Component sealing and insulating structure of FPC (flexible printed circuit) in display module

By combining insulating Mylar with pressure-sensitive adhesive layers in the display module, sealing and insulation of FPC components are achieved, solving the problems of complex processes, high costs, and UV adhesive diffusion in existing technologies, thereby improving production efficiency and reducing costs.

CN224203787UActive Publication Date: 2026-05-05SHENZHEN TXD TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN TXD TECH CO LTD
Filing Date
2025-05-26
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

Existing methods for protecting FPC components in display modules suffer from problems such as cumbersome processes, high costs, low production efficiency, and poor flow and diffusion of UV adhesive.

Method used

It adopts a sealing structure that combines insulating Mylar with a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer surrounds and covers the device area and is tightly bonded to the FPC, avoiding the use of UV adhesive and the curing process.

Benefits of technology

It simplifies the process, improves production efficiency, reduces costs, and facilitates subsequent disassembly, avoiding the problem of UV adhesive flow and diffusion.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model discloses a component sealing and insulating structure of an FPC in a display module, which comprises a module FPC and an insulating mylar, a component area is formed on the module FPC, the insulating mylar comprises a mylar body and a pressure-sensitive adhesive layer arranged around the edge of the mylar body, and the pressure-sensitive adhesive layer is arranged on the component area. The insulating mylar is attached to a device area of the module FPC and completely covers the corresponding device area, and the pressure-sensitive adhesive layer is tightly bonded with the module FPC. The beneficial effects of the utility model are that the pressure-sensitive adhesive is arranged on the mylar body to realize a surrounding sealing form, so that the insulation and protection of the device area can be realized, and compared with the prior art, the processes of dispensing UV adhesive, passing through a UV furnace to carry out UV curing and the like are not needed, the process complexity is reduced, the production efficiency is improved, and the production cost is reduced. And moreover, the cost can be saved without using UV glue, and the insulating mylar can be conveniently disassembled in subsequent working procedures such as reworking and analysis.
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Description

Technical Field

[0001] This utility model relates to the field of display module technology, and in particular to a sealing and insulation structure for FPC components in a display module. Background Technology

[0002] In display modules, to improve reliability, the device area of ​​the FPC module needs to be protected. There are three common solutions: 1. Attach insulating Mylar to the device area without additional sealing around it. This method is prone to protection failure due to bending, stretching, or exposure to high temperature and humidity. 2. Apply a full layer of UV adhesive to completely encapsulate the device area. This method uses a large amount of UV adhesive and requires UV curing in a UV oven, resulting in high cost and multiple processes. Due to the fluidity of UV adhesive, UV diffusion can cause defects, and it is inconvenient to remove the adhesive when analysis or rework is required. 3. Combine insulating Mylar with UV adhesive curing. First, the insulating Mylar is attached, then UV adhesive is applied around it and cured. This method is cumbersome, requiring attaching Mylar, applying adhesive, and curing the UV adhesive in a UV oven, impacting production efficiency and also subject to UV adhesive diffusion.

[0003] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content

[0004] The purpose of this utility model is to overcome the shortcomings of the prior art and provide a sealing and insulation structure for the components of the FPC in a display module.

[0005] The technical solution of this utility model is as follows: This utility model provides a component sealing and insulation structure for an FPC in a display module, including: a module FPC and insulating Mylar. A device area is formed on the module FPC. The insulating Mylar includes a Mylar body and a pressure-sensitive adhesive layer disposed around the edge of the Mylar body. The insulating Mylar is attached to the device area of ​​the module FPC and completely covers the corresponding device area. The pressure-sensitive adhesive layer is tightly bonded to the module FPC.

[0006] Furthermore, the distance between the inner edge of the pressure-sensitive adhesive layer and the device in the device area is greater than or equal to 1.5 mm.

[0007] Furthermore, the width of the pressure-sensitive adhesive layer is 0.3mm-0.5mm.

[0008] Furthermore, the thickness of the pressure-sensitive adhesive layer is 0.1 mm.

[0009] The beneficial effects of this utility model by adopting the above solution are as follows: by setting pressure-sensitive adhesive on the Mylar body to achieve a surrounding seal, not only can the device area be insulated and protected, but also, compared with the prior art, there is no need to go through the processes of applying UV adhesive and UV curing in a UV oven, which reduces the complexity of the process and improves the production efficiency. In addition, the elimination of the need to use UV adhesive can also save costs and facilitate the disassembly of the insulating Mylar in subsequent rework, analysis and other processes. Attached Figure Description

[0010] Figure 1 This is a structural schematic diagram of an embodiment of the present utility model.

[0011] Figure 2 This is a schematic diagram of the structure of insulating Mylar according to an embodiment of the present invention. Detailed Implementation

[0012] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0013] Please refer to the following: Figure 1 and Figure 2 In this embodiment, the present invention provides a component sealing and insulation structure for an FPC in a display module, comprising: a module FPC 1 and an insulating Mylar 2. The module FPC 1 has a component area formed thereon. The insulating Mylar 2 includes a Mylar body and a pressure-sensitive adhesive layer 21 disposed around the edge of the Mylar body. The insulating Mylar 2 is attached to the component area of ​​the module FPC 1 and completely covers the corresponding component area. By pressing the pressure-sensitive adhesive layer 21 with a machine tool, the pressure-sensitive adhesive layer 21 is ensured to be tightly bonded to the module FPC 1.

[0014] In this embodiment, the distance between the inner edge of the pressure-sensitive adhesive layer 21 and the device in the device area is greater than or equal to 1.5 mm, so as to avoid damage to the device when the pressure-sensitive adhesive layer 21 is pressed.

[0015] In this embodiment, the width of the pressure-sensitive adhesive layer 21 is 0.3mm-0.5mm, and the thickness of the pressure-sensitive adhesive layer 21 is 0.1mm.

[0016] In summary, the beneficial effects of this solution are as follows: by setting pressure-sensitive adhesive on the Mylar body to achieve a surrounding seal, not only can the device area be insulated and protected, but also, compared with the existing technology, there is no need to go through the processes of applying UV adhesive and UV curing in a UV oven, which reduces the complexity of the process and improves the production efficiency. Furthermore, the elimination of the need to use UV adhesive can also save costs and facilitate the disassembly of the insulating Mylar in subsequent rework, analysis and other processes.

[0017] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A sealing and insulation structure for components in an FPC (Flexible Printed Circuit) of a display module, characterized in that, include: The FPC module and insulating Mylar are provided. The FPC module has a device area formed on it. The insulating Mylar includes a Mylar body and a pressure-sensitive adhesive layer disposed around the edge of the Mylar body. The insulating Mylar is attached to the device area of ​​the FPC module and completely covers the corresponding device area. The pressure-sensitive adhesive layer is tightly bonded to the FPC module.

2. The component sealing and insulation structure of the FPC in the display module according to claim 1, characterized in that, The distance between the inner edge of the pressure-sensitive adhesive layer and the device in the device area is greater than or equal to 1.5 mm.

3. The component sealing and insulation structure of the FPC in the display module according to claim 1 or 2, characterized in that, The width of the pressure-sensitive adhesive layer is 0.3mm-0.5mm.

4. The component sealing and insulation structure of the FPC in the display module according to claim 1 or 2, characterized in that, The thickness of the pressure-sensitive adhesive layer is 0.1 mm.