGA acts as an intermediate processing unit, undertaking key tasks such as signal acquisition, real-time processing, and protocol conversion.
[0052] In this embodiment, the image acquisition module includes a camera. The camera is connected to the core board via MIPI low-voltage differential signal. The base plate 3 has a camera acquisition hole 2 at its center. The camera is located inside the camera acquisition hole 2, and microphones are distributed around the camera. The camera is an OV5695 camera. The camera is used to acquire image signals. The RK3588 core board is connected to the corresponding interface of the camera via the MIPI_CSI interface.
[0053] In this embodiment, the peripheral module includes a TF card, an RJ45 connector, and a USB port. The TF card, RJ45 connector, and USB port are connected to the core board. The TF card is used for local data storage, the RJ45 connector is used for remote monitoring, and the USB port is used to connect to external devices to export data. The TF card is connected to the SDMMC pin of the RK3588 core board. The RK3588 core board is connected to an external PHY chip via the GMAC pin. The PHY chip is an RTL8211F and is responsible for digital-to-analog conversion. The RJ45 connector is connected to the PHY0 pin of the PHY chip. In this embodiment, there are two USB ports, and the RK3588 core board is connected to the USB ports via the TYPEC0 pin.
[0054] In this embodiment, the power module includes an input power supply and four step-down circuits. The four step-down circuits are a 5V step-down circuit, a 4V step-down circuit, a 3.3V step-down circuit, and a 1.8V step-down circuit. The input terminals of the four step-down circuits are respectively connected to the input power supply, and the output terminals are connected to the components to meet the needs of each component.
[0055] In this embodiment, the core board is connected to a display module via a MIPI transmission interface. The display module is an LCD high-definition touch screen, which enables function settings and display of test data.
[0056] In this embodiment, as Figures 6-9 As shown, these represent the first, second, third, and fourth parts of the RK3588, which together form the entire RK3588 core board. The ports of the first, second, third, and fourth parts of the RK3588 are connected to the corresponding FPGA, camera, and peripheral modules.
[0057] In this embodiment, the peripheral module settings, voltage divider circuit, RK3588 core board, FPGA, OV5695 camera and external display module are all existing technologies. The structure of each module and its circuit connection with the RK3588 core board will not be described in detail here.
[0058] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A surface discharge detection and positioning system for contact wire insulators, characterized in that, It includes a sampling module, a core board, a power supply module, and peripheral modules. The sampling module includes a microphone sampling module and an image acquisition module. The microphone sampling module includes multiple microphones, which are randomly distributed on the same substrate (3). Each microphone and the image acquisition module are respectively connected to the core board. The peripheral module and power module are respectively connected to the core board.
2. The contact wire insulator surface discharge detection and positioning system according to claim 1, characterized in that: The microphone sampling module includes 128 microphones, which are divided into 16 groups. The 16 groups of microphones are evenly distributed on the substrate (3), and the 8 microphones in each group are randomly arranged among each other.
3. The contact wire insulator surface discharge detection and positioning system according to claim 2, characterized in that: The spacing between two adjacent microphones is 15±1mm.
4. The contact wire insulator surface discharge detection and positioning system according to claim 2, characterized in that: The sampling module also includes an FPGA, and the 128 microphones are connected to the FPGA, which is connected to the core board.
5. The contact wire insulator surface discharge detection and positioning system according to claim 1, characterized in that: The image acquisition module includes a camera, which is connected to the core board via MIPI.
6. The contact wire insulator surface discharge detection and positioning system according to claim 1, characterized in that: The peripheral module includes a TF card, an RJ45 port, and a USB port, which are respectively connected to the core board.
7. The contact wire insulator surface discharge detection and positioning system according to claim 1, characterized in that: The power module includes an input power supply and four step-down circuits, namely a 5V step-down circuit, a 4V step-down circuit, a 3.3V step-down circuit, and a 1.8V step-down circuit. The input terminals of the four step-down circuits are respectively connected to the input power supply.
8. A contact wire insulator surface discharge detection and positioning system according to any one of claims 1-7, characterized in that: The core board is connected to a display module via a MIPI transmission interface.