Memory skeleton layer card structure

Abstract

The utility model discloses a memory skeleton layer card structure, comprising a memory skeleton layer, an antenna and a chip which are embedded in the skeleton layer, and an upper substrate and a lower substrate which wrap the skeleton layer. The memory skeleton layer is of a grid structure with shape recovery capability, the surface of the memory skeleton layer is provided with an antenna positioning groove and a chip accommodating cavity, and the grid structure of the memory skeleton layer enables the memory skeleton layer to have excellent shape recovery capability, so that the card can be quickly recovered to an original state even if the card is subjected to external force of bending and twisting in a carrying or using process; due to the design of the antenna positioning groove and the chip accommodating cavity, the antenna and the chip can be accurately and stably embedded into the card, and the communication quality between the card and the read-write equipment is ensured; the grid structure of the memory skeleton layer and the coating of the upper substrate and the lower substrate jointly form a multi-layer protection system of the card, so that the card has excellent bending resistance, tear resistance and wear resistance, and can keep stable performance in a severe use environment.

Description

Technical Field

[0001] This utility model relates to the field of card technology, specifically to a memory skeleton layer card structure. Background Technology

[0002] In the fields of information technology and data storage, memory skeleton cards, as an important information carrier, are widely used in various electronic devices, such as smartphones, tablets, and e-readers. These cards typically carry large amounts of data and information and need to maintain good physical performance and stability to ensure the accuracy and readability of the data.

[0003] However, traditional memory skeleton card structures have some inherent design flaws, the most prominent of which is their weak resistance to bending. During manufacturing, transportation, and use, memory skeleton cards may be subjected to various external forces, such as compression and bending. These forces often cause changes in the card's internal structure, and may even lead to data corruption or loss. Summary of the Invention

[0004] To overcome the shortcomings of existing technical solutions, this utility model provides a memory skeleton layer card structure, which can effectively solve the problem of cards being easily bent as mentioned in the background technology.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a memory skeleton layer card structure, including a memory skeleton layer, an antenna and a chip embedded in the skeleton layer, and an upper substrate and a lower substrate covering the skeleton layer; the memory skeleton layer is a grid structure with shape recovery capability, and its surface is provided with an antenna positioning groove and a chip accommodating cavity.

[0006] Furthermore, the grid cells of the memory skeleton layer are honeycomb-shaped, wavy, or rhomboid in shape.

[0007] Furthermore, the depth of the antenna positioning slot is 1.1-1.5 times the antenna wire diameter, and the slot width is within ±0.02mm of the wire diameter tolerance.

[0008] Furthermore, the chip accommodating cavity is filled with a conductive adhesive layer, the thickness of which is 50-70% of the chip thickness.

[0009] Furthermore, the upper substrate is provided with a first flexible layer for fixing the antenna and a second flexible layer for fixing the chip.

[0010] Furthermore, the width of the first flexible layer is consistent with the antenna positioning slot, so it can be installed inside the antenna positioning slot.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] The memory skeleton layer adopts a honeycomb / wave / diamond grid structure, which gives the card excellent bending and compression resistance. Combined with shape recovery capability, it can automatically restore its initial shape after external force, significantly improving product durability.

[0013] The antenna positioning slot depth is designed to be 1.1-1.5 times the wire diameter, and with a tolerance control of ±0.02mm, the antenna can be embedded without offset. The chip accommodating cavity is flexibly fixed by conductive adhesive (thickness of 50-70% of the chip thickness), which not only ensures the reliability of electrical connection, but also avoids the risk of thermal damage from traditional welding processes.

[0014] The upper substrate integrates a dual flexible layer structure. The first flexible layer is matched with the antenna positioning slot in width to form a physical limiting protection. The second flexible layer covers the chip with nanoscale buffer material to reduce impact stress. Attached Figure Description

[0015] Figure 1 The structural three-dimensional representation of this utility model Figure 1 ;

[0016] Figure 2 The structural three-dimensional representation of this utility model Figure 2 ;

[0017] Figure 3 This is a schematic diagram of the memory skeleton layer structure of this utility model. Figure 1 ;

[0018] Figure 4 This is a schematic diagram of the memory skeleton layer structure of this utility model. Figure 2 ;

[0019] Figure 5 This is a cross-sectional view of the structure of this utility model;

[0020] Figure 6 This is a schematic diagram of the memory skeleton layer structure of this utility model. Figure 3 .

