Imaging detection module and detector

Abstract

The embodiment of the utility model provides an imaging detection module and a detector. The imaging detection module comprises a circuit board, a photodiode array, a supporting layer and a first adhesive layer, the supporting layer is arranged on one side, away from the photodiode array, of the circuit board; the supporting layer is bonded with the circuit board through the first bonding glue layer. On the basis of the supporting effect of the supporting layer, the flatness of the circuit board and the photodiode array is guaranteed, and the situation that when the photodiode array and the circuit board are assembled, due to the fact that thermal expansion coefficients are different, the photodiode array and the circuit board shrink differently, the photodiode array is bent, and the reliability of the photodiode array is improved is avoided. The problem that the quality of an image of detected target information provided by an imaging detection module is reduced after the detected target information is reconstructed by an upper computer is further caused by non-uniform gaps between the photodiode array and the scintillator in subsequent assembly is solved.

Description

Technical Field

[0001] Embodiments of this disclosure relate to the field of detector technology and related technical fields, and more specifically, to an imaging detection module and detector. Background Technology

[0002] Common detector structures used in medical / security / industrial X-ray inspection systems include: Figure 1 and Figure 2 As shown, in the above-described X-ray inspection system, the X-ray source 101 and detector 103 are mounted on a rack. X-rays emitted by the X-ray source 101 penetrate the target 102 and are received by the detector 103. A collimator 201 near or mounted on the detector absorbs most of the scattered rays. The X-rays carrying information about the target are absorbed by the scintillator array 212 on the detector 103. The scintillator array 212 converts the X-rays into light signals, which are absorbed by the photodiode array 211 below and converted into charge signals. The charge signals enter the circuit board 220 through the electrode leads on the same side as the pixels or the electrodes on the opposite side of the pixels. The charge signals are then converted into voltage or digital signals by the charge processing chip 210 on the circuit board 220 and sent to the data acquisition and processing system. Image algorithms are then used to reconstruct the image of the target and ultimately complete the inspection task. In the above applications, when installing detector cards / modules, the midpoint of the card in the X-axis is perpendicular to the focal point of the X-ray source 101. The direction of movement of the target 102 is perpendicular to the plane formed by the X and Y axes. As described above, in the detector system, detector modules 103 are cascaded along the X-direction to form a length sufficient to cover the object / person being inspected, and can be assembled into an arc-shaped or linear detector. Common materials for the scintillator array 212 include CsI(Tl), CdWO4, Gd2O2S, GGAG, and ZnSe. Pixels 301 and 302 are on the scintillator array 212 and photodiode array 211, respectively, and pixel 303 is the pixel formed by combining 301 and 302.

[0003] A new, low-cost X-ray imaging detection module is being gradually adopted. This module is a structure found in detector 103, such as... Figure 3As shown, a back-illuminated photodiode array 211 is directly mounted on a low-cost epoxy fiberglass (FR4) circuit board 220. This type of photodiode array has metal electrodes 213 implanted on the electrode pads on the signal output side for outputting current signals from the corresponding pixels of the photodiode array. Simultaneously, the corresponding circuit board has pads 218 for receiving current signals. During installation, conductive adhesive or flux 214 is used to electrically connect the electrodes 213 to the pads 218. Finally, bottom filler adhesive 215 is used to fill the gaps between the photodiode array chip 211 and the circuit board 220, excluding the conductive adhesive covering 213 and 218. Finally, optical coupling adhesive is used to bond the scintillator array 212 to the photodiode array 211, ultimately forming an X-ray imaging detection module.

[0004] However, in actual operation, due to the different coefficients of thermal expansion between the photodiode array 211 and the circuit board 220, and the fact that the photodiode array 211 is very thin, usually less than 0.8 mm, the photodiode array 211 bends during the heating and curing of the conductive adhesive 214 due to different shrinkage. This leads to uneven gaps between the photodiode array 211 and the scintillator array 212 during subsequent assembly, resulting in a decrease in the image quality of the detected target information provided by the final imaging detection module after reconstruction by the host computer. Utility Model Content

[0005] The embodiments described herein provide an imaging detection module and detector that solve the problem of image quality degradation after reconstruction by the host computer due to bending of the photodiode array, which causes the image of the detected target information provided by the imaging detection module to be degraded.