[0021] Numbering on the map:

[0022] 1-Upper substrate, 2-Lower substrate, 3-Memory skeleton layer, 4-Groove, 5-Chip, 6-Antenna, 11-First flexible layer, 12-Second flexible layer, 31-Antenna positioning groove, 32-Chip accommodating cavity, 33-Conductive adhesive layer. Detailed Implementation

[0023] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0024] The following specific examples illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. This disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this disclosure. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure. Example

[0025] like Figure 1-6 As shown, this utility model provides a memory skeleton layer 3 card structure, including a memory skeleton layer 3, an antenna 6 and a chip 5 embedded in the skeleton layer, and an upper substrate and a lower substrate 2 covering the skeleton layer; the memory skeleton layer 3 is a grid structure with shape recovery capability, and its surface is provided with an antenna positioning groove 31 and a chip accommodating cavity 32.

[0026] The memory skeleton layer 3 disperses external forces, such as bending and compression, through a grid structure. It utilizes material phase change or molecular chain recombination to achieve automatic recovery of the original shape after deformation, thereby improving the card's fatigue resistance.

[0027] Shape memory polymer (TPU): Shore hardness 70A-95A, room temperature elastic recovery, suitable for low-cost smart cards;

[0028] Nickel-titanium alloy: phase transformation temperature 40-80℃, austenite phase recovery triggered by heating, used in high reliability scenarios.

[0029] Honeycomb / wavy mesh: density 15-25 mesh / cm², optimized stress distribution.

[0030] Diamond mesh: The overlapping diagonals enhance shear resistance, making it suitable for high-strength requirements.

[0031] In high-frequency bending scenarios, such as transit cards, or in extreme temperature environments, such as vehicle cards, to prevent permanent deformation that could cause antenna 6 to break or chip 5 to fail.

[0032] The antenna positioning slot 31 and the chip accommodating cavity 32 are pre-formed by laser etching to ensure the positional accuracy of the antenna 6 coil and the chip 5, reducing signal transmission loss, such as in a 13.56MHz RFID card. This avoids poor contact or signal attenuation caused by displacement in traditional adhesive bonding processes.

[0033] The skeleton layer, as the core load-bearing structure, is hot-pressed together with the upper / lower substrate 2 (PET / PC material) to form a lightweight package that balances mechanical strength and flexibility.

[0034] The grid structure of the memory skeleton layer 3 gives it excellent shape recovery capabilities. Even if the card is subjected to bending or twisting forces during carrying or use, it can quickly return to its original state, ensuring the card's functionality and lifespan.

[0035] The design of the antenna positioning slot 31 and the chip accommodating cavity 32 allows the antenna 6 and chip 5 to be precisely and stably embedded in the card. This ensures the communication quality between the card and the reader / writer and also avoids malfunctions or damage caused by the antenna 6 or chip 5 becoming loose.

[0036] The grid structure of the memory skeleton layer 3, along with the covering of the upper and lower substrates 2, together constitute the card's multi-layer protection system. This gives the card excellent resistance to bending, tearing, and abrasion, enabling it to maintain stable performance in harsh environments.

[0037] Because the antenna 6 and the chip 5 are precisely fixed in the card, the electrical connection between them is more stable and reliable, reducing communication failures and error rates.

[0038] See Figure 6 The grid cell shape of memory skeleton layer 3 is honeycomb, wavy or rhomboid. When the grid cell is honeycomb, the Shore hardness of TPU is 70A-85A.

[0039] The honeycomb grid cells possess extremely high structural strength and stability. Their unique hexagonal structure maximizes the dispersion of external forces, allowing the card to better maintain its integrity when subjected to pressure or bending. Furthermore, the honeycomb grid helps optimize internal space allocation, enabling embedded components such as antenna 6 and chip 5 to utilize the card's internal space more efficiently.

[0040] The wavy mesh unit gives the card a degree of flexibility and elasticity, allowing it to better adapt to various usage scenarios. This shape also helps to provide additional cushioning and shock absorption when the card is subjected to external forces, thereby reducing the risk of card damage. In addition, the wavy mesh can improve the surface flatness of the card, allowing components such as antenna 6 and chip 5 to fit more tightly on the card, improving communication efficiency.