[0006] According to a first aspect of the present disclosure, an imaging detection module is provided, comprising at least: a circuit board, a photodiode array, a support layer, and a first adhesive layer;

[0007] The support layer is disposed on the side of the circuit board away from the photodiode array;

[0008] The support layer is bonded to the circuit board via the first adhesive layer;

[0009] The vertical projection of the support layer and the first adhesive layer on the circuit board overlaps with the vertical projection of the photodiode array on the circuit board.

[0010] In some embodiments of this disclosure, a charge processing chip, a metal support, a third adhesive layer, and a fourth adhesive layer are also included;

[0011] The charge processing chip is disposed on the side of the circuit board away from the photodiode array;

[0012] The metal bracket includes a second support platform;

[0013] The third adhesive layer includes a first adhesive structure and a second adhesive structure. The support layer is bonded to the metal bracket through the first adhesive structure, and the charge processing chip is bonded to the metal bracket through the second adhesive structure.

[0014] The second support platform is C-shaped, and the fourth adhesive layer includes a third adhesive structure and a fourth adhesive structure;

[0015] The third bonding structure and the second support platform are respectively arranged in a corresponding manner, and the fourth bonding structure is arranged parallel and symmetrically at the edge of the support layer in the X-axis direction.

[0016] The circuit board is bonded to the second support platform of the metal bracket via the third bonding structure, and the support layer is bonded to the metal bracket via the fourth bonding structure.

[0017] In some embodiments of this disclosure, the vertical projection of the third bonding structure onto the circuit board overlaps with the vertical projection of the second support platform onto the circuit board in the Z-axis direction, and the fourth bonding structure is arranged parallel and symmetrically at the edge of the support layer in the X-axis direction.

[0018] The circuit board is bonded to the second support platform of the metal bracket via the third bonding structure, and the support layer is bonded to the metal bracket via the fourth bonding structure.

[0019] In some embodiments of this disclosure, the circuit board is aligned with the photodiode array on one side.

[0020] In some embodiments of this disclosure, a flexible circuit board is also included, wherein the metal support includes a second opening structure, and the gold fingers or connectors of the flexible circuit board are communicatively connected to the connectors of the circuit board through the second opening structure.

[0021] In some embodiments of this disclosure, the support layer is formed of a high-stiffness, low-thermal-expansion-coefficient metallic material, or a material with high stiffness and low thermal expansion coefficient.

[0022] In some embodiments of this disclosure, the first adhesive layer includes a plurality of fifth adhesive structures arranged in an array, wherein the fifth adhesive structures are dot-shaped or line-shaped.

[0023] According to a second aspect of this disclosure, a detector is provided, comprising the imaging detection module described in any of the first aspects.

[0024] According to a third aspect of this disclosure, an X-ray detection system is provided, including the detector described in the second aspect.

[0025] The imaging detection module, detector, and X-ray detection system provided in this disclosure embodiment, by setting a support layer on the side of the circuit board away from the photodiode array, and the support layer being bonded to the circuit board through a first adhesive layer, ensure the flatness of the circuit board and the photodiode array based on the supporting effect of the support layer. This avoids the problem that when the thermal expansion coefficients of the photodiode array and the circuit board are different, the photodiode array and the circuit board will shrink differently, causing the photodiode array to bend, which in turn leads to uneven gaps between the photodiodes and the photodiodes, resulting in a decrease in the image quality of the detected target information provided by the imaging detection module after reconstruction by the host computer.

[0026] The above description is merely an overview of the technical solutions of the embodiments of this application. In order to better understand the technical means of the embodiments of this application and to implement them in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the embodiments of this application more obvious and understandable, specific implementation methods of this application are described below. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings of the embodiments will be briefly described below. It should be understood that the drawings described below only relate to some embodiments of this disclosure and are not intended to limit this disclosure, wherein:

[0028] Figure 1 This is a schematic diagram of the structure of a detector in the prior art;

[0029] Figure 2 This is a schematic diagram of the specific structure of a detector in the prior art;

[0030] Figure 3 This is a schematic diagram of the structure of an imaging detection module in the prior art;

[0031] Figure 4 This is a schematic diagram of the structure of an imaging detection module provided in an embodiment of this disclosure;

[0032] Figure 5 This is a schematic diagram of another imaging detection module provided in an embodiment of this disclosure;

[0033] Figure 6A This is a schematic diagram of the structure of another imaging detection module provided in this embodiment;

[0034] Figure 6B yes Figure 6A Corresponding top view structural diagram;

[0035] Figure 6C This is another top view structural schematic diagram provided in the embodiments of this disclosure;

[0036] Figure 7AThis is a schematic diagram of the structure of another imaging detection module provided in this embodiment;

[0037] Figure 7B This is a schematic diagram of the structure of another imaging detection module provided in this embodiment;

[0038] Figure 8A This is a partial structural schematic diagram of an imaging detection module provided in an embodiment of this disclosure;

[0039] Figure 8B This is a schematic diagram of the structure of a structural adhesive layer provided in an embodiment of this disclosure;

[0040] Figure 9A This is a partial structural schematic diagram of another imaging detection module provided in an embodiment of this disclosure;

[0041] Figure 9B This is a schematic diagram of another structural adhesive layer provided in an embodiment of this disclosure. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are also within the scope of protection of this disclosure.

[0043] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this subject matter pertains. It will be further understood that terms such as those defined in commonly used dictionaries shall be interpreted as having the meaning consistent with their meaning in the context of the specification and in the relevant art, and shall not be interpreted in an idealized or overly formal form unless otherwise explicitly defined herein. As used herein, the statement of “connecting” or “coupling” two or more parts together shall mean that these parts are directly joined together or joined through one or more intermediate components.

[0044] In all embodiments of this disclosure, terms such as “first” and “second” are used only to distinguish one component (or part of a component) from another component (or another part of a component).

[0045] Unless otherwise expressly indicated by the context, the singular form of words used herein and in the appended claims includes the plural form, and vice versa. Thus, when referring to the singular, the plural form of the corresponding term is generally included. Similarly, the terms “comprising” and “including” shall be interpreted as including rather than exclusively. Likewise, the terms “including” and “or” shall be interpreted as including unless such interpretation is expressly prohibited herein. Where the term “example” is used herein, particularly when it follows a set of terms, the “example” is merely exemplary and illustrative and should not be considered exclusive or extensive.

[0046] In view of the problems existing in the prior art, the present disclosure provides an imaging detection module. Figure 4 This is a schematic diagram of the structure of an imaging detection module provided in an embodiment of this disclosure, as shown below. Figure 4 As shown, the imaging detection module includes: a circuit board 220, a photodiode array 211, a support layer 216, and a first adhesive layer 217; the support layer 216 is disposed on the side of the circuit board 220 away from the photodiode array 211; the support layer 216 is bonded to the circuit board 220 through the first adhesive layer 217, and the vertical projection of the support layer and the first adhesive layer on the circuit board overlaps with the vertical projection of the photodiode array on the circuit board.

[0047] Specifically, such as Figure 4 As shown, by providing a support layer 216 on the side of the circuit board 220 away from the photodiode array 211, the bending problem of the photodiode is solved based on the supporting effect of the support layer 216, and the surface flatness after assembly is guaranteed.

[0048] For details, please refer to [link / reference]. Figure 4 The support layer 216 is bonded to the circuit board 220 through the first adhesive layer 217.

[0049] In one specific implementation, a first adhesive layer 217 is formed on one side surface of the circuit board 220, and a support layer 216 is formed on the first adhesive layer 217. The support layer 216 is bonded to the circuit board 220 through the first adhesive layer 217. Finally, a photodiode array 211 is assembled on the side of the circuit board 220 away from the support layer 216.

[0050] In another specific implementation, a first adhesive layer 217 is formed on the support layer 216, and then the support layer 216 is bonded to the circuit board 220 through the first adhesive layer 217. Finally, a photodiode array 211 is assembled on the side of the circuit board 220 away from the support layer 216.

[0051] The support layer 216 is formed of a high-rigidity, low-thermal-expansion-coefficient metal material, or a low-thermal-expansion-coefficient, high-rigidity material (such as ceramic).

[0052] As a preferred feasible approach, such as Figure 5 As shown, the photodiode array 211 includes multiple photodiode units 2110, and the support layer 216 includes multiple support units 2160. The support units 2160 are arranged correspondingly to the photodiode units 2110, and any two adjacent support units are independent of each other to reduce the mismatch of thermal expansion coefficients when the support layer is assembled with the circuit board.