[0041] The diamond-shaped grid cells maintain the stability of the card structure while also possessing an aesthetic appeal. Their unique geometry makes the card more visually attractive and improves its legibility. Furthermore, the diamond-shaped grid cells provide multi-directional support, allowing for more even distribution of pressure when subjected to external forces, thus enhancing the card's durability.

[0042] The depth of the antenna positioning slot 31 is 1.1-1.5 times the diameter of the antenna 6 wire, and the slot width and wire diameter tolerance are ≤±0.02mm.

[0043] When the depth of the antenna positioning slot 31 is 1.1-1.5 times the diameter of the antenna 6, the antenna 6 can be tightly and stably embedded in the slot. This ensures a firm connection between the antenna 6 and the card, and avoids the problem of the antenna 6 becoming loose or falling off due to the slot being too shallow.

[0044] A suitable slot depth helps reduce the air gap between antenna 6 and the card, thereby reducing signal loss during transmission. This helps improve the radiation efficiency and receiving sensitivity of antenna 6, ensuring communication quality between the card and the reader / writer.

[0045] The design requirement of a slot width and wire diameter tolerance of ≤±0.02mm ensures a precise fit between the wire diameter of antenna 6 and the antenna positioning slot 31. This fit helps reduce friction and resistance during the embedding process, making it easier and more accurate to install antenna 6 into the slot.

[0046] Precise tolerances help prevent damage to the antenna 6 or card deformation during installation due to mismatch between the antenna 6 wire diameter and slot width. This helps protect the integrity of the antenna 6 and the stability of the card, extending its lifespan.

[0047] See Figure 4 The chip cavity 32 is filled with a conductive adhesive layer 33. The thickness of the adhesive layer is 50-70% of the thickness of the chip 5. The conductive adhesive layer 33 is a silver-epoxy resin composite material with a silver content of 60-80wt%. After curing, the volume resistivity is ≤1×10⁻³Ω·cm and the shear strength is ≥15MPa. The curing process includes step temperature rise: 80℃ / 30min→120℃ / 30min→150℃ / 60min.

[0048] The conductive adhesive layer 33 serves as an electrical connection bridge between the chip 5 and other parts of the card, ensuring normal communication between the chip 5 and external circuits. The chip 5 generates heat during operation; failure to dissipate heat promptly may affect its performance or even cause damage. The conductive adhesive layer 33 plays a crucial role here, transferring the heat generated by the chip 5 more quickly to other parts of the card or heat dissipation devices, thus ensuring that the temperature of the chip 5 remains within a safe range.

[0049] The conductive adhesive layer 33 not only provides a stable electrical connection but also offers necessary mechanical support for the chip 5. When the card is subjected to external force, the conductive adhesive layer 33 can absorb and disperse some of the stress, protecting the chip 5 from damage. Simultaneously, it also acts as a buffer, extending the card's lifespan.

[0050] The adhesive layer thickness is 50-70% of the chip 5 thickness. This ensures that the conductive adhesive layer 33 can fully cover the chip 5 and provide a stable electrical connection, while avoiding the increase in card thickness and cost caused by an excessively thick adhesive layer.

[0051] The conductive adhesive layer 33 is a silver-epoxy resin composite material with a silver content of 60-80 wt%. Silver, as a conductive filler, can significantly improve the conductivity of the conductive adhesive layer 33; while epoxy resin, as a matrix material, provides good adhesion and mechanical strength.

[0052] See Figure 2 The upper substrate is provided with a first flexible layer 11 for fixing the antenna 6 and a second flexible layer 12 for fixing the chip 5.

[0053] The first flexible layer 11 can fit tightly around the antenna 6, providing stable support. This support helps to ensure that the antenna 6 is fixed in position in the card, preventing the antenna 6 from shifting or falling off due to external forces.

[0054] As a key component for communication between the card and the outside world, the integrity of antenna 6 is crucial to the card's performance. The first flexible layer 11 effectively protects antenna 6 from potential damage such as mechanical shock and chemical corrosion, thereby extending the service life of antenna 6.