[0053] In one specific example, the support layer 216 is formed of a high-stiffness, low-thermal-expansion-coefficient material, such as pure tungsten, tungsten-nickel-iron, or ceramic, with a thickness typically >= 0.2 mm. The expansion coefficient of the support layer 216 material is approximately the same as that of the silicon material used in the photodiode array. Because the expansion coefficient of the support layer material is approximately the same as that of the silicon material used in the photodiode, the flatness of the circuit board 220 and the photodiode array 211 can be maintained during the assembly of the circuit board and the photodiode array.

[0054] Another specific example is that the support layer is formed of a high-density metal material, such as tungsten or tungsten-nickel-iron, with a thickness typically >= 0.2 mm. The support layer is made of a metal material, and the coefficient of thermal expansion of this metal material is approximately the same as that of the silicon material used in the photodiode array. The support layer serves a supporting function, ensuring the flatness of the circuit board 220 and the photodiode array 211.

[0055] The imaging detection module provided in this embodiment provides a support layer on the side of the circuit board away from the photodiode array. The support layer is bonded to the circuit board through a first adhesive layer. Based on the support of the support layer, the flatness of the circuit board and the photodiode array is ensured. This avoids the problem that when the thermal expansion coefficients of the photodiode array and the circuit board are different, the photodiode array and the circuit board will shrink differently, causing the photodiode array to bend. This would lead to uneven gaps between the photodiode array and the scintillator array, resulting in a decrease in the image quality of the target information provided by the imaging detection module after reconstruction by the host computer.

[0056] exist Figure 4 Based on the corresponding embodiments, Figure 6A This is a schematic diagram of the structure of another imaging detection module provided in this embodiment. Figure 6B This is a top view schematic diagram of an imaging detection module provided in an embodiment of this disclosure, as shown below. Figure 6A and 6BAs shown, the imaging detection module also includes a charge processing chip 210, a metal support 223, a third adhesive layer 242, and a fourth adhesive layer 241. The charge processing chip 210 is disposed on the side of the circuit board 220 away from the photodiode array 211. The metal support 223 includes a second support platform 420. The third adhesive layer 242 includes a first adhesive structure 242A and a second adhesive structure 242B. The support layer 216 is bonded to the metal support 223 through the first adhesive structure 242A, and the charge processing chip 210 is bonded to the metal support 223 through the second adhesive structure 242A. 42B is bonded to the metal bracket 223; the second support platform 420 is C-shaped, and the fourth adhesive layer 241 includes a third adhesive structure 241A and a fourth adhesive structure 241B; the third adhesive structure 241A and the second support platform 420 are correspondingly arranged, and the fourth adhesive structure 241B is arranged parallel and symmetrically on the edge of the support layer 216 in the X-axis direction; the circuit board 220 is bonded to the second support platform 420 of the metal bracket 223 through the third adhesive structure 241A, and the support layer 216 is bonded to the metal bracket 223 through the fourth adhesive structure 241B.

[0057] The fourth adhesive layer 241 can also simply appear as two opposite sides of a square, i.e., two parallel adhesive strips, to achieve the required bonding strength. The second support platform can also not protrude from the metal bracket, i.e., it only occupies the corresponding four sides of the metal bracket 223 and the circuit board 220.

[0058] In this embodiment, the third adhesive layer 242 is made of an adhesive material with thermal conductivity. The support layer 216 is bonded to the metal bracket 223 through the first adhesive structure 242A of the third adhesive layer 242. The charge processing chip 210 is bonded to the metal bracket 223 through the second adhesive structure 242B of the third adhesive layer 242. The first adhesive structure 242A acts as a thermal conductive medium to achieve uniform temperature at the position of the photodiode on the circuit board 220. The second adhesive structure 242B acts as a thermal conductive medium to conduct heat generated by the charge processing chip 210.

[0059] To ensure the stability of the imaging detection module, the fourth adhesive layer 241 is formed using structural adhesive. The fourth adhesive layer 241 surrounds the circuit board 220 in a U-shape, such as... Figure 6B As shown, the circuit board 220 is bonded to the second support platform 420 of the metal bracket 223. The fourth adhesive layer 241, which is prepared by structural adhesive, can ensure the adhesion between the metal bracket 223 and the circuit board 220, and ensure the stability of the imaging detection module.

[0060] In the imaging detection module provided in this embodiment, one method of fabrication involves first applying two different adhesives to a metal support. Specifically, a third adhesive is applied to the metal support at positions corresponding to the support layer and the charge processing chip to form a third adhesive layer. Space is reserved around the support layer to form a fourth adhesive layer, creating a fourth adhesive structure 241B. The fourth adhesive is then applied to the second support platform 420 of the metal support to form the third adhesive structure 241A of the fourth adhesive layer 241. Then... Figure 4 The corresponding imaging detection module is combined with the metal support 223, and the fourth adhesive layer 241 is cured by an adhesive curing method, such as UV curing. The third adhesive layer 242 can be cured at room temperature to form... Figure 6A The corresponding imaging detection module.

[0061] Another method for fabricating the imaging detection module provided in this embodiment is as follows: First, the circuit board 220, with the charge processing chip 210 and connector already soldered, is assembled with the support layer 216 using a first adhesive layer 217. Next, a third adhesive is applied to the support layer 216 and the charge processing chip 210 to form a third adhesive layer 242. Space is reserved around the support layer to form a fourth adhesive structure 241B of a fourth adhesive layer. A fourth adhesive is applied to the second support platform 420 of the metal bracket to form a third adhesive structure 241A of the fourth adhesive layer 241. Then, the metal bracket 223 is assembled with high precision using the third adhesive layer 242 and the fourth adhesive layer 241. Finally, the photodiode array 211 and the scintillator array 212 are assembled together to obtain... Figure 6A The corresponding imaging detection module.

[0062] It should be noted that the above Figure 6A In the corresponding implementation, the metal bracket is formed by mechanical integral processing. The formed metal bracket includes a second support platform. The second support platform 420 is a support platform milled out of the metal bracket 223 by mechanical processing to compensate for the height difference between the metal bracket 223 and the circuit board 220.

[0063] As another possible approach, such as Figure 6C As shown, the vertical projection of the third bonding structure 241A on the circuit board 220 overlaps with the vertical projection of the second support platform 420 on the circuit board 220 in the Z-axis direction, and the fourth bonding structure 241B is arranged parallel and symmetrically on the edge of the support layer 216 in the X-axis direction; the circuit board 220 is bonded to the second support platform 420 of the metal bracket 223 through the third bonding structure 241A, and the support layer 216 is bonded to the metal bracket 223 through the fourth bonding structure 241B.

[0064] In other possible implementations, to ensure high-precision assembly of the metal bracket 223 and the circuit board 220, multiple fourth bonding structures 214B parallel to the Z-axis direction can also be provided. This embodiment does not specifically limit this, nor does it specifically limit the shape of the fourth bonding structure.

[0065] Based on the above embodiments, see below. Figure 6A The imaging detection module also includes a flexible circuit board 240, and a metal bracket 223 includes a second opening structure 322. The gold fingers or connectors of the flexible circuit board 240 are communicatively connected to the connectors of the circuit board 220 through the second opening structure 322.

[0066] like Figure 6A As shown, one end of the flexible circuit board 240 is fixed to the connector 230 of the circuit board 220 by gold fingers. The flexible circuit board passes through the second opening structure 322 on the metal bracket 223 and is led out to the side of the metal bracket 223 away from the circuit board 220. After the flexible circuit board 240 is led out to the other side of the metal bracket 223, it is connected to the gold fingers or connector on the flexible circuit board (330 is the gold fingers or connector on the flexible circuit board), which facilitates the subsequent installation of the imaging detection module and signal interconnection.

[0067] As a preferred feasible approach, in Figure 4 Based on the corresponding embodiment, the circuit board 220 is aligned with the photodiode array 211 on one side.

[0068] Specifically, the attached Figure 4 The circuit board is removed along the Z-axis direction beyond the edge of the photodiode array 211, resulting in... Figure 7A One way to implement it is in Figure 7A The same image is installed on the right. Figure 7A Then, through the third and fourth adhesive layers, Figure 7A The imaging detection module is bonded to the metal bracket, and then the flexible circuit board 240 is connected to obtain... Figure 7B , Figure 7B It is a spliced ​​imaging detection module that extends the detector's scanning width in the Z direction.

[0069] In a specific implementation, the first adhesive layer includes a plurality of fifth adhesive structures arranged in an array.

[0070] As a specific embodiment, Figure 8A This is a partial structural schematic diagram of an imaging detection module provided in an embodiment of this disclosure. Figure 8B yes Figure 8A A partial cross-sectional structural diagram along A1A2, as shown below. Figure 8A and 8B As shown, the fifth bonding structure is linear.