[0055] The second flexible layer 12 tightly encloses the chip 5, ensuring a stable and reliable electrical connection between it and the rest of the card. As the core component of the card, the chip 5 is highly vulnerable. The second flexible layer 12 provides necessary cushioning and protection for the chip 5, reducing the risk of damage when subjected to external forces.

[0056] Chip 5 generates heat during operation, and if it is not dissipated in time, its performance may be affected. The second flexible layer 12 can help disperse and conduct the heat generated by chip 5 to a certain extent, ensuring that chip 5 always operates within a suitable temperature range.

[0057] See Figure 5 The width of the first flexible layer 11 is the same as that of the antenna positioning slot 31, and it can be installed in the antenna positioning slot 31.

[0058] Since the width of the first flexible layer 11 is exactly the same as that of the antenna positioning slot 31, it can fit tightly around the antenna 6 and fix the antenna 6 precisely in the positioning slot. This helps to ensure the stability of the antenna 6 in the card and avoid the antenna 6 from shifting or falling off due to external forces, thereby ensuring a stable and reliable electrical connection between the antenna 6 and other parts of the card.

[0059] The tight fit between the first flexible layer 11 and the antenna positioning slot 31 helps reduce the air gap between the antenna 6 and the card, thus reducing signal loss during transmission. This close fit also improves the radiation efficiency and receiving sensitivity of the antenna 6, enabling the card to communicate more efficiently with the reader / writer.

[0060] The first flexible layer 11 not only fixes the position of the antenna 6, but also provides additional protection for the antenna 6. It can absorb and disperse shocks and vibrations from the outside, reducing the risk of damage to the antenna 6; the first flexible layer 11 can also prevent chemical corrosion of the antenna 6 to a certain extent, thereby extending the service life of the antenna 6.

[0061] Since the first flexible layer 11 can be installed precisely within the antenna positioning slot 31, no additional fasteners or adhesives are needed to secure the antenna 6. This simplifies the card manufacturing process, reduces production costs, and improves production efficiency.

[0062] The upper substrate has an aluminized polyester film shielding layer on its inner surface, which is bonded to the substrate via hot pressing. The aluminized polyester film shielding layer possesses excellent electromagnetic shielding performance. In the card, electronic components such as antenna 6 and chip 5 may generate electromagnetic interference during operation. This interference not only affects the card's own performance but may also interfere with other electronic devices. The aluminized polyester film shielding layer effectively blocks and weakens the propagation of these electromagnetic waves, thereby reducing the impact of electromagnetic interference and ensuring normal communication between the card and external devices.

[0063] In the description of this utility model, it should be understood that the terms "middle", "length", "upper", "lower", "front", "rear", "vertical", "horizontal", "inner", "outer", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0064] In this invention, unless otherwise expressly specified and limited, the first feature "on" the second feature may be in direct contact with the first feature, or indirect contact with the first feature through an intermediate medium. "A plurality of" means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.

[0065] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0066] The above description is merely illustrative of the embodiments of this utility model and is not intended to limit the scope of this utility model. For those skilled in the art, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model without creative labor should be included within the protection scope of this utility model.

Claims

1. A memory skeleton layer card structure, characterized in that: It includes a memory skeleton layer, an antenna and a chip embedded in the skeleton layer, and an upper substrate and a lower substrate covering the skeleton layer; the memory skeleton layer is a grid structure with shape recovery capability, and its surface is provided with an antenna positioning groove and a chip accommodating cavity.

2. The memory skeleton layer card structure according to claim 1, characterized in that: The grid cells of the memory skeleton layer are honeycomb, wavy, or rhomboid in shape.

3. The memory skeleton layer card structure according to claim 1, characterized in that: The depth of the antenna positioning slot is 1.1-1.5 times the antenna wire diameter, and the slot width is within ±0.02mm of the wire diameter tolerance.

4. The memory skeleton layer card structure according to claim 1, characterized in that: The chip accommodating cavity is filled with a conductive adhesive layer, the thickness of which is 50-70% of the chip thickness.

5. The memory skeleton layer card structure according to claim 1, characterized in that: The upper substrate is provided with a first flexible layer for fixing the antenna and a second flexible layer for fixing the chip.

6. The memory skeleton layer card structure according to claim 5, characterized in that: The width of the first flexible layer is the same as that of the antenna positioning slot, so it can be installed inside the antenna positioning slot.

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