[0071] As another specific embodiment Figure 9A This is a partial structural schematic diagram of another imaging detection module provided in an embodiment of this disclosure. Figure 9B yes Figure 9A A partial cross-sectional structural diagram along B1B2, as shown in 9A and 9B, shows that the fifth bonding structure is dot-shaped.

[0072] By setting the first adhesive layer to be dot-shaped or line-shaped, dot-shaped or line-shaped adhesive is prepared on the circuit board. By setting the fifth adhesive structure to be dot-shaped, line-shaped, or any combination thereof, the gas in the adhesive can be easily discharged when the adhesive cures. In addition, it prevents the adhesive from pushing against each other, causing uneven adhesive thickness, and reduces the additional stress on the circuit board caused by the mismatch of the thermal expansion coefficient of the adhesive, further improving the flatness of the circuit board and the photodiode array.

[0073] Furthermore, in the above embodiments, the thickness of the prepared support layer is greater than or equal to 0.2 mm, and the thickness of the first adhesive layer is less than 0.5 mm.

[0074] It should be noted that, in the above embodiments, the imaging detection module includes other auxiliary devices besides the charge processing chip, such as resistors, capacitors and chips of other functional modules, which will not be specifically described in this disclosure.

[0075] Based on the above embodiments, this disclosure also provides a detector, which includes the imaging detection module described in any of the above embodiments and has the beneficial effects described in any of the above embodiments. This disclosure does not provide specific details on this aspect.

[0076] Based on the above embodiments, this disclosure also provides an X-ray detection system, which includes the detector described in any of the above embodiments and has the beneficial effects described in any of the above embodiments. This disclosure does not provide specific details on this aspect.

[0077] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0078] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this application, the sequence numbers of the above steps / processes do not imply a sequential order of execution; the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application. Moreover, the above embodiment numbers are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0079] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0080] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. An imaging detection module, characterized in that, It includes at least: a circuit board, a photodiode array, a support layer, and a first adhesive layer; The support layer is disposed on the side of the circuit board away from the photodiode array; The support layer is bonded to the circuit board via the first adhesive layer; The vertical projection of the support layer and the first adhesive layer on the circuit board overlaps with the vertical projection of the photodiode array on the circuit board.

2. The imaging detection module according to claim 1, characterized in that, It also includes a charge processing chip, a metal bracket, a third adhesive layer, and a fourth adhesive layer; The charge processing chip is disposed on the side of the circuit board away from the photodiode array; The metal bracket includes a second support platform; The third adhesive layer includes a first adhesive structure and a second adhesive structure. The support layer is bonded to the metal bracket through the first adhesive structure, and the charge processing chip is bonded to the metal bracket through the second adhesive structure. The second support platform is C-shaped, and the fourth adhesive layer includes a third adhesive structure and a fourth adhesive structure; The third bonding structure and the second support platform are respectively arranged in a corresponding manner, and the fourth bonding structure is arranged parallel and symmetrically at the edge of the support layer in the X-axis direction. The circuit board is bonded to the second support platform of the metal bracket via the third bonding structure, and the support layer is bonded to the metal bracket via the fourth bonding structure.

3. The imaging detection module according to claim 2, characterized in that, The vertical projection of the third bonding structure on the circuit board overlaps with the vertical projection of the second support platform on the circuit board in the Z-axis direction, and the fourth bonding structure is arranged parallel and symmetrically at the edge of the support layer in the X-axis direction. The circuit board is bonded to the second support platform of the metal bracket via the third bonding structure, and the support layer is bonded to the metal bracket via the fourth bonding structure.

4. The imaging detection module according to claim 1, characterized in that, The circuit board is aligned with the photodiode array on one side.

5. The imaging detection module according to claim 2, characterized in that, It also includes a flexible circuit board, wherein the metal support includes a second opening structure, and the gold fingers or connectors of the flexible circuit board are communicatively connected to the connectors of the circuit board through the second opening structure.

6. The imaging detection module according to any one of claims 1-5, characterized in that, The support layer is formed of a high-rigidity, low-thermal-expansion-coefficient metallic material, or a material with high rigidity and low thermal expansion coefficient.

7. The imaging detection module according to any one of claims 1-5, characterized in that, The first adhesive layer includes a plurality of fifth adhesive structures arranged in an array, wherein the fifth adhesive structures are dot-shaped or line-shaped.

8. A detector, characterized in that, Includes the imaging detection module as described in any one of claims 1-7.

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